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Objective:

The objectives of this experiment are:

• To identify different types of CPUs (such as Intel and AMD) and examine their key
specifications, including model, architecture, core and thread count, clock speed, cache
size, and thermal design power (TDP). This will help build foundational knowledge of
processor capabilities and performance levels.
• To understand and differentiate various CPU socket types (e.g., LGA, PGA, BGA) and
determine their compatibility with respective CPUs and motherboards. Recognizing
socket types is essential to avoid hardware incompatibility issues during CPU installation
or upgrades.
• To demonstrate the correct, safe, and static-free procedures for installing and uninstalling
CPUs. This includes handling the CPU properly, applying thermal paste, aligning socket
pins, and securing the cooling system to ensure the processor operates safely and
efficiently.
• To use CPU-Z, a diagnostic tool, to analyze and verify CPU specifications directly from a
working system. This software helps in understanding real-time CPU performance
metrics such as frequency, voltage, temperature, and core usage.
• To evaluate the importance of effective CPU cooling solutions and their role in
maintaining system performance, preventing overheating, and extending the lifespan of
the processor. The experiment will also highlight different cooling methods and their
practical implications in system design.

Introduction:

• The Central Processing Unit (CPU) is often referred to as the "brain" of the computer. It
is responsible for executing instructions and performing calculations that drive system
performance. The performance of a system heavily depends on the type and capability of
the CPU.
• Selecting the appropriate CPU requires knowledge about socket compatibility. The
socket serves as a mechanical and electrical connection between the CPU and the
motherboard. Using an incompatible socket can lead to system failure or hardware
damage.
• Moreover, CPUs generate heat during operation, which can impair performance or even
cause hardware failure if not properly managed. Thus, effective cooling mechanisms such
as air coolers, liquid cooling, and thermal paste application are essential.
• CPU-Z is a free utility that provides detailed information about the CPU's characteristics,
including model, core count, clock speed, and more. It is a crucial tool for analyzing
system specifications and performance.
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Materials and Equipment:

• Intel and AMD CPUs

• Compatible motherboards with different socket types (LGA, PGA, BGA)
• CPU coolers (stock and aftermarket)
• Thermal paste
• Screwdrivers
• Anti-static wrist strap
• CPU-Z software installed on a working PC

Theory/Background:

A. Identifying CPU Characteristics: Modern CPUs are defined by several characteristics:

• Core count: The number of processing units in a CPU.

• Threads: Virtual cores that allow simultaneous processing.
• Clock speed: Measured in GHz, indicates how fast a CPU operates.
• Cache size: Temporary memory used for quick data access.
• TDP (Thermal Design Power): The amount of heat the CPU generates and needs to
dissipate. Intel and AMD offer CPUs with varied performance levels, power efficiency,
and architecture. Intel often emphasizes single-core performance, whereas AMD Ryzen
CPUs focus on multi-core efficiency.
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B. Recognizing CPU Sockets: Socket types are essential in determining CPU-motherboard

compatibility. Common socket types include:

• LGA (Land Grid Array): Used by Intel, where pins are on the motherboard socket.
• PGA (Pin Grid Array): Used by AMD, with pins on the CPU.
• BGA (Ball Grid Array): Soldered onto the motherboard, commonly found in laptops.
Each socket type is uniquely designed to match a specific group of CPUs.

C. Cooling CPU: Effective thermal management is vital for CPU longevity and performance.
Common cooling methods include:

• Air cooling: The most common method using fans and heat sinks.
• Liquid cooling: Efficient but more expensive; ideal for high-performance systems.
• Thermal paste: Ensures better contact and heat transfer between the CPU and cooler.
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Procedure/Methodology:

Step 1: Identifying CPU Specifications

• Open CPU-Z on a working system.

• Record CPU model, cores, threads, clock speed, cache size, and TDP.

Step 2: Identifying Socket Types

• Remove the CPU cooler.

• Inspect the motherboard socket.
• Refer to the motherboard manual to confirm socket type.

Step 3: Removing and Installing the CPU

• Use an anti-static wrist strap to prevent electrostatic discharge.

• Carefully lift the socket lever (for LGA/PGA sockets).
• Remove the CPU from the socket.
• Align the new CPU with the socket using the triangle indicator.
• Gently place the CPU and secure it by closing the socket lever.
• Apply a pea-sized drop of thermal paste at the center of the CPU.
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• Reinstall the CPU cooler and fasten screws diagonally.

Step 4: Verifying Installation

• Reconnect power and boot the system.

• Monitor CPU temperature using CPU-Z.
• Ensure the system boots without error.

Step 5: Exploring CPU Specifications with CPU-Z

• Open the CPU-Z application.

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• Analyze details such as clock speed, core voltage, core usage, and temperature.

Results and Analysis:

The observed specifications for an Intel Core i5-9400F were:

• Model: Intel Core i5-9400F

• Clock Speed: 2.9 GHz (Base), 4.1 GHz (Max Turbo)
• Cores: 6
• Threads: 6
• Cache: L1 – 384 KB, L2 – 1.5 MB, L3 – 9 MB
• TDP: 65W

Socket Type: LGA1151

The installation was completed successfully without physical damage. The system booted
correctly, and CPU temperatures remained within acceptable limits (30-45°C at idle, 60-75°C
under load). Proper application of thermal paste and secure cooler installation contributed to
effective thermal management.

Challenges included aligning the CPU properly and applying the right amount of thermal paste.
These were mitigated through careful handling and following best practices.
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Conclusion:

This experiment enhanced our understanding of CPU specifications, socket types, and
installation techniques. We learned to differentiate between Intel and AMD CPU structures,
especially regarding socket types like LGA and PGA. Proper CPU installation procedures and
the importance of using anti-static tools were also emphasized.

Effective CPU cooling is critical for system performance and longevity. CPU-Z proved to be a
valuable tool for verifying system specifications and monitoring CPU health. Overall, this hands-
on experience provided a solid foundation in hardware-level CPU management.

References:

• CPU-Z User Manual

• Intel and AMD official websites
• Motherboard manufacturer manuals
• Computer Hardware Textbooks (Stallings, Patterson & Hennessy)
• https://www.tomshardware.com/
• https://www.techspot.com/

Appendix:

• Photos of Intel and AMD CPUs

• Diagrams of LGA, PGA, and BGA sockets
• Screenshots from CPU-Z showing system specifications
• Notes on proper thermal paste application and cooler installation
• Troubleshooting checklist for CPU installation errors
• Additional research on aftermarket cooling solutions (e.g., Noctua, Corsair, Cooler
Master)