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FS - QBank - 1 and 2

The document outlines key concepts and processes in semiconductor packaging and testing, including packaging assembly technology, wafer thinning, die attach, and various testing methodologies. It emphasizes the importance of defect prevention, reliability, and the role of tools and techniques in enhancing semiconductor manufacturing. Additionally, it discusses challenges faced in testing and the significance of methodologies like functional testing and Design for Testability (DFT).

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Patel Krishna
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8 views2 pages

FS - QBank - 1 and 2

The document outlines key concepts and processes in semiconductor packaging and testing, including packaging assembly technology, wafer thinning, die attach, and various testing methodologies. It emphasizes the importance of defect prevention, reliability, and the role of tools and techniques in enhancing semiconductor manufacturing. Additionally, it discusses challenges faced in testing and the significance of methodologies like functional testing and Design for Testability (DFT).

Uploaded by

Patel Krishna
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Unit 1 - Package Manufacturing Processes

1. (RM) Define Packaging Assembly Technology and explain its role in semiconductor
manufacturing.
2. (UN) Describe the major steps involved in the packaging assembly process and their
significance.
3. (UN) Explain the importance of wafer thinning in semiconductor packaging and the
techniques used.
4. (UN) What are the key dicing techniques used in semiconductor manufacturing, and
how do they impact yield?
5. (UN) What is die attach, and how does it affect the performance of an IC package?
6. (AN) Analyze the possible defects in the die attach process and suggest methods to
prevent them.
7. (UN) Differentiate between wire bonding and flip chip bonding in semiconductor
packaging.
8. (EL) Evaluate the advantages and challenges of flip chip bonding over wire bonding.
9. (UN) Explain the flux cleaning process in semiconductor packaging and its importance
in preventing failures.
10. (EL) Assess the role of underfill materials in improving the mechanical reliability of
Flip Chip packages.
11. (UN) What is encapsulation, and how does it protect semiconductor packages from
environmental damage?
12. (EL) Discuss the importance of laser marking in semiconductor packaging and
traceability.
13. (UN) Explain the solder ball attach process and its role in Ball Grid Array (BGA)
packaging.
14. (EL) Evaluate the impact of reflow soldering temperature profiles on package
reliability.
15. (UN) Define singulation and describe its importance in IC packaging.
16. (EL) Explain how cleanroom operations contribute to defect prevention in
semiconductor manufacturing.
17. (UN) List the key IC packaging toolsets used in the semiconductor industry and their
functions.
18. (AP) A semiconductor factory faces high contamination levels in its cleanroom. Suggest
possible causes and corrective actions.
19. (AP) A wafer exhibits excessive warpage after thinning. Propose corrective measures
to improve process control.
20. (AP) Given a scenario where poor solder joint reliability is observed after reflow,
develop a troubleshooting approach to resolve the issue.
Unit 2 - Semiconductor Component And Package Test

1. (RM) Define semiconductor package testing and explain its importance.


2. (RM) List the different types of testing methodologies used in semiconductor package
testing.
3. (RM) Identify the major challenges faced in semiconductor package testing.
4. (RM) What are the key components tested in semiconductor package testing?
5. (RM) Describe the basic working principle of Automated Test Equipment (ATE).
6. (UN) Explain the differences between Automated Test Equipment (ATE) and Benchtop
Testers.
7. (UN) Illustrate the role of tester calibration and maintenance in semiconductor testing.
8. (UN) Discuss the principles of functional testing in semiconductor components.
9. (UN) What is Design for Testability (DFT), and why is it important?
10. (UN) Explain the purpose and significance of test data analysis in semiconductor
testing.
11. (AP) Demonstrate the process of conducting an in-circuit test (ICT) for a semiconductor
component.
12. (AP) How would you apply boundary scan testing for detecting faults in IC packages?
13. (AP) Illustrate the working of a Flying Probe Test and its advantages over ICT.
14. (AP) Apply the principles of functional testing to analyze the performance of an IC.
15. (AP) Given a faulty semiconductor package, describe how parametric testing can help
diagnose the issue.
16. (AN) Compare and contrast different types of semiconductor testers used in the
industry.
17. (AN) Analyze the effectiveness of different test methodologies in semiconductor
testing.
18. (AN) What are the critical factors influencing the accuracy of parametric tests in
semiconductor testing?
19. (AN) Compare Functional Testing with In-Circuit Testing (ICT) in terms of application
and effectiveness.
20. (EL) Evaluate the future trends in semiconductor package testing and their impact on
the industry.

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