UNIT-V EMBEDDED SYSTEM DEVELOPMENT:

The integrated development environment, Types of files generated on cross-compilation,

Deassembler/Decompiler, Simulators, Emulators and Debugging, Target hardware
debugging, Boundary Scan, Embedded Software development process and tools.

1.Introduction

• As illustrated in the figure, the development environment consists of a Development

Computer (PC) or Host, which acts as the heart of the development environment.
• Integrated Development Environment (IDE) Tool for embedded firmware development
and debugging, Electronic Design Automation (EDA) Tool for Embedded Hardware
design.
• Emulator hardware for debugging the target board, Signal sources (like Function
generator) for simulating the inputs to the target board.
• Target hardware debugging tools (Digital CRO, Multimeter, Logic Analyser, etc.) and
the target hardware.
2. THE INTEGRATED DEVELOPMENT ENVIRONMENT (IDE)
o In embedded system development context, Integrated Development Environment
(IDE) stands for an integrated environment for developing and debugging the
target processor specific embedded firmware.
o IDE is a software package which bundles a ‘Text Editor (Source Code Editor)’,
‘Cross-compiler (for cross platform development and compiler for same platform
development)’, ‘Linker’ and a ‘Debugger’.
o Some IDEs may provide interface to target board emulators, Target
processor’s/controller’s Flash memory programmer, etc.
o IDEs can be either command line based or GUI based. Command line based IDEs
may include little or less GUI support.
o In Embedded Applications, the IDE is either supplied by the target
processor/controller manufacturer or by third party vendors or as Open Source.
o The Keil u-Vision3 IDE for 8051
▪ Keil pVision3 is a licensed IDE tool from Keil Software (www.keil.com').
an ARM company, for 8051 family microcontroller based embedded
firmware development.
▪ It contains various menu options, a project window showing files, Register
view, Books and Functions Tab and an output window.
▪ The ‘Debug' tab is used for configuring the firmware debugging. ‘Debug'
supports both simulation type firmware debugging and debugging the
application while it is running on the target hardware.
▪ The ‘ Utilities' tab is used for configuring the flash memory programming
of the target processor/controllers from the Keil IDE.
▪ Cross-compilation is the conversion of the firmware written in Embedded
C to machine language corresponding to the target processor/controller.
▪ Debugging firmware is the process of monitoring the program flow,
various registers and memory contents while the firmware is executed.
▪ The first method is by using breakpoints and simulator (a software tool
which simulates the functionalities of the target processor). The second
method is hardware level debugging.
▪ While debugging the firmware you can switch the view between
Assembly code and original source code lines by selecting the
Disassembly view.
▪ During debugging the content of various CPU and general purpose
registers are displayed under the ‘Regs’ tab of the project Window. Apart
from this you can inspect the data memory and code memory by invoking
the ‘Memoiy Window’ under the ‘ View’ tab of the IDE menu.
▪ The local variables can be viewed in the ‘Locals’ section of ‘ Watch and
call Stack Window’ whereas users can add other variables to the ‘Watch’
window to get their values. ‘Call Stack’ gives the ‘Callee- Caller’ details
for subroutine calls.
▪ The ‘Performance analyser’ support by the Keil IDE helps in calculating
the time consumed by a function.
▪ The 'Reset CPU option available under the 4Peripherals' tab is used for
resetting the firmware execution.
▪ Keil provides extensive support for simulating various peripherals like;
ports, memory mapped I/O, etc. and Interrupts (External, Timer and Serial
interrupts).
 ▪ The main limitation of simulation is that we can simulate it with only
known values (in a real application the simulated value may not be the real
input) and also it is difficult to predict the real-time behaviour of the
system based on these simulations.

3. Types of files generated on cross-compilation

• Cross-compilation is the process of converting a source code written in high level
language (like ‘Embedded C’) to a target processor/controller understandable
machine code (e.g. ARM processor or 8051 microcontroller specific machine
code).
• In a single word cross-compilation is the process of cross platform
software/firmware development. Cross assembling is similar to cross-compiling;
the only difference is that the code written in a target processor/controller specific
Assembly code is converted into its corresponding machine code.
• Cross- compilation/cross-assembling is carried out in different steps and the
process generates various types of intermediate files. they are;
o As an example let’s consider the cross-compilation process of the file
sample.c given as the first illustrative embedded C program under Keil
pVision3 IDE discussion.
o List File (.LSTFile)
▪ Listing file is generated during the cross-compilation process and it
contains an abundance of information about the cross compilation
process, like cross compiler details, formatted source text (‘C’
code), assembly code generated from the source file, symbol
tables, errors and warnings detected during the cross-compilation
process.
▪ Page Header – Indicates the compiler version number, source file
name, date, time, and page number.
▪ Command Line - Represents the entire command line that was
used for invoking the compiler.
▪ Source Code - The source code listing outputs the line number as
well as the source code on that line.
▪ Assembly Listing - It contains the assembly code generated by the
cross compiler for the ‘C’ source code.
▪ Symbol Listing - Symbol listing contains the sections symbol
name (NAME) symbol classification (CLASS (Special Function
Register (SFR), structure, typedef, static, public, auto, extern,
etc.)), memory space (MSPACE (code memory or data memory)),
data type (TYPE'(int, char, Procedure call, etc.)), offset ((OFFSET
from code memory start address)) and size in bytes (SIZE).
▪ Warnings and Errors

o Preprocessor Output File

▪ Preprocessor output file is used for verifying the operation of
macros and conditional preprocessor directives.
o Object File (.OBJFile)
▪ The object file is a specially formatted file with data records for
symbolic information, object code, debugging information, library
references, etc.
▪ The list of some of the details stored in an object file is given
below.
• Reserved memory for global variables.
• Public symbol (variable and function) names.
• External symbol (variable and function) references.
• Library files with which to link.
• Debugging information to help synchronise source lines
with object code.
o Map File (.MAP)
▪ Map file contains information about the link/locate process and is
composed of a number of sections.
▪ It is the responsibility of a linker to link all these object files. The
locater is responsible for locating absolute address to each module
in the code memory.
▪ Linking and locating of re-locatable object files will also generate
a list file called ‘linker listfile’ or ‘mapfile’.
o HEX File (.HEX)
▪ The utility used for converting an object file to a hex file is known
as Object to Hexfile converter.
▪ Intel HEX and Motorola HEX are the two commonly used hex file
formats in embedded applications.
▪ Intel HEX file is an ASCII text file in which the HEX data is
represented in ASCII format in lines.
▪ Intel HEX File Format
Start Record Address Record Date Checksum
Length Fiels Type Field Field
: ll aaaa Tt dd…d cc
Example

• Motorola HEX File Format

o The lines in Motorola HEX file represent a HEX Record. Each
record is made up of hexadecimal numbers that represent
machine language code and/or constant data. The general form
of Motorola Hex record is given below.
Start of Record Length Start Date Checksum
Record Type Address Field Field
SOR RT ll aaaa dd…d cc
4. Deassembler/Decompiler
• Disassembler is a utility program which converts machine codes into target processor
specific Assembly codes/instractions. The process of converting machine codes into
Assembly code is known as ‘Disassembling’.
• In operation, disassembling is complementary to assembling/cross-assembling.
• Decompiler is the utility program for translating machine codes into corresponding high
level language instructions. Decompiler performs the reverse operation of compiler/cross-
compiler.
• Disassemblers/Decompilers are deployed in reverse engineering. Reverse engineering is
the process of revealing the technology behind the working of a product.
• Reverse engineering in Embedded Product development is employed to find out the
secret behind the working of popular proprietary products.
• Disassemblers/Decompilers are powerful tools for analysing the presence of malicious
codes (virus information) in an executable image.
• It is not possible for a disassembler/decompiler to generate an exact replica of the original
assembly code/high level source code in terms of the symbolic constants and comments
used. However disassemblers/decompilers generate a source code which is somewhat
matching to the original source code from which the binary code is generated.
5. Simulators, Emulators and Debugging
o Simulator is a software tool used for simulating the various conditions for
checking the functionality of the application firmware.
o Emulator is hardware device which emulates the functionalities of the target
device and allows real time debugging of the embedded firmware in a hardware
environment.
o Simulators
▪ Simulators simulate the target hardware and the firmware execution can be
inspected using simulators. The features of simulator based debugging are
listed below.
• Purely software based
• Doesn’t require a real target system
• Very primitive (Lack of featured I/O support. Everything is a
simulated one)
• Lack of Real-time behavior
▪ Advantages of Simulator Based Debugging
• Simulator based debugging techniques are simple and
straightforward.
• No Need for Original Target Board.
• Simulate I/O Peripherals.
• Simulates Abnormal Conditions.
 ▪
Limitations
• Deviation from Real Behaviour
• Lack of real timeliness
o Emulators and Debuggers
▪ What is debugging?
• Debugging in embedded application is the process of diagnosing
the firmware execution, monitoring the target processor’s registers
and memory while the firmware is running and checking the
signals from various buses of the embedded hardware
▪ Various types of debugging techniques
1. Incremental EEPROM Burning Technique
o Instead of burning the entire code into the EEPROM chip at
once, the code is burned in incremental order, where the code
corresponding to all functionalities are separately coded,
cross-compiled and burned into the chip one by one.
o It is a time-consuming process. But remember it is a onetime
process and once you test the firmware in an incremental
model you can go for mass production.
o In incremental firmware burning technique we are not doing
any debugging but observing the status of firmware
execution as a debug method.

2. Inline Breakpoint Based Firmware Debugging

o Within the firmware where you want to ensure that

firmware execution is reaching up to a specified point,
insert an inline debug code immediately after the point.

3. Monitor Program Based Firmware Debugging

o In this approach a monitor program which acts as a

supervisor is developed.
o The monitor program controls the downloading of user
code into the code memory, inspects and modifies
register/memory locations; allows single stepping of source
code, etc.
 o The monitor program implements debug functions as per a
pre-defined command set from the debug application
interface.
o The monitor program contains the following set of minimal
features.
1. Command set interface to establish communication with
the debugging application
2. Firmware download option to code memory
3. Examine and modify processor registers and working
memory (RAM)
4. Single step program execution
5. Set breakpoints in firmware execution
6. Send debug information to debug application running on
host machine

4. In Circuit Emulator (ICE) Based Firmware Debugging

o An ‘Emulator’ is a self-contained hardware device which

emulates the target CPU.
o The emulator hardware contains necessary emulation logic
and it is hooked to the debugging application running on
the development PC on one end and connects to the target
board through some interface on the other end.
o The emulator application for emulating the operation of a
PDA phone for application development is an example of a
‘Software Emulator’.

▪ Emulation Device
• Emulation device is a replica of the target CPU
which receives various signals from the target
board through a device adaptor connected to the
target board and performs the execution of
firmware under the control of debug commands
from the debug application.
• The emulation device can be either a standard
chip same as the target processor (e.g.
AT89C51) or a Programmable Logic Device
(PLD) configured to function as the target CPU.
▪ Emulation Memory
• It is the Random Access Memory (RAM)
incorporated in the Emulator device. It acts as a
replacement to the target board’s EEPROM
 where the code is supposed to be downloaded
after each firmware modification.
• Hence the original EEPROM memory is
emulated by the RAM of emulator. This is
known as ‘ROMEmulation’.
• Emulation memory also acts as a trace buffer in
debugging. Trace buffer is a memory pool
holding the instructions executed/registers
modified/related data by the processor while
debugging.
• The common features of trace buffer memory
and trace buffer data viewing are listed below:
• Trace buffer records each bus cycle in frames
• Trace data can be viewed in the debugger
application as Assembly/Source code
• Trace buffering can be done on the basis of a
Trace trigger (Event)
• Trace buffer can also- record signals from
target board other than CPU signals (Emulator
depen dent)
• Trace data is a-very useful information in
firmware debugging
• Emulator Control Logic
o Emulator control logic is the logic circuits used for
implementing complex hardware breakpoints, trace
buffer trigger detection, trace buffer control, etc.
• Device Adaptors
o Device adaptors act as an interface between the target
board and emulator POD. Device adaptors are normally
pin-to-pin compatible sockets which can be
inserted/plugged into the target board for routing the
various signals from the pins assigned for the target
processor.
5.On Chip Firmware Debugging (OCD)
• On-chip debugger provides the means to set simple
breakpoints, query the internal state of the chip and single step
through code.
• OCD module implements dedicated registers for controlling
debugging. An On Chip Debugger can be enabled by setting
the OCD enable bit (The bit name and register holding the bit
varies across vendors).
• Debug related registers are used for debugger control
(Enable/disable single stepping, Freeze execution, etc.) and
breakpoint address setting. BDM and JTAG are the two
commonly used interfaces to communicate between the Debug
application running on Development PC and OCD module of
target CPU.
 • Chips with JTAG debug interface contain a built-in JTAG port
for communicating with the remote debugger application.
• The signal lines ofJTAG protocol are explained below.
o Test Data In (TDI): It is used for sending debug
commands serially from remote debugger to the target
processor.
o Test Data Out (TDO): Transmit debug response to the
remote debugger from target CPU.
o Test Clock (TCK): Synchronises the serial data transfer.
o Test Mode Select (TMS): Sets the mode of testing.
o Test Reset (TRST): It is an optional signal line used for
resetting the target CPU.

6. Target hardware debugging

Hardware debugging involves the monitoring of various signals of the target board
(address/data lines, port pins, etc.), checking the inter, connection among various components,
circuit continuity checking, etc.
The various hardware debugging tools used in Embedded Product Development are
explained below.
• Magnifying Glass (Lens)
o A magnifying glass is a powerful visual inspection tool. With a magnifying
glass (lens), the surface of the target board can be examined thoroughly for
dry soldering of components, missing components, improper placement of
components, improper soldering, track (PCB connection) damage, short of
tracks, etc.
o Nowadays high quality magnifying stations are available for visual inspection.
• Multimeter
o A multimeter is used for measuring various electrical quantities like voltage
(Both AC and DC), current (DC as well as AC), resistance, capacitance,
continuity checking, transistor checking, cathode and anode identification of
diode, etc.
o It is the primary debugging tool for physical contact based hardware
debugging and almost all developers start debugging the hardware with it. In
embedded hardware debugging it is mainly used for checking the circuit
continuity between different points on the board, measuring the supply
voltage, checking the signal value, polarity, etc. Both analog and digital
versions of a multimeter are available.
• Digital CRO
o CRO is a very good tool in analysing interference noise in the power supply
line and other signal lines. Monitoring the crystal oscillator signal from the
target board is a typical example of the usage of CRO for waveform capturing
and analysis in target board debugging.
• Logic Analyser
o Logic analyser is used for capturing digital data (logic 1 and 0) from a digital
circuitry whereas CRO is employed in capturing all kinds of waves including
logic signals.
o A logic analyser contains special connectors and clips which can be attached
to the target board for capturing digital data.
 o In target board debugging applications, a logic analyser captures the states of
various port pins, address bus and data bus of the target processor/controller,
etc.
o Logic analysers give an exact reflection of what happens when a particular
line of firmware is running.
o Function Generator
o Function generator is not a debugging tool. It is an input signal simulator tool.
o A function generator is capable of producing various periodic waveforms like
sine wave, square wave, saw-tooth wave, etc. with different frequencies and
amplitude.

7. Boundary Scan
• Boundary scan is a technique used for testing the interconnection among the various
chips, which support JTAG interface, present in the board. Chips which support
boundary scan associate a boundary scan cell with each pin of the device.
• A JTAG port which contains the five signal lines namely TDI, TDO, TCK, TRST
and TMS form the Test Access Port (TAP) for a JTAG supported chip. Each device
will have its own TAP.
• The PCB also contains a TAP for connecting the JTAG signal lines to the external
world. A boundary scan path is formed inside the board by interconnecting the
devices through JTAG signal lines.
• The TDI pin of the TAP of the PCB is connected to the TDI pin of the first device.
The TDO pin of the first device is connected to the TDI pin of the second device. In
this way all devices are interconnected and the TDO pin of the last JTAG device is
connected to the TDO pin of the TAP of the PCB.
• The clock line TCK and the Test Mode Select (TMS) line of the devices are
connected to the clock line and Test mode select line of the Test Access Port of the
PCB respectively.
• This forms a boundary scan path. Figure 13.41 illustrates the same.

•
• The boundary scan cells can be operated in Normal, Capture, Update and Shift
modes.
• In the Normal mode, the input of the boundary scan cell appears directly at its output.
• In the Capture mode, the boundary scan cell associated with each input pin of the chip
captures the signal from the respective pins to the cell and the boundary scan cell
associated with each output pin of the chip captures the signal from the internal
circuitry.
• In the Update mode, the boundary scan cell associated with each input pin of the chip
passes the already captured data to the internal circuitry and the boundary scan cell
associated with each output pin of the chip passes the already captured data to the
respective output pin.
• In the shift mode, data is shifted from TDI pin to TDO pin of the device through the
boundary scan cells.
• Instruction Register, Bypass Register, Identification Register, etc. are examples of
boundary scan related registers.
• The Instruction Register is used for holding and processing the instruction re: ceived
over the TAP.
• The bypass register is used for bypassing the boundary scan path of the device and
directly interconnecting the TDI pin of the device to its TDO.
• Extest, Bypass, Sample and Preload, Intest, etc. are examples for instructions for
different types of boundary scan tests, whereas the instruction Runbist is used for
performing a self test On the internal functioning of the chip. The Runbist instruction
produces a pass/fail result.
• Boundary Scan Description Language (BSDL) is used for implementing boundary
scan tests using JTAG. BSDL is a subset of VHDL and it describes the JTAG
implementation in a device. BSDL provides information on how boundary scan is
implemented in an integrated chip.
• The BSDL file is used as the input to a Boundary Scan Tool for generating boundary
scan test cases for a PCB. Automated tools are available for boundary scan test
implementation from multiple vendors.
8. Embedded Software development process and tools.
 Unit-VI: Embedded System Implementation And Testing:

The main software utility tool, CAD and the hardware, Translation tools-Pre-
processors, Interpreters, Compilers and Linkers, Debugging tools, Quality
assurance and testing of the design, Testing on host machine, Simulators,
Laboratory Tools.

1. Implementing the Design

• For implementation of an embedded system it is important to understand what
development tools are available.
• The development and integration of an embedded system’s various hardware and
software components are made possible through development tools that provide
everything from loading software into the hardware to providing complete control over
the various system components.
• The key development tools in embedded design can be located on the host or on the
target, or can exist standalone. These tools typically fall under one of three categories:
utility, translation, and debugging tools.

• Utility tools are general tools that aid in software or hardware development, such as
editors (for writing source code), VCS (Version Control Software) that manages software
files, and ROM burners that allow software to be put onto ROMs.
• Translation tools convert code a developer intends for the target into a form the target
can execute, and debugging tools can be used to track down and correct bugs in the
system.
• Development tools of all types are as critical to a project as the architecture design,
because without the right tools, implementing and debugging the system would be very
difficult, if not impossible.

2. The main software utility tool

• Source code is typically written with a tool such as a standard ASCII text editor, or an
IDE located on the host (development) platform, as shown in Figure 12-2.
• An IDE is a collection of tools, including an ASCII text editor, integrated into one
application user interface.
• While any ASCII text editor can be used to write any type of code, independent of
language and platform, an IDE is specific to the platform and is typically provided by the
IDE’s vendor.

3. CAD and the hardware

• CAD tools are commonly used by hardware engineers to simulate circuits at the
electrical level in order to study a circuit’s behavior under various conditions
before they actually build the circuit.
• Figure 12-3a is a snapshot of a popular standard circuit simulator, called PSpice.
• PSpice is the PC version of SPICE and is an example of a simulator that can do
several types of circuit analysis, such as non-linear transient, non-linear DC,
linear AC, noise, and distortion, to name a few.
• As shown in Figure 12-3b, circuits created in this simulator can be made up of a
variety of active and/or passive elements

• At the highest level, a behavioral model of the entire circuit is created for both analog and
digital circuits, and is used to study the behavior of the entire circuit.
• This behavioral model can be created with a CAD tool that offers this feature or can be
written in a standard programming language.
4. Translation tools-Pre-processors, Interpreters, Compilers and Linkers
• This mechanism usually includes one or some combination of preprocessing,
translation, and/or interpretation machine code generation techniques. These
mechanisms are implemented within a wide variety of translating development
tools.
• The preprocessor’s role is to organize and restructure the source code to make
translation or interpretation of this code easier. The preprocessor can be a separate
entity, or can be integrated within the translation or interpretation unit.
• Many languages convert source code, either directly or after having been
preprocessed, to target code through the use of a compiler.
• As is usually the case in embedded systems, most compilers are located on the
programmer’s host machine and generate target code for hardware platforms that
differ from the platform the compiler is actually running on. These compilers are
commonly referred to as cross-compilers.
• In the case of assembly, an assembly compiler is a specialized cross-compiler
referred to as an assembler and will always generate machine code.

• After all the compilation on the programmer’s host machine is completed, the remaining
target code file is commonly referred to as an object file and can contain anything from
machine code to Java byte code, depending on the programming language used.
• As shown in Figure 12-5, a linker integrates this object file with any other required
system libraries, creating what is commonly referred to as an executable binary file,
either directly onto the board’s memory or ready to be transferred to the target embedded
system’s memory by a loader.

• The interpreters located on the target. An interpreter generates (interprets) machine code one
source code line at a time from source code or target code generated by an intermediate compiler
on the host system (see Figure 12-6).
• Optimizing the code for performance means that the compiler understands and makes use of the
various features of a particular Instruction Set Architecture (ISA), such as math operations, the
register set; knowing the various types of on-chip ROM and random access memory (RAM), the
number of clock cycles for various types of accesses, etc.

5. Debugging tools
• Debugging is primarily the task of locating and fixing errors within the system. This task
is made simpler when the programmer is familiar with the various types of debugging
tools available and how they can be used.
• The debugging tools reside and interconnect in some combination of standalone devices,
on the host, and/or on the target board.
6. Quality assurance and testing of the design
• Among the goals of testing and assuring the quality of a system are finding bugs within a
design and tracking whether the bugs are fixed.
• With testing, on the other hand, bugs are discovered as a result of trying to break the
system, including both testing-to-pass and testing-to-fail, where weaknesses in the system
are probed.
• Ensuring the quality of source code is visible along with feature feedback from day 1,
requires executing a disciplined test strategy as soon as any software is running on the
system.
• Track all hardware and software defects, including measure defect rate in specific
components as they are found.
• Highly problematic components are more expensive to debug than to replace, so it is
critical to monitor these defects to ensure knowing when these unstable components are
in a state that they must be replaced or rewritten.
• In general, testing techniques fall under one of four models: static black-box testing,
static white-box testing, dynamic black-box testing, or dynamic white-box testing (see the
matrix in Figure 12-9).
• Black-box testing occurs with a tester that has no visibility into the internal workings of
the system (no schematics, no source code, etc.).
• Black-box testing is based on general product requirements documentation, as opposed to
white-box testing (also referred to clear-box or glass-box testing) in which the tester has
access to source code, schematics, etc.
• Static testing is done while the system is not running, whereas dynamic testing is done
when the system is running.
• Testing can be further broken down to include, for example:
o Unit/module testing: incremental testing of individual elements within the
system.
o Compatibility testing: testing that the element doesn’t cause problems with other
elements in the system.
o Integration testing: incremental testing of integrated elements.
o System testing: testing the entire embedded system with all elements integrated.
o Regression testing: rerunning previously passed tests after system modification.
o Manufacturing testing: testing to ensure that manufacturing of the system didn’t
introduce bugs.
• Code inspection team type of roles:
o Moderator: responsible for managing the code inspection process and meeting(s).
o Reader: reads out-loud the source code and relative specifications for the operational
investigation. Should not be the developer that created the source code being inspected.
o Recorder: fills in code inspection check list report and documents any agreed upon open
items.
o Author: helps explain source to code inspection team, to discuss errors found, and future
rework that needs to be done. Should be the developer of the source code being
inspected.
7. Testing on host machine
8. Laboratory Tools.
1.

2. A general purpose microprocessor is a processor that is not tied to or integrated with a particular
language or piece of software. Most general purpose microprocessors are present in personal
computers. They are often used for computation, text editing, multimedia display, and
communication over a network. Other microprocessors are part of embedded systems. These
provide digital control over practically any technology, such as appliances, automobiles, cell
phones, industrial process control, etc.
The DSP processor, on the other hand, is a particular type of microprocessor. DSP stands for digital
signal processing. It is basically any signal processing that is done on a digital signal or information
signal. A DSP processor is a specialized microprocessor that has an architecture optimized for the
operational needs of digital signal processing.

The main difference between a DSP and a microprocessor is that a DSP processor has features
designed to support high-performance, repetitive, numerically intensive tasks. DSP processors are
designed specifically to perform large numbers of complex arithmetic calculations and as quickly
as possible. They are often used in applications such as image processing, speech recognition and
telecommunications. As compared to general microprocessors, DSP processors are more efficient
at performing basic arithmetic operations, especially multiplication.

Most general-purpose microprocessors and operating systems can execute DSP algorithms
successfully. However, they are not suitable for use in portable devices such as mobile phones.
Hence, specialized digital signal processors are used. Digital Signal Processors have
approximately the same level of integration and the same clock frequencies as general purpose
microprocessors, but they tend to have better performance, lower latency, and no requirements for
specialized cooling or large batteries. This allows them to be a lower-cost alternative to general-
purpose microprocessors.

DSPs also tend to be two to three times as fast as general-purpose microprocessors. This is because
of architectural differences. DSPs tend to have a different arithmetic Unit architecture; specialized
units, such as multipliers, etc

In shorts dsps are comparitively faster,cheaper and are better optimised for specific operations.

3. time to market (TTM) is the length of time it takes from a product being conceived until its
being available for sale. The reason that time to market is so important is because being late erodes
the addressable market that you have to sell your product into.[1] A common assumption is that
TTM matters most for first-of-a-kind products, but actually a late product launch in any industry
can negatively impact revenues—from reducing the window of opportunity to generate revenues
to causing the product to become obsolete faster. [2]
Why Product Development is Important
Product development, is the life-blood of companies and societies. The product could be a
physical product such as an automobile, smartphone, or coffee maker. It could also be services
such as new IT solution, new manufacturing process, or a new real estate marketing concept.
All successful product development actions provide the following:

1. New value for customers

2. Improved society
3. Continued existence of the company
 4.

5.Key Players of Automotive Embedded Market

• Silicon Providers

1. Analog Devices
2. Xilinx
3. Atmel
4. Maxim/Dallas
5. NXP Semiconductor
6. Renesas
7. Texas Instruments
8. Fujitsu
9. Infineon
10. NEC

• Tools and Platform Providers

1. ENEA
2. The Math Works
3. Keil Software
4. Lauterbach
5. ATTiSAN
6. Microsoft
 • Solution Providers
• Bosch Automotive
• DENSO Automotive
• Infosys Technologies
• Delphi

UNIT-2

1.

BASIS FOR COMPARISON SERIAL TRANSMISSION PARALLEL TRANSMISSION

Meaning Data flows in bi-direction, bit by bit Multiple lines are used to send data, i.e. 8 bits or 1 byte at a

time

Cost Economical Expensive

Bits transferred at 1 clock pulse 1 bit 8 bits or 1 byte

Speed Slow Fast

Applications Used for long-distance communication. Short distance.

E.g., Computer to computer E.g., computer to a printer

Number of communication channel Only one N number of communication channels are needed

required

Need of converters Required to convert the signals according to the Not required

need.
 Serial Transmission Parallel Transmission
S.NO

In serial transmission, data(bit) In Parallel Transmission, data

1. flows in bi-direction. flows in multiple lines.

Serial Transmission is cost- Parallel Transmission is not cost-

2. efficient. efficient.

In Parallel Transmission, eight

In serial transmission, one bit bits transferred at one clock
3. transferred at one clock pulse. pulse.

Serial Transmission is slow in Parallel Transmission is fast in

comparison of Parallel comparison of Serial
4. Transmission. Transmission.

Generally, Serial Transmission is Generally, Parallel Transmission

5. used for long-distance. is used for short distance.

The circuit used in Parallel

The circuit used in Serial Transmission is relatively
6. Transmission is simple. complex.

2.

Sr. Key Combinational Circuit Sequential Circuit

No.

1 Definition Combinational Circuit is the On other hand Sequential circuit is

type of circuit in which output is the type of circuit where output not
independent of time and only only relies on the current input but
relies on the input present at also depends on the previous
that particular instant. output.

2 Feedback In Combinational circuit as On other hand in case of

output does not depend on the Sequential circuit output relies on
time instant, no feedback is its previous feedback so output of
previous input is being transferred
Sr. Key Combinational Circuit Sequential Circuit
No.

required for its next output as feedback used with input for
generation. next output generation.

3 Performance As the input of current instant is On other hand Sequential circuit

only required in case of are comparatively slower and has
Combinational circuit, it is faster low performance as compared to
and better in performance as that of Combinational circuit.
compared to that of Sequential
circuit.

4 Complexity No implementation of feedback However on other hand

makes the combinational circuit implementation of feedback
less complex as compared to makes sequential circuit more
sequential circuit. complex as compared to
combinational circuit.

5 Elementary Elementary building blocks for On other hand building blocks for
Blocks combinational circuit are logic sequential circuit are flip flops..
gates.

6 Operation Combinational circuit are On other hand Sequential circuit is

mainly used for arithmetic as mainly used for storing data.
well as Boolean operations.
3.

4.

4. Pseudo op stands for "pseudo operation" and is sometimes called "assembler

directive". These are keywords which do not directly translate to a machine
instruction. Examples are the ones mentioned in your questions or .data, .def, .desc,
.dim, .double, .eject, .else, .elseif, .end and many more
Pseudo-op is an assembly language instruction that specify an operation of
assembler. Example: START , END , USING, DC, DS in programs
 EMBEDDED SYSTEMS
QUESTION BANK
UNIT-I: INTRODUCTION
Syllabus

Embedded system-Definition, history of embedded systems, classification of embedded systems, major application areas
of embedded systems, purpose of embedded systems, the typical embedded system-core of the embedded system,
Memory, Sensors and Actuators, Communication Interface, Embedded firmware, Characteristics of an embedded system,
Quality attributes of embedded systems, Application-specific and Domain-Specific examples of an embedded system.

QUESTION BANK

1. Write the history of embedded system.

2. Differentiate RISC and CISC.
3. Write and explain the classification of embedded system.
4. Explain the onboard communication interfaces.
5. Explain the purpose of embedded system.
6. What is ROM? How the ROM is classified? Explain it.
7. What is RAM? Explain the categories of RAM.
8. Define sensors? Explain I/O subsystem.
9. Explain how Digital Signal processor and Media processor are different than a general purpose
processor and also compare them.
10. Distinguish between a sensor and an actuator. Also explain their role in an embedded system with
suitable examples
11. Explain the quality and non-quality attributes of an embedded system.
12. Explain about Domain Specific Embedded System application by taking an Automotive Embedded
System (AES) as an example.
13. Draw and explain the typical Embedded system architecture?
14. Illustrate an application-specific Embedded system with suitable example?
15. Explain time to market? What is significance in product development?
16. Explain the different communication buses used in automotive application
17. What is programmable peripheral Interface Device? Explain the interfacing of 8255 PPI with an 8-bit
microprocessor/controller.
18. What are the different types of memories used in Embedded System design? Explain the role of each.
19. Discuss the concept of load store architecture and instruction pipelining.
20. Give an overview of the different market players of the automotive Embedded application domain.
21. Compare the operation of ZigBee and Wi-Fi networks
22. Explain in detail about USB.
 UNIT-II: EMBEDDED HARDWARE DESIGN
Syllabus
Analog and digital electronic components, I/O types and examples, Serial communication devices, Parallel device ports, Wireless
devices, Timer and counting devices, Watchdog timer, Real time clock.

QUESTION BANK

1. What is sequential circuit? Explain with examples.

2. What are serial communication devices? Explain.
3. What is Latch? Draw and explain the Latch.
4. Explain briefly about parallel device ports.
5. What is combination circuit? Explain with example.
6. Explain briefly about wireless devices.
7. What is multiplexer (mux)? Explain it.
8. Explain the purpose of a Real Time Clock and its functionality in an embedded system.
9. Explain serial interface, timer and counters along with their usage in an embedded processor.
10. Explain the purpose of (i) Counting Device and (ii) Real Time Clock in an embedded system
11. Explain the working of watchdog timer and also explain about control and status registers.
12. Compare the data transfer using serial and parallel port devices along with their advantages and disadvantages.
13. Explain the role of decoders in embedded hardware development. Draw the circuit diagram for interfacing a 3-
bit binary decoder with 8051.
14. Explain the merits and limitations of parallel port over serial interface
15. What is a sequential circuit? Draw a 3-bit binary counter using T flip flop and explain its functioning.
16. With suitable diagram briefly discuss about open collector and tri-state output.
17. List out the differences between digital combinational and sequential circuits?

UNIT-III: EMBEDDED FIRMWARE DESIGN

Syllabus

Embedded Firmware design approaches, Embedded Firmware development languages, ISR concept, Interrupt sources, Interrupt
servicing mechanism, Multiple interrupts, DMA, Device driver programming, Concepts of C versus Embedded C and Compiler
versus Cross-compiler.
QUESTION BANK

1. Write a note on C versus embedded C and compiler versus cross compiler.

2. What is interrupt? Explain multiple interrupts with example.
3. Explain the conversion process from source file to object file translation.
4. Write and explain the advantages of high level based development.
5. Discuss the mixing assembly with high level language and mixing high level language with assembly.
6. What is a Device Driver? Explain different types of device drivers and use of them.
7. Explain the following: (i) interrupt (ii) Interrupt Vector address and (iii) Interrupt Service Routine (ISR)?
Explain the role of ISR in an embedded application development
8. Briefly discuss about the different types of device drivers used in an embedded system along with their usage.
9. What are the different possible sources of interrupts? Explain different interrupt service mechanisms.
10. What is a device driver? Explain the programming of the device driver with an example.
11. Explain the working of DMA with appropriate diagrams.
12. Discuss the development procedure for parallel port device driver
13. Explain any one of Embedded firmware design approaches in detail?
14. Tabulate the concepts of compiler and cross compiler relevant to an Embedded Firmware?
15. Explain the advantages and disadvantages of high level language based embedded firmware development.
16. Explain the advantages and disadvantages of Assembly language based embedded firmware development.
17. What is ISR? explain about Interrupt servicing mechanism.
18. What is interrupt? What is its role in embedded application development?
 UNIT-IV: REAL TIME OPERATING SYSTEM & HARDWARE SOFTWARE CO-DESIGN

Syllabus

Operating system basics, Types of operating systems, Tasks, Process and Threads, Multiprocessing and Multitasking, Task
Scheduling, Threads, Processes and Scheduling, Task communication, Task synchronisation, Device Drivers.: Fundamental
Issues in Hardware Software Co-Design, Computational models in embedded design, Hardware software Trade-offs,
Integration of Hardware and Firmware, ICE.

QUESTION BANK

1. What is shared memory? Explain different mechanisms are adopted to implement shared memory.
2. What are the building blocks of UML? Explain it.
3. Write and explain the basic functions of real time kernel.
4. Explain data flow graph and state machine model in embedded design.
5. Define process? Draw the processor state transition diagram and explain it.
6. Define message passing? Explain how the message passing is classified.
7. What is dead lock? List and explain different conditions favoring a deadlock situation.
8. Explain the fundamental issues in hardware software co-design.
9. Compare various Task scheduling algorithms in RTOS.
10. Differentiate between Hardware and Software Co-Design with all the salient features of them.
11. In a real time system having periodic Tasks T1, T2, T3 and an aperiodic task T4 all requesting at time t = 0
have the following properties
Task Period Execution Time Dead Line

T1 210 70 210

T2 70 21 70

T3 140 28 140

T4 aperiodic 80 420

(i) Calculate the utilization ratios and hence find the scheduling.
(ii) Determine whether the tasks can meet deadlines.
12. Explain the important Hardware Software Tradeoffs in Hardware Software Partitioning.
13. Discuss how ICE is useful for testing an Embedded System with neat diagram.
14. What are pseudo-ops? What is the use of it in assembly language programming?
15. Discuss about Multiprocessing and Multitasking techniques used in RTOS?
16. What is the difference between general purpose kernel and real time kernel? Give example.
17. Explain the different multitasking models in operating system context
18. What is task scheduling? Explain Round Robin scheduling algorithm
19. Explain about how to choose an RTOS
20. Explain the architecture of device driver
21. What is critical section? What are the different techniques to control critical section?
22. Explain the difference between super loop based and OS based embedded firmware design.
23. Three processes with process IDs P1, P2, P3 with estimated completion time 12, 10, 2 milliseconds
respectively enters the ready queue together in the order P2, P3, P1. Process P4 with estimated execution
completion time 4 milliseconds enters the Ready queue after 8 milliseconds. Calculate the waiting time and
Turn Around Time (TAT) for each process and the average waiting time and Turn Around Time
(Assuming there is no I/O waiting for the processes) in the FIFO scheduling.
24. What is IDLEPROCESS? What is the significance of IDLEPROCESS in the process scheduling context?
25. Explain Thread context switch and the various activities performed in thread context switching for user
level and kernel level threads.
26. What is hardware software co-design? Explain the fundamental issues in hardware software co-design?
27. Explain Round Robin process scheduling with interrupts.
 28. What is kernel space and user space? How is kernel space and user space interfaced?
29. Explain the different task communication synchronization issues encountered in interprocess
communication
30. Compare various Task scheduling algorithms in RTOS.

UNIT-V: EMBEDDED SYSTEM DEVELOPMENT

Syllabus
The integrated development environment, Types of files generated on cross-compilation, Deassembler/Decompiler, Simulators,
Emulators and Debugging, Target hardware debugging, Boundary Scan, Embedded Software development process and tools.

QUESTION BANK

1. Explain various elements of an embedded system development environment.

2. Explain the various details held by a List file generated during the process of cross-compiling an
embedded C project.
3. Explain the role of integrated development environment (IDE) for embedded software development.
4. Explain the various details held by a Map file generated during the process of cross-compiling an
embedded C project.
5. Explain the format of Hex records in an Intel Hex file.
6. What are the different techniques available for embedded firmware debugging? Explain them in
detail.
7. What is the difference between assembler and disassembler? State their uses in embedded application
development.
8. Explain the boundary scan based hardware debugging in detail.
9. What is a simulator? Explain the features, advantages and limitations of simulator based debugging
10. Explain the role of Integrated Development Environment (IDE) in the design of an Embedded System
application.
11. Differentiate between Hardware and Software Co-Design with all the salient features of them.
12. Explain various techniques used for uploading the code in to the target Hardware.
13. Explain different cross development tools for an embedded system.
14. Explain all the software development tools available in IDE.
15. Explain the advantages and limitations of simulator based debugging
16. Draw and explain the integrated embedded system development environment.
17. Write notes on Embedded software development-process?
18. Explain in detail about different files generated during the cross compilation of an Embedded C file
19. What is a monitor program? Explain role in embedded firmware debugging.
20. Explain the different tools used for hardware debugging
21. Explain the various elements of an embedded system development environment
22. Explain in detail about Boundary scan
23. What is ROM emulator? Explain ICE based debugging in detail.
24. Describe in detail the improvements over firmware debugging starting from the most primitive type of
debugging to the most sophisticated on chip debugging.
25. What are the different techniques available for embedded firmware debugging? Explain them in detail.
26. Explain different files generated on cross-compilation and also explain about decompiler.
 UNIT-VI: EMBEDDED SYSTEM IMPLEMENTATION AND TESTING
Syllabus
The main software utility tool, CAD and the hardware, Translation tools-Pre-processors, Interpreters, Compilers and Linkers,
Debugging tools, Quality assurance and testing of the design, Testing on host machine, Simulators, Laboratory Tools.

QUESTION BANK

1. Explain Computer-Aided Design (CAD) and hardware.

2. Differentiate static and dynamic testing.
3. Draw the compilation diagram and explain it.
4. What is testing? Explain different types of testing.
5. Draw the interpretation diagram and explain it.
6. Explain how testing is done on host machine.
7. What is debugging tool? Explain it.
8. Discuss Simulators and Laboratory tools in detail.
9. Explain the testing steps on host machine. Why host system is used for most of the development?
10. What is a target system? Explain the process of loading Embedded Software into the target system.
11. Explain the following (I) Interpreter, (ii) Compiler and (iii) Linker
12. Compare various Laboratory tools used for embedded system implementation and testing.
13. Explain in detail the testing process involved in developing an embedded system.
14. Explain how the compiling needs of an embedded system are different from that of general purpose computer
with suitable examples.
15. Explain the following Laboratory Tools (i) Logic Probe (ii) Oscilloscope (iii) Logic Analyzer (iv) System
Monitor Code
16. Explain at least four models that are used for testing an Embedded System.
17. Explain about Laboratory instruments for testing the embedded system.
18. Write short notes on quality assurance and testing of the embedded system design.
19. Explain in detail about below terms a) Interpreters b) Simulator c) Linkers
20. a) Explain in detail Translation tools-Pre-processors b) Explain about Laboratory Tool
21. Explain about main software utility tool
22. Explain the important features of compilers and linkers that are relevant to embedded system?
23. List and describe the translation tools used in an embedded system
24. List and describe the debugging tools used in an embedded system.
 EMBEDDED SYSTEMS
ASSIGNMENT QUESTIONS

UNIT-1
1. Distinguish between a sensor and an actuator. Also explain their role in an embedded
system with suitable examples
2. Explain how Digital Signal processor and Media processor are different than a general
purpose processor and also compare them.
3. Explain about Domain Specific Embedded System application by taking an Automotive
Embedded System (AES) as an example.
4. What are the different types of memories used in Embedded System design? Explain the
role of each.

UNIT-2
1. What are serial communication devices? Explain.
2. Explain the working of watchdog timer and also explain about control and status
registers.
3. Explain briefly about parallel device ports.
4. Explain the purpose of a Real Time Clock and its functionality in an embedded system.

UNIT-3
1. Explain the advantages and disadvantages of Assembly language based embedded
firmware development.
2. What is Device driver? explain about device driver programming
3. Explain the following: (i) interrupt (ii) Interrupt Vector address and (iii) Interrupt Service
Routine (ISR)? Explain the role of ISR in an embedded application development
4. Explain the working of DMA with appropriate diagrams.

UNIT-4

1. Briefly explain (i) Task scheduling (ii) Hardware software trade-offs

2. Define process? Draw the processor state transition diagram and explain it.
3. Discuss how ICE is useful for testing an Embedded System with neat diagram.
4. Explain different Computational models in embedded design
 UNIT-5
1. Explain the role of integrated development environment (IDE) for embedded software
development.
2. What are the different techniques available for embedded firmware debugging? Explain
them in detail.
3. What is a simulator? Explain the features, advantages and limitations of simulator based
debugging
4. Write notes on Embedded software development-process?

UNIT-6
1. Explain Computer-Aided Design (CAD) and hardware.
2. Differentiate static and dynamic testing.
3. Explain the testing steps on host machine. Why host system is used for most of the
development?
4. List and describe the translation tools used in an embedded system
 Code No: R164104D R16 Set No. 1
IV B.Tech I Semester Supplementary Examinations, July/Aug - 2021
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) What is the Purpose of Embedded Systems? [2]
b) What is watch dog timer? [2]
c) Compare the concepts of C versus Embedded C [3]
d) What is kernel? What are the services of Kernel? [3]
e) What high-level categories do development tools typically fall under? [2]
f) What is the difference between a loader and a linker? [2]

PART–B (4x14 = 56 Marks)

2. a) What are the Operational Quality Attributes? Explain with examples. [7]
b) What are the unique Characteristics of Embedded systems? [7]

3. a) List different input devices? Explain the significance of input devices. [7]
b) What are the analog and digital electronic components? Explain [7]

4. a) What are the basic approaches for the design and implementation of embedded [7]
firmware? Explain any one approach.
b) Discuss about interrupt servicing mechanism. [7]

5. a) What are the different types of Operating Systems? Explain [7]

b) What is IPC? Mention the two methods available for it. [7]

6. a) What are the Embedded software development tools? Discuss about Target [7]
machines.
b) What are some features that differentiate compiling needs in embedded systems [7]
versus in other types of computer systems?

7. a) List and define the four models under which testing techniques fall. Within [7]
each of these models, what are five types of testing that can occur?
b) List and describe four real-world examples of each type of debugging tool [7]

1 of 1

||''|'''|''|'|''''||
 Code No: R164104D R16 Set No. 1
IV B.Tech I Semester Regular/Supplementary Examinations, March - 2021
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) Write short notes on large scale embedded systems. [3]
b) Define watchdog timer. List the applications. [3]
c) What is Assembly language programming? [2]
d) List different types of RTOS? Explain any one. [2]
e) Define and Explain boundary scan. [2]
f) What are Laboratory Tools? [2]
PART–B (4x14 = 56 Marks)
2. a) Explain the different classifications of Embedded Systems. Give an example for [7]
each.
b) What is Actuator? Explain its role in Embedded System Design? Illustrate with an [7]
example.

3. a) Explain the sequence of operations for communicating with an I2c slace device. [7]
b) Explain the purpose of (i) Counting Device and (ii) Real Time Clock in an [7]
embedded system.

4. a) What is Device driver? Explain about device driver programming. [7]

b) List out the differences between an architecture specific device driver and a [7]
generic device driver.

5. a) Explain how thread and process are used in an embedded system. [7]
b) Differentiate between Hardware and Software Co-Design with all the salient [7]
features of them.

6. a) What is a monitor program? Explain role in embedded firmware debugging. [7]

b) Explain the advantages and limitations of simulator based debugging. [7]

7. a) Explain at least four models that are used for testing an Embedded System. [7]
b) Write short notes on Translation Tools. [7]

1 of 1

||''|'''|''|'|''''||
 Code No: R164104D R16 Set No. 2
IV B.Tech I Semester Regular/Supplementary Examinations, March - 2021
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) What is embedded system? Explain it. [3]
b) Explain the operation of transistor based relay driver circuit. [3]
c) What is macro in embedded C. [2]
d) What is ICE? Explain it. [2]
e) What are the limitations of simulator base debugging? [2]
f) What are the various simulators used for Embedded system testing. [2]
PART–B (4x14 = 56 Marks)
2. a) What are the different types of memories used in Embedded System design? [7]
Explain the role of each.
b) Explain the difference between Embedded Systems and General Computing [7]
Systems.

3. a) Explain the role of Watchdog timer in embedded system. [7]

b) Compare the data transfer using serial and parallel port devices along with their [7]
advantages and disadvantages.

4. a) Explain the advantages and disadvantages of high level language based [7]
embedded firmware development.
b) What is interrupt? Explain its role in embedded application development. [7]

5. a) Discuss how ICE is useful for testing an Embedded System with neat diagram. [7]
b) Explain the architecture of device drivers. [7]

6. a) Explain in detail about different files generated during the cross compilation of [7]
an Embedded C file.
b) State the uses of assembler and dissembler in embedded application [7]
development.

7. a) Explain in detail the testing process involved in developing an embedded system. [7]
b) Explain in detail about below terms: [7]
i) Interpreters ii) Simulator

1 of 1

||''|'''|''|'|''''||
 Code No: R164104D R16 Set No. 3
IV B.Tech I Semester Regular/Supplementary Examinations, March - 2021
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****
PART–A (14 Marks)
1. a) What are the applications of embedded systems? [3]
b) What is the role of reset circuit in embedded systems? [3]
c) What is the difference between C and Embedded C. [2]
d) Explain multi task and their functions in embedded system. [2]
e) What are the advantages of simulator base debugging? [2]
f) What is the use of host machine for embedded system? [2]
PART–B (4x14 = 56 Marks)
2. a) Distinguish between a sensor and an actuator. Explain their role in an embedded [7]
system with suitable examples.
b) Explain about application specific embedded system with suitable example. [7]

3. a) Discuss Real time clock with respect to an Embedded Hardware. [7]

b) Compare the operation of ZigBee and Wi-Fi networks. [7]

4. a) Discuss about compiler and cross compiler with respect to Embedded Firmware. [7]
b) Explain structure in the 'Embedded-C' programming context. Explain the [7]
significance of structure over normal variables.

5. a) Explain the important Hardware Software Tradeoffs in Hardware Software [7]

Partitioning.
b) Explain how to choose an RTOS. [7]

6. a) Write notes on Embedded software development-process. [7]

b) Explain in detail about Boundary scan. [7]

7. a) Explain how the compiling needs of an embedded system are different from that [7]
of general purpose computer with suitable examples.
b) Compare various Laboratory tools used for embedded system implementation and [7]
testing.

1 of 1

||''|'''|''|'|''''||
 Code No: R164104D R16 Set No. 4
IV B.Tech I Semester Regular/Supplementary Examinations, March - 2021
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****
PART–A (14 Marks)
1. a) Discuss various embedded systems requirements. [3]
b) What are Timer and counting devices? [3]
c) What are concepts of Embedded C. [2]
d) Explain the functional and non-functional requirements to choose a RTOS. [2]
e) What are the types of files generated on cross-compilation? [2]
f) Describe preprocessor and Interpreters. [2]
PART–B (4x14 = 56 Marks)
2. a) What is non-operational quality attributes? Explain the important non-operational [7]
Quality attributes to be considered in any embedded system design.
b) Write the details about the embedded hardware units and devices in a system. [7]

3. a) What are the various serial communication devices used in an Embedded [7]
Hardware? Explain any one of them.
b) Explain about Timer and counting devices in Embedded Hardware. [7]

4. a) Explain any one of Embedded firmware design approaches in detail. [7]

b) With the help of appropriate diagrams explain the working of DMA. [7]

5. a) Compare various Task scheduling algorithms in RTOS. [7]

b) Explain the different multitasking models in operating system context. [7]

6. a) Draw and explain the integrated embedded system development environment. [7]
b) What is ROM emulator? Explain ICE based debugging in detail. [7]

7. a) Explain in detail Translation tools-Pre-processors. [7]

b) In addition to CAD, what other techniques are used to design complex circuits. [7]

1 of 1

||''|'''|''|'|''''||
 Code No: R164104D R16 Set No. 1
IV B.Tech I Semester Regular Examinations, October/November - 2019
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) What is an embedded system? [2]
b) What is current limiting Resistor in embedded application? [3]
c) Write the execution steps for embedded firmware. [3]
d) Define Process Management. [2]
e) What is decompiler? [2]
f) Define IDE(Integrated Development Environment) tools? [2]

PART–B (4x14 = 56 Marks)

2. a) Write the history of embedded system. [7]
b) Differentiate RISC and CISC. [7]

3. a) What is sequential circuit? Explain with examples. [7]

b) What are serial communication devices? Explain. [7]

4. a) Explain the advantages of assembly language based development. [7]

b) Write a note on C versus embedded C and compiler versus cross compiler. [7]

5. a) What is shared memory? Explain different mechanisms are adopted to implement

shared memory. [7]
b) What are the building blocks of UML? Explain it. [7]

6. a) Explain various elements of an embedded system development environment. [7]

b) Explain the various details held by a List file generated during the process of
cross-compiling an embedded C project. [7]

7. a) Explain Computer-Aided Design (CAD) and hardware. [7]

b) Differentiate static and dynamic testing. [7]

1 of 1

|''|'''||''||'''||||
 Code No: R164104D R16 Set No. 2
IV B.Tech I Semester Regular Examinations, October/November - 2019
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) Write the major application areas of embedded system. [3]
b) Explain the usage of capacitors and inductors in embedded hardware circuit. [3]
c) Write about super loop based approach. [2]
d) Define file system management. [2]
e) What is the difference between simulator and an emulator? [2]
f) What is complier? [2]

PART–B (4x14 = 56 Marks)

2. a) Write and explain the classification of embedded systems. [7]
b) Explain the onboard communication interfaces. [7]

3. a) What is Latch? Draw and explain the latch. [7]

b) Explain briefly about parallel device ports. [7]

4. a) Write and explain the drawbacks of assembly language based development. [7]
b) What is Interrupt? Explain multiple interrupts with examples. [7]

5. a) Write and explain the basic functions of real time kernel. [7]
b) Explain data flow graph and state machine model in embedded design. [7]

6. a) Explain the role of Integrated Development Environment (IDE) for embedded

Software development. [7]
b) Explain the various details held by a Map file generated during the process of
cross-compiling an embedded C project. [7]

7. a) Draw the compilation diagram and explain it. [7]

b) What is testing? Explain the types of testing. [7]

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 Code No: R164104D R16 Set No. 3
IV B.Tech I Semester Regular Examinations, October/November - 2019
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) What is typical embedded system? [2]
b) What is Schottky diode's role in embedded applications? [3]
c) Write about super loop based design. [3]
d) Define Non-Preemptive multitasking. [2]
e) What is monitor program? [2]
f) What is interpreter? [2]
PART–B (4x14 = 56 Marks)
2. a) Explain the purpose of embedded system. [7]
b) What is ROM? How the ROM classified? Explain it. [7]

3. a) What is combinational circuit? Explain with example. [7]

b) Explain briefly about wireless devices. [7]

4. a) Explain the conversion process from source file to object file translation. [7]
b) Explain briefly about interrupt servicing mechanism. [7]

5. a) Define process? Draw the processor state transition diagram and explain it. [7]
b) Define message passing? Explain how the message passing is classified. [7]

6. a) Explain the format of Hex records in an Intel Hex file. [7]

b) What are the different techniques available for embedded firmware debugging?
Explain them in detail. [7]

7. a) Draw the interpretation diagram and explain it. [7]

b) Explain how testing will done on host machine. [7]

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Code No: R164104D R16 Set No. 4
IV B.Tech I Semester Regular Examinations, October/November - 2019
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) Differentiate Harvard architecture and Von-Neumann architecture. [3]
b) How transistors are used in embedded hardware circuit? [3]
c) Write the drawbacks of super loop. [2]
d) Define thread. [2]
e) What is On Chip Debugging? [2]
f) What is preprocessor? [2]

PART–B (4x14 = 56 Marks)

2. a) What is RAM? Explain the categories of RAM.
b) Define sensors? Explain the I/O subsystem. [7]

3. a) What is multiplexer (mux)? Explain it. [7]

b) Explain briefly about watchdog timer. [7]

4. a) Write and explain the advantages of high level based development. [7]
b) Discuss the Mixing Assembly with high level language and mixing high level
language with assembly. [7]

5. a) What is deadlock? List and explain different conditions favoring a deadlock

situation. [7]
b) Explain the fundamental issues in hardware software co-design. [7]

6. a) What is the difference between assembler and disassembler? State their uses in
embedded application development. [7]
b) Explain the Boundary Scan based hardware debugging in details. [7]

7. a) What is debugging tool? Explain it. [7]

b) Discuss Simulators and Laboratory tools in details [7]

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 Code No: R164104D R16 Set No. 1
IV B.Tech I Semester Regular Examinations, October/November - 2019
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) What is an embedded system? [2]
b) What is current limiting Resistor in embedded application? [3]
c) Write the execution steps for embedded firmware. [3]
d) Define Process Management. [2]
e) What is decompiler? [2]
f) Define IDE(Integrated Development Environment) tools? [2]

PART–B (4x14 = 56 Marks)

2. a) Write the history of embedded system. [7]
b) Differentiate RISC and CISC. [7]

3. a) What is sequential circuit? Explain with examples. [7]

b) What are serial communication devices? Explain. [7]

4. a) Explain the advantages of assembly language based development. [7]

b) Write a note on C versus embedded C and compiler versus cross compiler. [7]

5. a) What is shared memory? Explain different mechanisms are adopted to implement

shared memory. [7]
b) What are the building blocks of UML? Explain it. [7]

6. a) Explain various elements of an embedded system development environment. [7]

b) Explain the various details held by a List file generated during the process of
cross-compiling an embedded C project. [7]

7. a) Explain Computer-Aided Design (CAD) and hardware. [7]

b) Differentiate static and dynamic testing. [7]

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 Code No: R164104D R16 Set No. 2
IV B.Tech I Semester Regular Examinations, October/November - 2019
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) Write the major application areas of embedded system. [3]
b) Explain the usage of capacitors and inductors in embedded hardware circuit. [3]
c) Write about super loop based approach. [2]
d) Define file system management. [2]
e) What is the difference between simulator and an emulator? [2]
f) What is complier? [2]

PART–B (4x14 = 56 Marks)

2. a) Write and explain the classification of embedded systems. [7]
b) Explain the onboard communication interfaces. [7]

3. a) What is Latch? Draw and explain the latch. [7]

b) Explain briefly about parallel device ports. [7]

4. a) Write and explain the drawbacks of assembly language based development. [7]
b) What is Interrupt? Explain multiple interrupts with examples. [7]

5. a) Write and explain the basic functions of real time kernel. [7]
b) Explain data flow graph and state machine model in embedded design. [7]

6. a) Explain the role of Integrated Development Environment (IDE) for embedded

Software development. [7]
b) Explain the various details held by a Map file generated during the process of
cross-compiling an embedded C project. [7]

7. a) Draw the compilation diagram and explain it. [7]

b) What is testing? Explain the types of testing. [7]

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 Code No: R164104D R16 Set No. 3
IV B.Tech I Semester Regular Examinations, October/November - 2019
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) What is typical embedded system? [2]
b) What is Schottky diode's role in embedded applications? [3]
c) Write about super loop based design. [3]
d) Define Non-Preemptive multitasking. [2]
e) What is monitor program? [2]
f) What is interpreter? [2]
PART–B (4x14 = 56 Marks)
2. a) Explain the purpose of embedded system. [7]
b) What is ROM? How the ROM classified? Explain it. [7]

3. a) What is combinational circuit? Explain with example. [7]

b) Explain briefly about wireless devices. [7]

4. a) Explain the conversion process from source file to object file translation. [7]
b) Explain briefly about interrupt servicing mechanism. [7]

5. a) Define process? Draw the processor state transition diagram and explain it. [7]
b) Define message passing? Explain how the message passing is classified. [7]

6. a) Explain the format of Hex records in an Intel Hex file. [7]

b) What are the different techniques available for embedded firmware debugging?
Explain them in detail. [7]

7. a) Draw the interpretation diagram and explain it. [7]

b) Explain how testing will done on host machine. [7]

1 of 1

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Code No: R164104D R16 Set No. 4
IV B.Tech I Semester Regular Examinations, October/November - 2019
EMBEDDED SYSTEMS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any FOUR questions from Part-B
*****

PART–A (14 Marks)

1. a) Differentiate Harvard architecture and Von-Neumann architecture. [3]
b) How transistors are used in embedded hardware circuit? [3]
c) Write the drawbacks of super loop. [2]
d) Define thread. [2]
e) What is On Chip Debugging? [2]
f) What is preprocessor? [2]

PART–B (4x14 = 56 Marks)

2. a) What is RAM? Explain the categories of RAM.
b) Define sensors? Explain the I/O subsystem. [7]

3. a) What is multiplexer (mux)? Explain it. [7]

b) Explain briefly about watchdog timer. [7]

4. a) Write and explain the advantages of high level based development. [7]
b) Discuss the Mixing Assembly with high level language and mixing high level
language with assembly. [7]

5. a) What is deadlock? List and explain different conditions favoring a deadlock

situation. [7]
b) Explain the fundamental issues in hardware software co-design. [7]

6. a) What is the difference between assembler and disassembler? State their uses in
embedded application development. [7]
b) Explain the Boundary Scan based hardware debugging in details. [7]

7. a) What is debugging tool? Explain it. [7]

b) Discuss Simulators and Laboratory tools in details [7]

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 Code No: RT42043C R13 Set No. 1
IV B.Tech II Semester Regular/Supplementary Examinations, April/May - 2019
EMBEDDED SYSTEMS
(Common to Electronics and Communications Engineering, Electronics and
Instrumentation Engineering and Electronics and Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) List the different categories of Embedded Systems based on the area of
applications. [3]
b) Explain any two wireless communication devices used in an Embedded System. [4]
c) Explain the different files generated during the cross-compilation of an Embedded
C file. [3]
d) Explain multi task and their functions in embedded system. [4]
e) Compare Emulator and Simulator along with their major differences. [4]
f) Distinguish between software and hardware based debugging. [4]

PART–B (3x16 = 48 Marks)

2. a) Explain the operational quality attributes to be considered in the design of an
embedded system. [8]
b) Discuss the Application Specific Embedded system with an example. [8]

3. a) Explain about serial communication devices and parallel device ports. [8]
b) Discuss the significance of Watchdog timer in an Embedded System. [8]

4. a) What is a Device Driver? Explain different types of device drivers and use of them. [8]
b) Explain different Embedded Firmware design approaches. [8]

5. a) Describe Embedded programming tools (i) Integrated Development Environment,

(ii) Compiler and (iii) Cross-compiler. [8]
b) Explain different files generated on cross-compilation and also explain about
decompiler. [8]

6. a) What is a simulator? Explain the features, advantages and limitations of simulator

based debugging [8]
b) Explain the role of Integrated Development Environment (IDE) in the design of an
Embedded System application [8]

7. a) Explain the testing steps on host machine. Why host system is used for most of the
development? [8]
b) What is a target system? Explain the process of loading Embedded Software into
the target system. [8]
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 Code No: RT42043C R13 Set No. 2
IV B.Tech II Semester Regular/Supplementary Examinations, April/May - 2019
EMBEDDED SYSTEMS
(Common to Electronics and Communications Engineering, Electronics and
Instrumentation Engineering and Electronics and Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) List the Application-specific and Domain Specific examples of an embedded
System. [3]
b) Distinguish between serial and parallel communication devices. [4]
c) Compare Compiler and Cross-compiler. [4]
d) Explain the functional and non-functional requirements to choose a RTOS. [4]
e) What is an IDE? [3]
f) List out the translation tools used in an Embedded system. [4]

PART–B (3x16 = 48 Marks)

2. a) Explain how Digital Signal processor and Media processor are different than a
general purpose processor and also compare them. [8]
b) Distinguish between a sensor and an actuator. Also explain their role in an
embedded system with suitable examples. [8]

3. a) Explain the purpose of a Real Time Clock and its functionality in an embedded
system. [8]
b) Explain serial interface, timer and counters along with their usage in an embedded
processor. [8]

4. a) Explain the following: (i) interrupt (ii) Interrupt Vector address and (iii) Interrupt
Service Routine (ISR)? Explain the role of ISR in an embedded application
development [8]
b) Briefly discuss about the different types of device drivers used in an embedded
system along with their usage. [8]

5. a) Compare various Task scheduling algorithms in RTOS. [8]

b) Differentiate between Hardware and Software Co-Design with all the salient
features of them. [8]

6. a) Explain how cross-compiler is used for host and target machines? [8]
b) Discuss Embedded Software Development Tools in details. [8]

7. a) Explain the following (i) Interpreter, (ii) Compiler and (iii) Linker [8]
b) Compare various Laboratory tools used for embedded system implementation and
testing. [8]
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 Code No: RT42043C R13 Set No. 3
IV B.Tech II Semester Regular/Supplementary Examinations, April/May - 2019
EMBEDDED SYSTEMS
(Common to Electronics and Communications Engineering, Electronics and
Instrumentation Engineering and Electronics and Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) List out the different communication Interface used in an embedded system. [3]
b) Explain the role of watchdog timer in a single board computer. [4]
c) Give the functionalities of an Embedded device driver. [4]
d) Explain different Computational models used in an Embedded System design. [4]
e) What is an IDE and what is the selection criterion of an IDE. [4]
f) Describe preprocessor and Interpreters. [3]

PART–B (3x16 = 48 Marks)

2. a) Explain the classification of the embedded systems and explain each of them. [8]
b) Explain the PCB design steps with neat diagrams and also give the details of the
components and elements facts in the process flow. [8]

3. a) Explain the purpose of (i) Counting Device and (ii) Real Time Clock in an
embedded system, [8]
b) Explain different I/O subsystems of embedded systems. [8]

4. a) What are the different possible sources of interrupts? Explain different interrupt
service mechanisms. [8]
b) What is a device driver? Explain the programming of the device driver with an
example. [8]

5. a) In a real time system having periodic Tasks T1, T2, T3 and an aperiodic task T4
all requesting at time t = 0 have the following properties.
Task Period Execution Time Dead Line
T1 210 70 210
T2 70 21 70
T3 140 28 140
T4 aperiodic 80 420
(i) Calculate the utilization ratios and hence find the scheduling.
(ii) Determine whether the tasks can meet deadlines. [8]
b) Explain the important Hardware Software Tradeoffs in Hardware Software
Partitioning. [8]
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 Code No: RT42043C R13 Set No. 3
6. a) Explain various techniques used for uploading the code in to the target
Hardware. [8]
b) Discuss the Boundary Scan based hardware debugging in detail. [8]

7. a) Explain in detail the testing process involved in developing an embedded system. [8]
b) Explain how the compiling needs of an embedded system are different from that
of general purpose computer with suitable examples. [8]

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 Code No: RT42043C R13 Set No. 4
IV B.Tech II Semester Regular/Supplementary Examinations, April/May - 2019
EMBEDDED SYSTEMS
(Common to Electronics and Communications Engineering, Electronics and
Instrumentation Engineering and Electronics and Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****

PART–A (22 Marks)

1. a) Explain the purpose of an Embedded System. [4]
b) Explain the role of the analog electronics components like resistor, transistor,
capacitor and diode in embedded hardware design. [3]
c) Explain the serial communication SCI and SPI and compare them. [4]
d) Compare In System Programming (ISP) and In Application Programming (IAP). [4]
e) Explain JTAG based boundary scanning for hardware testing. [4]
f) Explain how CAD and the hardware are useful in Embedded System
Implementation. [3]

PART–B (3x16 = 48 Marks)

2. a) Explain the quality and non-quality attributes of an embedded system. [8]
b) Explain about Domain Specific Embedded System application by taking an
Automotive Embedded System (AES) as an example. [8]

3. a) Explain the working of watchdog timer and also explain about control and status
registers. [8]
b) Compare the data transfer using serial and parallel port devices along with their
advantages and disadvantages. [8]

4. a) Explain the working of DMA with appropriate diagrams. [8]

b) Discuss the development procedure for parallel port device driver. [8]

5. a) Explain how thread and process are used in an embedded system. [8]
b) Discuss how ICE is useful for testing an Embedded System with neat diagram. [8]

6. a) Explain different cross development tools for an embedded system. [8]

b) Explain all the software development tools available in IDE. [8]

7. a) Explain the following Laboratory Tools (i) Logic Probe (ii) Oscilloscope
(iii) Logic Analyzer (iv) System Monitor Codes [8]
b) Explain at least four models that are used for testing an Embedded System. [8]

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 Code No: RT42043C R13 Set No. 1
IV B.Tech II Semester Regular/Supplementary Examinations, April - 2018
EMBEDDED SYSTEMS
(Common to Electronics and Communications Engineering, Electronics and
Instrumentation Engineering & Electronics and Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) What is the difference between big -endian and little-endian processors? [4]
b) Explain the role of logic gates in embedded hardware design? [4]
c) What is task control block (TCB)? [4]
d) What is relocatable code? [3]
e) List the different files generated during the cross compilation? [4]
f) What is the use of host machine for embedded system? [3]

PART–B (3x16 = 48 Marks)

2. a) What is non-operational quality attributes? Explain the important non-operational
quality attributes to be considered in any embedded system design. [8]
b) Explain about application specific embedded system with suitable example? [8]

3. a) Explain the role of decoders in embedded hardware development. Draw the

circuit diagram for interfacing a 3-bit binary decoder with 8051. [8]
b) Explain the role of watchdog timer in Embedded System with suitable diagram. [8]

4. a) Explain the various activities involved in the creation of process and threads. [8]
b) Three processes with process IDs P1, P2, P3 with estimated completion time 12,
10, 2 milliseconds respectively enters the ready queue together in the order P2,
P3, P1. Process P4 with estimated execution completion time 4 milliseconds
enters the Ready queue after 8 milliseconds. Calculate the waiting time and Turn
Around Time (TAT) for each process and the average waiting time and Turn
Around Time (Assuming there is no I/O waiting for the processes) in the FIFO
scheduling. [8]

5. a) Explain the high level language based embedded firmware development. [8]
b) What are pseudo-ops? What is the use of it in assembly language programming? [8]

6. a) State the uses of assembler and deassembler in embedded application

development. [8]
b) Explain the advantages and limitations of simulator based debugging. [8]

7. a) Explain about Laboratory instruments for testing the embedded system. [8]
b) Write short notes on quality assurance and testing of the embedded system
design. [8]

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 Code No: RT42043C R13 Set No. 2
IV B.Tech II Semester Regular/Supplementary Examinations, April - 2018
EMBEDDED SYSTEMS
(Common to Electronics and Communications Engineering, Electronics and
Instrumentation Engineering & Electronics and Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) List out the major application areas of embedded systems. [4]
b) What is the difference between multiplexer and de-multiplexer? [4]
c) Explain the process management in the operating system context. [3]
d) Explain the format of assembly language instruction. [3]
e) Explain the various details stored in an object file generated during the cross
compilation. [4]
f) List the various simulators used for embedded system testing. [4]

PART–B (3x16 = 48 Marks)

2. a) What is programmable peripheral Interface Device? Explain the interfacing of
8255 PPI with an 8-bit microprocessor/controller. [8]
b) Explain the different classifications of Embedded Systems. Give an example for
each. [8]

3. a) What is a sequential circuit? Draw a 3-bit binary counter using T flip flop and
explain its functioning. [8]
b) Explain the role of real time clock in embedded systems with suitable diagram? [8]

4. a) What is IDLEPROCESS? What is the significance of IDLEPROCESS in the

process scheduling context? [8]
b) Explain Thread context switch and the various activities performed in thread
context switching for user level and kernel level threads. [8]

5. a) Explain the difference between super loop based and OS based embedded
firmware design. [8]
b) List out the limitations/drawbacks of assembly language based embedded
firmware development. [8]

6. a) Explain the boundary scan based hardware debugging in detail. [8]

b) What is ROM emulator? Explain ICE based debugging in detail. [8]

7. a) Explain the important features of compilers and linkers that are relevant to
embedded system? [8]
b) List and describe the translation tools used in an embedded system. [8]

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 Code No: RT42043C R13 Set No. 3
IV B.Tech II Semester Regular/Supplementary Examinations, April - 2018
EMBEDDED SYSTEMS
(Common to Electronics and Communications Engineering, Electronics and
Instrumentation Engineering & Electronics and Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) List the differences between embedded system and general computing system. [3]
b) What is the difference between synchronous and asynchronous sequential
circuits? [4]
c) Explain the task scheduling in the operating system context. [4]
d) What is absolute object file? [3]
e) Explain the various details held by map file generated during the cross
compilation. [4]
f) How the target systems differ from the final embedded system? [4]

PART–B (3x16 = 48 Marks)

2. a) What are the different types of memories used in Embedded System design?
Explain the role of each. [8]
b) Discuss the concept of load store architecture and instruction pipelining. [8]

3. a) What is a combinational circuit? Draw a combinational circuit for embedded

application development. [8]
b) With suitable diagram briefly discuss about open collector and tri-state output. [8]

4. a) What is hardware software co-design? Explain the fundamental issues in

hardware software co-design? [8]
b) Explain Round Robin process scheduling with interrupts. [8]

5. a) Explain the different embedded firmware design approaches in detail. [8]

b) List out the advantages of assembly language based embedded firmware
development. [8]

6. a) Describe in detail the improvements over firmware debugging starting from the
most primitive type of debugging to the most sophisticated on chip debugging. [8]
b) Explain the different tools used for hardware debugging. [8]

7. a) List and describe the debugging tools used in an embedded system. [8]
b) Briefly discuss about testing on host machine. [8]

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 Code No: RT42043C R13 Set No. 4
IV B.Tech II Semester Regular/Supplementary Examinations, April - 2018
EMBEDDED SYSTEMS
(Common to Electronics and Communications Engineering, Electronics and
Instrumentation Engineering & Electronics and Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) What is the difference between PLD and ASIC? [4]
b) List out the analog electronic components in embedded hardware design. [4]
c) Explain the concept of multithreading. [4]
d) Explain library file in assembly language. [3]
e) What is a decompiler? [3]
f) Explain the need of editor. [4]

PART–B (3x16 = 48 Marks)

2. a) Give an overview of the different market players of the automotive Embedded
application domain. [8]
b) What is operational quality attributes? Explain the important operational quality
attributes to be considered in any embedded system design. [8]

3. a) What is an integrated circuit? Explain the different types of integrations for ICs.
Give an example for each. [8]
b) List out the differences between digital combinational and sequential circuits? [8]

4. a) What is kernel space and user space? How is kernel space and user space
interfaced? [8]
b) Explain the different task communication synchronization issues encountered in
interprocess communication. [8]

5. a) State the differences between compiler and cross-compiler. Explain the

Concepts of C versus Embedded C. [8]
b) List out the advantages of high level language based embedded firmware
development. [8]

6. a) Explain the role of IDE for embedded software development. [8]

b) What are the different techniques available for embedded firmware debugging?
Explain them in detail. [8]

7. with suitable example briefly discuss about

(i) Linker (ii) Compiler (iii) Interpreters [16]

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 Code No: RT42043C R13 Set No. 1
IV B.Tech II Semester Regular Examinations, April/May - 2017
EMBEDDED SYSTEMS
(Common to Electronics & Communication Engineering, Electronics & Instumentation
Engineering and Electronics & Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) What is meant by Embedded firmware? [3]
b) What are Timer and counting devices? [4]
c) What are concepts of Embedded C? [4]
d) What are the types of RTOS? [3]
e) What are types of files generated on cross-compilation? [4]
f) What are the various simulators used for Embedded system testing? [4]

PART–B (3x16 = 48 Marks)

2. a) Draw and explain the typical Embedded system architecture? [8]
b) Illustrate an application-specific Embedded system with suitable example? [8]

3. a) What are the various serial communication devices used in an Embedded

Hardware? Explain any one of them? [8]
b) Discuss about Real time clock with respect to an Embedded Hardware? [8]

4. a) Explain any one of Embedded firmware design approaches in detail? [8]

b) Tabulate the concepts of compiler and cross compiler relevant to an Embedded
Firmware? [8]

5. a) Discuss about Multiprocessing and Multitasking techniques used in RTOS? [8]

b) Briefly explain (i) Task scheduling (ii) Hardware software trade-offs [8]

6. a) Draw and explain the integrated embedded system development environment. [8]
b) Write notes on Embedded software development-process? [8]

7. Write short notes on the following

a) Translation Tools
b) Debugging Tools [16]

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 Code No: RT42043C R13 Set No. 2
IV B.Tech II Semester Regular Examinations, April/May - 2017
EMBEDDED SYSTEMS
(Common to Electronics & Communication Engineering, Electronics & Instumentation
Engineering and Electronics & Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) What is operational quality attribute? [3]
b) What is the operation of transistor based relay driver circuit [4]
c) What is the difference between C and Embedded C [4]
d) What is process life cycle? [3]
e) What are the advantages of simulator base debugging? [4]
f) What is a target system? How does the target system differ from the final
embedded system? [4]
PART–B (3x16 = 48 Marks)
2. a) What is Digital Signal Processor? Explain the role of DSP in embedded system
design. [8]
b) Explain the different characteristics of embedded systems in detail? [8]

3. a) Explain the role of Watchdog timer in embedded system [8]

b) Compare the operation of ZigBee and Wi-Fi networks [8]

4. a) Explain the advantages and disadvantages of high level language based

embedded firmware development. [8]
b) What is Device driver? explain about device driver programming [8]

5. a) What is the difference between general purpose kernel and real time kernel?
Give example. [8]
b) Explain the different multitasking models in operating system context [8]

6. a) Explain in detail about different files generated during the cross compilation of
an Embedded C file [8]
b) What is a monitor program? Explain role in embedded firmware debugging.
[8]
7. Explain in detail about below terms
a) Interpreters b) Simulator c) Linkers [16]

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 Code No: RT42043C R13 Set No. 3
IV B.Tech II Semester Regular Examinations, April/May - 2017
EMBEDDED SYSTEMS
(Common to Electronics & Communication Engineering, Electronics & Instumentation
Engineering and Electronics & Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) What is non-operational quality attribute? [3]
b) What is role of reset circuit in embedded systems? [4]
c) What is macro in embedded C? [3]
d) What are the activities involved during context switching? [4]
e) What is logic Analyzer? [4]
f) What do you mean by application software for a target system? [4]

PART–B (3x16 = 48 Marks)

2. a) Explain time to market? What is significance in product development? [8]
b) Explain the different communication buses used in automotive application [8]

3. a) Explain the role of Real time clock in embedded system [8]

b) Explain the merits and limitations of parallel port over serial interface [8]

4. a) Explain the advantages and disadvantages of Assembly language based

embedded firmware development. [8]
b) What is ISR? explain about Interrupt servicing mechanism [8]

5. a) What is task scheduling? Explain Round Rabin scheduling algorithm [8]

b) Explain about how to choose an RTOS [8]

6. a) Explain role of integrated development environment for embedded software

development [8]
b) Explain the different tools used for hardware debugging [8]

7. a) Explain in detail Translation tools-Pre-processors [8]

b) Explain about Laboratory Tool [8]

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 Code No: RT42043C R13 Set No. 4
IV B.Tech II Semester Regular Examinations, April/May - 2017
EMBEDDED SYSTEMS
(Common to Electronics & Communication Engineering, Electronics & Instumentation
Engineering and Electronics & Computer Engineering)
Time: 3 hours Max. Marks: 70
Question paper consists of Part-A and Part-B
Answer ALL sub questions from Part-A
Answer any THREE questions from Part-B
*****
PART–A (22 Marks)
1. a) What are the difference between general purpose computing and embedded
systems [4]
b) What is watchdog timer? [3]
c) What is Assembly language programming? [4]
d) What is ICE? [4]
e) What are the limitations of simulator base debugging? [4]
f) What are Laboratory Tools? [3]

PART–B (3x16 = 48 Marks)

2. a) Explain different classification of embedded systems with example [8]
b) Explain the role of embedded systems in automotive domain [8]

3. a) Explain in detail about USB. [8]

b) Explain about Timer and counting devices in Embedded Hardware. [8]

4. a) Explain the different embedded firmware design approaches in detail [8]

b) What is interrupt? What is role embedded application development? [8]

5. a) Explain the architecture of device river [8]

b) What is critical section? What are the different techniques to control critical
section? [8]

6. a) Explain the various elements of an embedded system development environment [8]

b) Explain in detail about Boundary scan [8]

7. a) Explain about main software utility tool [8]

b) What is Quality assurance and testing of the design? Explain in detail. [8]

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