Mysore University School of Engineering

8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006

BIO-MEMS
(21BR741)

MODULE 01 NOTES

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006

Module 01: Course Content

1.0 Introduction to MEMS and Micro systems

1.1 Definition of MEMS and Microsystems
1.2 Typical MEMS and Microsystem Products
1.3 Evolution of Micro-fabrication
1.4 Micro systems and Microelectronics
1.5 Multidisciplinary nature of Microsystem design and Manufacture
1.6 Microsystems and Miniaturization
1.7 Applications of Microsystem in Health-care Industry.
1.8 Introduction to Bio-MEMS:
1.9 Fabrication of Bio-MEMS
1.10 Structure of Bio-MEMS
1.11 Biocompatibility
1.12 Reliability consideration.
1.13 Introduction to Microsensors
1.13.1 Acoustic wave sensor
1.12.2 Biomedical Sensors and Biosensors
1.13.3 Chemical Sensors
1.13.4 Optical Sensors
1.13.5 Pressure sensors
1.14.6 Thermal sensors.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
1.0 Introduction to MEMS and Microsystems
Microelectromechanical systems (MEMS) and Microsystems are technologies that combine mechanical and
electrical elements on a very small
scale, typically at the micrometer to
nanometer range. They are central to
creating smart, compact, and efficient
systems used across various industries,
especially in electronics, healthcare,
and automotive sectors.

1.1 Definition of MEMS and Microsystems

• MEMS (Microelectromechanical Systems): These are tiny integrated devices or systems that
combine mechanical, electrical, and sometimes optical components at the micro- or nano-scale. MEMS
devices are typically fabricated using semiconductor processes and include sensors, actuators, and
microelectronics.
• Microsystems: A broader term that includes MEMS but also encompasses other micro-scale
technologies, such as microfluidics, micro-optics, and integrated circuits. Microsystems typically
involve the integration of multiple technologies to create systems that perform complex tasks.

1.2 Typical MEMS and Microsystems Products

Some common MEMS and Microsystems products include:

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
1.3 Evolution of Micro-Fabrication
Micro-fabrication is the process used to create MEMS and Microsystems. The evolution of this field has seen:
• Early Development (1980s-1990s): Involvement of semiconductor technologies like
photolithography and etching to create small mechanical components.
• Advancements (2000s-Present): Introduction of batch fabrication techniques, integration of materials
like polymers and ceramics, and development of novel bonding techniques. New methods also enable
the production of highly complex and multifunctional systems.

1.4 Microsystems, Microelectronics and Miniaturization

Microsystems Definition:
Microsystems refer to integrated systems that combine microscale mechanical components (such as sensors,
actuators, and microstructures) with electronics on a single chip or in a small-scale system. They often operate
at the micro (or smaller) scale and are designed to perform specific tasks like sensing, actuation, or signal
processing. The key features are:
Examples:
1. MEMS (Micro-Electromechanical Systems): These are miniaturized devices that integrate
mechanical structures (like springs, levers, gears) with electronics on a single chip. MEMS are used in
sensors (e.g., accelerometers in smartphones), actuators, and micro-robots.
o Example: A MEMS accelerometer in a smartphone detects orientation and motion.
o Example: Micro-pumps in medical devices for drug delivery.
2. Microfluidic systems: Miniaturized devices used for fluid manipulation, mixing, and analysis, often
used in lab-on-a-chip devices for medical diagnostics.
o Example: A microfluidic chip used for analyzing blood samples in point-of-care diagnostics.
3. RFID systems: Radio Frequency Identification systems that combine microelectronics with sensors
to identify and track objects.

Microelectronics Definition:
Microelectronics refers to the study and manufacture of electronic devices and circuits at a very small scale,
typically on the order of micrometers or nanometers. It primarily focuses on semiconductors, integrated
circuits (ICs), and transistors, which are fundamental components in modern electronics. The key features
are:
Examples:
1. Integrated Circuits (ICs): Small chips that can contain millions of transistors and components used
in various electronic devices, from smartphones to computers.
o Example: A microprocessor (e.g., Intel Core or AMD Ryzen) used in personal computers.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
o Example: Memory chips (e.g., DRAM or Flash memory) used in smartphones, computers,
and storage devices.
2. Transistors: The fundamental building blocks of most modern electronic circuits, used to amplify or
switch electronic signals.
o Example: Field-Effect Transistors (FETs) in amplifiers or logic gates.
3. Semiconductor Devices: These include diodes, photodetectors, and power transistors that form the
basis of microelectronics.
o Example: Solar cells made using semiconductor materials.

Miniaturization: Miniaturization is the process of reducing the size of devices, components, or systems
while maintaining or improving their functionality, performance, and reliability. In the context of
microsystems, miniaturization refers specifically to the ability to shrink the size of electronic, mechanical,
or optical components to fit into a much smaller form factor without compromising on performance or
efficiency. The main Characteristics of Miniaturization are:
• Focuses on reducing size and weight of devices.
• Often used to enable the integration of multiple functions in compact devices.
• Achieved through advancements in manufacturing technologies, materials science, and system
design.
Applications of Miniaturization
Miniaturization impacts various industries by making devices smaller, lighter, more portable, and energy-
efficient. Some applications of miniaturization include:
1. Consumer Electronics:
o Smartphones, Tablets, Laptops
o Wearables: Devices like smartwatches, and augmented reality (AR) glasses
2. Medical Devices:
o Miniaturized Diagnostic Devices: Portable ultrasound, blood glucose monitors, etc.
o Micro-robots
3. Automotive:
o Electric and Hybrid Vehicles
o Miniaturized Sensors
4. Telecommunications:
o Communication Systems
o Miniaturized Antennas
5. Aerospace:
o Micro Satellites
o Drones and UAVs
Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
Differences Between Microsystems and Microelectronics:
Feature Microsystems Microelectronics
Integration of mechanical and electronic Primarily focused on electronic circuits
Focus
components (e.g., sensors, actuators). and semiconductor devices.
Often operates at the microscale or Operates at the microscale, focusing on
Scale
nanoscale (µm, nm). electronic devices.
Combines mechanical (e.g., MEMS), Focuses on electronic components like
Components
optical, and electronic elements. transistors, diodes, and ICs.
Includes sensing, actuation, and fluid Involves computing, signal processing,
Applications manipulation (e.g., MEMS sensors, and power management (e.g., processors,
microfluidics). memory chips).
Example MEMS sensors, lab-on-a-chip devices, Integrated circuits, microprocessors,
Products micro-pumps, micro-actuators. diodes, and transistors.

Both microsystems and miniaturization refer to the trend of reducing the size and complexity of systems
while increasing their efficiency, but they are distinct concepts in engineering and technology. Below is a
detailed comparison:

Differences Between Microsystems and Miniaturization:

Feature Microsystems Miniaturization
Systems that integrate mechanical, The process of reducing the size of a
Definition electrical, and/or optical components at a device or component while maintaining
microscale (e.g., MEMS devices). or improving performance.
Encompasses a combination of functions
Refers specifically to the reduction of
Scope (e.g., sensing, actuation, processing)
size of devices or components.
integrated at a small scale.
Focuses on size reduction, often
Key Combines multiple functions in a single
through advanced manufacturing
Characteristics microchip (sensor + actuator + processor).
processes.
Applies to all areas that benefit from
Used in medical diagnostics, aerospace,
Application compact, efficient devices, including
automotive sensors, and robotics (e.g.,
Areas consumer electronics and medical
MEMS sensors).
devices.
MEMS devices, microfluidic chips, lab- Smartphones, miniaturized sensors,
Examples
on-a-chip systems. microchips in general.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
1.5 Multidisciplinary Nature of Microsystem Design and Manufacture
The design and manufacture of microsystems is inherently multidisciplinary, integrating knowledge and
techniques from various fields of engineering, science, and technology. This interdisciplinary approach is
crucial for the development of effective and functional microsystems, which are used in a wide range of
applications, including medical devices, automotive sensors, consumer electronics, and industrial systems.

1. Mechanical Engineering: Mechanical engineering is essential for the design of the physical structures
and mechanisms of microsystems. It deals with micro-scale actuators, sensors, and moving parts
(such as gears, springs, and levers) often used in Micro-Electromechanical Systems (MEMS).
2. Electrical Engineering: Electrical engineering is vital for the development of the electronic
components that process signals, power the microsystem, and manage communication with external
devices. This includes design of integrated circuits (ICs), sensors, and power management systems.
3. Materials Science and Engineering: Materials science plays a significant role in selecting appropriate
materials for the fabrication of microsystems. Materials must have specific properties (e.g., strength,
flexibility, thermal conductivity) and must be suitable for the microfabrication processes.
4. Physics: Physics, particularly solid-state physics and microphysics, governs the fundamental
principles underlying the behavior of materials and devices at small scales. This includes
understanding the interactions between electromagnetic fields, mechanical forces, and thermal effects.
5. Computer Science and Software Engineering: Computer science is involved in the modeling,
simulation, and control of microsystems. Software is crucial for managing data from sensors,
controlling actuators, and implementing algorithms for real-time decision-making.
6. Nanotechnology: Nanotechnology plays a crucial role in the development of microsystems, especially
at the intersection of nano and micro scales. It involves manipulating materials at the atomic or
molecular level to achieve specific properties.
7. Biotechnology and Biomedical Engineering: Microsystems are increasingly being used in medical
applications, requiring a deep understanding of biological systems and how microsystems can interact
with human tissue, biological fluids, or cells.
8. Chemistry: Chemistry plays a critical role in the synthesis and functionalization of materials used in
microsystems, particularly in sensors and actuation components that interact with chemicals or
biological agents.
9. Manufacturing and Process Engineering: Manufacturing techniques are essential for the scalable
production of microsystems. This includes microfabrication technologies and assembly processes that
can produce small devices with high precision and low cost.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
1.6 Applications of Microsystems in the Healthcare Industry
MEMS and Microsystems have numerous applications in the healthcare sector:
• Wearable Health Monitoring: MEMS sensors are used in devices like fitness trackers, glucose
monitors, and wearable ECG/EEG systems.
• Diagnostic Devices: Microsystems are used in lab-on-a-chip devices, microfluidic systems, and
biosensors for diagnostics.
• Drug Delivery Systems: MEMS-based micro pumps and micro valves are used for controlled drug
delivery in medical devices.
• Implants and Prosthetics: Microsystems are used to create high-precision implants and prosthetics
that improve the quality of life for patients.

1.7 Introduction to Bio-MEMS

Bio-MEMS (Biomedical Micro-Electromechanical Systems) refers to the integration of
microelectromechanical systems (MEMS) with biological and medical applications. These devices are
designed to interact with biological systems—either for diagnostics, therapeutic purposes, or for research in
the field of biology and medicine. Bio-MEMS are built at the micro-scale, typically ranging from
micrometers to millimeters, and combine microelectronics, sensors, actuators, and biological systems on a
single chip or device. Bio-MEMS technology enables the development of miniaturized medical devices that
offer advantages such as higher precision, lower cost, and real-time monitoring in medical diagnostics,
therapeutic interventions, and patient care. They are especially important for point-of-care diagnostics,
implantable devices, drug delivery systems, and bio-sensing applications, Features of Bio-MEMS are:
1. Miniaturization
• Compact Design: Bio-MEMS devices are typically on the micrometer to millimeter scale, allowing
for portability and less invasive procedures.
• Small Sample Size: Due to their miniaturized size, they require small biological samples, reducing
the need for large quantities of tissue or fluid.
2. Integration of Biological and Mechanical Systems
• Sensing: Bio-MEMS can incorporate sensors for detecting biological signals such as pH, temperature,
and enzyme activity, which are critical for monitoring biological functions.
• Actuation: These devices can perform tasks like fluid manipulation, drug delivery, or mechanical
movement in response to biological stimuli.
3. High Precision and Sensitivity
• Enhanced Accuracy: The small scale allows for high precision in measurement and control, which is
critical for biomedical applications like lab-on-chip (LOC) systems.
• Sensitive Detection: Bio-MEMS can detect low concentrations of biological analytes, such as
pathogens, biomolecules, or cells, with great sensitivity.
4. Low Power Consumption
• Energy-Efficient: Due to their small size and the nature of MEMS technology, Bio-MEMS are
generally low-power devices, making them suitable for portable and wearable medical devices.
5. Real-Time Monitoring

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
• Continuous Data Collection: Bio-MEMS systems can be used for continuous real-time monitoring
of biological conditions, which is useful for chronic disease management or point-of-care diagnostics.
6. Multiplexing Capabilities
• Simultaneous Analysis: Multiple sensors can be integrated into a single device to enable the
simultaneous detection of various biological markers, improving the efficiency and functionality of
diagnostics.
7. Cost-Effective Manufacturing
• Microfabrication Techniques: The use of semiconductor fabrication techniques allows for mass
production of Bio-MEMS devices at lower cost compared to traditional medical devices.
• Scalability: The ability to scale up production enables widespread use in medical diagnostics,
especially in low-resource settings.
8. Biocompatibility
• Material Selection: Bio-MEMS are made from biocompatible materials (such as polymers, silicon,
and metals) to minimize adverse reactions when in contact with biological systems.
9. Versatility
• Wide Range of Applications: Bio-MEMS can be used in diverse fields such as diagnostics (e.g., DNA
analysis, pathogen detection), drug delivery (e.g., controlled release systems), and personalized
medicine (e.g., monitoring biomarkers).
10. Integration with Other Technologies
• Nanotechnology: Many Bio-MEMS systems also integrate nanotechnology to enhance sensitivity or
enable novel functionalities, such as nanoparticle-based drug delivery.
• Wireless Communication: Some Bio-MEMS systems are designed with wireless capabilities for
remote monitoring and data transfer, making them ideal for wearable health devices.
11. In Vivo and In Vitro Applications
• In Vivo: Bio-MEMS can be used directly in living organisms for applications like implantable sensors
or drug delivery systems.
• In Vitro: Bio-MEMS are also used in laboratory settings for cell analysis, biomarker detection, and
other diagnostic tasks

Applications of Bio-MEMS
1. Medical Diagnostics:
o Point-of-care diagnostics (e.g., glucose monitoring, pregnancy tests) use microfluidic
devices and biosensors to detect biomarkers and provide fast results.
o Lab-on-a-chip (LOC) technologies that integrate sample processing, detection, and analysis
on a single chip. For example, microfluidic chips can analyze blood samples for pathogen
detection or genetic testing.
2. Drug Delivery Systems:
o Micro-pumps or micro-valves for controlled release of drugs or other therapeutic agents, often
used in applications such as insulin pumps or implantable drug delivery devices.
3. Wearable Health Monitors:
o Bio-MEMS are used in wearable devices like smartwatches and health monitoring bands
to track vital signs (e.g., heart rate, blood oxygen levels, temperature) or electrocardiogram
(ECG) measurements in real-time.
4. Implantable Medical Devices:

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
o Implantable Bio-MEMS devices can monitor glucose levels, detect tumor markers, or
provide neurological stimulation. Examples include pacemakers, neural interfaces, and
biosensors that continuously monitor specific biomarkers or physiological signals.
5. Cell-Based Sensing and Drug Screening:
o Bio-MEMS devices are used for cell culture, drug screening, and toxicology testing by
providing a platform for culturing cells on-chip and testing their responses to various drugs or
chemicals.
6. Tissue Engineering and Regenerative Medicine:
o Bio-MEMS can be used to develop artificial organs, scaffolds for tissue regeneration, or
bioreactors that support the growth of cells in controlled environments.
7. Environmental and Food Safety Monitoring:
o Bio-MEMS are used for detecting contaminants, toxins, or pathogens in food and water
supplies.

1.9 Fabrication Methods of Bio-MEMS

The manufacturing of Bio-MEMS is an interdisciplinary process involving techniques from microsystems
engineering, biotechnology, electronics, and material science. Several advanced fabrication methods are
employed to create Bio-MEMS devices, depending on the specific application and materials used.
The fabrication of Bio-MEMS (Biomedical Micro-Electro-Mechanical Systems) involves several
sophisticated techniques, each tailored to the specific requirements of the bioengineering and biomedical
fields. Below are detailed steps for key fabrication methods commonly used in Bio-MEMS.
1. Photolithography
Steps:
1. Substrate Preparation: Clean the silicon wafer or
other substrate to remove impurities using solvents
and deionized water. Dry the wafer thoroughly.
2. Photoresist Coating: Apply a thin layer of photoresist
(a light-sensitive polymer) onto the wafer surface.
This is typically done by spin-coating.
3. Soft Bake: Bake the wafer to remove any solvents
from the photoresist, making it harden slightly.
4. Mask Alignment: Place a photomask with the desired pattern onto the wafer. This mask will block
light during exposure to define the areas that will be patterned.
5. Exposure: Expose the wafer to UV light. The light causes a chemical reaction in the photoresist, which
hardens or softens it depending on whether a positive or negative photoresist is used.
6. Development: Use a developer solution to remove the exposed (or unexposed) photoresist, revealing
the underlying substrate in the desired pattern.
7. Hard Bake: Bake the wafer again to fully harden the remaining photoresist.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
8. Etching: Etch the exposed areas of the substrate (e.g., with plasma etching or wet etching) to transfer
the pattern into the material.
9. Stripping: Remove the remaining photoresist layer to complete the pattern transfer.
Applications: Used for creating microstructures, such as sensors and microchannels for biochips and
biosensors.

2. Deep Reactive-Ion Etching (DRIE)

Steps:
1. Substrate Preparation: Start with a clean silicon wafer, similar to the process for photolithography.
2. Masking: Coat the wafer with a hard mask material like silicon dioxide or a photoresist layer.
3. Etching Process: In the DRIE chamber, alternate between etching and passivating cycles. The etching
uses plasma to remove material, while the passivation cycle coats the etched surfaces with a protective
layer.
4. Pattern Transfer: Through repeated cycles, deep, narrow trenches are etched into the wafer, creating
highly anisotropic features.
5. Cleaning: Remove any remaining passivation layer or byproducts from the etching process.
Applications: Creating high aspect-ratio structures like microfluidic channels, deep holes for sensors, and
MEMS actuators.

3. Soft Lithography
Steps:
1. Master Mold Creation: Use photolithography or another
microfabrication method to create a master mold on a silicon
wafer.
2. PDMS Mixture Preparation: Mix polydimethylsiloxane
(PDMS) elastomer with a curing agent in the correct ratio.
3. Mold Casting: Pour the PDMS mixture over the master mold
and cure it (usually by heating) to solidify it into a flexible, elastomeric mold.
Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
4. Demolding: Once the PDMS has cured, peel it off from the master mold.
5. Bonding: If necessary, bond the PDMS mold to a glass or silicon substrate using plasma treatment or
thermal bonding.
6. Microfluidic Channel Formation: The PDMS mold can be used to form microchannels for lab-on-
a-chip devices, sensors, or other Bio-MEMS structures.
Applications: Fabricating flexible, soft microfluidic devices, cell culture platforms, and biosensors.

4. Bulk Micromachining
Steps:
1. Substrate Preparation: Begin with a silicon
wafer or another suitable substrate.
2. Oxidation: Grow a thin layer of silicon
dioxide (SiO₂) on the substrate if needed for
masking purposes.
3. Patterning: Use photolithography to define the pattern on the silicon dioxide layer.
4. Etching: Perform wet etching (e.g., using potassium hydroxide or another chemical solution) or dry
etching (reactive-ion etching) to etch the substrate deeply, removing layers and forming structures like
cantilevers or cavities.
5. Cleaving: Remove unwanted parts of the silicon substrate to create free-standing structures.
6. Cleaning and Finalizing: Clean the etched wafer and finalize it for use in Bio-MEMS devices.
Applications: Creating MEMS components such as accelerometers, pressure sensors, and other high-aspect-
ratio structures.

5. Micro-Milling
Steps:
1. Substrate Preparation: Select the
material to be milled (e.g., metal,
polymer, or ceramic).
2. CNC Milling: Use a Computer Numerical Control (CNC) machine equipped with micro-scale cutting
tools to precisely mill the material according to the design.
3. Design Loading: Input the design patterns into the CNC machine for milling, guiding it to create fine
microfeatures.
4. Finishing: Smooth the surfaces and remove any rough edges using polishing or additional finishing
steps.
Applications: Fabricating 3D microstructures, customized Bio-MEMS devices, and prototypes.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
5. Additive Manufacturing (3D Printing)

Steps:
1. 3D Design: Create a 3D digital model of the desired Bio-MEMS device using CAD (Computer-Aided
Design) software.
2. Material Selection: Choose a suitable biocompatible or functional material (such as biocompatible
polymers, metals, or ceramics).
3. Printing: Use a 3D printer (e.g., SLA, FDM, or SLS) to layer material onto the print bed based on the
digital model. The material solidifies layer by layer.
4. Post-Processing: After printing, the structure may need additional curing, cleaning, or finishing, such
as removing support material or smoothing surfaces.
Applications: Prototyping complex Bio-MEMS structures, customized scaffolds for tissue engineering, and
rapid fabrication of microfluidic devices.

7. Electroplating
Steps:
1. Substrate Preparation: Clean the substrate (e.g., silicon
wafer) and deposit a thin layer of seed metal, like gold or
copper, using sputtering or vapor deposition.
2. Electrolyte Solution Preparation: Prepare an electrolyte
solution containing metal ions (e.g., gold or silver) to be
plated.
3. Electroplating: Submerge the substrate in the electrolyte
bath and apply an electrical current. The metal ions in the
solution are reduced and deposited onto the substrate.
4. Finalizing: After plating, the metal layer is polished and any excess material is removed.
Applications: Fabricating conductive elements such as electrodes, microcoils, and conductive traces for Bio-
MEMS.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
1.10 Structure of Bio-MEMS
The structure of a Bio-MEMS device typically includes:
• Sensing Elements: These could be biochemical sensors that detect specific molecules or biological
markers.
• Actuators: For performing mechanical tasks such as
pumping, mixing, or applying force.
• Microfluidic Channels: To handle small volumes of
fluids, often used in lab-on-a-chip devices.
• Packaging: Protective materials to ensure the device
remains stable in biological settings and can interact
with tissue without harmful effects.

BioMEMS devices (Biomedical Micro-Electro-Mechanical Systems) integrate both mechanical and electrical
components on the microscale to create devices that can be used in medical applications. These devices
typically consist of sensors, actuators, and microelectronics, and are designed for a variety of biomedical
applications like diagnostics, drug delivery, prosthetics, tissue engineering, and more.

Key Components of BioMEMS Devices:

1. Microfluidics: Microfluidic channels and systems are used to handle small amounts of liquids at the
microscale, often for applications such as lab-on-a-chip devices, where small quantities of biological
samples or reagents are manipulated. These systems can perform functions like mixing, sorting, and
dispensing fluids.
2. Sensors: BioMEMS often include micro sensors that can detect changes in the environment. These
sensors might detect parameters such as:
o Temperature
o pH levels
o Pressure
o Ion concentration
o Chemical composition These sensors are typically fabricated using semiconductor processes.
3. Actuators: Actuators in BioMEMS are components that perform mechanical tasks, like moving fluids or
delivering precise doses of a drug. Common actuators include:
o Pneumatic actuators (use air pressure)
o Thermal actuators (rely on temperature changes)
o Electrostatic actuators (use electric fields)
4. Microelectronics: BioMEMS devices often include microelectronic components that control the
operation of the system. This can include microprocessors, power management units, and data storage
Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
elements. These electronics interface with sensors and actuators to process signals and control system
functions.
5. Materials: The materials used in BioMEMS are critical to the functionality and biocompatibility of the
device. Common materials include:
o Silicon: Often used as a substrate for microfabrication.
o Polymers: These can be used in flexible, biocompatible applications.
o Glass: Frequently used in microfluidic devices due to its clarity and chemical resistance.
o Gold: Often used in electrodes for detecting or stimulating biological signals.
o Piezoelectric materials: Used for precise mechanical movements in actuators.
6. Power Sources: BioMEMS devices, especially those intended for implantable applications, need power
sources. These might be small batteries, energy harvesting systems (e.g., from body heat or motion), or
wireless power transfer systems.
7. Interfacing Components: Devices often need to interface with external systems, such as computers or
medical equipment, for monitoring, control, and data analysis. This requires communication modules
(e.g., Bluetooth, wireless RF, or optical communication systems).

1.11 Biocompatibility
Biocompatibility refers to the ability of materials to interact with biological systems without causing adverse
reactions. For MEMS devices used in biomedical applications, this is crucial to avoid rejection by the body or
interference with biological processes.
Need for Biocompatibility in BioMEMS
1. Minimizing Toxicity: Materials used in BioMEMS must not release harmful substances into the body.
For example, metals or polymers that degrade over time should not release toxic ions or byproducts
that could cause inflammation, infection, or tissue damage.
2. Cellular Interaction: BioMEMS devices often interface directly with cells or tissues.
Biocompatibility ensures that the device does not provoke a harmful immune response. Ideally, it
should support normal cellular functions like cell growth, adhesion, and differentiation (especially in
tissue engineering applications).
3. Long-Term Functionality: Many BioMEMS devices are designed for long-term implantation (e.g.,
pacemakers, drug delivery systems). Long-term biocompatibility is essential to ensure that the device
continues to function as intended without causing chronic adverse reactions, such as fibrosis, scar
tissue formation, or calcification.
4. Reducing Inflammation and Infection: Biocompatible devices help prevent chronic inflammation,
which can lead to rejection or failure of the implant. The device materials should also resist bacterial
colonization to reduce the risk of infection, which can be a serious concern in medical implants.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
8J99+QC7, Manasa Gangothiri, Mysuru, Karnataka 570006
1.12 Reliability Consideration
Reliability in BioMEMS is essential for the safe and effective deployment of these devices, particularly in
medical applications where failure can have serious consequences. Achieving high reliability requires
attention to mechanical, electrical, material, thermal, and biological factors, as well as rigorous testing and
validation processes. By using high-quality materials, ensuring robust design and manufacturing processes,
and incorporating fail-safe features, BioMEMS can meet the reliability demands of their intended applications
and provide long-term, safe, and effective service to patients. Reliability is a key concern for Bio-MEMS
because these devices are often used in critical medical applications. Factors affecting reliability include:
Material Durability, Fatigue and Wear, Device Longevity, etc.
Reliability Considerations in BioMEMS:
1. Mechanical Reliability: BioMEMS devices often operate in environments where mechanical integrity
is essential, particularly when interacting with biological tissues or fluids. Mechanical reliability
involves ensuring that the device withstands physical stress and performs as expected over time.
o Fatigue Resistance
o Microstructural Integrity
o Wear and Abrasion
2. Electrical and Functional Reliability: Many BioMEMS devices integrate electrical components
(e.g., sensors, actuators, microelectronics) to interface with biological systems. These components
must remain operational throughout the device's intended lifespan.
oSensor and Actuator Performance
oPower Supply
oSignal Integrity
oDegradation
3. Material Reliability: The materials must maintain their functional properties in challenging biological
environments, including corrosive body fluids, mechanical stresses, and chemical interactions with
tissues.
Corrosion Resistance
o
Biofouling
o
PEGylated surfaces or hydrophilic coatings, reduce clotting, inflammation, or infection risk.
o
Degradation Over Time
o
4. Thermal Reliability: BioMEMS devices often operate in environments with temperature fluctuations,
including the human body (typically around 37°C) or external temperatures. Components like sensors,
actuators, and microelectronics must be able to function within this range without thermal stress.
o Thermal Expansion
o Temperature Sensitivity
5. Reliability in Biological Environments: Biological environments are highly variable and can
introduce factors that compromise the reliability of BioMEMS devices. These factors include
inflammation, infection, cellular interactions, and the presence of enzymes that can degrade
materials or interfere with device performance.
o Biological Fouling
o Immune Response
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1.13 Introduction to Microsensors
Microsensors are key components of MEMS and Microsystems. They detect changes in environmental
conditions or biological parameters and convert these changes into readable signals.

1.13.1 Acoustic Wave Sensor

A Bio-MEMS Acoustic Wave Sensor combines Microelectromechanical Systems (MEMS) technology
with acoustic wave sensing principles for applications in biological and biomedical fields. These sensors
leverage acoustic waves to detect changes in the physical, chemical, or biological environment. Here's a
breakdown of its components and applications:
Key Components:
1. MEMS Platform:
o MEMS technology involves miniaturized mechanical and electrical systems fabricated at the
micro and nanoscale. These platforms typically consist of tiny mechanical structures (like
beams, membranes, or resonators) that can interact with their surroundings when subjected to
external forces.
2. Acoustic Wave Transducers:
o Acoustic waves (often surface acoustic waves or bulk acoustic waves) are generated and
detected by piezoelectric transducers. When the sensor interacts with an external material (such
as biological samples or gases), it causes a change in the acoustic properties (like frequency,
amplitude, or phase of the waves). This change is measured and analyzed.
o Common types of acoustic wave devices include:
▪ Surface Acoustic Wave (SAW): These waves propagate along the surface of the sensor
material.
▪ Love Waves: A type of SAW with high sensitivity to surface changes.
▪ Quartz Crystal Microbalance (QCM): Uses bulk acoustic waves to detect mass
changes.
3. Biorecognition Element:
o A functional layer or coating (e.g., antibodies, enzymes, DNA strands) that specifically
interacts with the target biological analyte, such as proteins, pathogens, or biomarkers. When
the target interacts with this element, it causes a change in the acoustic wave signal, allowing
for detection.
4. Signal Processing:
o The changes in the acoustic wave signals are converted into readable outputs. These can include
frequency shifts or amplitude variations, which are indicative of specific molecular or
biological interactions.

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 Mysore University School of Engineering
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Working Principle:
• The sensor works by exciting an acoustic wave on a substrate (often a piezoelectric material). When a
biological substance (like a protein or virus particle) binds to the surface of the sensor, it alters the
characteristics of the acoustic wave, such as its frequency or phase.
• These shifts are proportional to the mass change or changes in the surface properties, which can be
correlated to the presence and concentration of the target analyte.

Applications: Advantages:
1. Medical Diagnostics • High Sensitivity
2. Environmental Monitoring • Miniaturization
3. Food Safety • Real-Time Monitoring
4. Wearable Health Devices • Low Cost
5. Lab-on-a-Chip Systems

1.13.2 Biomedical Sensors and Biosensors

Biomedical Sensors are designed to detect biological signals, such as glucose levels, pH, or oxygen
concentration. Biomedical sensors are devices that monitor physiological signals or physical changes in the
body to provide insight into health conditions or aid in medical diagnosis. These sensors detect specific
biological parameters such as heart rate, blood pressure, temperature, oxygen levels, and other indicators of
health.
Types of Biomedical Sensors:
1. Electrochemical Sensors
2. Optical Sensors
3. Biopotential Sensors
4. Thermal Sensors
5. Pressure Sensors
6. Flow Sensors
The components of MEMS-based biomedical sensors are designed to work together to provide accurate,
sensitive, and reliable measurements, often in small and portable form factors.
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Here are the key components of MEMS biomedical sensors:
1. Sensing Element (Microstructure or Sensing Layer):
2. Microelectromechanical Transducer:
3. Signal Conditioning and Amplification Circuit:
4. Microcontroller or Processor:
5. Power Management System:
6. Communication Interface:
7. Calibration and Compensation Circuitry:
8. Enclosure or Housing:
9. Display or Output Interface:

Biosensors are a subset of these, specifically designed to detect biological molecules and pathogens.
Biosensors are a specialized type of sensor that detects biological analytes (biomolecules, cells, viruses, etc.)
and converts the biological interaction into a measurable signal, usually electrical, optical, or mechanical.
Biosensors have found extensive use in diagnostics, environmental monitoring, food safety, and drug
development.
Components of a Biosensor:
1. Bioreceptor: The bioreceptor is a biological element that
specifically interacts with the target analyte. It could be an
enzyme, antibody, nucleic acid, or microorganism that binds to or
reacts with the analyte.
▪ Examples: Antibodies (for antigen detection), enzymes (for
substrate detection), aptamers (for specific molecule binding),
and DNA probes (for genetic material detection).
2. Transducer: The transducer converts the interaction between the analyte and the bioreceptor into a
readable signal. Different types of transducers include:
▪ Electrochemical Transducers: Convert the biological interaction into an electrical signal (e.g.,
potentiometric, or conductometric).
▪ Optical Transducers: Use changes in light (absorbance, fluorescence, etc.) to indicate the presence
of an analyte.
▪ Piezoelectric Transducers: Measure the change in frequency or resonance caused by the binding
of biomolecules to a surface (e.g., surface plasmon resonance).
▪ Thermal Transducers: Measure heat changes due to biochemical reactions.
3. Signal Processor: The signal processor interprets the signal generated by the transducer and outputs
it in a format that can be understood by the user (e.g., numerical data, visual display).
4. Indicator or Output: The sensor provides an output such as an electrical current, voltage change,
color shift, or a resonance frequency shift that corresponds to the concentration of the target analyte.

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 Mysore University School of Engineering
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Types of Biosensors:
1. Enzyme-Based Biosensors
2. Antibody-Based Biosensors
3. DNA-Based Biosensors
4. Cell-Based Biosensors
5. Immunosensors

1.14.3 Chemical Sensors: Chemical Sensors

detect the presence and concentration of
chemicals in the environment. They can be
used in a variety of applications, including
environmental monitoring, industrial
applications, and healthcare.

Structure of MEMS Chemical Sensors

The structure of a MEMS (Microelectromechanical Systems) chemical sensor integrates mechanical,
electrical, and chemical components in a highly miniaturized form factor. The basic structure of a MEMS
chemical sensor consists of several key components that work together to detect chemical changes and convert
them into readable signals. The detailed structural elements of a MEMS chemical sensor are:
1. Sensing Element (Chemical-sensitive layer)
The sensing element is the heart of the MEMS chemical sensor and is responsible for detecting the target
chemical. It interacts with the chemical species and undergoes a physical, chemical, or electrical change that
is measurable.
• Material Properties: The sensing element is often made from materials that are sensitive to specific
chemicals or gases. Common materials include:
• Type of Response: Depending on the design of the sensor, the response could be:
o Resistance Change
o Capacitance Change
o Electrochemical Reaction
o Optical Response
2. Transducer (Signal Conversion Layer)
The transducer converts the physical, chemical, or optical changes induced by the sensing element into
measurable electrical signals. This is an essential part of the MEMS sensor structure because the output from
the sensing element is typically in the form of a small change in physical properties (e.g., resistance,
capacitance, mass) that needs to be converted into a signal suitable for processing.
• Resistive Transducer
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• Capacitive Transducer
• Piezoelectric Transducer
• Optical Transducer
3. Microstructure (Mechanical Components): The microstructure in MEMS chemical sensors refers to the
mechanical elements that enable the sensor to detect changes in the environment, including movement, strain,
or deflection. In gas sensors, these microstructures may be used to support the sensing element or enable the
detection of chemical changes in a more efficient manner.
• Microbeams or Membranes
• Cantilevers
• Nanoscale Features

4. Heating and Temperature Control (Thermal Elements): Many MEMS chemical sensors, especially
those based on metal oxide semiconductors (MOX) or electrochemical reactions, require heating elements
to maintain the sensing material at a specific temperature for optimal performance. The temperature controls
the reaction kinetics or changes the properties of the sensing material.
5. Signal Conditioning Circuit: The signal conditioning circuit is designed to amplify, filter, and process
the signals produced by the transducer. Since the signals generated by MEMS chemical sensors are often small
(such as resistance changes in the range of milliohms or picofarads), signal conditioning is essential for
accurate and reliable measurements.
• Amplification
• Filtering
• Analog-to-Digital Conversion (ADC)

6. Microcontroller or Processor: The microcontroller or signal processor is the brain of the MEMS
chemical sensor. It receives the digitized signal, processes it to compute the chemical concentration or other
relevant metrics, and then outputs the result.
• Data Interpretation
• Calibration and Compensation
• Communication

7. Power Supply: MEMS chemical sensors often operate in low-power modes, especially when they are used
in remote or battery-operated applications. A power supply is required to provide energy to the sensor, its
heater, microcontroller, and other components.
8. Enclosure or Housing: The housing or enclosure of a MEMS chemical sensor protects the internal
components from physical damage, environmental factors (e.g., moisture, dust), and chemicals. The material
for the housing depends on the application, whether it is for industrial, environmental, or medical use.
Example Structures of MEMS Chemical Sensors
1. MOX Gas Sensors:
2. Electrochemical Sensors:
3. Optical Gas Sensors:
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 Mysore University School of Engineering
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1.14.4 Optical Sensors:
The MEMS optical sensor
structure typically
involves the integration of
micromechanical
elements that manipulate
light (such as mirrors, lenses, and diffraction gratings) and electronic components (such as photodetectors,
light sources, and signal processors). The primary goal of these sensors is to detect and convert light signals
(e.g., intensity, wavelength, or polarization) into electrical signals for further analysis.

Key Structural Components of MEMS Optical Sensors

1. Micro-Optical Components: These components are responsible for controlling, manipulating, and
detecting light. They are often made from silicon or other semiconductor materials that can be
fabricated using standard MEMS processes. Micro-lenses: Tiny lenses are used to focus light onto a
detector or to direct light to specific parts of the sensor. MEMS optical sensors often feature
microlenses that are fabricated as part of the chip. Micro-mirrors: MEMS optical sensors may
integrate micro-machined mirrors that can adjust their position to direct or reflect light. These mirrors
can be used in optical switch matrices or beam steering applications.
2. Photodetectors
o Photodetectors are used to measure the intensity of light that interacts with the sensor. MEMS
optical sensors often integrate photodetectors directly onto the chip to minimize size and
complexity.
3. Light Sources
o Some MEMS optical sensors require an integrated light source, typically a light-emitting
diode (LED) or a laser diode, to generate the optical signal that will interact with the target
material or analyte.
4. Micro-Machined Components
o The micromachined components in MEMS optical sensors are typically fabricated from
silicon or other materials like polymer, glass, or ceramics, and are used to manipulate the
optical path or provide mechanical movement for dynamic control of light. These include:
Micro-mirrors, Gratings and Filters, Micro-actuators
5. Optical Interface and Coupling Structures
o Optical coupling is a critical aspect of MEMS optical sensors, as it ensures that light is
efficiently transferred between the sensor's internal components (e.g., photodetectors,
waveguides) and external light sources or objects being analyzed.

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6. Substrate and Structural Support
o The substrate is typically made of silicon, which is the foundation for the microstructures and
opto-electronic components. The substrate provides mechanical support for the optical
components and serves as the platform for the MEMS fabrication process.
7. Signal Processing Circuit
o The signal processing electronics are responsible for amplifying and processing the output
from the photodetector. The MEMS sensor typically integrates a signal conditioning circuit
to:
▪ Amplify the small photocurrents generated by photodetectors.
▪ Filter noise from the signal.
▪ Convert the signal from analog to digital
8. Power Supply and Energy Management
o MEMS optical sensors, especially in portable or remote sensing applications, require an
efficient power supply. These devices are designed for low-power operation, often using
small batteries, energy harvesting, or low-voltage systems to ensure long operational life.
9. Packaging and Housing
o The packaging of MEMS optical sensors is crucial to protect the sensitive components from
mechanical damage, environmental exposure, and contamination. The packaging must also
allow light to enter and exit the sensor.

1.14.6 Pressure Sensors are used to measure pressure variations in gases and liquids. These are critical in
medical devices (e.g., blood pressure monitors) and in industrial applications (e.g., automotive systems).
MEMS Pressure Sensors are small, highly sensitive devices that measure the pressure of gases or liquids and
convert it into an electrical signal. They integrate microelectromechanical systems (MEMS) technology,
combining tiny mechanical elements with electronic components on a single chip. These sensors are widely
used in applications such as automotive, medical devices, industrial monitoring, and consumer electronics due
to their compact size, low power consumption, and high accuracy.

Prepared by: Mr Thanmay J S, Assistant Professor, Bio-Medical & Robotics Engineering, UoM, SoE, Mysore 57006
 Mysore University School of Engineering
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Key Components:
1. Sensing Element (Diaphragm): A flexible diaphragm deforms in response to applied pressure. The
deformation is the core mechanical response to pressure.
2. Transducer: This converts the mechanical deflection into an electrical signal. Common transduction
methods include strain gauges (resistive), capacitive, and piezoelectric transducers.
3. Signal Conditioning Circuit: Amplifies, filters, and converts the electrical signal for easier processing
and interpretation.
4. Substrate: Typically made from silicon, which supports both the mechanical and electrical
components.
5. Packaging: Protects the sensor from environmental conditions while allowing pressure to interact with
the diaphragm.
Types of MEMS Pressure Sensors:
• Capacitive: Measures changes in capacitance caused by diaphragm movement.
• Resistive (Strain Gauge): Measures changes in resistance from strain gauges
• Piezoelectric: Measures electrical charge generated by the deformation of piezoelectric materials.

1.14.7 MEMS Thermal Sensors are miniaturized devices that measure temperature or heat through the
integration of microelectromechanical systems
(MEMS) technology. These sensors are capable of
detecting changes in temperature and converting them
into an electrical signal for further processing. MEMS
thermal sensors are highly valued for their compact size,
fast response time, low power consumption, and high
precision, making them ideal for a wide range of
applications in industries like automotive, medical,
consumer electronics, and industrial monitoring.
Key Components:
1. Sensing Element: The core component of a MEMS thermal sensor, typically a thermistor, RTD
(resistance temperature detector), or thermocouple, which changes its electrical properties
(resistance, voltage, or current) with temperature variation.
o Thermistors: Materials whose resistance decreases (NTC) or increases (PTC) with temperature. They
are commonly used in MEMS thermal sensors due to their sensitivity and precision.
o Thermocouples: Two different metals joined at one end. A voltage is generated at the junction based on
the temperature difference.
o RTDs: Semiconductor-based sensors that provide a linear relationship between resistance and
temperature, offering high accuracy.
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2. Transducer: Converts the thermal response of the sensing element into an electrical signal. This could
involve the change in resistance (for thermistors or RTDs) or voltage (for thermocouples).
3. Signal Conditioning Circuit: Processes the output signal from the sensing element. It typically
includes amplifiers, filters, and analog-to-digital converters (ADC) to ensure accurate and usable
temperature readings.
4. Substrate: The MEMS device is usually built on a silicon substrate which provides both mechanical
support and the platform for integrating the sensing element, transducer, and signal conditioning
components.
5. Packaging: MEMS thermal sensors are housed in protective packaging, which ensures that they are
shielded from environmental factors while still allowing them to accurately sense temperature changes.
Types of MEMS Thermal Sensors:
• Resistive (Thermistors and RTDs): The most common type, where the electrical resistance of the
sensor changes with temperature.
• Volatile or Infrared Sensors: Some MEMS thermal sensors can detect changes in emitted infrared
radiation, typically used in thermal cameras or non-contact temperature sensing.

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 Mysore University School of Engineering
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Practice Questions
Four Marks Questions
1. Define MEMS and Microsystems. What are the key differences between the two?
2. List and explain three typical MEMS and Microsystems products. How do these products contribute
to technological advancements?
3. Describe the evolution of micro-fabrication. What are the significant milestones in the development of
MEMS fabrication techniques?
4. Explain the relationship between Microsystems and Microelectronics. How are they integrated into
modern devices?
5. How does miniaturization in Microsystems lead to innovations in various industries? Provide examples
where miniaturization has been beneficial.
6. What are the primary applications of Microsystems in the healthcare industry? Explain how MEMS-
based devices improve medical diagnoses and treatments.
7. What is Bio-MEMS? How is it different from traditional MEMS technology, and what are its
applications in the medical field?
8. Discuss the fabrication process of Bio-MEMS. What are the key challenges involved in creating Bio-
MEMS devices?
9. Explain the concept of biocompatibility in the context of MEMS used in biomedical applications?
10. Explain Reliability Considerations in BioMEMS

Eight Marks Questions

11. Definition of MEMS and Microsystems and its typical Products
12. Define Microsystems and Microelectronics and mention their difference
13. Explain the Features of Bio-MEMS and its applications
14. List the Fabrication Methods of Bio-MEMS and explain any 2 in detail
15. Mention the Structure of Bio-MEMS and its key components
16. Explain Biocompatibility and Reliability Considerations in BioMEMS
17. List the different types of sensors used in Bio-MEMS and explain any 2 in detail

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