Computer_Program
Computer_Program
1. Input Devices
2. Processing Devices
3. Output Devices
1. INPUT DEVICES: These are devices that are used to give commands to
the computer system they comprise of keyboard, mouse, joystick, scanner
digital, camera, web cam, etc.
TYPES OF KEYBOARDS
1. Standard keyboard.
2. Enhance keyboard
3. Multimedia keyboard for internet
We have serial or Ps 2 keyboard
COMPONENT OF KEY BOARD
1. Casing
2. Key strokes
3. Magic processor board
4. Nursel/spring
5. Keypad
6. Cable connector
TYPES OF MOUSES
1. Serial mouse
2. P s 2 mouse
3. Multimedia mouse
4. USB mouse
5. wireless mouse
PARTS OF MOUSE
1. p-roller-vertical &horizontal
2. ball
3. buttons
4. mouse gurad
5. lens
6. magic processor board
7. casing
JOY STICK
A scanner is a device that is used to input pictures and text into a computer.
They work by passing a beam of light of the image and sensors collects
information from.
The reflected light. The data produced is an image, which can be changed
using special image editing software. If the image is a page of text, which the
user wants to be able to edit, then special optical character recognition
software must be used to convert the image of letters in text, which can be
edited using word processor.
TYPES OF SCANNERS
1. Handheld Scanner
2. Flat Bed Scanner
DIGITAL CAMERA
Digital camera is an input device that is also used to capture image or object
through the chipset o the process or board on a focal receiver to the memory
that enable picture, images, objects to be capture and later transfer to the
computer as an input device. You need not to connect the digital camera to the
computer before snapping but after snapping you connect then through image
or object are copied into the hard.
WEBS CAMERA
PROCESSING DEVICE
MOTHER BOARD
Mother Board is one of the most important devices of the computer. It is made
up of chipsets and other logical devices or component. It is on the
motherboard that other cards derive their functions.
TWO TYPES OF MOTHER BOARD
PROCESSOR UNIT
TYPES OF CPU
PIN CPU-this are type of CPU that comes with pin on the processor on itself.
PINLESS CPU- it doesn’t deal with pin on the processor but has pin on the
socket (slot).
SOCKET CPU-this type of CPU deals with slots. It can be attached under the
board.
The CPU controls the Arithmetic, logical sequencing & front side (FSB)
Interaction with Cache. The CPU’s sockets are made up of pins, which are
logically built to the core areas. Not every CPU socket will feat every socket
hence you must analyze your board for the type of CPU that will feat in, so is
applicable to CPU slots.
CPU speed is measured in mega hertz. MEGA stands, for million & HERTZ
Stand for Cycle for clock speed.
Many companies manufacture CPU e.g., IBM, INTEL, AMERICAN
MEGATREND, AMD, CYRIX ETC.
The cycle of a CPU determines the processing speed of the entire computer
units.
CPU ranges in Accordance with the manufactures like 8088 from Intel 80186,
80/286 (25-33 MHz) 80/386 (38-40 MHz) 80486, 80586, step by step
1. Make sure that the processor is the right one for the board.
2. Make sure that the processor has heat sink or fan on it.
3. Don’t detach the CPU from the board while the system is still on; make
sure that you disconnect the power from the power pack exp, ATX
board.
4. Check for proper jumpering for power of the CPU Core Voltage input
and output voltage.
5. Shut down the computer system properly; do not on or off the system
anyhow because you have to allow the fan on the CPU to stop.
A CPU can be upgraded but must be the same match for the slot or
sockets.
PROBLEMS OF CPU.
System hanging.
System not powering.
Can power but not booting.
BATTERY: The type of battery used by the computer system is known as the
complementary metal oxide semi conductor (CMOS) battery, which regulates
the computer modular operating system. The CMOS battery takes care of the
setting of the board parameters e.g., the time and date of the computer system.
The type of battery that the motherboard carries is the Litton battery with 3v
capacity series CR 2002.When the CMOS battery is low or spoilt, the CMOS
configuration settings on the motherboard will be lost and will need to be reset
before the commencement of work for the day.
Bios are a chipset that controls every input to the board and every output,
input to the board and every output that goes out of the board. Manually every
day before works commence, you will check it. Bios contain ROM program.
JUMPERS
Jumpers are meant to close or open a circuit connected to the device e.g., hard
disk drives, cd rom drives or Jumper 7 (located at the motherboard) is for
enabling and disabling the board parameters (i.e., restore default).
1&2 Clear CMOS (Disable)
2&3 users’ default (Enable)
After enabling or disabling a jumper, the settings need to be saved to the cmos
for the settings to be effective and for future use. You can also jump your
sound card, VGA card, modem cards etc.
MEMORY
Memory in computing is the part of computer where information is stored; the
amount of space in a computer for storing information either permanently or
temporally.
a. Hard disk
b. Cache
c. Rom (Read only Memory)
d. Magnetic Tapes, etc.
HARD DISK
Hard disk is a permanent storage device. It is always tied to the system i.e.,
why it is called fixed hard disk. The composition of the hard disk includes the
board, cylinders, the heads and sectors. The cylinders are spherical in shape
coated with magnetic substances from data.
* The Head is the starting point for every cylinder.
* The sectors are the division to which the cylinder could be divided. The
storage of the hard disk is measured in bytes. The older hard disk has low
capacity while the modern one has the higher capacities while the modern one
has the higher capacities files are permanently sacred in the hard disk. Every
hard disk from the factory is per-formatted. So, for you to save work, it must
first of all be formatted in a higher-level way. During formatting, the
operating system (OLS) will now prepare the hard disk into cylinders, head
and sectors. High processor board will carry a higher hard disk while a low
processor will carry a lower hard disk. If a higher hard disk says 20GB
connected to Pentium 1 series processor, it might have a draw back because of
a rotation per mint (RPM) compared to the processor clock speed. So, it is
necessary to identify the processor of the system before attaching to a system.
Most hard disk gets crashed or bisector early because of processor speed and
unnecessary power failure or constant power failure.
The company that manufactures hard disk includes, Sea Gate,
Quantum, Maxtor, fusion, International Business Machine (IBM) etc.
STRUCTURE OF THE HARD DISK
Track
Head
The read and write head starts from head & sector.
You can also know the capacity of your hard disk. By multiplying the
cylinder-Head and sector by size.
A. Master indicates that the O/S will start the computer from the hard disk.
The master being the source does not depend on any other hard disk to
boot the system.
B. Slave hard disk cannot boot up the system to windows, hence to save or
copy information to and from the slave you must go through the master
first. Slave hard disk is used as a backup of the master hard disk.
C. Cable Select enables a system to select by itself in other words it enables
the system to automatically configure the hard disk jumper depending on
the boot of the system. Cable selects may be necessary when you are
confused on the jumper of the system you will then the hampering of the
system you will then configure it as slave or master. Normally the pins for
jumper are eight (8) in number s
In a nutshell, a head crash is a physical damage of a hard disk when the faulty
electronics or mechanism causes the read –write head to land on the rotating
platter instead f retracting to its safe zone, hence by damaging and grinding
away the magnetic film on the disk surface.
A read-write head or simply the head is a tiny electromagnet suspended by an
armature that is prissily positional above every disk platter. The head acts as
an interface between the physical storage media and the rest of electronics
components of the disk by transforming electric signals into magnetic pulses
to store data into a disk in reverse, it reads the patterns of magnetic flux and
converts them into electrical signals which are further encoded into binary
bits to be processed by the computer.
When the platter is rotating at rates between 5,400 to 15,000 revolutions per
minutes, a thin film of air suspends the read/write head extremely closely
above the disk surface. The distance called the head is typically measured in
millions of inches. So, it is possible that heads can make contact with the
media on the hard disk when they are faulty disk mechanism.
DUST DEBRIS.
A hard disk is never 100% seal if it is then, it is not possible to create the
necessary air flow from the disk working mechanism. When dust enters and
contaminated to the hard disk. It can obstruct the movement of the head
resulting in a crash as the clearances between the sizes of a smoke particle.
MECHNICAL SHOCK
A sock applied to a disk while it’s in active state may cause the head to
bounce and slide against the platter hence forth scratching it.
POWER SURGE.
Another reason is the effect of using poor power supply which has the same
problem as power surges and power cuts resulting in unpredictable movement
of read write head mechanism causing the crash.
CACHE MEMORY
Cache memory is the special type of buffer (G) memory that holds a copy of
data or instructions in main memory if they are likely to be needed by the next
processor. It generally increases the speed at which data and instructions can
be accessed and therefore the speed at which the task is completed. Cache
enhances software operation. A board with high cache of says 256KB –
512KB perform better than a board of 128 or 64KB.
READ ONLY MEMORY (ROM): This is a name giving to chips that store
information or instructions that do not change. An example would be the
instructions and data used when a computer is first turned on. The contents of
ROM memory are retained when the computer is turned off, therefore it is
non-volatile. The data or programmed stored in ROM cannot be altered only
read. Instructions that are stored in memory are called firmware or
macrocodes. Examples of computers that use ROM memory are the special-
purpose computers used in automobiles and appliances.
MAGNETIC DISK: This is the type of memory that is made with plastic
coated magnetic material
ALPHAPETICATION OF DRIVES
FLOPPY DISK
FLOPPY DRIVE
CD ROM DRIVES
The CD Rom drive is measured in rotating per minute rated as X e.g., 4X,
8X, 12X, 16X, 24X, 32X, 38X, 42X, 46X, 52X, 56X,
TYPES OF CD –ROM DRIVES
1. CD ROM DRIVE
2. CD /DVD DRIVE
3. CD REWRITABLE DRIVE
4. CD-DVD –COMBO DRIVE
FORMATING A NEW HARD DISK
Formatting is the division of the hard disk into tracks & sectors.
Ram is the name giving to integrated circuits, or chips that are used for
main memory. It is temporary memory that allows you to run applications.
When a computer is turned off, data stored in ram memory are erased,
therefore RAM memory is volatile. Programs that need to be saved need
to be transferred to the secondary memory before the power is turned off. A
new type of memory called flash ram or flash memory can now retain data
even when the power is turned off. Many applications require specific amount
of ram to work, fortunately, more memory can be added. Examples of
temporal device are: -
a. RAM (Random access Memory)
b. SIMM (Single Inline Memory Modules)
c. DIMM (Direct inline Memory Modules)
d. DRAM (Single Data Random Access Memory)
e. DDRAM (Double Data Random access Memory)
SIMM Comes in 30, 32, 72 pins for 386 or 486 boards
DIMM Use 84 pins and above.
All Memory are measured in bytes, bytes stand for characters then 8 bits =
1byte = 1character
A bit is the smallest identifiable unit in information storage or Data storage.
Memory works for program whereas processor works for the Board. The
higher the memory in your system the faster the programs in your system.
MEASUREMENT OF MEMORY
Memory can be measured in: -Memory is measured in bytes, which can also
be measured in binary numbers.
1. Bring out the memory and use mentholated spirit to clean the pin, capacity
Bios etc. keep for about 2 hrs dry or day to dry. But before you insert it back,
blow off the dust in the banks before inserting the memory again to avoid
affecting it again.
DIAGRAM OF A MEMORY
MEMORY SLOTS
CAUTION
VGA CARD
Video Graphical Array or Adapter can be onboard
or can be an Adaptor a card. VGA enhances the
display of the screen in other words; it is the bridge
between the CPU and the monitor. VGA Card
comes in variety; it can be ISA, PCI or AGP
Advantages of onboard VGA depends on the
onboard memory.
SOUND CARD
Sound Audio processing card is used to capture chipsets and then processes
the audio in form of sound transmission, it travels in Hertz
It can be onboard or adapter. In any well-installed sound card, you must have
the mic connection port, the speaker ports and in and out ports also.
INSERTING METHOD
1. Insert the card to the system slot whether ISA or PCI Slot
2. The system will detect the card as a new hardware
3. Insert the driver that it comes with weather CD driver or a diskette
4. The O/S will automatically search for the inserted driver to install the
software then click next until it installs the software.
5. If properly installed the Audio will function else it will not function.
MODEM CARD
Modem means Modular De-modular that has to do with analog digital card;
this is a device that is used in converting telephone language to computer
language from Nitel in Nigeria to public phone of data in computer world.
RANGE OF MODERN
1. Uncouple the system and insert the modern card in a slot at the mother
board
2. Reboot the system
3. New hardware found massage will appear on the screen
4. Then insert the CD driver that it comes with.
5. The O/S will ask you whether you want to install automatically or
manually
6. The system will install the driver and make it ready for use.
LAN CARD
Local area network card can also be called Network interface card (NIC)
TV CARD
U S B CARD
ISDN CARD
POWER PACK
SOLUTIONS
1. Change some components that are bad
2. Troubleshoot the power pack, which mean checking for component,
which are bad and change them.
ASSEMBLING CARDS
In a system where you have LAN, modern VGA, US6 and sound card you
can put VGA in I or in 3 or VGA in I, modern in 3. If you did not insert the
right card 60 its sitting, there will be conflicting. Try to insert your cards in
a slot.
During the process of assembling the system you should be careful on
how arrange the cards in such that they can properly adapt non-conflicting
IRQ the cards.
Dual forts in first out (FIFO)
Last forts in first out (LIFO)
COMPUTER ASSEMBLING
NOTE: the type of motherboard you buyer determines the type of case you
buy. We have:
1. AT CASEN
2. ATX CASEN
New Casein you buy must have:
1. Power Pack
2. Power cable
3. Screws
4. Extra brackets
After assembling a system test it before you couple the system. Which
means are you couple the system. Which means after testing outside
disconnect and stage of your assembling you must test before slotting
ribbons.
ASSEMBLING
INDICATORS ON MOTHERBOARD
TYPES OF INDICATORS ARE
It is a program that acts as an inter face (Go between) for the user and the
system. The level of language you see on the screens called the high-level
language and then converted to low languages or machine language so that the
system will understand.
The O/S also acts as an interpreter between the user and the machine because
the machine will not understand the high-level language but before the
computer understands it must be decoded or converted to machine language.
THE OS IS DIVIDED INTO TWO.
1. Windows
2. Network
3. Wireless
EXAMPLES OF GRAPHICS OS
1. Mac
2. Linux
3. Zen ox
4. Unix
FORMARTTING
Formatting is the process of preparing the HDD to receive data. Data cannot
stay in the HDD because during the formatting process the hard disk cylinder
will divide into tracks and sectors
NOTE: BEFORE FORMATTING A COMPUTER, YOU MUST SET
YOUR BIOS, SOME KEYS USED TO ENTER SETUP, F12, F2, AND
DEL.
Now the computer will ask you press any key to boot from cd/DVD, press
the key without wasting time
Dos are the priest operating system that started the method of booking
computer from the permanent Medium. MS DOS as it is called is the most
popular on in the market. Dos itself is a command interpreter.
INTERNAL COMMANDS
These are those commands that are visible in the dos directory
EXTERNAL COMMAND
These are those commands that are not visible in Dos Directory but if you
issue such commands it works.
Examples of Internal Command are:
C:/Dos Dir
Command. (Com) Enter– Extension
Copy. Exe * Backup
Print. Exe ANSI Restore
Delete
Rename
Auto exe
Tree
Deltree
X copy 32
Edit
EXTERNAL COMMAND
US – Clear Screen
Dir – directory
Wild card - *
MD – make directory
RD – Remove
CD – Change
/ - Root
CD. – Step out to root
: - File extension
CD * - step out
Assignment
1. Formulate a technical command that will help you to change from one
drove to another
2. Give two examples of internal command you can use a technician
during repairs
: ANSWERS:
1. C: / A; C: / D: ; C: / E: etc A:/ C
12. X copy command & deltree command
BACKUP COMMAND
ANSWER
In win 98 their CDSA that is the original, which came with a new PC this, can
be used automatically to format a new hard disk. Proceed with the installation
of win proper but if you decide to quit setup after formatting the hard disk
press F3 twice to exit setup and to return to prompt and setup the version of
Ols you needed.
In the areas of win 2000, XP, just insert the installation CD containing
the Ols into the CD-ROM drive and restart the system. As the system is
booting enter the board level to change the command to boot from CD-ROM
after changing press F10 and to exit. The CD of this window runs Auto play,
and then follows the installation procedure to install this OLS.
In Win 98 it has a cap file but in Win XP and 2000 it has no cap files in
win 95-08 installation are done manually but as win XP and 2000 it is done
Automatically. Enter
UPGRADING OLS
NB: before you can upgrade an OLS, it means that the Ols will meet the
minimum requirement of the upgrade e.g., upgrade win 95 to win 98, 98-
2000, me or XP.
TO UPGRADE WIN 95
: REQUIREMENTS:
HOW TO UPGRADE
1. Insert the upgrade version of window CD into the CD rom drive after
the precious win you want to upgrade has finished booting normally.
2. The Ols CD will prompt for an upgrade or clean installation you set
upgrade
3. Follow the instructions on the screen
4. You can upgrade from win 3.0 to 95,97 or 98 from 97 and 98 to me,
2000 or XP. Apart from upgrade system or OLS you can also upgrade
devices.
ASSIGMENT
1. Give three examples of device that can be upgrade before installing Ols
2. What is the different between system after and application files
3. Give five reasons why computer users upgrade their system
4. What can hinder upgrade of Ols
5. A system hangs while upgrading what the problem?
ANSWERS
1a. Memory can be upgraded
b Hard disk can be upgraded
c. Processors can be upgraded
2a. System files are that make up the operating system eg Win 98 se,
upgrade etc.
b Application files are files that are install after the installation Ols that is
system files e.g., Corel Draw, page maker etc.
3a the user wants fast and efficient system which can run H/Her program
fast
b. This is because of the types of devices He or she has like memory VGA
etc.
d. Thrist to upgrade the vision of OLS
e. The type of Application program His/her is running.
4. Memory hinder upgrade because if the memory in your system is low
e.g., like 16mb it cannot run win 2000 or XP.
a. Memory hinder upgrade because if the memory in your system is low
e.g., like 16mb it cannot run win 2000 or XP.
b. HDD space can hinder upgrade because if you have a little disk space it
cannot capacitate an upgradeable OLS.
5. Bad memory can hang a system while upgrade. Just replace with a good
1. As for bad memory, remove the bad memory and replace with a good
one and you can blow out dust from the memory banks with your
blower before inserting the good memory. You can as well clean the
bad memory with mentholated spirit and leave to dry. If it continued to
hang the system replace with another good one.
2. As for bad tracks and sectors,
A) Use low level format to delete the bad tracks
B) Partition the hard disk to good sections
C) Limit your installation to Ols to the partitioned space blc it can take all
the space and none will be left for application programs
D) After all this and it continues to hang the system change the hard disk
1. Run-cmd
2. Cd/ enter
3. ClS enter
4. Format space (e:) depending were the drive lies.
5. Press enters when ready –enter
6. Volume label-means if you want to name the drive
7. It will display some note telling you that your drive has been formatted
8. Type EXIT-enter
IC TERMINOLOGY.
BONDING-attaching the die on the ceramic substrate and then connecting the
leads to the package.
CHIPS-an extremely small part of a silicon wafer on which IC is fabricated.
CIRCULT PROBING-testing the electrical performance of each IC chips
with the help of a microscope and multi-point probe.
DIE-same as chips.
DIFFUSION-a process that consist of the introduction of in purities into the
selected region of a wafer to form junction.
ENCAPSULATION-putting a cap over the ic and sealing it in an inert
atmosphere.
EPITARY-a process of the controlled growth of a crystalline doped layer of
silicon on a single crystal substrate.
ETACHING-a process of selective removal of a region of a semi conductor
metal or silicon dioxide.
MASK-a glass plate with desired pattern for diffusion or metallization.
METALLIZATION- a process for pro viding ohmic contacts and
interconnections by evaporating aluminum over the chips.
PHOTOLITHOGRAPHY-a process to transfer geometrical pattern from the
mask to the surface of the wafer.
PHOTORESIST-a light sensitive material that hardens when exposed to
ultraviolet light.
WAFER-a thin disk of semi-conductor in which number of ICs are fabricated
simultaneously.
The fundamental device of the digital world is the integrated circuit, a small
square of silicon containing millions of transistors. It is probably the most
complex of man-made products. Although it looks flat, it is in fact a three-
dimensional structure made by painstakingly building up on the silicon base
several microscopically thin layers of materials that both insulate and conduct
electricity. Assembled according to a pattern carefully worked out in advance,
these layers form the transistors, which function as switches controlling the
flow of electricity through the circuit, which is also known as a chip. 'On' and
'off' switches manipulate the binary code that is at the core of what a computer
does.
Building a chip typically requires several hundred manufacturing steps that
take weeks to complete. Each step must be executed perfectly if the chip is to
work. The conditions are demanding. For example, because a speck of dust
can ruin a chip, the manufacturing has to be done in a 'clean room' containing
less than one submicron particle of dust per cubic foot of air (in contrast, the
average living room has between 100,000 and one million particles per cubic
foot of air). Much of the equipment needed for making chips embodies the
highest of high technology, with the result that chip factories—which cost
between $1 billion and $2 billion for a state-of-the-art facility—are among the
costliest of manufacturing plants.
A basic technology of chips making is the 'planar' process devised in 1957 by
Jean Hoerni of Fairchild Semiconductor. It provided a means of creating a
layered structure on the silicon base of a chip. This technology was pivotal in
Robert N. Noyce's development of the integrated circuit in 1958. (Noyce later
became co-founder with Gordon E. Moore of Intel Corporation, the company
that invented the microprocessor and has become the world's leading supplier
of semiconductor chips.…) Bridging the gap between the transistor and the
integrated circuit, the planar technology opened the way to the manufacturing
process that now produces chips. The hundreds of individual steps in that
process can be grouped into a few basic operations.
Chip Design
The first operation is the design of the chip. When tens of millions of
transistors are to be built on a square of silicon about the size of a child's
fingernail, the placing and interconnections of the transistors must be
meticulously worked out. Each transistor must be designed for its intended
function, and groups of transistors are combined to create circuit elements
such as inverters, adders and decoders. The designer must also take into
account the intended purpose of the chip. A processor chip carries out
instructions in a computer, and a memory chip stores data. The two types of
chips differ somewhat in structure. Because of the complexity of today's
chips, the design work is done by computer, although engineers often print out
an enlarged diagram of a chip's structure to examine it in detail.
The Silicon Crystal
The base material for building an integrated circuit is a silicon crystal. Silicon,
the most abundant element on the earth except for oxygen, is the principal
ingredient of beach sand. Silicon is a natural semiconductor, which means that
it can be altered to be either an insulator or a conductor. Insulators, such as
glass, block the passage of electricity; conductors, such as copper, let
electricity pass through. To make a silicon crystal, raw silicon obtained from
quartz rock is treated with chemicals that remove contaminants until what
remains is almost 100 percent silicon. This purified silicon is melted and then
formed into cylindrical single crystals called ingots. The ingots are sliced into
wafers about 0.725 millimeter (0.03 inch) thick. In a step called planarization
they are polished with a slurry until they have a flawless, mirror-smooth
surface. At present, most of the wafers are 200 millimeters (eight inches) in
diameter, but the industry is moving toward achieving a standard diameter of
300 millimeters (12 inches) by 1999. Because a single wafer yields hundreds
of chips, bigger wafers mean that more chips can be made at one time,
holding down the cost per chip.
The First Layers
With the wafer prepared, the process of building the chip's circuitry begins.
Making the transistors and their interconnections entails several different
basic steps that are repeated many times. The most complex chips made today
consist of 20 or more layers and may require several hundred separate
processing steps to build them up one by one.
The first layer is silicon dioxide, which does not conduct electricity and
therefore serves as an insulator. It is created by putting the wafers into a
diffusion furnace —essentially an oven at high temperature where a thin layer
of oxide is grown on the wafer surface.
Removed from the furnace, the wafer is now ready for its first patterning, or
photolithographic, step. A coating of a fairly viscous polymeric liquid called
photoresist, which becomes soluble when it is exposed to ultraviolet light, is
applied to the surface. A spigot deposits a precise amount of photoresist on
the wafer surface. Then the wafer is spun so that centrifugal force spreads the
liquid over the surface at an even thickness. This operation takes place on
every layer that is modified by a photolithographic procedure called masking,
described in the next step.
Masking
A mask is the device through which ultraviolet light shines to define the
circuit pattern on each layer of a chip. Because the pattern is intricate and
must be positioned precisely on the chip, the arrangement of opaque and
transparent spaces on a mask must be done carefully during a chip's design
stage.
The mask image is transferred to the wafer using a computer-controlled
machine known as a stepper. It has a sophisticated lens system to reduce the
pattern on the mask to the microscopic dimensions of the chip's circuitry,
requiring resolution as small as 0.25 micron. The wafer is held in place on a
positioning table below the lens system. Ultraviolet light from an arc lamp or
a laser shine through the clear spaces of the mask's intricate pattern onto the
photoresist layer of a single chip. The stepper table then moves the wafer the
precise distance required to position another chip under the light. On each
chip, the parts of the photoresist layer that were struck by the light become
soluble and can be developed, much like photographic film, using organic
solvents. Once the photoresist is patterned, the wafer is ready for etching.
Etching
During this step, photoresist remaining on the surface protects parts of the
underlying layer from being removed by the acids or reactive gases used to
etch the pattern on the surface of the wafer. After etching is complete, the
protective layer of photoresist is removed to reveal electrically conducting or
electrically insulating segments in the pattern determined by the mask. Each
additional layer put on the chip has a distinctive pattern of this kind.
Adding Layers
Further masking and etching steps deposit patterns of additional materials on
the chip. These materials include polysilicon as well as various oxides and
metal conductors such as aluminum and tungsten. To prevent the formation of
undesired compounds during subsequent steps, other materials known as
diffusion barriers can also be added. On each layer of material, masking and
etching create a unique pattern of conducting and nonconducting areas.
Together these patterns aligned on top of one another form the chip's circuitry
in a three-dimensional structure. But the circuitry needs fine-tuning to work
properly. The tuning is provided by doping.
Doping
LOGIC CIRCUITS.
LOGIC GATE- this is an electronic cct which makes a logic decision. It
has one output and one or more inputs. 0s and 1
Digital circuits operate in the binary number system, which means that all
circuit variables must be either 1 or 0. The algebra used to solve problems and
process information in digital systems is called Boolean algebra; it deals with
logic, rather than calculating actual numeric values. Boolean algebra is based
on the idea that logical propositions are either true or false, depending on the
type of operation they describe and whether the variables are true or false.
“True” corresponds to the digital value of 1, while “false” corresponds to 0.
These diagrams show various electronic switches, called gates, each of which
performs a specific Boolean operation. There are three basic Boolean
operations, which may be used alone or in combination: logical multiplication
(AND gate), logical addition (OR gate), and logical inversion (NOT gate).
The accompanying tables, called truth tables, map all of the potential input
combinations against yielded outputs.
N-P Junction
An n-p junction (also known as a diode) will only allow current to flow in one
direction. The electrons from the n-type material can pass to the right through
the p-type material, but the lack of excess electrons in the p-type material will
prevent any flow of electrons to the left. Note that the current is defined to
flow in a direction that is opposite to the direction of the flow of the electrons.
Kirchhoff’s Rules
Kirchoff’s rules govern the flow of current and voltage through an electric
circuit. In this diagram, I stands for electric current and U stands for voltage.
Boldface letters designate parts of the circuit: R designates a resistor, C a
capacitor, and L an inductor. The smaller letters A, B, C, D, E, and F simply
correspond to points on the circuit. The junction rule states that the sum of
currents going into a junction (where the circuit splits) must be equal to the
sum of currents going out of the junction. The loop rule states that the sum of
voltages over a closed circuit must be zero.
Computer System
A typical computer system consists of a central processing unit (CPU), input
devices, storage devices, and output devices. The CPU consists of an
arithmetic/logic unit, registers, control section, and internal bus. The
arithmetic/logic unit carries out arithmetical and logical operations. The
registers store data and keep track of operations. The control unit regulates
and controls various operations. The internal bus connects the units of the
CPU with each other and with external components of the system. For most
computers, the principal input devices are a keyboard and a mouse. Storage
devices include hard disks, CD-ROM drives, and random-access memory
(RAM) chips. Output devices that display data include monitors and printers.
The physical computer and its components are known as hardware. Computer
hardware includes the memory that stores data and program instructions; the
central processing unit (CPU) that carries out program instructions; the input
devices, such as a keyboard or mouse, that allow the user to communicate
with the computer; the output devices, such as printers and video display
monitors, that enable the computer to present information to the user; and
buses (hardware lines or wires) that connect these and other computer
components. The programs that run the computer are called software.
Software generally is designed to perform a particular type of task—for
example, to control the arm of a robot to weld a car’s body, to write a letter, to
display and modify a photograph, or to direct the general operation of the
computer.
COMPUTER MEMORY
Inside a Computer Hard Drive
The inside of a computer hard disk drive consists of four main components.
The round disk platter is usually made of aluminum, glass, or ceramic and is
coated with a magnetic media that contains all the data stored on the hard
drive. The yellow armlike device that extends over the disk platter is known
as the head arm and is the device that reads the information off of the disk
platter. The head arm is attached to the head actuator, which controls the head
arm. Not shown is the chassis which encases and holds all the hard disk drive
components. To process information electronically, data are stored in a
computer in the form of binary digits, or bits, each having two possible
representations (0 or 1). If a second bit is added to a single bit of information,
the number of representations is doubled, resulting in four possible
combinations: 00, 01, 10, or 11. A third bit added to this two-bit
representation again doubles the number of combinations, resulting in eight
possibilities: 000, 001, 010, 011, 100, 101, 110, or 111. Each time a bit is
added, the number of possible patterns is doubled. Eight bits is called a byte; a
byte has 256 possible combinations of 0s and 1s. See also Expanded Memory;
Extended Memory.
The Bus
The bus enables the components in a computer, such as the CPU and the
memory circuits, to communicate as program instructions are being carried
out. The bus is usually a flat cable with numerous parallel wires. Each wire
can carry one bit, so the bus can transmit many bits along the cable at the
same time. For example, a 16-bit bus, with 16 parallel wires, allows the
simultaneous transmission of 16 bits (2 bytes) of information from one
component to another. Early computer designs utilized a single or very few
buses. Modern designs typically use many buses, some of them specialized to
carry particular forms of data, such as graphics.
1966: Electronics
The biggest newsmakers in electronics were the burgeoning fields of
microelectronics and high-speed digital computers, the latter with a particular
emphasis on medicine. Other electronic devices also made news in medical
electronics, with auto safety and crime prevention taking a share of the
electronics headlines.
Microelectronics.
Computers in Medicine.
Medical Electronics
Electronic devices other than the large-scale computer that have assisted the
medical profession are the radio pill and cardiac pacemaker. The radio pill is
an ultra-compact FM transmitter encapsulated in a plastic tube the size of a
common cold pill. The pill is swallowed by the patient and the signals that are
transmitted enable the physician to chart the patient's digestive tract. The
cardiac pacemaker is another small electronic assembly which applies
properly timed electrical impulses to the heart when the patient's natural
action misses or falters. During lengthy heart surgery, an external artificial
heart—abundant with electronic circuits—is used to bypass the patient's own
heart and fulfill the organ's functions.
With more than 50,000 people killed in automobile accidents in 1966, auto
safety campaigns have stirred the conscience of the American public. In the
United States, more than 96 million licensed drivers pilot about 87 million
vehicles, and over 870 billion miles of auto travel are carried over 3.6 million
miles of highways, roads, and streets.
In an effort to find the 'why' of more than 12 million accidents reported each
year—involving about 22 million drivers—electronics is being used. The
major factor in auto accidents, the human behind the wheel, is being closely
studied with the aid of a driving simulator developed by RCA for the U.S.
Department of Health, Education and Welfare's Division of Accident
Prevention. The simulator consists of the shell of an automobile connected to
a 20-foot-long wooden tunnel. The inside of the car contains a standard
dashboard and steering assembly; however, outside light is blocked out by
wooden window boxes which provide illuminated scenes of highway traffic.
Through the windshield one can see a 20-foot roadway with five endless belts.
Two belts simulate two lanes of a highway, two belts simulate the shoulders
of the road, and the fifth belt represents the center lane. As the belts are
moved together, they create the illusion of highway travel. An optical system
combines this view with the illuminated pictures provided by the wooden
window boxes.
As the subject sits behind the wheel during a test, an unseen simulator
operator at a computer console can suddenly put other vehicles alongside the
driver, thus simulating conditions causing the majority of accidents. Driver
reaction response to various tests, when thousands of drivers are involved in
such tests, may lead to improvements in road and car design as well as
changes in traffic regulations.
Crime Prevention.
Man's first trip to the moon via the U.S. Apollo spacecraft represents a
massive challenge to the electronics industry. Complex, highly sophisticated
systems are being built, tested, and installed to accomplish such critical
functions as stabilization, guidance and navigation, and communication. There
will be little room for error or failure in any one of these electronic systems,
each of which is densely packed with hundreds of thousands of electronic
components.
Electronics will play several roles in the lunar mission. Guidance and control
of the Saturn booster stage during blast-off will be handled by a combination
of a ground-based computer and an electronic system housed in the second
stage of the booster. Once the craft is in orbit around the earth, sensitive
receivers and high-gain antennas at tracking stations throughout the world will
keep contact with the space vehicle. Precise position information will be
transmitted to the astronauts for insertion in their space-borne guidance
computer. Information from the computer will determine the precise timing
and duration of the booster refiring, as well as the exact attitude and position
at the time of the refiring, to hurl the craft out of the earth's pull toward the
moon. The astronauts and ground stations will then quickly compare guidance
data to assure proper trajectory. Another group of electronic systems will aid
in spacecraft control, positioning of the Command and Service Module (CSM)
relative to the Lunar Excursion Module (LEM)—the vehicle which will
descend to the moon—and midcourse corrections. After two of the astronauts
have descended to the lunar surface in the LEM, leaving the CSM in orbit
about the moon, rendezvous between the CSM and LEM is accomplished with
the help of tracking radar. The two astronauts return in the LEM to join their
companion in the CSM. The LEM is detached and left in a lunar orbit. Headed
back to earth, the vehicle again depends on precise guidance and control
exercised by electronic systems. The dangerous and critical phase of re-entry
first involves precise control: If the vehicle enters the atmosphere at a shallow
angle, it will bounce off the atmosphere and disappear into space; if entry is at
too sharp an angle, the vehicle will burn up.
Applications Satellites.
Dating by Computer.
The humming of computers turned to songs of love for college students across
the nation who applied to electronic matchmaking services, which pair boys
and girls with similar interests.
An applicant submits his answers to a variety of questions ('Do you believe in
a God who answers prayer?' 'Do you think romantic love is necessary for
successful marriage?'). In addition to describing his own characteristics, he
also indicates the qualities he desires in a dating partner. After scanning the
punch cards of thousands of lonely collegians, the computer is able to provide
the applicant with the names of five or more 'ideal mates'—all for an
application fee of a few dollars.
Making romance 'more efficient' was the idea of two Harvard undergraduates
who formed a corporation called Operation Match to improve the social life of
students at non-coed colleges and to reduce 'the anxiety of the blind date.'
Rival organizations sprang up at MIT (Contact) and at the University of
Wisconsin (SECS); TACT, a Manhattan organization aimed mainly at college
graduates in professional fields, also offers a series of 'compu-functions,'
including 'scientifically balanced cocktail parties.'
Electronics, field of engineering and applied physics dealing with the design
and application of devices, usually electronic circuits, the operation of which
depends on the flow of electrons for the generation, transmission, reception,
and storage of information. The information can consist of voice or music
(audio signals) in a radio receiver, a picture on a television screen, or numbers
and other data in a computer.
II HISTORICAL BACKGROUND
The introduction of vacuum tubes at the beginning of the 20th century was the
starting point of the rapid growth of modern electronics. With vacuum tubes
the manipulation of signals became possible, which could not be done with
the early telegraph and telephone circuit or with the early transmitters using
high-voltage sparks to create radio waves. For example, with vacuum tubes
weak radio and audio signals could be amplified, and audio signals, such as
music or voice, could be superimposed on radio waves. The development of a
large variety of tubes designed for specialized functions made possible the
swift progress of radio communication technology before World War II and
the development of early computers during and shortly after the war.
The transistor, invented in 1948, has now almost completely replaced the
vacuum tube in most of its applications. Incorporating an arrangement of
semiconductor materials and electrical contacts, the transistor provides the
same functions as the vacuum tube but at reduced cost, weight, and power
consumption and with higher reliability. Subsequent advances in
semiconductor technology, in part attributable to the intensity of research
associated with the space-exploration effort, led to the development of the
integrated circuit. Integrated circuits may contain hundreds of thousands of
transistors on a small piece of material and allow the construction of complex
electronic circuits, such as those in microcomputers, audio and video
equipment, and communications satellites.
B Transistors
Circuit Board and Transistors
A close-up photograph of a smoke detector’s circuit board reveals its inner
components, which include transistors, resistors, capacitors, diodes, and
inductors. The rounded silver containers house the transistors that make the
circuit work. Transistors are capable of serving many functions, such as
amplifier, switch, and oscillator. Each transistor consists of a small piece of
silicon that has been “doped,” or treated with impurity atoms, to create n-type
and p-type semiconductors. Invented in 1940, transistors are a fundamental
component in nearly all modern electronic devices.
H. Schneebeli/Science Source/Photo Researchers, Inc.
The bipolar transistor was invented in 1948 as a replacement for the triode
vacuum tube. It consists of three layers of doped material, forming two p-n
(bipolar) junctions with configurations of p-n-p or n-p-n. One junction is
connected to a battery so as to allow current flow (forward bias), and the other
junction has a battery connected in the opposite direction (reverse bias). If the
current in the forward-biased junction is varied by the addition of a signal, the
current in the reverse-biased junction of the transistor will vary accordingly.
The principle can be used to construct amplifiers in which a small signal
applied to the forward-biased junction causes a large change in current in the
reverse-biased junction.
C Integrated Circuits
D Resistors
E Capacitors
F Inductors
Inductors consist of a conducting wire wound into the form of a coil. When a
current passes through the coil, a magnetic field is set up around it that tends
to oppose rapid changes in current intensity (see Induction). As a capacitor, an
inductor can be used to distinguish between rapidly and slowly changing
signals. When an inductor is used in conjunction with a capacitor, the voltage
in the inductor reaches a maximal value for a specific frequency. This
principle is used in a radio receiver, where a specific frequency is selected by a
variable capacitor.
G Sensing Devices and Transducers
Some devices act as both sensor and transducer. A thermocouple has two
junctions of wires of different metals; these generate a small electric voltage
that depends on the temperature difference between the two junctions. A
thermistor is a special resistor, the resistance of which varies with
temperature. A variable resistor can convert mechanical movement into an
electrical signal. Specially designed capacitors are used to measure distance,
and photocells are used to detect light (see Photoelectric Cell). Other devices
are used to measure velocity, acceleration, or fluid flow. In most instances, the
electric signal is weak and must be amplified by an electronic circuit.
IV POWER-SUPPLY CIRCUITS
Most electronic equipment requires DC voltages for its operation. These can
be provided by batteries (see Battery) or by internal power supplies that
convert alternating current as available at the home electric outlet, into
regulated DC voltages. The first element in an internal DC power supply is a
transformer, which steps up or steps down the input voltage to a level suitable
for the operation of the equipment. A secondary function of the transformer is
to provide electrical ground insulation of the device from the power line to
reduce potential shock hazards. The transformer is then followed by a
rectifier, normally a diode. In the past, vacuum diodes and a wide variety of
different materials such as germanium crystals or cadmium sulfide were
employed in the low-power rectifiers used in electronic equipment. Today
silicon rectifiers are used almost exclusively because of their low cost and
their high reliability.
V AMPLIFIER CIRCUITS
A Audio Amplifiers
Audio amplifiers, such as are found in radios, television sets, citizens band
(CB) radios, and cassette recorders, are generally operated at frequencies
below 20 kilohertz (1 kHz = 1000 cycles/sec). They amplify the electrical
signal, which then is converted to sound in a loudspeaker. Operational
amplifiers (op-amps), built with integrated circuits and consisting of DC-coupled,
multistage, linear amplifiers are popular for audio amplifiers.
B Video Amplifiers
Video amplifiers are used mainly for signals with a frequency spectrum range
up to 6 megahertz (1 MHz = 1 million cycles/sec). The signal handled by the
amplifier becomes the visual information presented on the television screen,
with the signal amplitude regulating the brightness of the spot forming the
image on the screen. To achieve its function, a video amplifier must operate
over a wide band and amplify all frequencies equally and with low distortion.
See Video Recording.
Oscillator Circuit
This illustration shows a simplified schematic diagram of an oscillator circuit.
The tuned circuit contains an inductor coil L1, a smaller inductor coil L2, and
a capacitor C.
© Microsoft Corporation. All Rights Reserved.
Switching and timing circuits, or logic circuits, form the heart of any device
where signals must be selected or combined in a controlled manner.
Applications of these circuits include telephone switching, satellite
transmissions, and digital computer operations.
CMOS
In memory, bits are grouped together so they can represent larger values. A
group of eight bits is called a byte and can represent decimal numbers ranging
from 0 to 255. The particular sequence of bits in the byte encodes a unit of
information, such as a keyboard character. One byte typically represents a
single character such as a number, letter, or symbol. Most computers operate
by manipulating groups of 2, 4, or 8 bytes called words.
Internal
RAM
Random access memory is also called main memory because it is the primary
memory that the CPU uses when processing information. The electronic
circuits used to construct this main internal RAM can be classified as dynamic
RAM (DRAM), synchronized dynamic RAM (SDRAM), or static RAM
(SRAM). DRAM, SDRAM, and SRAM all involve different ways of using
transistors and capacitors to store data. In DRAM or SDRAM, the circuit for
each bit consists of a transistor, which acts as a switch, and a capacitor, a
device that can store a charge. To store the binary value 1 in a bit, DRAM
places an electric charge on the capacitor. To store the binary value 0, DRAM
removes all electric charge from the capacitor. The transistor is used to switch
the charge onto the capacitor. When it is turned on, the transistor acts like a
closed switch that allows electric current to flow into the capacitor and build
up a charge. The transistor is then turned off, meaning that it acts like an open
switch, leaving the charge on the capacitor. To store a 0, the charge is drained
from the capacitor while the transistor is on, and then the transistor is turned
off, leaving the capacitor uncharged. To read a value in a DRAM bit location,
a detector circuit determines whether a charge is present or absent on the
relevant capacitor.
In SRAM, the circuit for a bit consists of multiple transistors that hold the
stored value without the need for refresh. The chief advantage of SRAM lies
in its speed. A computer can access data in SRAM more quickly than it can
access data in DRAM or SDRAM. However, the SRAM circuitry draws more
power and generates more heat than DRAM or SDRAM. The circuitry for a
SRAM bit is also larger, which means that a SRAM memory chip holds fewer
bits than a DRAM chip of the same size. Therefore, SRAM is used when
access speed is more important than large memory capacity or low power
consumption.
The time it takes the CPU to transfer data to or from memory is particularly
important because it determines the overall performance of the computer. The
time required to read or write one bit is known as the memory access time.
Current DRAM and SDRAM access times are between 30 and 80
nanoseconds (billionths of a second). SRAM access times are typically four
times faster than DRAM.
The internal RAM on a computer is divided into locations, each of which has
a unique numerical address associated with it. In some computers a memory
address refers directly to a single byte in memory, while in others, an address
specifies a group of four bytes called a word. Computers also exist in which a
word consists of two or eight bytes, or in which a byte consists of six or ten
bits.
Internal
ROM
External
Memory
Another form of magnetic memory uses a spinning disk coated with magnetic
material. As the disk spins, a sensitive electromagnetic sensor, called a read-
write head, scans across the surface of the disk, reading and writing magnetic
spots in concentric circles called tracks.
Optical
Media
Magneto-Optical
Media
Magneto-optical (MO) devices write data to a disk with the help of a laser
beam and a magnetic write-head. To write data to the disk, the laser focuses
on a spot on the surface of the disk heating it up slightly. This allows the
magnetic write-head to change the physical orientation of small grains of
magnetic material (actually tiny crystals) on the surface of the disk. These tiny
crystals reflect light differently depending on their orientation. By aligning the
crystals in one direction a 0 can be stored, while aligning the crystals in the
opposite direction stores a 1. Another, separate, low-power laser is used to
read data from the disk in a way similar to a standard CD-ROM. The
advantage of MO disks over CD-ROMs is that they can be read and written to.
They are, however, more expensive than CD-ROMs and are used mostly in
industrial applications. MO devices are not popular consumer products.
Cache
Memory
CPU speeds continue to increase much more rapidly than memory access
times decrease. The result is a growing gap in performance between the CPU
and its main RAM memory. To compensate for the growing difference in
speeds, engineers add layers of cache memory between the CPU and the main
memory. A cache consists of a small, high-speed memory system that holds
recently used values. When the CPU makes a request to fetch or store a
memory value, the CPU sends the request to the cache. If the item is already
present in the cache, the cache can honor the request quickly because the
cache operates at higher speed than main memory. For example, if the CPU
needs to add two numbers, retrieving the values from the cache can take less
than one-tenth as long as retrieving the values from main memory. However,
because the cache is smaller than main memory, not all values can fit in the
cache at one time. Therefore, if the requested item is not in the cache, the
cache must fetch the item from main memory.
Cache cannot replace conventional RAM because cache is much more
expensive and consumes more power. However, research has shown that even
a small cache that can store only 1 percent of the data stored in main memory
still provides a significant speedup for memory access. Therefore, most
computers include a small, external memory cache attached to their RAM.
More important, multiple caches can be arranged in a hierarchy to lower
memory access times even further. In addition, most CPUs now have a cache
on the CPU chip itself. The on-chip internal cache is smaller than the external
cache, which is smaller than RAM. The advantage of the on-chip cache is that
once a data item has been fetched from the external cache, the CPU can use the item
without having to wait for an external cache access.
DEVELOPMENTS AND
LIMITATIONS
Since the inception of computer memory, the capacity of both internal and
external memory devices has grown steadily at a rate that leads to a
quadrupling in size every three years. Computer industry analysts expect this
rapid rate of growth to continue unimpeded. Computer engineers consider it
possible to make multigigabyte memory chips and disks capable of storing a
terabyte (one trillion bytes) of memory.
Some computer engineers are concerned that the silicon-based memory chips
are approaching a limit in the amount of data they can hold. However, it is
expected that transistors can be made at least four times smaller before
inherent limits of physics make further reductions difficult. Engineers also
expect that the external dimensions of memory chips will increase by a factor
of four, meaning that larger amounts of memory will fit on a single chip.
Current memory chips use only a single layer of circuitry, but researchers are
working on ways to stack multiple layers onto one chip. Once all of these
approaches are exhausted, RAM memory may reach a limit. Researchers,
however, are also exploring more exotic technologies with the potential to
provide even more capacity, including the use of biotechnology to produce
memories out of living cells. The memory in a computer is composed of many
memory chips. While current memory chips contain megabytes of RAM,
future chips will likely have gigabytes of RAM on a single chip. To add to
RAM, computer users can purchase memory cards that each contain many
memory chips. In addition, future computers will likely have advanced data
transfer capabilities and additional caches that enable the CPU to access memory
faster.
HISTOR
Y
Early electronic computers in the late 1940s and early 1950s used cathode ray
tubes (CRT), similar to a computer display screen, to store data. The coating
on a CRT remains lit for a short time after an electron beam strikes it. Thus, a
pattern of dots could be written on the CRT, representing 1s and 0s, and then
be read back for a short time before fading. Like DRAM, CRT storage had to
be periodically refreshed to retain its contents. A typical CRT held 128 bytes,
and the entire memory of such a computer was usually 4 kilobytes.
The next step in the development of computer memory came with the
introduction of integrated circuits, which enabled multiple transistors to be
placed on one chip. Computer scientists developed the first such memory
when they constructed an experimental supercomputer called Illiac-IV in the
late 1960s. Integrated circuit memory quickly displaced core and has been the
dominant technology for internal memory ever since.
COMPUTER NETWORKING