8-layer stackup – Traditional A

Pros, Cons and Challenges

(L1) SIG
Prepeg (thin)
(L2) GND
Core (thick)
(L3) SIG
Prepeg (thin)
(L4) PWR
Core (thick)
(L5) PWR
Prepeg (thin)
(L6) SIG
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG
8-layer stackup – Traditional A
Pros (L1) SIG
Prepeg (thin)
(L2) GND
• It allows to have four layers for routing signals. Core (thick)
(L3) SIG
Prepeg (thin)
(L4) PWR
Core (thick)
(L5) PWR
Prepeg (thin)
(L6) SIG
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG
8-layer stackup – Traditional A
Cons (L1) SIG
Prepeg (thin)
(L2) GND
• Power layers in the middle referenced each other, Core (thick)
causing cross-coupling of power fields. (L3) SIG
• Common mode coupling for signal layers as the are Prepeg (thin)
(L4) PWR
sandwiched between power and ground.
Core (thick)
(L5) PWR
Prepeg (thin)
(L6) SIG
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG
8-layer stackup – Traditional A
Challenges (L1) SIG
Prepeg (thin)
(L2) GND
• Thickening the center core of the board could reduce Core (thick)
cross-coupling but increase coupling to signal layers. (L3) SIG
Prepeg (thin)
(L4) PWR
Core (thick)
(L5) PWR
Prepeg (thin)
(L6) SIG
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG
8-layer stackup – Alternative A
Pros, Cons and Challenges
(L1) SIG
Prepeg (thin)
(L2) GND
Core (thick)
(L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) PWR
Prepeg (thin)
(L6) SIG/GND
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG/PWR
8-layer stackup – Alternative A
Pros (L1) SIG
• Strip lines for most traces, with microstrip traces only Prepeg (thin)
(L2) GND
on the outer layers.
Core (thick)
• Optimized for solid ground planes and high-power (L3) SIG/PWR
planes. Prepeg (thin)
(L4) GND
• Additional Power plane. Core (thick)
(L5) PWR
Prepeg (thin)
(L6) SIG/GND
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG/PWR
8-layer stackup – Alternative A
Cons (L1) SIG
• It is more complex design according to the SIG/GND Prepeg (thin)
(L2) GND
and SIG/PWR pairs.
Core (thick)
(L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) PWR
Prepeg (thin)
(L6) SIG/GND
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG/PWR
8-layer stackup – Alternative A
Challenges (L1) SIG
• Ensuring critical signals are routed inside the board Prepeg (thin)
(L2) GND
and power is poured.
Core (thick)
(L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) PWR
Prepeg (thin)
(L6) SIG/GND
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG/PWR
8-layer stackup – Alternative B
Pros, Cons and Challenges
(L1) SIG/PWR
Prepeg (thin)
(L2) GND
Core (thick)
(L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) GND
Prepeg (thin)
(L6) SIG/PWR
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG/PWR
8-layer stackup – Alternative B
Pros (L1) SIG/PWR
Prepeg (thin)
• Optimized for solid ground planes and high-power (L2) GND
planes. Core (thick)
(L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) GND
Prepeg (thin)
(L6) SIG/PWR
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG/PWR
8-layer stackup – Alternative B
Cons (L1) SIG/PWR
Prepeg (thin)
• It is more complex design according to the SIG/GND (L2) GND
and SIG/PWR pairs. Core (thick)
(L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) GND
Prepeg (thin)
(L6) SIG/PWR
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG/PWR
8-layer stackup – Alternative B
Challenges (L1) SIG/PWR
Prepeg (thin)
• Ensuring critical signals are routed inside the board (L2) GND
and power is poured. Core (thick)

• Less space to route signal layers. (L3) SIG/PWR

Prepeg (thin)
(L4) GND
Core (thick)
(L5) GND
Prepeg (thin)
(L6) SIG/PWR
Core (thick)
(L7) GND
Prepeg (thin)
(L8) SIG/PWR
8-layer stackup – Alternative C
Pros, Cons and Challenges
(L1) SIG/PWR
Prepeg (thin)
(L2) GND
Core (thick)
(L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) SIG/PWR
Prepeg (thin)
(L6) GND
Core (thick)
(L7) SIG/PWR
Prepeg (thin)
(L8) GND
8-layer stackup – Alternative C
Pros (L1) SIG/PWR
• Strip lines for most traces, with microstrip traces only Prepeg (thin)
(L2) GND
on the outer layers.
Core (thick)
• Easy to controlled its impedance and easy to contain (L3) SIG/PWR
fields Prepeg (thin)
(L4) GND
• Optimized for solid ground planes and high-power Core (thick)
planes. (L5) SIG/PWR
Prepeg (thin)
(L6) GND
Core (thick)
(L7) SIG/PWR
Prepeg (thin)
(L8) GND
8-layer stackup – Alternative C
Cons (L1) SIG/PWR
• It is more complex design according to the SIG/GND Prepeg (thin)
(L2) GND
and SIG/PWR pairs.
Core (thick)
• Less space to route signal layers. (L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) SIG/PWR
Prepeg (thin)
(L6) GND
Core (thick)
(L7) SIG/PWR
Prepeg (thin)
(L8) GND
8-layer stackup – Alternative C
Challenges (L1) SIG/PWR
• Ensuring critical signals are routed inside the board Prepeg (thin)
(L2) GND
and power is poured.
Core (thick)
(L3) SIG/PWR
Prepeg (thin)
(L4) GND
Core (thick)
(L5) SIG/PWR
Prepeg (thin)
(L6) GND
Core (thick)
(L7) SIG/PWR
Prepeg (thin)
(L8) GND