Chapter 4 Creating the PCB data

1. Overview 4-3
2. Registering and selecting the PCB name 4-5
2.1 Registering PCB names ............................................................................... 4-6
2.2 Selecting the PCB name ............................................................................. 4-8

3. Creating the component information 4-10

3.1 Creating procedure .................................................................................. 4-12
3.2 Setting the stick feeder component data ................................................... 4-15
3.2.1 When searching for the optimum feeder set position 4-15
3.2.2 When not searching for the optimum feeder set position 4-20
3.3 Setting the tray component data ............................................................... 4-22
3.4 Various parameter settings ........................................................................ 4-29
3.4.1 Box type chip resistors and capacitors 4-30
3.4.2 Mini-mold transistors 4-35
3.4.3 SOP components 4-39
3.4.4 QFP components 4-43
3.4.5 Melf components (cylindrical components) 4-48
3.4.6 BGA components 4-52
3.4.7 Connectors 4-55
3.5 Executing the Adjust Assistant commands ................................................ 4-59
3.6 Pickup angle ............................................................................................ 4-67
3.7 Pickup and mount vacuum pressures ....................................................... 4-68
3.7.1 Reference pickup vacuum level 4-69
3.7.2 Reference mount vacuum level 4-70
3.8 Registration location of component data .................................................. 4-71
3.9 Editing the BGA ball lead information ...................................................... 4-72

4. Creating the mark information 4-78

4.1 Creating procedure .................................................................................. 4-80
4.2 Various parameter settings ........................................................................ 4-82
4.3 Executing the Adjust Assistant commands ................................................ 4-87

5. Clamping the PCB 4-92

6. Creating the PCB information 4-95
6.1 Creating procedure .................................................................................. 4-97
6.2 PCB origin .............................................................................................. 4-102
6.2.1 Normal PCB origin position setting 4-103
6.2.2 Setting the PCB origin at a position other than
the locate pin position 4-104
6.2.3 Setting the PCB origin for multi-block PCB 4-105
continued...
 7. Creating the mount information 4-106
8. Checking the data 4-112
8.1 Checking the component information .................................................... 4-112
8.2 Checking the mount information ............................................................ 4-114

9. Data optimization 4-118

9.1 Selecting the data ................................................................................... 4-119
9.2 Setting optimization conditions .............................................................. 4-120
9.3 Optimizing the data ............................................................................... 4-122

10. Mounting test and data correction 4-123

10.1Making setups for mounting test ............................................................. 4-124
10.2Starting the mounting test ....................................................................... 4-127
10.3Error countermeasures during mounting test ........................................... 4-130
10.3.1PCB data error 4-131
10.3.2Fiducial mark recognition error 4-132
10.3.3Component pickup error 4-134
10.3.4Component recognition error 4-136
10.3.5Component mount error 4-137
10.4Correcting the data after mounting test ................................................... 4-140

11. Data backup 4-143

11.1 Formatting and creating the PCB data disk ............................................. 4-144
11.2 Creating the PCB data disk ..................................................................... 4-145
11.3 Data backup .......................................................................................... 4-146

12. Teaching and trace 4-147

12.1Trace ...................................................................................................... 4-147
12.2Teaching ................................................................................................ 4-149
12.2.1Point teaching 4-149
12.2.2Vision cursor teaching 4-151
12.3Automatic trace ...................................................................................... 4-155

13. Data editing for production PCB 4-156

13.1Data editing ........................................................................................... 4-156
13.1.1Copying the specified range 4-157
13.1.2Deleting the specified range 4-159
13.1.3Inserting one line 4-160
13.1.4Deleting one line 4-161
13.2Data replace .......................................................................................... 4-162
13.2.1Data replace in mount information 4-162
13.2.2Data replace in component information 4-165
13.3Data sort ................................................................................................ 4-169
 Creating the PCB data Chapter 4
1
1. Overview
The PCB data is indexed by means of each individual PCB name. Each PCB
type (model) consists of various information as shown below.
Data management for each PCB
30023007-02

PCB name MAIN WINDOW SUB WINDOW

PCB1 PCB Info. USER ITEMS

PCB2 Mount Info. PICK & MOUNT
PCB3 Component Info. TRAY
Mark Info. SHAPE
Block Repeat Info. VISION
Local Fidu. Info. Mark Type Info.
Local BadMrk Info. Mark size Info.

Vision Info.

This section describes basic methods for creating PCB data so that you will
understand what data is needed for what item. After you have obtained a
complete understanding of these methods, begin actual work according to the
desired method.
The flow chart on the next page shows the basic procedure for creating new
PCB production data.

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 Chapter 4 Creating the PCB data
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Flow chart for creating new PCB production data
30023008-02

Create database ☞ Chapter 5

Execute the shaded item as needed.

Register and select

PCB names ☞ 2

Create Component Info.

☞ 3

Create Mark Info.

For fiducial mark
☞ 4

For badmark
☞ Chapter 5

Secure PCB on conveyor ☞ 5

Create PCB Info.

☞ 6

Create
Block Repeat Info. ☞ Chapter 5

Create Mount Info.

☞ 7

Create
Local Fidu. Info. ☞ Chapter 5

Create
Local Bad Mrk Info. ☞ Chapter 5

Check mounting position

and correct data ☞ 8

Data optimization
☞ 9

Test mount components

and correct the data ☞ 10

Make data backup

☞ 11

To PCB production
☞ Chapter 3

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 Creating the PCB data Chapter 4
2
2. Registering and selecting the PCB name
Flow chart for registering and selecting PCB name
30023009-00

2/DATA/M

1/EDIT_DATA

D2/CREATE
PCB DATA

Input PCB name

D1/SWITCH
PCB DATA

Select
PCB name

VIOS hierarchical structure (for registering and selecting PCB name)

30924001-00

1/OPERATION/M 2/DATA/M 3/MAINTE/M 4/SHELL/M 0/EXIT

1/EDIT_DATA 2/DATA_GENERATOR 3/DATABASE 4/MANUAL 0/EXIT

A/DISPLAY

B/UTILITY

C/EDIT_TOOL

D/FILE

D1 SWITCH PCB DATA

D2 CREATE PCB DATA
D3 DELETE PCB DATA
D4 COPY PCB DATA
D5
D6 RENAME & SAVE & EXIT
D7 CHECK DATA ROUGHLY
D8 SAVE PCB DATA
D9 ABORT PCB DATA
D0 SAVE PCB DATA & EXIT

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 Chapter 4 Creating the PCB data
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2.1 Registering PCB names
To create new PCB data for production, you must first register the PCB name.
There are four methods for registering a PCB name.
1. Registering a new PCB name
If no basic data is found in the previously registered PCB data. You should
register a PCB name to create empty space for new PCB data and then
enter necessary data.
2. Utilizing PCB data already registered
Make a copy of PCB data which is already registered in the VIOS software
memory.
3. Converting PCB data created by a YAMAHA YM series mounter (UFOS
machine)
Convert the UFOS data into VIOS data.
4. Converting CAD data or other manufacturer’s mounter data
After converting CAD data or other manufacturer’s mounter data into a
typical format, take its component coordinate data into the VIOS to create
data that can be used with YAMAHA full vision series mounters.
The following steps explain the procedure in “1. Registering a new PCB
name”. For other methods, refer to the separate manual “YVOS 2 ” available
from YAMAHA.
1 Select <2/1/D2 CREATE PCB DATA> and press the [ENTER]
key.
The Create PCB box then appears on the screen.
2 Enter a PCB name.
Enter a PCB name within 20 alphanumeric characters and press the [ENTER]
key. The message “NOT EXIST” then appears on the right in the box and the
cursor moves to the “Select Execute” parameter. (Refer to the Caution below.)

Create PCB box

70023002-00

Enter the PCB name here

Create PCB
Destination
PCB Name : PCB1
MCH Name : Machine NOT EXIST
Select Execute : CANCEL
[INS][DEL] to change.
[ESC] to abort, [Enter] to finish.

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 Creating the PCB data Chapter 4
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3 Set the “Select Execute” parameter to “EXECUTE”.
Use the [INS] [DEL] or [Space] key to select “EXECUTE” and press the [ENTER]
key. The PCB name has now been registered.

c
Selecting “EXECUTE” to register the new PCB name
70023003-00

Create PCB

Select Execute : EXECUTE

n Note
A space cannot be included in a PCB name. Use underbars instead.
Example: SAMPLE PCB DATA→SAMPLE_PCB_DATA

c Caution
When the message “EXIST” appears in Step 2, this means that a PCB with the same name
has already been registered, so register another PCB name.

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 Chapter 4 Creating the PCB data
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2.2 Selecting the PCB name
After you have registered the PCB name, select it to create data. (Likewise,
you must also select the PCB name to edit the PCB data previously registered.)
1 Press the [F2] key to execute the <2/1/D1 SWITCH PCB
DATA> command.
Pressing the [F2] key directly displays the PCB name selection box that shows
PCB names currently registered.

2
PCB name selection box
70023004-01

pcb name
CONVEYOR 1994-08-16
ANC_TEST 1998-02-11
PALLET_88 1998-02-23
PCB1 1997-11-24

2 Select the PCB name.

There are the following two methods for selecting the PCB name.
1. Using the arrow keys (or PageUp/PageDown keys)
Using the up/down arrow keys (or PageUp/PageDown keys), move the
cursor to the PCB name for which you will edit data, and press the [ENTER]
key.
2. Typing the PCB name
On the screen showing the PCB name selection box, you can select the
PCB name by typing its first few letters from the keyboard, in the INPUT
PCB box which appears upon typing the first letter of the PCB name. At the
same time, the cursor in the PCB name selection box moves to a PCB name
that matches the letters you typed. (This method will prove convenient
when many PCB names are already registered.)
When the target PCB is selected, press the [ENTER] key. To change the PCB
name you have just typed, press the [Back Space] key to delete the last
letter one by one and retype the correct letters.

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 Creating the PCB data Chapter 4
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INPUT PCB box
70923016-00

Cursor moves as you type the PCB name.

pcb name
CUK_92001_1 1997-03-08
TCO1M2 1997-03-22
TCO1M1 1997-03-22
TCO1M1_P 1997-03-25

INPUT PCB : CUK

Type the PCB name here.

3 Select the item you want to edit or create.

After you have selected the PCB name, the edit object list appears, so select
the item you want to edit or create.
The selected information screen then appears. The PCB name is displayed on
the top of the screen (DATA [ ] column).

Selecting the PCB name and edit item

70924000-00

pcb name
CONVEYOR 1994-08-16
OBJECT ANC_TEST 1998-02-11
PCB Info. PALLET_88 1998-02-23
Mount Info. PCB1 1997-11-24
Component Info.
Mark Info.
Blk Repeat Info.
Local Fidu. Info.
LocalBadMrk Info.

n Note
To switch the PCB data on the editing screen, press the [F2] key (or execute <2/1/D1 SWITCH
PCB DATA>) . To switch the edit item, press the [F3] key (or execute <2/1/A1 MAIN WIN-
DOW>).

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3. Creating the component information
The flow chart below shows the procedure for creating data on components to
be mounted on a PCB. Component data has various parameters for each of the
component names registered. To set these parameters, it is convenient to copy
sample data of a component with a similar shape from the database (<2/3
DATABASE>) and then edit only the different parameters.
Flow chart for creating component data
30023010-02

Open
component info.

Enter component
name

Enter comment

Copy information
from database

Enter feeder set No.

NO
Create tray Is Comp. Package set to
information Tape or Bulk?

☞ 3.2
3.3
YES

Set various
parameters ☞ 3.4

Execute Adjust
Assistant ☞ 3.5

Save data

Reference
To create PCB data more efficiently, it is advisable to register the component data in the
appropriate location by considering how the component is to be used. Refer to “3.8 Registra-
tion location of component data” in this chapter for more details.

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 Creating the PCB data Chapter 4
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VIOS hierarchical structure (for creating component information)
30924002-00

1/OPERATION/M 2/DATA/M 3/MAINTE/M 4/SHELL/M 0/EXIT

1/EDIT_DATA 2/DATA_ 3/DATABASE 4/MANUAL 0/EXIT

GENERATOR
A/DISPLAY A1 MAIN WINDOW PCB Info.
Mount Info.
Component Info.
Mark Info.
Blk Repeat Info.
Local Fidu.Info.
LocalBadMrkInfo.
A2 SUB WINDOW USER ITEMS
A3 VIEW DATABASE NO. PICK & MOUNT
A4 VISION ALIGNMENT DIC. TRAY
A5 SHAPE
A6 VIEW/DEL. TEMPLET NO. VISION
A7 FIND NEXT
A8 JUMP
A9 SWITCH WINDOW
A0 RETURN TO EDIT
B/UTILITY B1 ADJUST ASSISTANT
C/EDIT_TOOL B2 SET FROM DATABASE
D/FILE B3 SET FROM DATABASE ALL
B4 DRAW THE SHAPE(CMP)
B5
B6 SET PALLET
B7 CONVEYOR UNIT
B8 TRACE
B9 TEACHING
B0 TEACH,TRACE CONDITION

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 Chapter 4 Creating the PCB data
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3.1 Creating procedure
To create PCB data, follow these steps.

1 Open the component Info. screen.

When you are editing other information, press the [F3] key (or execute <2/1/
A1 MAIN WINDOW>) to display the editing list, then select “Component
Info.” and press the [ENTER] key.

3
Component Info. screen
70023005-02

<<<APPLICATION>>> 2/DATA/M
<<MODE>> 1/EDIT_DATA
PCB:
OBJ: Component Info. USER ITEMS V
No. COMPONENT NAME COMMENT Edit Term :
1 FixCmpRef. :
2 Comp. Package :
3 Feeder Type :

Main window Sub-window

2 Enter the component name.

Enter the name printed on the tape reel or on the component itself in the
COMPONENT NAME column on the main window (left-hand window) within
20 alphanumeric characters. A space cannot be included in the name.
3 Enter a comment.
Type any desired comment in the COMMENT column as necessary. You can
omit entering comments here.
4 Copy sample data from the database.
1. Press the [ESC] key to display the <A/DISPLAY> menu window and execute
the <A3 VIEW DATABASE NO.> command.
2. Data registered in the database is listed, so select the data of the same
component or the most similar component in shape and press the [ENTER]
key.
3. The database number is entered in the Database No. column in the USER
ITEMS sub-window. At the same time, various parameters of the selected
component are copied.

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 Creating the PCB data Chapter 4
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Database No. selection screen
70923018-00

<<<APPLICATION>>> 2/DATA/M
<<MODE>> 1/EDIT_DATA
<COMMAND_LIST> A/DISPLAY

No. COMPONEN 500 R1005 Edit Term

1 501 R1608
2 A3 502 R2125
3 503 R3216
504 R3225 Database No. :

Database No. Component name Database No. is copied here automatically

Reference
You can copy the database information without using the <2/1/A3 VIEW DATABASE NO.>
command as follows:
1. Enter the desired database number in the Database No. column in the USER ITEMS
sub-window.
2. Press the [F7] key to execute the SET FROM DATABASE command, and the information on
the specified database number is then copied.
For details on the database, refer to “3. Creating the user database” in Chapter 5.

Database No. in USER ITEMS sub-window

70924001-00

USER ITEMS
Edit Term :

Enter the database No.

to be copied and press
Database No. 502 the [F7] key.

Reference
If data is registered in the database with numbers 1001 to 1600, you can redisplay all these
pieces of data from 1001 in alphabetical order by placing the cursor on the <A3 VIEW
DATABASE NO.> command and pressing the [SHIFT] + [ENTER] keys.

5 Set other parameters in the sub-windows.

Referring to “3.4 Various parameter settings” in this chapter, set other param-
eters as necessary. (To move the cursor between the main and sub windows,
press the [TAB] key. To switch the sub-windows, press the [F4] key.)

k4
Reference
When using stick feeders or tray feeders, refer to “3.2 Setting the stick feeder component data”
or “3.3 Setting the tray component data”.

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6 Execute the Adjust Assistant.
The Adjust Assistant commands are used to check or optimize the data copied
or registered.
Press the [F6] key to execute the <2/1B1 ADJUST ASSISTANT> command.
(Refer to “3.5 Executing the Adjust Assistant commands” in this chapter for
more details.)

6
7 Save the PCB data.
Press the [ESC] key, then select <2/1/D8 SAVE PCB DATA> and press the
[ENTER] key.
8 Repeat the above steps for other components.
Use the same procedure from Step 2 to register all components to be mounted
on the PCB.

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3.2 Setting the stick feeder component data
When using stick feeder components (multi or single stick feeders), you must
enter the following settings in the Component Information.

3.2.1 When searching for the optimum feeder set

position
To determine the feeder set position by automatic search for the optimum
feeder set position, follow these steps.
1 Set the stick feeder on the feeder plate.
Install the stick feeder with components loaded on the feeder plate, at a
position that meets the following two conditions.
1. Within the working range of the moving camera
The moving camera is used for teaching of the component pickup point.
2. On the front feeder plate
The component information is specified based on the component supply
from the front feeder plate.
Reference
For details on how to load components into a stick feeder or set a stick feeder on the feeder
plate, refer to the separate feeder user’s manual.

2 Select the component data.

Move the cursor to the data line of the component which is supplied by the
stick feeder.
3 Set the “Comp. Package” parameter in the USER ITEMS
window to “Stick”.
1. Press the [F4] key to display the USER ITEMS sub-window on the Compo-
nent Information screen, and press the [TAB] key to move the cursor into
the sub-window.

4k
2. Align the cursor with “Comp. Package” and press the [INS], [DEL] or
[SPACE] key to set this parameter to “Stick”.

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4 Set the “Feeder Type” parameter.
Using the [INS], [DEL] or [SPACE] key, set this parameter according to the stick
feeder type you will use.

c
• Multi-stick feeder
For general multi-stick feeders, set this parameter to “Multistick”. For
wide multi-stick feeders, set to “WideMultiStk”.
• Single stick feeder
Select from among “Stick 15mm, “Stick 20mm”, “Stick 25mm”, “Stick
30mm” and “Stick 35mm” according to the stick width. For other stick
feeders, select from “Stick-A” to “Stick-G”. (See the reference below.)
• High-speed stick feeder
Select from among “HS-Stick-L06”, “HS-Stick-L09”, “HS-Stick-L13”, “HS-
Stick-L16”, “HS-Stick-L20”and “HS-Stick-L26”. (Each number indicates
the length of component.) For other high-speed stick feeders, select from
“HS-Stick-A” to “HS-Stick-D”. (See the reference below.)
• Stacked stick feeder
Select from among “StackStk-L06”, “StackStk-L09”, “StackStk-L13”,
“StackStk-L16”, “StackStk-L20”and “StackStk-L26”. (Each number
indicates the length of component.) For other stacked stick feeders, select
from “StackStk-A” to “StackStk-D”. (See the reference below.)
Reference
When you set the Feeder Type parameter to “HS-Stick A to D” or “StackStk-A to D”, you must
first make correct settings for <3/1/A5 FEEDER SPEC. INF.> in the MAINTENANCE
Manager. For details on settings, refer to the mounter service manual.

5 Set the Use feeder opt. parameter to “Yes”.

Use the [INS], [DEL] or [SPACE] key to set this parameter to “Yes”.

c
6 Set the feeder set No.
Enter the number of the feeder set position at which the stick feeder knockpins
are inserted into the feeder plate.
7 Set the Pos. Definition parameter.
Using the [INS], [DEL] or [SPACE] key, set this parameter to “Automatic” when
not using a multi-stick feeder and advance to Step 10. When using a multi-
stick feeder, proceed to Step 8.

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 Creating the PCB data Chapter 4
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8 Move the teaching unit to the feeder set position by trace.
1. Use the [INS], [DEL] or [SPACE] key to set the Pos. Definition parameter to
“Automatic”.

c
2. The XY coordinates of the feeder set position specified in Step 6 are
automatically entered in the Feeder Pos_X and Pos_Y columns.
3. Press the [TAB] key to check that the cursor is positioned on the target data
line in the left-hand main window.

k
4. Set the trace (teaching) conditions and press the [F9] key to perform trace.
The teaching unit moves to the position specified in the Feeder Pos_XY
columns. The trace (teaching) conditions should be set as follows:
Teaching unit : Select “camera”
Speed : Select a slow speed (SPEED=20 to 40).
Fiducial : Select “NotUse”.

9
9 Perform teaching for the pickup position.
Referring to the procedure below, perform teaching for the coordinates of the
pickup position for a component.
1. Press the [TAB] key to move the cursor back to the USER ITEMS sub-
window.

k
2. Change the Pos. Definition parameter to “Relative”.
3. Move the cursor to “Feeder Pos_X mm” or “Feeder Pos_Y mm”.
4. Manipulate the YPU joystick to move the camera directly above the
component to be picked up.
Making sure that the cross cursor is positioned at the center of the
component, press the [F10] key twice to perform teaching.
The teaching position coordinates relative to the feeder knockpin have now
been entered.

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 Chapter 4 Creating the PCB data
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Teaching position
30023000-02

Component

Cross cursor
(Teaching position)

Reference
Marking at the center of the component with a pencil makes it easier to perform teaching.

n Note
When you make off-line settings, enter the correct XY distance from the feeder knockpin to the
component pickup point in the Feeder Pos_X and Pos_Y columns.

Teaching position coordinates

30023105-00

Feeder
Y
positioning
knockpin X
Pickup point

Reference
About “Pos. Definition”
This is a parameter to specify the method for obtaining the coordinates of a component pickup
position.
“Automatic”: When “Automatic” is selected, the machine automatically calculates the pickup
position based on the feeder plate reference position specified on the FeederPlateOffset screen
available from the <3/2/A1 SELECT TARGET> menu. What you have to do is just enter a
value in the Feeder Set No. column. Select this setting when using components whose pickup
position is independent of the component size, such as tape feeders.
“Teaching”: Select “Teaching” when using components whose pickup position varies
depending on the component type, such as multi-stick feeders. In this case, you must perform
teaching for the pickup position with respect to the machine origin. Since the feeder set
position has to be fixed when “Teaching” is selected, the data optimization in the <2/2/
DADA_GENERATOR> mode is not applied.
“Relative”: As with “Teaching”, select this setting when using components whose pickup
position varies depending on the component type, such as multi-stick feeders. In this case,
however, the pickup position will be a distance from the reference pickup position (feeder
positioning knockpin) of an 8mm tape feeder. Unlike “Teaching”, the data optimization in the
<2/2/DADA_GENERATOR> mode can be applied. Off-line data input is also possible.

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0 Set the TRAY parameters.
Press the [F4] key till the TRAY sub-window appears, then set each parameter
as follows.

4
• Y-Comp. Amount
Enter the number of components loaded into a single stick.
• Y-Current Pos.
This shows the number of components which have been used from the
stick. Use the initial setting value.
• CountOut Stop
Normally, set this parameter to “Nothing”. If this is set to “Exist”, the
machine will automatically stop when the number of components set in
the Y-Comp Amount parameter have been used up.

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3.2.2 When not searching for the optimum feeder
set position
If you want to set the stick feeder at a particular position and do not want to
perform automatic search for the optimum feeder set position, follow these
steps.
1 Set the stick feeder on the feeder plate.
Install the stick feeder with components loaded, onto the feeder plate at the
same position as is set in actual PCB production.
Reference
For details on loading components into a stick feeder or setting a stick feeder on the feeder
plate, refer to the feeder user’s manual.

2 Select the component data.

Move the cursor to the data line of the component which is supplied by the
stick feeder.
3 Set the “Comp. Package” parameter in the USER ITEMS
window to “Stick”.
1. Press the [F4] key until the USER ITEMS sub-window appears on the
Component Information screen, and press the [TAB] key to move the cursor
into the sub-window.

4k
2. Align the cursor with “Comp. Package” and press the [INS], [DEL] or
[SPACE] key to set this parameter to “Stick”.

c
4 Set the “Feeder Type” parameter.
Using the [INS], [DEL] or [SPACE] key, set this parameter according to the stick
feeder type you will use. See Step 4 in the preceding section for detailed
information.

c
5 Set the Use feeder opt. parameter to “No”.
Use the [INS], [DEL] or [SPACE] key to set this parameter to “No”.

c
6 Set the Feeder Set No.
Enter the number of the feeder set position at which the stick feeder knockpins
are inserted into the feeder plate.

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 Creating the PCB data Chapter 4
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7 Set the Pos. Definition parameter.
Using the [INS], [DEL] or [SPACE] key, set this parameter to “Automatic”.
When using a multi-stick feeder, proceed to Step 8. When not using a multi-
stick feeder, advance to Step 9.
8 Perform teaching for the pickup position.
Referring to the procedure below, perform teaching for the coordinates of the
pickup position for a component.
1. Move the cursor to “Feeder Pos_X mm” or “Feeder Pos_Y mm”.
2. Manipulate the YPU joystick to move the camera directly above the
component to be picked up.
Making sure that the cross cursor on the vision monitor is positioned at the
center of the component, press the [F10] key twice to perform teaching.
The teaching position coordinates relative to the machine origin have now
been entered.
The teaching conditions should be set as follows:
Teaching unit : Select “camera”
Speed : Select a slow speed (SPEED=20 to 40).
Fiducial : Select “NotUse”.

0
9 Set the TRAY parameters.
Press the [F4] key till the TRAY sub-window appears, then set each parameter
as necessary. See Step 10 in the preceding section for more details.

4
n Note
When the stick feeder needs to be installed at a particular position, you cannot make off-line
settings. Be sure to use teaching to enter the correct pickup point.

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3.3 Setting the tray component data
When using an MTF (manual tray feeder), ATS (automatic tray stacker) or
external tray changer, you must enter the following component data settings in
the Component Information.
1 Make the component setups.
Set the components on the tray. Refer to the separate tray changer user’s
manual for more details.
2 Display the USER ITEMS sub-window.
Press the [F4] key to display the USER ITEMS sub-window on the Component
Information screen.

4
3 Set the “Comp. Package” parameter to “Tray”.
Align the editing cursor with “Comp. Package” and press the [INS], [DEL] or
[SPACE] key to set this parameter to “Tray”.

c
4 Set the “Feeder Type” parameter.
Using the [INS], [DEL] or [SPACE] key, set this parameter according to the tray
feeder type you are using.

c
• MTF (manual tray feeder)
Set to “Fix. TF”.
• ATS27A
Set to “Auto TC”.
• YTF100A, YTF31A
Set to “Ext. TC”.

5 Set the Use feeder opt. parameter to “No”.

Use the [INS], [DEL] or [SPACE] key to set this parameter to “No”.

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6 Enter the Feeder Set No. (only for the MTF)
Enter the feeder set number near a position at which the MTF (manual tray
feeder) is installed on the feeder plate. (See 4 in Step 9) If your machine is
used with an ATS (auto tray stacker) or external tray changer, use the initial
setting value.
7 Adjust the conveyor width. (only for MTF)
1. Press the [ESC] key, select <2/1/B7 CONVEYOR UNITS> →”CONVEYOR
WIDTH” and press the [ENTER] key.
2. Remove any chip or debris from the conveyor if any.
3. Enter the PCB width (dimension perpendicular to the PCB flow) and press
the [ENTER] key.
The conveyor width will be adjusted to the PCB width.
4. Select “RETURN” (or press the [ESC] key) to return to the previous screen.

c Caution
The MTF (manual tray feeder) is installed to the movable conveyor rail. The conveyor width
must be adjusted to the PCB width before setting component information used with the
MTF.

8 Set the Pos. Definition parameter to “Teaching”.

9 Set the TRAY parameters.
Press the [F4] key to display the TRAY sub-window, then set each parameter as
follows.

4
1 X-Comp. Amount, Y-Comp. Amount
Enter the number of components in the XY directions on a tray. When using
a tray shown in the figure below, for example, set the X-Comp. Amount to
“5” and the Y-Comp. Amount to “4”.
2 X-CompPitch, Y-CompPitch
Enter the component pitch (center to center spacing) in millimeters in the
XY directions.
3 X-Current Pos., Y-Current Pos.
These parameters indicate which row and column on a tray the component
is currently picked up from. The row and column on a tray are counted
from the tray origin (see the reference below). Normally, enter "1" in both
the X-Current Pos. and Y-Current Pos. parameters when you have created
new component information.
Since these parameters automatically change as the components are picked
up, so you can check which row and column on the tray the components
have been used from.

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X-Current Pos., Y-Current Pos. settings

30023103-00

Y-Comp. Amount Current Pos. X

4 1,4 2,4 3,4 4,4 5,4 Current Pos. Y

3 1,3 2,3 3,3 4,3 5,3

Y-CompPitch
2 1,2 2,2 3,2 4,2 5,2

Tray origin
1 1,1 2,1 3,1 4,1 5,1

1 2 3 4 5
X-Comp. Amount
Pallet origin X-CompPitch

Reference
The pallet origin is the front left corner of the pallet when viewed from the pallet extract neck.
The tray origin is the center of the component on the tray which is nearest the pallet origin.
In the case of an MTF, the tray origin is the center of the component which is nearest the front
left corner of the tray when viewed from the front of the machine.

Pallet origin and tray origin

30023014-00

Toray origin

X
Pallet origin Pallet extract neck

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4 WastedSpace (L), WastedSpace (R) (only for the MTF)
When an MTF (manual tray feeder) is installed on the feeder, these
parameters define the feeder set positions where 8mm tape feeders cannot
be attached to the feeder plate. These parameters should be set with the
Feeder No. specified in Step 6 as the reference.
For example, when the MTF occupies the feeder plate from Nos. 109 to
135 and the Feeder No. specified in Step 6 is “120”, the left-hand feeder
set positions of Nos. 109 to 119 cannot be used, so enter “11” for the
WastedSpace (L) parameter. For the right-hand feeder set positions, Nos.
121 to 135 cannot be used, so enter “15” for the WastedSpace (R) param-
eter.

WastedSpace (L) / WastedSpace (R)

30023007-01

No feeders cannot be installed in this area

;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
WastedSpace (L) WastedSpace (R)
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;; MTF
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;
109 120 135

5 Pallet-StartNo., Pallet-LastNo. (other than the MTF)

These parameters indicate the pallet positions in a tray stacker or tray
changer where the components to be used are stored. For example, when
the components are stored on the pallets Nos. 3 to 5, enter “3” in the
Pallet-StartNo. column and “5” in the Pallet-LastNo. column.

Pallet-StartNo./Pallet-LastNo.
10023008-00

Magagine

3
4
5

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6 Pallet-Current (other than the MTF)
Enter the pallet position No. to start from for component pickup. Normally
enter the same value as specified in the Pallet-StartNo. column above. This
parameter automatically changes as components on each pallet are used
up.

7 X-TrayAmount, Y-TrayAmount
These parameters specify the number of trays set in the XY directions on a
pallet. For example in Figure A on the next page, enter “2” for the X-
TrayAmount parameter, and “1” for the Y-TrayAmount parameter. In the
case of Figure B, enter “1” for the X-TrayAmount parameter, and “2” for the
Y-TrayAmount parameter.

8 X-TrayPitch, Y-TrayPitch
These parameters set the center to center spacing of the adjacent trays on a
pallet. For example in Figure A on the next page, enter “15.00” for the X-
TrayPitch parameter, and “0.00” for the Y-TrayPitch perimeter. In the case of
Figure B, enter “0.00” for the X-TrayPitch parameter, and “10.00” for the Y-
TrayPitch parameter. When only one tray is set on a pallet, both the X-
TrayPitch and Y-TrayPitch parameters should be “0.00”.

9 X-CurrentTray, Y-CurrentTray
These parameters indicate which row and column on a pallet the tray is
currently used. Normally, enter "1" for both X-CurrentTray and Y-Current
Tray parameters. When you specify "1" for these parameters, the machine
starts pickup from the tray placed closest to the pallet origin. Normally,
enter "1" in both XY parameters.

TrayAmount/TrayPitch settings
30023009-02

A Tray B

15.00

1, 2
10.00

Tray

1, 1 2, 1 1, 1

Pallet origin X-CurrentTray Y-CurrentTray Pallet origin Pallet

0 CountOutStop
When this parameter is set to “Exist”, the machine automatically stops
when the specified number of components are used up. When set to
“Nothing”, the machine returns to the first position to continue component
pickup after the specified number of components are used up. Normally set
this parameter to “Nothing”.

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0 Enter the component pickup position in the Feeder Pos_XY
columns on the USER ITEM sub-window.
1. Press the [F4] key to switch the sub-window to the USER ITEMS display,
then enter “0.00” in both the Feeder Pos_X and Feeder Pos_Y columns.

4
2. With the cursor still positioned on the Feeder Pos_X or Feeder Pos_Y
column, press the [F9] key and set the TEACH, TRACE conditions. (If this
box is not directly displayed, select <2/1/B0 TEACH, TRACE CONDITION>
and press the [ENTER] key.)
Teaching unit : Select “Camera”.
Speed : Select a slow speed (SPEED=20 to 40).
Fiducial : Select “NotUse”.

9
3. Press the [F9] key again to perform trace.
The pallet of the number specified in the Pallet Start-No. column is
extracted and set on the stage (except for the MTF), and the teaching unit
moves to the machine origin. (If you are using an external tray changer, its
pickup head moves to the pallet origin.)
4. When you are using an MTF or ATS, manipulate the YPU joystick to move
the teaching unit to right above the center of the component which is
located nearest the machine origin (the camera is positioned here by trace).
This component is usually located in the front left corner on the pallet as
viewed from the front of the mounter. When you are using an external tray
changer, press the emergency stop button to turn the servo-control off.
Then, move the tray changer pickup head by hand to right above the center
of the component which is located nearest the pallet origin (the pickup
head is positioned here by trace). At this point, checking the position while
lowering the pickup head by pressing the [CTRL]+[F10] keys or the manual
button on the head descent air valve is recommended.

l0
Pickup head descent air valve (external tray changer)
30023004-01

Pickup head
descent air valve

Pickup head

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5. Press the [F10] key twice to perform teaching.
The teaching position coordinates you set have now been entered in the
Feeder Pos_X and Feeder Pos_Y columns.

0
6. After the teaching is complete, press the [ESC] key and execute the <2/1/B6
SET PALLET> command to return the extracted pallet to the original
position.
The pallet will be returned by entering “0” in “Pallet number for setting”.
Reference
You can make off-line settings for the Feeder Pos_X and Pos_Y parameters. In this case, enter
the correct XY distance from the pallet origin to the component pickup point in the Feeder
Pos_X and Pos_Y columns.

Component pickup point

30023106-00

Y
Feeder Pos_Y

X
Feeder Pos_ X
Pallet origin

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3.4 Various parameter settings
You must check and make necessary settings to the data copied from the
database, so that it matches the actual component you are going to use. This
section explains how to set basic parameters according to typical component
types. Since precise settings can be made by recognizing each component
(with the Adjust Assistant commands described later in “3.5”) the following
paragraphs describe only specific parameters which can be set manually in
each sub-window.
Reference
When making parameter settings, you will notice four kinds of alphabet letters “N, S, E and
W” which are indicated following certain parameters. These letters stand for the directions in
which the component is recognized with a vision system.

Component recognition directions

30924000-00

Vision display (vision monitor)

Single-vision camera

Multi-vision camera

n Note
Parameters not described in this section can be optimized or fine-adjusted while executing the
Adjust Assistant commands (explained in the next section, “3.5”) or by referring to “3.7
Pickup and mount vacuum pressures” in this chapter. You can also refer to the help message
displayed by pressing the [F1] key.

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3.4.1 Box type chip resistors and capacitors
These chip resistors and capacitors are registered with the parameters shown
below.
Chip component parameters
70924002-00

USER ITEMS PICK & MOUNT

Edit Term : Edit Term :
FixCmpRef. : 0 8 Pick Angle : 0
1 Comp. Package : Tape Pick Timer : 0.00
2 Feeder Type : 8mmTape Mount Timer : 0.00
Database No. : 501 9 Pick Height : 0.0
3 Use feeder opt. : Yes Mnt Height : 0.5
4 Required Nozzle : For1608CHIP 0 Dump Way : Dump POS
5 AlignmentModule: For&Back&Las Retry Times : 2
6 Feeder Set No. : 1 Mount Action : NORMAL
7 Pos. Definition : Automatic Mount Speed : 100
Feeder Pos_Xmm : -111.89 PickupSpeed : 100
Feeder Pos_Ymm : -4.24 A Vacuum Check : NORMAL CHK
Alt. Cmp : 0 Pick Vacuum : 30
Mount Vacuum : 30

SHAPE VISION
Edit Term : Edit Term :
C Body Size X : 0.80 B Alignment Type : Std. Chip
Body Size Y : 1.60 Lighting Level : 6/8
D Body Size Z : 0.45 Comp. Threshold : 55
E Ruler Offset : 3 Comp. Tolerance : 30
Search Area : 1.50

USER ITEMS parameters

Set the parameters in the USER ITEMS sub-window as described below. Use
the [INS], [DEL] or [Space] key, or number keys to make settings.
1 Comp. Package
Select the type of component feed.
• Tape
Select this setting when using a tape feeder which supplies components
on paper tape, embossed tape or adhesive tape.
• Stick
Select this setting when using a stick feeder such as a single stick feeder,
multi-stick feeder, staked stick feeder and high-speed stick feeder.
• Bulk
Select this setting when using a bulk cassette feeder.
• Tray
Select this setting when using a tray feeder such as a manual tray feeder,
auto tray stacker and external tray changer.

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2 Feeder Type
Select the specific feeder type to be used for component supply. Selectable
items differ depending on the Comp. Package setting. Refer to the table
below to make a selection. When the Comp. Package is set to “Stick” or
“Tray”, see “3.2 Setting the stick feeder component data” or “3.3 Setting the
tray component data” in this chapter. For details on feeders, refer to the
separate feeder user’s manual.

Feeder Type settings

50023063-01

Comp.
Package Feeder Type Tape feeder or bulk cassette feeder type
setting setting

Tape 8mmTape 8mm tape feeder (except for 1005 chip)

8mm1005cmp 8mm tape feeder (for 1005 chip)
12mmEmboss 12mm tape feeder (standard pitch)
12mmLongPitch 12mm tape feeder (long pitch)
16mmEmboss 16mm tape feeder
24mmEmboss 24mm tape feeder
32mmSticky 32mm air-driven feeder with sticky tape
32mmEmboss 32mm embossed air-driven feeder
44mmEmboss 44mm embossed air-driven feeder
56mmEmboss 56mm embossed air-driven feeder
Tape-A to D Select these settings when using a tape feeder other than the above.
Note that you must make necessary settings on the <3/1/A5 FEEDER
SPEC. INF> screen. For the setting procedure, refer to the mounter
service manual.

Bulk Bulk-1005C Bulk feeder for 1005 capacitors. Marked "1005 C" on the feeder.
Bulk-1005R Bulk feeder for 1005 resistors. Marked "1005 R" on the feeder.

Bulk-1608C Bulk feeder for 1608 capacitors. Marked "1608 C" on the feeder.

Bulk-1608R Bulk feeder for 1608 resistors. Marked "1608 R" on the feeder.

Bulk-T0.6C Bulk feeder for 2125 capacitors (chip thickness 0.6mm). Marked
"2125 T0.6" on the feeder.
Bulk-T0.6R Bulk feeder for 2125 resistors. Marked "2125 T0.6" on the feeder.

Bulk-T1.25C Bulk feeder for 2125 capacitors (chip thickness 1.25mm). Marked
"2125 T1.25" on the feeder.
Bulk-T1.25R Bulk feeder for 2125 resistors (chip thickness 1.25mm). Marked
"2125 T1.25" on the feeder.
Bulk-1608MELF Bulk feeder for 1610 Melf components. Marked "MELF φ1.0 × 1.6"
on the feeder.
Bulk-2125MELF Bulk feeder for 2125 Melf components. Marked "MELF φ1.25 × 2.0"
on the feeder.
Bulk-A to D Select these settings when using a bulk feeder other than the above.
Note that you must make necessary settings on the <3/1/A5 FEEDER
SPEC. INF> screen. For the setting procedure, refer to the mounter
service manual.

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3 Use feeder opt.
Set to “Yes” when you want to change the feeder set positions according to
results obtained with the DATA GENERATOR commands. (See “9. Data
optimization” in this chapter.) Set to “No” if you do not want to change
these positions. Setting to “Yes” is advised.
4 Required Nozzle
Select the optimum nozzle that matches the component size from among
the nozzle types for chip components. (See “Nozzle table” listed in
Supplement in this manual.)
5 AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Use the default setting (Fore&Back&Laser) in most cases.

Reference
When an AlignmentModule parameter including multiple items (e.g. “Fore&Back&Laser”) is
selected, the machine automatically selects an appropriate lighting method from those listed
and recognizes the component. An item on the right has higher selection priority than an item
on the left. However, since the YV100II surface mounter uses “Fore” only, “Back” and
“Laser” are invalid.

6 Feeder Set No.

Enter the feeder set number of the position at which the feeder is installed.
This parameter setting is unnecessary when the Use feeder opt. parameter
is set to “Yes.”
7 Pos. Definition
Set to “Automatic” when you set the Comp. Package parameter to “Tape”
or “Bulk”. For other settings, refer to “3.2 Setting the stick feeder compo-
nent data” or “3.3 Setting the tray component data” in this chapter.

PICK & MOUNT parameters

Set the parameters in the PICK & MOUNT sub-window as described below.
Use the [INS], [DEL] or [Space] key, or number keys to make settings.
8 Pick Angle deg
This parameter specifies the angle through which the mounter head rotates
to pick up a component on the feeder. This setting determines the orienta-
tion of the component (recognition reference) when it is recognized and
displayed on the vision monitor. Normally, set this parameter to “0”
degrees for horizontally long components in the loading position on the
feeder, and set to “90” degrees for vertically long components. When you
are using a bulk cassette feeder, always set this parameter to “90” degrees.

Chip component pickup angle

50023052-01

E N
Loading position S N E W
W S

Pickup angle 0º 90º

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c Caution
Pickup angle setting directly affects the recognition reference and mounting angle. Be sure
not to confuse the difference between “0” and “180” degrees for horizontally long compo-
nents in the loading position and between “90” and “-90” degrees for vertically long
components. Refer to “3.6 Pickup angle” in this chapter for more details.

9 Pick Height
Set this parameter to “0” in normal operation.
If the nozzle does not reach the component on the feeder, enter a plus
value in the Pick Height column. If the nozzle presses down on the
component, enter a minus value.
0 Dump Way
Set to “Dump POS”.
A Vacuum Check
Set this parameter to “NORMAL CHK” in normal operation. If you want to
strictly check pickup errors and mount errors (head return without mount-
ing the component), set to “SPECIAL CHK”.

n Note
With the Vacuum Check parameter set to “NORMAL CHK”, the machine controls the ascent
timing of the head from the lowered position during component pickup or mounting. This
parameter setting is valid only when the Production parameter on the PCB Info. is set to
“UseVacChk”.

VISION parameters
Make settings here for the Alignment Type parameter in the VISION sub-
window. Other VISION parameters can be optimized by executing the Adjust
Assistant commands described later.
B Alignment Type
Set this parameter to “Std.Chip” with the [INS], [DEL] or [Space] key.

SHAPE parameters
After specifying the Alignment Type parameter in the VISION sub-window,
set the parameters in the SHAPE sub-window. If the Alignment Type param-
eter is undefined, the following parameters are not displayed. Use the number
keys to make settings.
C Body Size X, Body Size Y
Enter the correct dimensions measured with a caliper or micrometer.
D Body Size Z
Enter the correct thickness measured with a caliper or micrometer.
E Ruler Offset
Enter the distance in pixels from the end of the component to an imaginary
ruler line used to measure the lead width. The ruler line should be
positioned across the lead area (light reflecting area) with a uniform width.
Use the default setting in most cases.

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SHAPE parameters for chip components
30923008-01

A : Body Size X
B B : Body Size Y
C : Body Size Z
D : Ruler Offset
C
N
E
S W
A

D
N
B
E W
S
A

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3.4.2 Mini-mold transistors
Mini-mold transistors are registered with the parameters shown below.
Mini-mold transistor parameters
70924003-00

USER ITEMS PICK & MOUNT

Edit Term : Edit Term :
FixCmpRef. : 0 8 Pick Angle : 0
1 Comp. Package : Tape Pick Timer : 0.00
2 Feeder Type : 8mmTape Mount Timer : 0.00
Database No. : 600 Pick Height : 0.5
3 Use feeder opt. : Yes Mnt Height : 0.5
4 Required Nozzle : For1608CHIP 9 Dump Way : Dump POS
5 AlignmentModule: For&Back&Las Retry Times : 2
6 Feeder Set No. : 1 Mount Action : NORMAL
7 Pos. Definition : Automatic Mount Speed : 100
Feeder Pos_Xmm : -111.89 PickupSpeed : 100
Feeder Pos_Ymm : -4.24 0 Vacuum Check : NORMAL CHK
Alt. Cmp : 0 Pick Vacuum : 10
Mount Vacuum : 10

SHAPE VISION
Edit Term : Edit Term :
B Body Size X : 1.60 A Alignment Type : Mini-Tr/SOT
Body Size Y : 1.60 Lighting Level : 6/8
C Body Size Z : 0.75 Comp. Threshold : 55
D Ruler Width : 2 Comp. Tolerance : 30
E Ruler Offset : 1 Search Area : 1.50
F Lead Number N : 2
Lead Number S : 1
G ReflectLL : 0.25
H LeadWidth : 0.30
I LeadPitch N : 0.80
LeadPitch S : 0.80

USER ITEMS parameters

Set the parameters in the USER ITEMS sub-window as described below. Use
the [INS], [DEL] or [Space] key, or number keys to make settings.
1 Comp. Package
Refer to “1 Comp. Package” in “3.4.1 Box type chip resistors and capaci-
tors”.
2 Feeder Type
Refer to “2 Feeder Type” in “3.4.1 Box type chip resistors and capacitors”.
3 Use feeder opt.
Set to “Yes” when you want to change the feeder set positions according to
results obtained with the DATA GENERATOR commands. (Refer to “9. Data
optimization” in this chapter.) Set to “No” if you do not want to change
these positions. Setting to “Yes” is advised.
4 Required Nozzle
Select the optimum nozzle that matches the component size from among
the nozzle types for chip components. (See “Nozzle tables” listed in
Supplement in this manual.)

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5 AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Use the default setting (Fore&Back&Laser) in most cases. Refer to “5
AlignmentModule” in “3.4.1 Box type chip resistors and capacitors” for
more details.
6 Feeder Set No.
Enter the feeder set number of the position at which the feeder is installed.
This parameter setting is unnecessary when the Use feeder opt. parameter
is set to “Yes.”
7 Pos. Definition
Set to “Automatic” when you set the Comp. Package parameter to “Tape”.
For other settings, refer to “3.2 Setting the stick feeder component data” or
“3.3 Setting the tray component data” in this chapter.

PICK & MOUNT parameters

Set the parameters in the PICK & MOUNT sub-window as described below.
Use the [INS], [DEL] or [Space] key to make a selection.
8 Pick Angle deg
This parameter specifies the angle through which the mounter head rotates
to pick up a component on the feeder. This setting determines the orienta-
tion of the component (recognition reference) when it is recognized and
displayed on the vision monitor. The pickup angle for transistors must be
specified so that their leads face the NS directions. Set this parameter to “0”
degrees for vertically long components in the loading position on the
feeder, and set to “90” degrees for horizontally long components. Select the
correct pickup angle referring to the table below.

Mini-mold transistor pickup angle

50023053-01

N N
Recognition W E W E
reference
S S
E N E N
Loading S N E W S N E W
position W S W S

Pickup angle 0° 90° 0° 90°

c Caution
Pickup angle setting directly affects the recognition reference and mounting angle. Be sure
not to confuse the difference between “0” and “180” degrees for horizontally long compo-
nents in the loading position and between “90” and “-90” degrees for vertically long
components. Refer to “3.6 Pickup angle” in this chapter for more details.

9 Dump Way
Set to “Dump POS”.
0 Vacuum Check
Set this parameter to “NORMAL CHK” in normal operation. If you want to
strictly check pickup errors and mount errors (head return without mount-
ing the component), set to “SPECIAL CHK”.
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n
Note
With the Vacuum Check parameter set to “NORMAL CHK”, the machine controls the ascent
timing of the head from the lowered position during component pickup or mounting. This
parameter setting is valid only when the Production parameter on the PCB Info. is set to
“UseVacChk”.

VISION parameters
Make settings here for the Alignment Type parameter in the VISION sub-
window. Other VISION parameters can be optimized by executing the Adjust
Assistant commands described later.
A Alignment Type
Set to “Mini-Tr/SOT” when the diagonally (oppositely) located lead shape is
the same, and set to “P-Tr/Con-NS” if not.

;;
Alignment Type setting for transistors
10023107-00

Mini Tr/SOT P-Tr/Con-NS

SHAPE parameters
After specifying the Alignment Type parameter in the VISION sub-window,
set the parameters in the SHAPE sub-window. If the Alignment Type param-
eter is undefined, the following parameters are not displayed. Use the number
keys to make settings.
B Body Size X, Body Size Y
Enter the correct dimensions including the leads, measured with a caliper
or micrometer.
C Body Size Z
Enter the correct thickness measured with a caliper or micrometer.
D Ruler Width
Enter the width of an imaginary ruler line used to detect the leads. Use the
default setting in most cases. If the lead end is specially formed (for
example, the lead end is round or not straight, set to “1”.

Ruler Width parameter settings

50923014-00

Straight Round Not straight

Lead form

Setting Default setting 1 1

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E Ruler Offset
Enter the distance in pixels from the lead end to an imaginary ruler line
used to measure the lead width. Use the default setting in most cases.
F LeadNumber
Enter the number of leads existing in the N and S directions.

NS directions
50924000-00

Pickup angle 0º 90º

N N
Loading
S N S N
position S S

G ReflectLL
Enter the projected length of leads which reflect light during recognition.
Use the default setting in most cases.
H LeadWidth
Enter the correct lead width.
I LeadPitch
Enter the correct lead pitch (lead-to-lead spacing).

SHAPE parameters for mini-mold transistors

30923009-01

B
A : Body Size X
C B : Body Size Y
C : Body Size Z
D : Ruler Width
A E N
E : Ruler Offset
S
F : Reflect LL
W G : Lead Pitch
H: Lead Width
G
N
D, E
E W
Top view
S

H F

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3.4.3 SOP components
SOP components are registered with the parameters shown below.
SOP recognition reference
70924004-00

USER ITEMS PICK & MOUNT

Edit Term : Edit Term :
FixCmpRef. : 0 9 Pick Angle : 0
1 Comp. Package : Tape Pick Timer : 0.15
2 Feeder Type : 32mmSticky Mount Timer : 0.05
Database No. : Yes 704 Pick Height : 0.0
3 Use feeder opt. : ForSOP10mm Mnt Height : 0.5
4 Required Nozzle : For&Back&Las 0 Dump Way : Dump POS
5 AlignmentModule: Retry Times : 2
6 Feeder Set No. : Automatic 1 Mount Action : NORMAL
7 Pos. Definition : Mount Speed : 100
8 Feeder Pos_Xmm : -111.89 PickupSpeed : 100
Feeder Pos_Ymm : -4.24 A Vacuum Check : NORMAL CHK
Alt. Cmp : 0 Pick Vacuum : 10
Mount Vacuum : 10

SHAPE VISION
Edit Term : Edit Term :
C Body Size X : 6.40 B Alignment Type : SOP
Body Size Y : 10.15 Lighting Level : 6/8
D Body Size Z : 2.10 Comp. Threshold : 55
E Ruler Width : 3 Comp. Tolerance : 30
F Ruler Offset : 2 Search Area : 5.00
G Lead Number : 8
H ReflectLL. : 0.50
I LeadWidth : 0.45
J LeadPitch : 1.27

USER ITEMS parameters

Set the parameters in the USER ITEMS sub-window as described below. Use
the [INS], [DEL] or [Space] key, or number keys to make settings.
1 Comp. Package
Refer to “1 Comp. Package” in “3.4.1 Box type chip resistors and capaci-
tors” or “3.2 Setting the stick feeder component data” in this chapter.
2 Feeder Type
Refer to “2 Feeder Type” in “3.4.1 Box type chip resistors and capacitors”
or “3.2 Setting the stick feeder component data” in this chapter.
3 Use feeder opt.
Set to “Yes” when you want to change the feeder set positions according to
results obtained with the DATA GENERATOR commands. (Refer to “9. Data
optimization” in this chapter.) Set to “No” if you do not want to change
these positions. Setting to “Yes” is advised.
4 Required Nozzle
Select the optimum nozzle that matches the component size from among
the nozzle types for SOP components.
5 AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Use the default setting (Fore&Back&Laser) in most cases. Refer to “5
AlignmentModule” in “3.4.1” for more details.
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6 Feeder Set No.
Enter the feeder set number of the position at which the feeder is installed.
This parameter setting is unnecessary when the Use feeder opt. parameter
is set to “Yes.”
7 Pos. Definition
Set to “Automatic” when you set the Comp. Package parameter to “Tape”.
When you are using a stick feeder and the Use feeder opt. parameter is set
to “No”, set this parameter to “Teaching”. If the Use feeder opt. parameter
is set to “Yes”, set to “Relative”. For more details, refer to “3.2 Setting the
stick feeder component data” in this chapter.
8 Feeder Pos_X, Feeder Pos_Y
Enter the position at which the head picks up the component from the
feeder. These parameters are skipped when the Pos. Definition parameter is
set to “Automatic”. For more details, refer to “3.2 Setting the stick feeder
component data” in this chapter.

PICK & MOUNT parameters

Set the parameters in the PICK & MOUNT sub-window as described below.
Use the [INS], [DEL] or [Space] key to make a selection.
9 Pick Angle deg
This parameter specifies the angle through which the mounter head rotates
to pick up a component on the feeder. This setting determines the orienta-
tion of the component (recognition reference) when it is recognized and
displayed on the vision monitor. The pickup angle for SOP components
must be specified so that their leads face the EW directions. Set this
parameter to “0” degrees for horizontally long components in the loading
position, and set to “90” degrees for vertically long components. Select the
correct pickup angle referring to the table below.

SOP component pickup angle

50023054-01

E N
Loading position S N E W
W S

Pickup angle 0º 90º

n Note
For components having leads on the short sides like TSOP, set the Pick Angle deg parameter to
“0” when the loading position is vertically long, and to “90” when horizontally long.

TSOP
10023108-01

0˚ 90˚

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c Caution
Pickup angle setting directly affects the recognition reference and mounting angle. Be sure
not to confuse the difference between “0” and “180” degrees for horizontally long compo-
nents in the loading position and between “90” and “-90” degrees for vertically long
components. Refer to “3.6 Pickup angle” in this chapter for more details.

0 Dump Way
Set to “Dump POS”.
A Vacuum Check
Set this parameter to “NORMAL CHK” in normal operation. If you want to
strictly check pickup errors and mount errors (head return without mount-
ing the component), set to “SPECIAL CHK”.

n Note
With the Vacuum Check parameter set to “NORMAL CHK”, the machine controls the ascent
timing of the head from the lowered position during component pickup or mounting. This
parameter setting is valid only when the Production parameter on the PCB Info. is set to
“UseVacChk”.

VISION parameters
Make settings here for the Alignment Type parameter in the VISION sub-
window. Other VISION parameters can be optimized by executing the Adjust
Assistant commands described later.
B Alignment Type
Set this parameter to “SOP” with the [INS], [DEL] or [Space] key.

SHAPE parameters
After specifying the Alignment Type parameter in the VISION sub-window,
set the parameters in the SHAPE sub-window. If the Alignment Type param-
eter is undefined, the following parameters are not displayed. Use the number
keys to make settings.
C Body Size X, Body Size Y
Enter the correct dimensions including the leads, measured with a caliper
or micrometer.
D Body Size Z
Enter the correct thickness measured with a caliper or micrometer.
E Ruler Width
Enter the width of an imaginary ruler line used to detect the leads. Use the
default setting in most cases. If the lead end is not uniform, set to “1”.
(Refer to “F Ruler Width” in “3.4.2 Mini-mold transistors”.)
F Ruler Offset
Enter the distance in pixels from the lead end to an imaginary ruler line
used to measure the lead width. Use the default setting in most cases.

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G LeadNumber
Enter the number of leads existing on one side in either E or W direction.
H ReflectLL
Enter the projected length of leads which reflect light during recognition.
Use the default setting in most cases.
I LeadWidth
Enter the correct lead width.
J LeadPitch
Enter the correct lead pitch (lead-to-lead spacing).

SHAPE parameters for SOP components

10923010-00

B A : Body Size X
B : Body Size Y
C : Body Size Z
C D : Ruler Width
N E : Ruler Offset
E
W
F : Reflect LL
S G : LeadPitch
A
H : LeadWidth
D, E F
G
N
H
Bottom view E
W
S

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3.4.4 QFP components
QFP components are registered with the parameters shown below.
QFP component parameters
70924005-00

USER ITEMS PICK & MOUNT

Edit Term : Edit Term :
FixCmpRef. : 0 9 Pick Angle : 0
1 Comp. Package : Tray Pick Timer : 0.30
2 Feeder Type : Fix. TF Mount Timer : 0.20
Database No. : 750 Pick Height : 0.0
3 Use feeder opt. : Yes Mnt Height : 0.5
4 Required Nozzle : ForQFP 20mm 0 Dump Way : Dump POS
5 AlignmentModule: For&Back Retry Times : 2
6 Feeder Set No. : 1 A Mount Action : QFP
7 Pos. Definition : Teaching Mount Speed : 30
8 Feeder Pos_Xmm : 0.00 PickupSpeed : 100
Feeder Pos_Ymm : 0.00 B Vacuum Check : SPECIAL CHK
Alt. Cmp : 0 Pick Vacuum : 10
Mount Vacuum : 10

SHAPE VISION
Edit Term : Edit Term :
D Body Size X : 17.20 C Alignment Type : QFP
Body Size Y : 17.20 Lighting Level : 6/8
E Body Size Z : 3.35 Comp. Threshold : 55
F Ruler Width : 3 Comp. Tolerance : 30
G Ruler Offset : 4 Search Area : 6.00
H Lead Number N : 11
Lead Number E : 11
I ReflectLL. : 0.80
J LeadWidth : 0.40
K LeadPitch : 1.00
L Bumper Mask : 0.00

n Note
For maximum component size that can be mounted, refer to “1.2.2 Mountable component size”
in Chapter 2.

USER ITEMS parameters

Set the following parameters in the USER ITEMS sub-window as described
below. Use the [INS], [DEL] or [Space] key, or number keys to make a
selection.
1 Comp. Package
Refer to “3.3 Setting the tray component data” in this chapter.
2 Feeder Type
Refer to “3.3 Setting the tray component data” in this chapter.
3 Use feeder opt.
QFP components are usually supplied from a tray feeder or tray changer, so
set this parameter to “No”.
4 Required Nozzle
Select the optimum nozzle that matches the component size from among
the nozzle types for QFP components.

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5 AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Use the default setting (Fore&Back) in most cases. Refer to “5
AlignmentModule” in “3.4.1 Box type chip resistors and capacitors” for
more details.
6 Feeder Set No.
Refer to “3.3 Setting the tray component data” in this chapter.
7 Pos. Definition
Refer to “3.3 Setting the tray component data” in this chapter.
8 Feeder Pos_X, Feeder Pos_Y
Refer to “3.3 Setting the tray component data” in this chapter.

PICK & MOUNT parameters

Set the parameters in the PICK & MOUNT sub-window as described below.
Use the [INS], [DEL] or [Space] key to make a selection.
9 Pick Angle deg
This parameter specifies the angle through which the mounter head rotates
to pick up a component on the feeder. This setting determines the orienta-
tion of the component (recognition reference) when it is recognized and
displayed on the vision monitor. Normally, set this parameter to “0”
degrees for horizontally long components in the loading position, and set
to “90” degrees for vertically long components. Select the correct pickup
angle referring to the table below.

QFP pickup angle

50023055-02

E N

Loading position S N E W

W S

Pickup angle 0º 90º

c Caution
Pickup angle setting directly affects the recognition reference and mounting angle. Be sure
not to confuse the difference between “0” and “180” degrees for horizontally long compo-
nents in the loading position and between “90” and “-90” degrees for vertically long
components. Refer to “3.6 Pickup angle” in this chapter for more details.

0 Dump Way
Set to “Station” when a QFP dump station (option) is used and to “Dump
POS. “ when not used.
A Mount Action
Set this parameter to “QFP” in normal operation.
If even higher mounting accuracy is required or the component is larger
than the maximum size (26×26mm) that can be recognized with the multi-
vision camera, set this parameter to “FINE”. The “FINE” setting is only
effective when the single-vision camera (option) has been installed.

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n Note
When the Mount Action parameter is set to “QFP”, the multi-vision camera is usually used to
recognize a component. However, if the component is larger than the maximum size
(26×26mm) that can be recognized with the multi-vision camera, the camera automatically
switches to the single-vision camera (option).
When set to “FINE”, note that it takes a longer time to recognize a component than the
“QFP” setting.

Reference
To see the maximum component size that can be recognized with the multi-vision and single-
vision camera, select <3/2/A1 SELECT TARGET>→”CameraCoordinate” and press the
[ENTER] key.

CameraCoordinate screen
70923005-00

<<<APPLICATION>>> 3/MAINTE/M
<<MODE>> 2/MCH_DATA

Editing Object CameraCoordinate

Camera No. X Y Z R MAX.CMP XY MAX. CMP Z

MovCamera
Single CAM. 1 45 6
Multi CAM. 2 26 6
Multi CAM. 1 26 6

Maximum recognizable component size

B Vacuum Check
Set this parameter to “SPECIAL CHK” in most cases because QFP compo-
nents should be checked more strictly for pickup and mounting errors than
other components.

n Note
This parameter setting is valid only when the Production parameter on the PCB Info. is set to
“UseVacChk”.

VISION parameters
Make settings here for the Alignment Type parameter in the VISION sub-
window. Other VISION parameters can be optimized by executing the Adjust
Assistant commands described later.
C Alignment Type
Set this parameter to “QFP” with the [INS], [DEL] or [Space] key.

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SHAPE parameters
After specifying the Alignment Type parameter in the VISION sub-window,
set the parameters in the SHAPE sub-window. If the Alignment Type param-
eter is undefined, the following parameters are not displayed. Use the number
keys to make settings.
D Body Size X, Body Size Y
Enter the correct dimensions including the leads, measured with a caliper
or micrometer.
E Body Size Z
Enter the correct thickness measured with a caliper or micrometer.
F Ruler Width
Enter the width of an imaginary ruler line used to detect the leads. Use the
default setting in most cases. If the lead end is not uniform, set to “1”.
(Refer to ”!4Ruler Width” for mini-mold transistors in the earlier section,
“3.4.2”.)
G Ruler Offset
Enter the distance in pixels from the lead end to an imaginary ruler line
used to measure the lead width. Use the default setting in most cases.
H LeadNumber
Enter the number of leads existing on each of the N and E sides.
I ReflectLL
Enter the projected length of leads which reflect light during recognition.
Use the default setting in most cases.
J LeadWidth
Enter the correct lead width.
K LeadPitch
Enter the correct lead pitch (lead-to-lead spacing).
L Bumper Mask
This parameter is used for QFPs with bumpers. Enter the distance in
millimeters from the cross point of the ruler lines, in order to specify the
area in which bumpers are not detected during component recognition.
Enter “0.00” for normal QFPs with no bumpers.

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SHAPE parameters for QFP
30923015-01

A A : Body Size Z
B : Body Size X
S
E C : Body SizeY
W D : RulerWidth
N E : Ruler Offset
F : Reflect LL
G : LeadPicth
D, E H D, E I H : LeadPitch
G I I : Bumper Mask

;
I
Bottom view
C F This area is
not detected

I I
B

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3.4.5 Melf components (cylindrical components)
These components are registered with the parameters shown below.
MELF component parameters
70924008-00

USER ITEMS PICK & MOUNT

Edit Term : Edit Term :
FixCmpRef. : 0 8 Pick Angle : 0
1 Comp. Package : Tape Pick Timer : 0.00
2 Feeder Type : 8mmTape Mount Timer : 0.00
Database No. : 520 Pick Height : 0.5
3 Use feeder opt. : Yes Mnt Height : 0.5
4 Required Nozzle : ForMELF S 9 Dump Way : Dump POS
5 AlignmentModule: Fore&Back&Las Retry Times : 2
6 Feeder Set No. : 1 Mount Action : NORMAL
7 Pos. Definition : Automatic Mount Speed : 100
Feeder Pos_Xmm : 0.00 PickupSpeed : 100
Feeder Pos_Ymm : 0.00 0 Vacuum Check : NORMAL CHK
Alt. Cmp : 0 Pick Vacuum : 50
Mount Vacuum : 50

SHAPE VISION
Edit Term : Edit Term :
B Body Size X : 0.50 A Alignment Type : Melf Chip
Body Size Y : 1.27 Lighting Level : 6/8
C Body Size Z : 0.50 Comp. Threshold : 55
D LeadWidth : 0.40 Comp. Tolerance : 50
E Ruler Width : 4 Search Area : 1.50

USER ITEMS parameters

Set the following parameters in the USER ITEMS sub-window as described
below. Use the [INS], [DEL] or [Space] key, or number keys to make a
selection.
1 Comp. Package
Refer to “1 Comp. Package” in “3.4.1 Box type chip resistors and capaci-
tors”.
2 Feeder Type
Refer to “2 Feeder Type” in “3.4.1 Box type chip resistors and capacitors.
3 Use feeder opt.
Set to “Yes” when you want to change the feeder set positions according to
results obtained with the DATA GENERATOR commands. (Refer to “9. Data
optimization” in this chapter.) Set to “No” if you do not want to change
these positions. Setting to “Yes” is advised.
4 Required Nozzle
Select the optimum nozzle that matches the component size from among
the nozzle types for Melf components.

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5 AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Use the default setting (Fore&Back&Laser) in most cases. Refer to “5
AlignmentModule” in “3.4.1” for more details.
6 Feeder Set No.
Enter the feeder set number of the position at which the feeder is installed.
This setting is unnecessary when the Use feeder opt. parameter is set to
“Yes.”
7 Pos. Definition
Set to “Automatic” when you set the Comp. Package parameter to “Tape”.
For other settings, refer to “3.2 Setting the stick feeder component data” or
“3.3 Setting the tray component data” in this chapter.

PICK & MOUNT parameters

Set the parameters in the PICK & MOUNT sub-window as described below.
Use the [INS], [DEL] or [Space] key to make a selection.
8 Pick Angle deg
This parameter specifies the angle through which the mounter head rotates
to pick up a component on the feeder. This setting determines the orienta-
tion of the component (recognition reference) when it is recognized and
displayed on the vision monitor. Normally, set this parameter to “0”
degrees for horizontally long components in the loading position, and set
to “90” degrees for vertically long components. Select the correct pickup
angle referring to the table below.

Melf component pickup angle

50023056-01

E N
Loading position S N E W
W S

Pickup angle 0º 90º

c Caution
Pickup angle setting directly affects the recognition reference and mounting angle. Take
sufficient care regarding the difference between “0” and “180” degrees for horizontally
long components in the loading position and between “90” and “-90” degrees for vertically
long components. Refer to “3.6 Pickup angle” in this chapter for more details.

9 Dump Way
Set to “Dump POS”.

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0 Vacuum Check
Set this parameter to “NORMAL CHK” in normal operation. If you want to
strictly check pickup errors and mount errors (head return without mount-
ing the component), set to “SPECIAL CHK”.

n Note
With the Vacuum Check parameter set to “NORMAL CHK”, the machine controls the ascent
timing of the head from the lowered position during component pickup or mounting. This
parameter setting is valid only when the Production parameter on the PCB Info. is set to
“UseVacChk”.

VISION parameters
Make settings here for the Alignment Type parameter in the VISION sub-
window. Other VISION parameters can be optimized by executing the Adjust
Assistant commands described later.
A Alignment Type
Set this parameter to “Melf Chip” with the [INS], [DEL] or [Space] key.

SHAPE parameters
After specifying the Alignment Type parameter in the VISION sub-window,
set the parameters in the SHAPE sub-window. If the Alignment Type param-
eter is undefined, the following parameters are not displayed. Use the number
keys to make settings.
B Body Size X, Body Size Y
Enter the correct dimensions measured with a caliper or micrometer. (See
the drawing below.)
C Body Size Z
Enter the correct diameter measured with a caliper or micrometer. (See the
drawing below.)
D LeadWidth
Enter the width of the leads provided on both ends of the component. (See
the drawing below.) This can be checked by executing the Adjust Assistant
explained later.
E Ruler Offset
Enter the distance in pixels from the lead end to an imaginary. ruler line
used to measure the lead width. The ruler line should be positioned across
the uniform portion of the lead. Use the default setting in most cases.

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SHAPE parameters for Melf components
30923012-01

B
A : Body Size X
B : Body Size Y
C C : Body Size Z
N D : Lead Width
E E : Ruler Offset
S W
A
E

Bottom view

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3.4.6 BGA components
These components can be recognized only when a single-vision camera
(option) is installed. Define and register the BGA component data as explained
below.
BGA component parameters
70924006-00

USER ITEMS PICK & MOUNT

Edit Term : Edit Term :
FixCmpRef. : 0 9 Pick Angle : 0
1 Comp. Package : Tray Pick Timer : 0.30
2 Feeder Type : Fix. TF Mount Timer : 0.20
Database No. : 950 Pick Height : 0.0
3 Use feeder opt. : Yes Mnt Height : 0.5
4 Required Nozzle : ForQFP 30mm 0 Dump Way : Dump POS
5 AlignmentModule: Back Retry Times : 2
6 Feeder Set No. : 1 A Mount Action : QFP
7 Pos. Definition : Teaching Mount Speed : 30
8 Feeder Pos_Xmm : 0.00 PickupSpeed : 100
Feeder Pos_Ymm : 0.00 Vacuum Check : NORMAL CHK
Alt. Cmp : 0 Pick Vacuum : 10
Mount Vacuum : 10

SHAPE VISION
Edit Term : Edit Term :
C Body Size X : 29.00 B Alignment Type : BGA
Body Size Y : 29.00 Lighting Level : 6/8
D Body Size Z : 2.50 Comp. Threshold : Non effective
E Dot Number N : 20 Comp. Tolerance : 30
Dot Number E : 20 Search Area : 6.00
F BGA diameter : 0.60
G BGA pitch : 1.27
H Dot amount : 400

USER ITEMS parameters

Set the parameters in the USER ITEMS sub-window as described below. Use
the [INS], [DEL] or [Space] key, or number keys to make a selection.
1 Comp. Package
Refer to “3.3 Setting the tray component data” in this chapter.
2 Feeder Type
Refer to “3.3 Setting the tray component data” in this chapter.
3 Use feeder opt.
QFP components are usually supplied from a tray feeder (or tray changer),
so set this parameter to “No”.
4 Required Nozzle
Select the optimum nozzle that matches the component size from among
the nozzle types for QFP components.
5 AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Set this parameter to “Fore”. Refer to “5 AlignmentModule” in “3.4.1 Box
type chip resistors and capacitors” for more details.

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6 Feeder Set No.
Refer to “3.3 Setting the tray component data” in this chapter.
7 Pos. Definition
Refer to “3.3 Setting the tray component data” in this chapter.
8 Feeder Pos_X, Feeder Pos_Y
Refer to “3.3 Setting the tray component data” in this chapter.

PICK & MOUNT parameters

Set the parameters in the PICK & MOUNT sub-window as described below.
Use the [INS], [DEL] or [Space] key to make a selection.
9 Pick Angle deg
Use the same setting as for QFP components.
0 Dump Way
Set to “Station” when a dump station (option) is used and to “Dump POS. “
when not used.
A Mount Action
Set this parameter to “FINE”.

VISION parameters
Make setting here for the Alignment Type parameter in the VISION sub-
window. Other VISION parameters can be optimized by executing the Adjust
Assistant commands described later.
B Alignment Type
Set to “BGA”. However, if the entire mold package is recognized as white
just like a ceramic package or part of the mold package is recognized as
white, set this parameter as indicated below.

Alignment Type setting

50023022-03

The entire package is recognized Part of the package is recognized

as white. as white.

Examples black

white
white

Alignment
"Odd.Chip" "Odd.Chip" or "QFP"
type setting

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SHAPE parameters
After specifying the Alignment Type parameter in the VISION sub-window,
set the parameters in the SHAPE sub-window. If the Alignment Type param-
eter is not set to “BGA” , the following parameters are not displayed. Use the
number keys to make settings.
C Body Size X, Body Size Y
Enter the correct dimensions measured with a caliper or micrometer.
D Body Size Z
Enter the correct diameter measured with a caliper or micrometer.
E Dot number N, Dot number E
Enter the number of ball terminals arrayed in the N and E directions. If the
number of terminals per array differs from each other, enter the largest
number of terminals per array.
F BGA diameter
Enter the diameter of ball terminals.
G BGA pitch
Enter the spacing between ball terminals.
H Dot amount
Enter the total number of ball terminals of the BGA component.

SHAPE parameters for BGA component

10023017-02

B A : Body Size X
B : Body Size Y
C : Body Size Z
D : Dot number N
N E : Dot number E
E
C W F : BGA pitch
A S G : BGA diameter

G E C
Side view

F
Bottom view

Reference
An optional special algorithm function allows detecting the direction of a BGA component.
For more details, refer to “3.11 Editing the BGA ball lead information” in this chapter.

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3.4.7 Connectors
Connector components are registered with the parameters shown below.
Connector component parameters
70924007-00

USER ITEMS PICK & MOUNT

Edit Term : Edit Term :
FixCmpRef. : 0 9 Pick Angle : 0
1 Comp. Package : Tape Pick Timer : 0.15
2 Feeder Type : 44mmEmboss Mount Timer : 0.05
Database No. : 850 Pick Height : 0.0
3 Use feeder opt. : Yes Mnt Height : 0.0
4 Required Nozzle : Sp. Nozzle A 0 Dump Way : Dump POS
5 AlignmentModule: Fore&Back&Las Retry Times : 2
6 Feeder Set No. : 1 Mount Action : NORMAL
7 Pos. Definition : Automatic Mount Speed : 30
8 Feeder Pos_Xmm : 0.00 PickupSpeed : 30
Feeder Pos_Ymm : 0.00 A Vacuum Check : NORMAL CHK
Alt. Cmp : 0 Pick Vacuum : 10
Mount Vacuum : 10

SHAPE VISION
Edit Term : Edit Term :
C Body Size X : 1.60 B Alignment Type : Con-E
Body Size Y : 3.20 Lighting Level : 6/8
D Body Size Z : 0.30 Comp. Threshold : 30
Cntr. OffsetX : 0 Comp. Tolerance : 30
Cntr. OffsetY : 0.00 Search Area : 3.00
Cntr. OffsetR : 0.00
E Ruler Width : 3
F Ruler Offset E : 3
G Lead Number E: 8
H ReflectLL. E : 0.42
I LeadWidth E : 0.80
J Lead Pitch E : 1.25

USER ITEMS parameters

Set the parameters in the USER ITEMS sub-window as described below. Use
the [INS], [DEL] or [Space] key, or number keys to make a selection.
1 Comp. Package
Refer to “qComp. Package” in “3.4.1 Box type chip resistors and capaci-
tors” or “3.2 Setting the stick feeder component data” in this chapter.
2 Feeder Type
Refer to “wFeeder Type” in “3.4.1 Box type chip resistors and capacitors”
or “3.2 Setting the stick feeder component data” in this chapter.
3 Use feeder opt.
Set to “Yes” when you want to change the feeder set positions according to
results obtained with the DATA GENERATOR commands. (Refer to “9. Data
optimization” in this chapter.) Set to “No” if you do not want to change
these positions. Setting to “Yes” is advised.
4 Required Nozzle
If using a custom nozzle (available from YAMAHA as option) designed for
the connector, select the corresponding type from among “Sp. Nozzles A to
F”. In other cases, select the optimum nozzle that matches the connector
size from among the nozzle types for SOP components.

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5 AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Use the default setting (Fore&Back&Laser) in most cases. Refer to “5
AlignmentModule” in “3.4.1 Box type chip resistors and capacitors” for
more details.
6 Feeder Set No.
Enter the feeder set number of the position at which the feeder is installed.
This parameter setting is unnecessary when the Use feeder opt. parameter
is set to “Yes.”
7 Pos. Definition
Set to “Automatic” when you set the Comp. Package parameter to “Tape”.
When you are using a stick feeder and the Use feeder opt. parameter is set
to “No”, set this parameter to “Teaching”. If the Use feeder opt. parameter
is set to “Yes”, set to “Relative”. For more details, refer to “3.2 Setting the
stick feeder component data” in this chapter.
8 Feeder Pos_X, Feeder Pos_Y
Enter the position at which the head picks up the component from the
feeder. These parameters are skipped when the Pos. Definition parameter is
set to “Automatic”. For more details, refer to “3.2 Setting the stick feeder
component data” in this chapter.

PICK & MOUNT parameters

Set the parameters in the PICK & MOUNT sub-window as described below.
Use the [INS], [DEL] or [Space] key to make a selection.
9 Pick Angle deg
This parameter specifies the angle through which the mounter head rotates
to pick up a component on the feeder. This setting determines the orienta-
tion of the component (recognition reference) when it is recognized and
displayed on the vision monitor. The pickup angle of connectors must be
specified so that their leads face the E direction. Select the correct pickup
angle according to the loading position of the component as shown in the
table below.

Connector pickup angle

50923003-01

Recognition
reference

Loading
position

Pickup angle 0º 180º 90º -90º

0 Dump Way
Set to “Dump POS”.

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A Vacuum Check
Set this parameter to “NORMAL CHK” in normal operation. If you want to
strictly check pickup errors and mount errors (head return without mount-
ing the component), set to “SPECIAL CHK”.

n Note
With the Vacuum Check parameter set to “NORMAL CHK”, the machine controls the ascent
timing of the head from the lowered position during component pickup or mounting. This
parameter setting is valid only when the Production parameter on the PCB Info. is set to
“UseVacChk”.

VISION parameters
Make settings here for the Alignment Type parameter in the VISION sub-
window. Other VISION parameters can be optimized by executing the Adjust
Assistant commands described later.
B Alignment Type
Set this parameter to “Con-E” with the [INS], [DEL] or [Space] key.

SHAPE parameters
After specifying the Alignment Type parameter in the VISION sub-window,
set the parameters in the SHAPE sub-window. If the Alignment Type param-
eter is undefined, the following parameters are not displayed. Use the number
keys to make settings.
C Body Size X, Body Size Y
Enter the correct dimensions including the leads, measured with a caliper
or micrometer.
D Body Size Z
Enter the correct thickness measured with a caliper or micrometer.
E Ruler Width
Enter the width of an imaginary ruler line used to detect the leads. Use the
default setting in most cases. If the lead end is not uniform, set to “1”.
(Refer to the Ruler Width parameter in “3.4.2 Mini-mold transistors”.)
F Ruler Offset
Enter the distance in pixels from the lead end to an imaginary ruler line
used to measure the lead width. Use the default setting in most cases.
G LeadNumber
Enter the number of leads existing on one side in either E or W direction.
H ReflectLL
Enter the projected length of leads which reflect light during recognition.
Use the default setting in most cases.
I LeadWidth
Enter the correct lead width.
J LeadPitch
Enter the correct lead pitch (lead-to-lead spacing).

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SHAPE parameters for connectors
30923014-01

A : Body Size X
B : Body Size Y
C C : Body Size Z
B S D : Ruler Width
W
A E E : Ruler Offset
N
F : Reflect LL
G : LeadPitch
D, E H : LeadWidth

Bottom view F
J
G
H

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3.5 Executing the Adjust Assistant commands
The Adjust Assistant commands allow you to check whether the parameter
settings are appropriate. While performing the recognition test with the Adjust
Assistant commands, you can also find and determine an optimum value for
parameters which have not yet been set.
Typical flow chart using the Adjust Assistant commands
30924003-00

Select component data

Open Adjust Assistant screen

Set feeder position

Check head & nozzle

to be used
Execute PICK UP COMP.
Check pickup/mount
vacuum levels
Execute TEACH COMP.

Execute VISION TEST

ERROR

Execute DRAW THE SHAPE

Execute PARAM SEARCH

Execute VISION TEST again

No error

Discard component

Quit Adjust Assistant

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1 Set up the component feeder.
Install the feeder with components you want to check, onto the feeder plate.
Be sure that the feeder set position matches the number previously set for the
Feeder Set No. in the USER ITEMS sub-window. If the Feeder Set No. has not
yet been determined, you can specify it on the Adjust Assistant screen, so
install the feeder at a position you can easily access.
When using a tray feeder or tray changer, prepare a component which you
will attach it to the nozzle by hand during adjustment.
Reference
To see a list of all the feeder set positions for components registered in the selected PCB data,
select <2/1/C1 EDITOR ASSISTANT>→”COMP. ASSIGNMENT”→”PUT IN SET_NO” and
press the [ENTER] key.

2 Select the component data.

On the Component Info. screen, move the cursor to the component data
you want to check. Press the [F4] key to switch the right-hand sub-window to
the USER ITEMS screen.

4
3 Open the Adjust Assistant screen.
Press the [F6] key to directly execute the <2/1/B1 ADJUST ASSISTANT>
command. Basic operations on the Adjust Assistant screen are described
below.

6
ADJUST ASSISTANT screen
70923002-02

Selected component name

Comp.Name : R1005
Command Adjust Assistant Items
PICK UP COMP. Feeder set No. 20
* Comp. Tolerance (%) 30 Parameters in
VISION TEST Comp. Threshold 30 Component Info.
PARM. SEARCH Lighting Level 6/8
DISCARD COMP. Search Area (mm) 9.00
Adjust Assistant DRAW THE SHAPE Monitor Mode Nothing
commands CHK GRAY VALUE Condition Chk.Mode ROW
EXIT

Vision display status

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4 Set the feeder position.
Set this item only for components whose feeder position is not set or tray
components. Press the [TAB] key to move the cursor to “Feeder Position”-
in the Adjust Assist Items window, then enter the number of the feeder plate
position at which the feeder is installed. If you are going to attach a tray
component to the nozzle by hand, enter the number of a feeder plate position
where you can access the nozzle easily.

k
Feeder position input screen
70023006-02

Comp.Name:
Command Adjust Assistant Items
Feeder Set No. 20 Enter feeder set
number here

5 Execute the PICK UP COMP. command.

Press the [TAB] key to move the cursor back to the PICK UP COMP. command
and press the [ENTER] key. The head and nozzle check screen then appears.

k
PICK UP COMP. command
70923009-00

Move the cursor here and press the [ENTER] key.

Comp.Name : QFP208-P0.50
Command Adjust Assistant Items
PICK UP COMP.

6 Check the head and nozzle to be used.

The head number and nozzle type to be used are indicated on the screen.
Advance to the next step when the display is okay. Press the [INS] or [DEL] key
to change the head number. If you want to change the nozzle type, select the
EXIT command to return to the Component Info. editing screen, then change
the “Required Nozzle” setting in the USER ITEMS sub-window.

c
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Head and nozzle check screen
70923001-00

Change the “Required Nozzle” setting

in the USER ITEMS sub-window.

V120

Please specify number os head to pick

up a component.
Required type of nozzle is
TYPE-32

HEAD NO. : 1 Change the head No.

with the [INS] or [DEL] key.

c Caution
If your machine is not equipped with an auto nozzle station (option) and the specified nozzle
is not attached to the specified head, press the emergency stop button and then attach the
nozzle to the head by hand.

7 Press the [ENTER] key to perform component pickup.

The head assembly moves to pick up a component, and the pickup and mount
vacuum levels are displayed on the message display area. (In the case of a tray
component, the head stops and descends at the “Feeder Set No.” position you
specified in the Adjust Assist Items window. After the head completely stops,
press the emergency stop button and attach the component by hand to the
nozzle. At this point, be sure to attach the component to the nozzle in the
same direction as actually supplied from a tray.)
Reference
If the component could not be picked up, refer to “10.3.3 Pickup errors” in this chapter.

8 Check and adjust the reference pickup/mount vacuum levels.

To check the reference vacuum levels used to determine whether or not a
component is being picked up by a nozzle, follow these steps.
1. Look at the pickup and mount vacuum pressure levels shown on the
message display area of the Adjust Assistant screen during component
pickup. The reference vacuum levels and actual vacuum levels are
graphically displayed in green and white like that shown below.

Pickup and mount vacuum pressure levels

70923010-00

V161

Upper bar: settings. Lower bar: current level.....

..................... C
.....................................................................................
................................................................... D
PICK 30%, MNT 30% (SHIFT).
A DATA
B LEVEL

A: DATA bar (upper bar graph)

Shows the reference pickup and mount vacuum level settings in green and
red.
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B: LEVEL bar (lower bar graph)
Shows the actual vacuum level currently being measured. The bar moves to
the right as the vacuum level increases.
C: Left-hand green bar
Represents the reference pickup vacuum level setting. The setting value is
indicated in percent (PICK %) just above the bar graph. This green bar
moves to the right as the reference pickup vacuum level setting increases.
Use the [INS] or [DEL] key to make adjustment.

c
D: Right-hand green bar
Represents the reference mount vacuum level setting. The setting value is
indicated in percent (MNT %) just above the bar graph. This green bar
moves to the left as the reference mount vacuum level setting increases.
Use the [SHIFT]+[INS] or [SHIFT]+[DEL] key to make adjustment.

hc
E: White zone
If the white bar zone becomes too narrow (reference pickup vacuum level
+ mount vacuum level setting exceeds 100%), the entire bar graph turns
red indicating the settings are not appropriate. In this case, press the [DEL]
or [SHIFT]+[DEL] keys until the green bars and white zone reappear.

h DEL

2. Check the reference mount vacuum level.

Check that the LEVEL bar overlaps with the right-hand green area on the
DATA bar. If not, increase the reference mount vacuum level (MNT) with
the [SHIFT]+[INS] keys.

h INS

Adjusting the reference mount vacuum level

10023020-00

PICK30%, MNT10%(SHIFT). PICK30%, MNT30%(SHIFT).

DATA DATA
LEVEL LEVEL

e
3. Check the reference pickup vacuum level.
Press the emergency stop button, then remove by hand the component
being picked up. Now check that the LEVEL bar is within the left-hand
green area on the DATA bar. If the LEVEL bar exceeds the green area and
overlaps with the white area, adjust the reference pickup vacuum level
(PICK) with the [INS] key. After having adjusted it, cancel the emergency
stop button and press the [READY] button.

e
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Adjusting the reference pickup vacuum level
10023021-00

PICK10%, MNT30%(SHIFT). PICK30%, MNT30%(SHIFT).

DATA DATA
LEVEL LEVEL

4. Execute the PICKUP COMP. command to pick up the component again

when the checks and adjustments are complete.
Reference
Refer to “3.7 Pickup and mount vacuum pressures” in this chapter for more details.

9 Execute the TEACH COMP. command (only when the single-

vision camera is installed).
Move the cursor to “TEACH COMP.” and press the [ENTER] key. The head
moves to directly above the single-vision camera and an image of the
component is displayed on the vision monitor.
Reference
The TEACH COMP. command is displayed on the Adjust Assistant screen only when the Mount
Action parameter in the PICK & MOUNT sub-window is set to “FINE”. Skip this procedure if
this command is not displayed.

0 Execute the VISION TEST command.

This command checks whether the component is correctly recognized with
the camera. Move the cursor to the VISION TEST command and press the
[ENTER] key. Perform this test several times. If no error is detected, each
parameter is appropriate so advance to Step 11. If an error occurs during this
test, make adjustments with the procedure below.
1. Execute the DRAW THE SHAPE command.
After checking the direction of the component displayed on the vision
monitor, execute the DRAW THE SHAPE command. An outline of the
component is displayed on the vision monitor, based on the setting data
defined in the Component Information, so confirm whether it matches the
component image you have checked with the VISION TEST command. If
the direction does not match, quit the Adjust Assistant once, then correct
the “Pick Angle deg” parameter setting in the PICK & MOUNT sub-
window.

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Component image and outline definition
30023022-01

Component image taken

with the VISION TEST

Z00
command

9632
Component outline
displayed with the DRAW
THE SHAPE command

n Note
To check the outline definition of a component which is recognized with a multi-vision camera,
use the image recognized when the component passes over the camera from left to right as the
reference.

2. Check the parameters in the SHAPE sub-window.

To make this check, set the Monitor Mode in the Adjust Assist Items
window to “Result” and then perform the VISION TEST command again.
The recognition results will be displayed on the upper left of the vision
monitor. Use the EXIT command to quit the Adjust Assistant once and
return to the Component Info. screen. Then check to see if the parameter
settings in the SHAPE sub-window such as “Body Size” and “Lead Number”
match the results obtained. Correct the settings as necessary.

Monitor Mode setting

70924022-00
Comp Name :
Command Adjust Assist Items

Monitor Mode Result Set here

Monitor Mode display on the vision monitor

70923006-01

XC,YC : 290.3 , 385.4 N:100 R: 1.56

X Y N pit wild
North : 263.0 185.4 20 0.66 0.36
South : 253.7 584.0 20 0.66 0.35
Lead width
West : 131.1 381.6 30 0.64 0.32
East : 387.1 389.1 30 0.64 0.33

Number of leads Lead pitch

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3. Press the [F6] key to enter the Adjust Assistant again and execute the
PARAM SEARCH command.
The PARAM SEARCH command automatically finds and enters the
optimum values for the component parameters.

6
Parameters optimized with the PARAM. SEARCH command
70923000-00

THRESHOLD 35
LIGHTING LEVEL 6/8
SEARCH AREA 5.00 (mm)
F. LINE OFFSET 3

4. Execute the VISION TEST command again. Repeat this test several times. If
there is no error, the adjustment is complete. Return the Monitor Mode
setting in the Adjust Assist Items window to “Nothing”.

q Discard the component.

To discard the component at dumping position, execute the DISCARD COMP.
command.
If you do not want to dump the component, follow the procedure below.
1. Execute the PICK UP COMP. command.

e
2. When the head stops completely at the component pickup position, press
the emergency stop button and remove the component by hand from the
nozzle.
3. Execute the DISCARD COMP. command to stop vacuum generation.

w Quit the Adjust Assistant.

Execute the EXIT command and you will return to the Component Info. screen.

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3.6 Pickup angle
The pickup angle is an angle through which the nozzle rotates to pick up a
component. This setting determines the orientation of the component (recogni-
tion reference) when it is recognized with the laser or camera. The pickup
angle must therefore be set correctly so that the component can be recognized
in the same orientation as that specified in the database.
The pickup angle depends on the loading position of components when they
are supplied from the feeder. Set the pickup angle to “0” or “180” degrees if
the loading position is horizontally long, and set it to “90” or “-90” degrees if
vertically long. With these settings, the component is recognized as being
vertically long. In other words, the short side of the component is viewed as
“X” and the long side as “Y” (except for transistors). For components requir-
ing 4 (NSEW) directions to be distinguished, you must make accurate settings
for the pickup angle.
Pickup angle
50923004-00

Loading
position

Pickup angle 0º 180º 90º -90º

Recognition
reference

The pickup angle setting affects the mount angle of the component. Take
sufficient care regarding the difference between the pickup angles 0 and 90
degrees, or 90 and -90 degrees.
Pickup angle and mount angle
50923005-00

Loading
position

Pickup angle 0º 180º 90º -90º

0°
Mounting angle

180°

90°

-90°

c Caution
The above table shows setting examples for a connector which has leads on one side and
whose orientation is easy to check. When you actually create connector data, set the pickup
angle so that the leads face the E direction during recognition.

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3.7 Pickup and mount vacuum pressures
To control the timing of head ascent movement during component pickup or
mounting and determine whether each nozzle is picking up a component, the
mounter checks the vacuum pressure levels of each nozzle which are con-
stantly monitored with the vacuum sensors.
The vacuum pressure (negative pressure) used to pick up or mount components
is monitored on a scale of 0 to 255 levels (the larger the value, the higher the
vacuum intensity). On this monitoring scale, a upper limit and lower limit are
specified as the reference vacuum levels.
These reference vacuum levels are specified for each head and also each type
of component. The reference vacuum levels for each head are expressed in
percentages, with 100% being equal to the range between the upper and lower
limits. (These settings can be optimized with the Vacuum Level adjustment
utility in the Maintenance Manager. Refer to the mounter service manual.) The
reference vacuum levels for each component are specified in percentages as
the “Pick Vacuum” and “Mount Vacuum” parameters on the PICK&MOUNT
sub-window in the Component Information.

Pickup and mount vacuum levels

30023023-00

Lower limit Pickup vacuum pressure Upper limit

0 100 (%)
0 255

100 0 (%)
Low vacuum Mount vacuum pressure High vacuum
Vacuum level

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3.7.1 Reference pickup vacuum level
The “Pick Vacuum” parameter setting in the PICK&MOUNT sub-window is
used as a reference vacuum level that determines whether a component is
currently picked up or not.
When the nozzle picks up a component, the vacuum pressure level increases as
the nozzle opening is sealed. The mounter then judges that “the component is
being picked up” when a vacuum higher than the reference pickup vacuum
level is detected, permitting the nozzle to ascend for the next operation. The
smaller the setting for this “Pick Vacuum” parameter, the shorter the time that
the head stays at the lowered position because the negative pressure more
immediately reaches the reference pickup vacuum level. Conversely, the larger
the setting, the longer the time will be.
For chip components with a flat surface causing very little air leakage during
pickup, a setting of about 30 (%) is appropriate. However, for components
which cause much air leakage like Melf or relatively heavy components like
QFPs, a setting of about 50 (%) is recommended so that the nozzle stays
longer at the lowered position to pick up the component. Make fine adjust-
ments to this setting by using the Adjust Assistant.

Pickup vacuum pressure

30023024-00

PICK Reference pickup vacuum level

0 100 (%)

Vacuum level 0 255

Nozzle rises when the vacuum level

exceeds this setting.

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3.7.2 Reference mount vacuum level
The “Mount Vacuum” parameter setting in the PICK&MOUNT sub-window is
used as a reference vacuum level that determines whether the component has
been mounted (separated from the nozzle).
When the nozzle releases a component, the vacuum pressure level decreases as
the vacuum breaks. The mounter then judges that “the component has been
mounted” when a vacuum lower than the reference mount vacuum level is
detected, permitting the nozzle to ascend for the next operation. The smaller
the setting for this “Mount Vacuum” parameter, the shorter the time that the
head stays at the lowered position because the negative pressure more immedi-
ately reaches the reference mount vacuum level. Conversely, the larger the
setting, the longer the time will be.

Mount vacuum pressure

30023025-00

Nozzle rises when the vacuum level

exceeds this setting.

Vacuum level 0 255

100 0 (%)
MOUNT Reference mount vacuum level

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3.8 Registration location of component data
Component data can be registered in the “Component Info.”, “Component
Database” and “STATIC COMPONENTS” information. To create PCB data
more efficiently, it is important to register the component data in the appropri-
ate location by considering how the component is to be used. Refer to the
following flow chart when determining the registration location.
Flow chart for determining component registration location
30024005-01

START

NO Is the same type of

component registered in
YAMAHA database?

YES

Do you want to save this data NO

along with various
parameter settings?

YES

YES NO

YES Do you want to change the

Do you use this component component setup ?
in different PCB
production?

NO

STATIC_COMPONENT
Component database Component Info.
information

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3.9 Editing the BGA ball lead information
After you have created BGA component information in the user database, you
can further edit the ball lead position data to improve recognition accuracy.
This is particularly effective for micro BGA components such as CSP.

c Caution
BGA components can be recognized only by machines equipped with an optional single-
vision camera.

1 Open the machine configuration screen and check the Simple

Edition setting.
Select <3/1/A1 OPTION CONFIG.> and press the [ENTER] key to open the
machine configuration screen. Then check that the Simple Edition parameter is
set to “Full Items”. If not, press the [INS], [DEL] or [Space] key to change the
setting.

Simple Edition parameter setting

70924019-00

<<<APPLICATION>>> 3/MAINTE/M
<<MODE>> 1/MCH_CONFIG

OPTION CONFIG.
Serial: M. type:

/BASIC CONF./
Simple Edition Full Items Set to "Full Items"

2 Enter the EDIT_DATA mode to register the necessary data in

the component information.
1. Open the Component Info. screen of the PCB for which you want to edit
data, then move the cursor to an empty data line and enter the component
name and comment.
2. Press the [ESC] key to exit the Component Info. screen.
3. Execute the <2/1/A3 VIEW DATABASE NO.> command, then move the
cursor to the BGA data you want to edit and press the [ENTER] key.
The selected database No. is entered in the Database No. column on the
USER ITEMS sub-window and, at the same time, its parameters are all
copied.

3 Set each parameter.

Set the following parameters while switching the sub-windows with the [F4]
key.

4
PICK & MOUNT sub-window
Set the “Mount Action” parameter to “FINE” to ensure accurate recognition
with the single-vision camera.
SHAPE sub-window
Enter the appropriate values for the “Body Size XY”, “Body Size Z”, “Dot
number NE”, “Dot diameter”, “BGA pitch” and “Dot amount” parameters.
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n Note
For more details on the BGA parameter settings, refer to “3.4.6 BGA components”.

4 Execute the Adjust Assistant commands.

1. Press the [F6] key to directly open the Adjust Assistant screen.

6
2. Press the [TAB] key or right arrow key to move the cursor into the Adjust
Assist Items window, and set the Feeder Set No. and Monitor Mode
parameters as follows.
Feeder Set No. : Set to a feeder position where you can easily attach the
component by hand.
Monitor Mode : Result
3. Press the [TAB] key or left arrow key to move the cursor back to the
command list screen (left-hand screen), then execute the PICK UP COMP.
command.
The head assembly moves to the feeder position specified in the Feeder Set
No. After the head assembly stops, attach the center of the component to
the nozzle tip by hand.
4. Execute the TEACH COMP. command.
The head assembly moves to above the single-vision camera and the
component image is displayed on the vision monitor.
5. Execute the VISION TEST command.
The recognition results are displayed on the upper left of the vision
monitor. Return to the Component Info. screen with the EXIT command and
enter the results obtained here for the SHAPE sub-window parameters,
referring to the drawing below.

VISION TEST result screen

30924005-00

Dot amount

BGA pitch
Dot number N XC, YC:231.1, 252.3 N:131 R:0.00 (vertical direction)
hn: 13 hpitch: 1.51
vn: 13 vpitch: 1.52
Dot number E diameter : 0.91 BGA pitch
(horizontal direction)
XC, YC:231.1, 252.3 N:131 R:0.00
hn: 13 hpitch: 1.51
vn: 13 vpitch: 1.52
diameter : 0.91
Dot diameter

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6. Press the [F6] key again to open the Adjust Assistant screen, then execute
the PARAM SEARCH command to optimize the component lighting level
and search area.

6
7. Execute the EXIT command and you will return to the Component Info.
screen.

5 Change the parameters to edit the BGA ball lead information.

Set the following parameters while switching the sub-windows with the [F4]
key.

4
VISION sub-window
Set the “Alignment Type” parameter to “Special”.
SHAPE sub-window
Set the “Algorithm” parameter to “Special 2” and the “Base Alignment”
parameter to “BGA”.

Alignment Type and Algorithm parameter settings

70924015-00

VISION SHAPE
Edit Term : Edit Term
Alignment Type : Special

Algorithm : Special 2
Base Alignment : BGA

6 Edit and register the BGA ball lead information.

1. Press the [F6] key again to open the Adjust Assistant screen.

6
2. Press the [TAB] or right arrow key to move the cursor into the Adjust Assist
Items screen (right-hand screen), then set the Monitor mode parameter to
“Nothing”.
3. Press the [TAB] or left arrow key to move the cursor back to the command
list screen (left-hand screen), then execute the VISION TEST command.
The image currently displayed on the vision monitor is reset.
4. Execute the DRAW THE SHAPE command and follow the utility messages
displayed on the operation monitor to open the screen for editing the BGA
ball lead information, which will appear on the upper left of the vision
monitor.

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Utility messages for editing the BGA ball lead information
70924012-00

V400
[BGA BALL DATA UTILITY]

Please select command.

(1) [Enter] key :[EDIT & RESISTRATION]
(2) [Tab] key :[DELETE DATA]
(3)any other key :[EXIT]

V401
There is no data for this component.
Do you make new data and edit it?
Please select.
[Enter] key :EXEC
any other key :CANCEL
V413
[BGA ball data edit] will e executed
on vision monitor.
To start to edit, please press any key.

V404
How to edit [BGA ball data]
[Arrow] key :move cursor
[Space] key :one ball ON/OFF
[F1] key :horizontal line all ON
[F2] key :verticall line all ON
[F3] key :horizontal line all OFF
[F4] key :verticall line all OFF
[Enter] key :exit

5. When the BGA ball lead information edit screen appears on the upper left
of the vision monitor, edit it while referring to the utility messages dis-
played on the operation monitor, so that the ball lead display on the edit
screen exactly matches the ball lead arrangement of the actual component.
The ball lead display should be set to ON when the ball lead exists and to
OFF when it does not exist.

BGA ball lead information edit screen

10924006-00
Hn:13
Vn:13
N: 0 ON
nh: 1
nv: 1
OFF

6. When you have edited the ball lead information, press the [ENTER] key to
register the edited data in the BGA ball data registration boxes. Follow the
messages displayed on the operation monitor to complete the registration.

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BGA ball data registration boxes
70924013-00

V405
Please input data number for registration.
Possible from 1 to 127.
After input, please press [Enter] key.

BGA BALL DATA No. : 8

V406
BGA ball data will be saved to this number.

[Enter] key :EXEC

[Tab] key :RETURN INPUT NUMBER
any other key :CANCEL

BGA BALL DATA No. : 8

V400
[BGA BALL DATA UTILITY]

Please select command.

(1) [Enter] key :[EDIT & REGISTRATION]
(2) [Tab] key :[DELETE DATA]
(3) any other key :[EXIT]

Reference
When BGA ball lead data is registered, “BGA ball data No.” registered on the Adjust Assistant
screen and the BGA ball data No. registered in “Vision Option 1” on the SHAPE sub-window
are automatically entered.

7. Repeat the VISION TEST command a few times. If no error occurs, the BGA
ball lead data is appropriate. Execute the PICK UP COMP command to
remove the component from the nozzle, the DISCARD COMP command to
turn off the vacuum generation, and the EXIT command to quit the Adjust
Assistant mode. If an error occurs, proceed to Step 7.

7 Increase the ball lead area as necessary.

If the mold part of the BGA package reflects light during recognition of the ball
leads, the reflected light may be detected as a lead, resulting in a ball lead
recognition error. To avoid this type of error, increasing the ball lead area will
prove effective.
1. Press the [TAB] key to move the cursor to the Adjust Assist Items window,
then set the Monitor Mode parameter to “FINE LINE”.

k
2. Press the [TAB] key again to move the cursor back to the Command
Window, then execute “VISION TEST”.
If the mold part of the BGA is displayed in white on the vision monitor,
check the percentage of this mold part area versus the entire area of the
ball leads. You will need to increase the ball lead area as described below.

k
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3. Execute the QUIT command to exit the Adjust Assistant mode and return to
the component information screen.
4. Enter the percentage you checked in the Vision Option 2 column on the
SHAPE sub-window as shown below

Ball lead area setting

70924016-00

Comp.Nmae : BGA
Command Adjust Assistant Items
SHAPE
Edit Term :
VISION TEST :
:
:
Monitor Mode Find Line :
:
:
:
:
:
:
Algorithm : Special 2
Base Alignment : BGA
Vision Option1 : 8 Data No. on BGA
Vision Option2 : 20
ball lead information

Ball lead area setting

5. Repeat substep 7 in Step 6.

8 Save the settings.

Press the [ESC] key twice, select <2/1/D8 SAVE PCB DATA> and press the
[ENTER] key.

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4. Creating the mark information
This section describes how to create mark information for fiducial marks used
on a PCB. Mark information has various parameters for each of the mark
names registered. To set these parameters, copy sample data of a mark with a
similar shape from the database and edit only the different parameters.
Flow chart for creating mark information
30023012-03

Open
Mark Information

Enter MARK NAME

Enter COMMENT

Copy database
information

Set various
parameters ☞ 4.2

Execute Adjust
Assistant ☞ 4.3

Save data

Reference
Refer to Chapter 5 on how to create mark information for badmarks.

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VIOS structure for “Mark Info.”
30924004-00

1/OPERATION/M 2/DATA/M 3/MAINTE/M 4/SHELL/M 0/EXIT

1/EDIT_DATA 2/DATA_GENERATOR 3/DATABASE 4/MANUAL 0/EXIT

A/DISPLAY A1 MAIN WINDOW PCB Info.

Mount Info.
Component Info.
Mark Info.
Blk Repeat Info.
Local Fidu.Info.
LocalBadMrkInfo.
A2 SUB WINDOW Mark Type Info.
A3 VIEW DATABASE NO. Mark size Info.
A4 VISION ALIGNMENT DIC. Vision Info.
A5
A6 VIEW/DEL.TEMPLET NO.
A7 FIND NEXT
A8 JUMP
A9 SWITCH WINDOW
A0 RETURN TO EDIT
B/UTILITY B1 ADJUST ASSISTANT
C/EDIT_TOOL B2 SET FROM DATABASE
D/FILE B3 SET FROM DATABASE ALL
B4 DRAW THE SHAPE(CMP)
B5
B6 SET PALLET
B7 CONVEYOR UNITS
B8 TRACE
B9 TEACHING
B0 TEACH,TRACE CONDITION

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4.1 Creating procedure
1 Open the Mark Info. screen.
Select “Mark Info.” from the edit object list and press the [ENTER] key.
(When you are editing other information, pressing the [F3] key directly
displays the edit object list.)

3
Mark Info. screen
70023008-01

PCB :
OBJ : Mark Information Mark Type Info.
No. MARK NAME COMMENT Edit Term :
1
2
3

2 Move the cursor to data registration No.

3 Enter a mark name
Enter a different name for each mark in the MARK NAME column.
4 Enter a comment.
Type any desired comment on the mark as necessary in the COMMENT
column. Performance is not affected even if no comment is entered.
5 Enter the database No.
1. Press the [ESC] key to display the <A/DISPLAY> menu box.
2. Execute the <A3 VIEW DATABASE NO.> command, then select the
database number of the same mark or the most similar mark in shape and
press the [ENTER] key.
3. Check that the selected database No. has been copied into the DataBase
Number column in the Mark Type Info. sub-window and also that other
parameters on the selected mark have been copied.

Database number input in Mark Type Info. sub-window

70023040-02

MARK NAME
<<<APPLICATION>>> 2/DATA/M
<<MODE>> 1/EDIT_DATA
<COMMAND_LIST> A/DISPLAY

NO. MARK NA 1 1.6mm_CIRCLE Edit Term

1 2 1.0mm_CIRCLE
2 A3 150 DOUBLE_CIR_1.6Cu DataBase Number :
3 151 CIRCLE_1.0_Cu

Database number Database No. is copied

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Reference
You can copy the database information without using the <2/1/A3 VIEW DATABASE NO.>
command, as follows:
Press the [TAB] key to move the cursor to the right-hand screen (sub-
window), then enter the desired database number in the Database
Number column in the Mark Type Info. sub-window. Press the [F7] key
to execute the SET FROM DATABASE command, and the information
on the selected database number is then copied.

6 Set other parameters in the sub-windows.

Referring to “4.2 Various parameter settings” in this chapter, set other param-
eters as necessary.
7 Execute the Adjust Assistant.
Refer to “4.3 Executing the Adjust Assistant” in this chapter for more details.
8 Save the settings.
Press the [ESC] key, then select <2/1/D8 SAVE PCB DATA> and press the
[ENTER] key.

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4.2 Various parameter settings
This section describes how to set basic parameters in the sub-windows.
Parameter settings not explained here should be found by evaluating recogni-
tion results obtained with the Adjust Assistant or referring to the help message
displayed by pressing the [F1] key.
Parameters for fiducial mark setting
70924009-00

Mark Type Info. Mark size Info.

Edit Term : Edit Term :
1 Mark Type : FidMrk/CAMERA 7 MarkOutSizeX : 1.50
DataBase Number: 297 MarkOutSizeY : 1.50
8 Area : 1.77
9 Perimeter : 4.71

Vision Info.
Edit Term :
2 Shape Type : Sp. Shape
3 Surface Type : Reflect
4 Algorithm Type : Normal
Mark Threshold : 163
5 Tolerance : 30
6 Search Area : 4.00
Cut Inner Noise : 2
Cut Outer Noise: 3

Mark Type Info. parameters

1 Mark Type
The “Mark Type” parameter in the Mark Type Info. sub-window should be
set to “FidMrk/CAMERA”.

Vision Info. parameters

2 Shape Type
The Shape Type in the Vision Info. sub-window can be selected from the
following 7 types.

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Shape Type settings
50023057-01

Setting Description Example

Circle Select to detect a circular mark.

Square Select to detect a square mark.

Triangle Select to detect an equilateral triangular mark.

Sp. Shape Select to detect a special mark other than above.

Corner Select to detect a corner of a pattern as a mark.

Select to detect an edge of a pattern as a mark.

TopEdge
This setting is effective in detecting a square edge.

Select to detect an edge of a pattern as a mark.

CirEdge
This setting is effective in detecting a round edge.

Reference
If you use a special mark composed of two or more objects as shown below, set the Algorithm
Type parameter (described later) to “Pattern”. In this case, the “Shape” parameter is ignored
during recognition, so you can set this parameter to any type. (See Chapter 5 for details on
“pattern matching”.)

Example of special mark

10924001-00

3 Surface Type
This specifies the bright and dark relation between the mark surface and
PCB (surrounding area). Select “NonReflect” when the mark is darker than
the surrounding area, and select “Reflect” when the mark is brighter than
the surrounding area, as shown below.

Surface Type settings

50023049-00

Setting NonReflect Reflect

PCB PCB
Image Mark Mark

Brightness
comparison PCB is brighter than mark. Mark is brighter than PCB.

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4 Algorithm Type
There are 5 algorithm types selectable for mark recognition.
Normal
In typical recognition, all types of marks should be set to “Normal”. Try
setting to other parameters if the mark cannot be recognized with the
“Normal” setting.
Special 1
Select this if the mark cannot be recognized by the “Normal” setting.
Special 2
Select this if the mark which cannot be recognized by the “Normal”
setting has a cutout area.
PTRN Outline, PTRN GrayLev
Select these parameters when the Shape Type parameter is set to
“Pattern”. For more details, refer to “9. Pattern matching” in Chapter 5.
5 Tolerance
This specifies a tolerance percentage for the mark size when the mark is
recognized with the vision system. (Typically this should be set to “30”.)
For example, suppose as shown below that the tolerance is set to 30 (%)
with respect to point A representing the mark size setting, and points B and
C are the actually measured mark sizes. Point B is okay since it is recog-
nized within the allowable range, but point C is treated as an error since it
is outside the allowable range.

Tolerance
10023093-01

B A C
A: Mark size setting
B, C: Vision recognition result
-100 0 +100 (%) : Allowable range
6 Search Area
It is recommended that this parameter be set to the mark diameter plus
3mm. For example, when the mark diameter is 1mm, set this parameter to
“4mm” as shown below.
If other marks (such as resist, silk print, other patterns) exist in this search
area, make the Search Area setting smaller.

Search Area
30023094-01

Search Area
Mark

1
4

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Mark Size Info. Parameters
7 Mark OutSize
Referring to the table below, enter the correct value in the MarkOutSize
column in the Mark Size Info. sub-window.

Mark OutSize settings

50023051-01

Shape type Example MarkOutSize setting

Circle Enter the diameter.

Square Enter the length of one side.

Triangle Enter the length of one side.

Y Enter the X length for the MarkOutSize X, and

Sp. Shape
the Y length for the MarkOutSize Y.
X

Enter the length of the shorter side displayed

Corner
within the search area.

Enter the length of the shortest side from among

TopEdge
the three sides displayed within the search area.

CirEdge Enter the diameter of the round edge.

Reference
If you use a special mark with two or more edges as shown below, enter the size of the shortest
side of the rectangular area you want to detect.

Mark OutSize setting for special mark

30023098-00

Rectangular area
to be detected

8 Mark Area
Enter here the area of the mark in units of square millimeters. This param-
eter is displayed only when the Shape Type in the Shape Type Info. sub-
window is set to “Sp. Shape”.

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9 Perimeter
Enter here the perimeter length of the mark in units of millimeters.
This parameter is displayed only when the Shape Type in the Shape Type
Info. sub-window is set to “Sp. Shape”.

n Note
A recognition error may occur due to environmental conditions such as illumination. In such
cases, enter a larger value than previously used for the “Tolerance” parameter in the Vision
Info. sub-window, or set the tolerance to 100%, then perform “VISION TEST” in the Adjust
Assistant and enter the obtained data on the area and perimeter. (The mark area and perimeter
values are displayed after VISION TEST as shown below.) Return the tolerance to the original
value after the data is obtained.

Mark area and perimeter display

30023096-01

Perimeter

Area YC:258.7
XC:257.2 XC:257.2 YC:258.7
area:0.74 area:0.74
peri:3.21
peri:3.21

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4.3 Executing the Adjust Assistant commands
This operation checks whether the parameter settings are correct. For param-
eters which are unspecified, the optimal values can be obtained by performing
“VISION TEST” here. The following adjustment procedure is explained for
cases where the “Mark Type” parameter in the Mark Type Info. sub-window is
set to “FidMrk/CAMERA”.
1 Select the mark data.
Move the cursor to the data you want to check on the Mark Info. screen.
2 Open the Adjust Assistant screen.
Press the [F6] key to directly execute the <2/1/B1 ADJUST ASSISTANT>
command. The Adjust Assistant screen appears as shown below.

6
Adjust assistant (mark) screen
70023042-02

Name of selected mark

Mark Name : FIDUCIAL
Command Adjust Assistant items
FIX PCB Mark Threshold 127
TEACH MARK Tolerance (%) 30
Adjust VISION TEST Search Area (mm) 4.00
Assistant PARAM. SEARCH Cut Inner Noise
Parameters
0
commands * Cut Outer Noise 0
specified in
* Mark Info.
CHK THRESHOLD
EXIT

Message or
results are
displayed here.

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3 Clamp the PCB in place.
1. Execute the FIX PCB command.
The conveyor unit selection box then appears.

e
2. Select “CONVEYOR WIDTH” to adjust the conveyor width, then press the
emergency stop button and clamp the PCB in place according to the order
indicated below.
For more details on the procedure for clamping xthe PCB on the conveyor,
refer to “5. Clamping the PCB” in this chapter.

Conveyor unit menu box

70023043-01

CONVEYOR UNIT (STS.)

LOCATE PIN OFF 4 (Pin-positioning type only)
PUSH UP OFF 5
EDGE CLAMP OFF 7 (Edge-positioning type only)
PUSH IN OFF 6 (Edge-positioning type only)
MAIN STOPPER OFF 2
ENT. STOPPER OFF
CONV. MOTOR OFF 3
CONV. WIDTH 1
RETURN 8

n Note
Before executing the FIX PCB command, each conveyor unit should be preadjusted correctly.
Refer to “8. Changing the conveyor unit setup” in Chapter 3 for conveyor unit adjustments.

4 Perform teaching for the mark.

When the cross cursor in the center of the vision monitor is aligned with the
appropriate position in the mark (see the table below), skip this step. If not,
perform teaching as follows.
1. Execute the TEACH MARK command.
2. Manipulate the joystick so that the cross cursor on the vision monitor is
aligned with the appropriate position in the mark (see the table below),
then press the [ENTER] key.

Mark teaching
50024003-00

Shape Type Teaching point Example

Circle
Square
Triangle Center of mark
Sp. Shape

Corner Corner of mark

TopEdge Center of a square

edge line

CirEdge Center of a round edge

:Cross cursor at center of screen

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w WARNING
STAY OUTSIDE THE MOVEMENT RANGE OF THE HEAD ASSEMBLY WHEN YOU
MANIPULATE THE YPU JOYSTICK.

5 Execute the VISION TEST command.

Repeat this test several times. When no errors occur, the parameter settings are
appropriate. Advance to the next step. If an error occurs, adjust the parameters
with the procedure below.
1. Return to the Mark Info. screen with the EXIT command, and check that the
following parameters are set correctly.
Mark Type and MarkOutSize in the Mark Type Info. sub-window
Shape Type and Surface Type in the Vision Info. sub-window
2. After checking the parameters, press the [F6] key to open the Adjust
Assistant screen again, then repeat Steps 4 to 5. When no errors occur,
move to the next step.

6
3. If an error still occurs, execute the PARAM SEARCH command to find an
optimum threshold level.
4. After the optimum threshold level has been found, execute “VISION TEST”
again.
When no errors occur, go to the next step.
5. If the optimum threshold level could not be obtained, execute the CHK
THRESHOLD command.
An binary image will be displayed on the vision monitor according to the
current parameter settings as shown below.

Binary image (mark)

70023010-00

Current threshold setting

is displayed.

V192
(LEVEL=150)
Binary image is on the monitor......
[INS] or [DEL] key to change the threshold.
Hit [ENTER] to finish.

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6. Adjust the threshold level as suggested below, so that the mark image is
clearly displayed.

Binary image adjustments

50023029-02

State Image Countermeasure Remarks

Increase the threshold Adjust it till the mark is

All white displayed.
level with the [INS] key.

Decrease the threshold Adjust it till the mark is

All black with the [DEL] key. displayed.

Increase the Cut Inner Recognition time becomes

Noise within longer as the Cut Inner
Noise level in the Adjust
mark Noise level is increased.
Assistant.

Increase the Cut Outer Recognition time becomes

Noise outside longer as the Cut Outer
Noise level in the Adjust
of mark Noise level is increased.
Assistant.

Other than Decrease the Search Refer to "Search Area"

mark in Area level in the Adjust explained previously.
search area Assistant.

7. Execute the PARAM SEARCH command again and, if successful, next

execute the VISION TEST command.
When no error occurs, advance to the next step.
8. If the PARAM SEARCH result is a fail, enter a larger value for the Tolerance
parameter in the Vision Info. sub-window, then execute “PARAM SEARCH”
again.

Reference
The vision system recognizes a mark on a gray scale of 256 gradations and converts the video
signal into a binary image consisting of complete black and white, depending on the bright-
ness of the image. This is known as “binary processing”. The threshold determines the binary
level at which the image is converted into white or black.

Threshold
30023028-01

Threshold

Reflect 0 255 Non reflect

White Binarization Black

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6 Check that the mark can be recognized even if it has moved.
Check that the mark can be recognized in any location within the search area.
Execute the TEACH MARK command, and manipulate the joy stick to move
the mark slightly. If no error occurs when “VISION TEST” is executed again,
the setting is okay. Repeat this operation several times, and check that no error
occurs.

Final check (mark)

30023029-00

Mark

Search Area

7 Execute the EXIT command.

Now you can exit the Adjust Assistant mode and return to the Mark Info.
screen.

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5. Clamping the PCB
When you clamp a PCB on the conveyor manually, for example when teaching
the coordinate data on the PCB, set it on the conveyor with the procedure
below.
There are three methods of positioning a PCB: “Locate Pin” and
“Pin+PushUp” positioning which use the locate pins as a reference and “Edge
Clamp” (option) positioning which does not use locate pins. The explanation
in this section assumes that the position and height of the conveyor units have
already been adjusted to the appropriate position for the PCB. Refer to “8.
Changing the setup” in Chapter 3 for adjustment of each conveyor unit.
Conveyor unit (top view)
30923024-00

Edge clamp (option)

Push-up plate
Push-up pin
Main stopper
Entrance stopper
Push-in unit (option)
Fixed locate pin Movable locate pin

Reference
The PCB clamping method can be selected by specifying the PcbFixDevice parameter on the
PCB Info. screen. For details on the PCB clamping method, refer to Step 11 of “6.1” in this
chapter.

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1 Execute the <2/1/B7 CONVEYOR UNIT> command.
The conveyor unit menu box appears as shown below. The sensor detection
status is displayed to the right of each unit.

Conveyor unit menu box

70023043-02

CONVEYOR UNIT (STS.)

LOCATE PIN OFF
PUSH UP OFF
EDGE CLAMP OFF
PUSH IN OFF
MAIN STOPPER OFF
ENT. STOPPER OFF
CONV. MOTOR OFF
CONV. WIDTH
RETURN

2 Check the surrounding area for safety.

Check that the push-up pins are not placed on the push-up plate so that they
do not interfere with the conveyor rails when the conveyor width is adjusted.
3 Adjust the conveyor width.
Select “CONVEYOR WIDTH” from the CONVEYOR UNIT menu box and
press the [ENTER] key. The PCB width input box then appears. Input the PCB
width value in millimeters and press the [ENTER] key, the conveyor width will
then be adjusted.

PCB width
30023055-00

PCB
PCB flow direction
width

c Caution
The conveyor width moves when you press the [ENTER] key after inputting the PCB width,
so use caution.

4 Set emergency stop.

e 5 Raise the main stopper.
Press the emergency stop button for safety.

Move the cursor to “MAIN STOPPER” and press the [ENTER] key. The main
stopper rises and lowers each time you press the [ENTER] key. Place the PCB
against the main stopper to set it on the conveyor.

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6 Raise the locate pins. (except “Edge Clamp” positioning)
Move the cursor to “LOCATE PIN” and press the [ENTER] key. The locate pins
rise and lower each time you press the [ENTER] key. Check that the locate pins
are securely inserted into the PCB positioning holes.
7 Raise the push-up plate and attach the push-up pins.(except
“Locate Pin” positioning)
Move the cursor to “PUSH UP” and press the [ENTER] key. The push-up plate
rises and lowers each time you press the [ENTER] key. Attach the push-up pins
to the push-up plate and adjust their positions so as to support the PCB
properly from the back surface.

c Caution
The push-up pins may interfere with the conveyor section if the push-up plate is raised
without preadjusting the positions of push-up pins.
When preadjusting the push-up pins, first raise the push-up plate with no pins attached, and
then arrange them at the proper positions.

Reference
Refer to “8. Changing the setup” in Chapter 3 for adjustment of the push-up pins.

8 Clamp the PCB in place by push-in. (“Edge Clamp” positioning

type only)
Move the cursor to “PUSH IN” and press the [ENTER] key. The push-in unit
functions to clamp the PCB.
9 Cancel emergency stop.
Press the [ESC] key (or select “RETURN”) to return to the previous screen, then
release the emergency stop button and press the [READY] button. The message
“EMERGENCY STOP” disappears, and the servo motor turns on.

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6. Creating the PCB information
This section describes how to create PCB information such as for PCB size
and production methods.
Flow chart for creating PCB information
30023013-00

Open
PCB Information

Input
PCB Origin

Input PCB Size

Set PCB Fiducial

Set BLOCK Fiducial

Set PCB Badmark

Set BLOCK Bad mark

Input
PCB Comment

Set
Pcb/Schedule/Block

Set
Unloader Count/Max

Set operation
conditions

Save data

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VIOS structure for “PCB Info.”
30924005-01

1/OPERATION/M 2/DATA/M 3/MAINTE/M 4/SHELL/M 0/EXIT

1/EDIT_DATA 2/DATA_ 3/DATABASE 4/MANUAL 0/EXIT

GENERATOR
A/DISPLAY A1 MAIN WINDOW PCB Info.
A2 SUB WINDOW Mount Info.
A3 VIEW DATABASE NO. Component Info.
A4 VISION ALIGNMENT DIC. Mark Info.
A5 Blk Repeat Info.
A6 VIEW/DEL. TEMPLET NO. Local Fidu.Info.
A7 FIND NEXT LocalBadMrkInfo.
A8 JUMP
A9 SWITCH WINDOW
A0 RETURN TO EDIT
B/UTILITY B1 ADJUST ASSISTANT
C/EDIT_TOOL B2 SET FROM DATABASE
D/FILE B3 SET FROM DATABASE ALL
B4 DRAW THE SHAPE(CMP)
B5
B6 SET PALLET
B7 CONVEYOR UNITS
B8 TRACE
B9 TEACHING
B0 TEACH,TRACE CONDITION

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6.1 Creating procedure
1 Open the PCB Info. screen.
In the EDIT_DATA mode press the [F3] key to directly display the edit object
list, then select “PCB Info.” and press the [ENTER] key.

3
PCB Info. screen
70023013-03

PCB :
OBJ :PCB Info
MARK X/X1 Y/Y1 MRK2 X2 Y2 Skip?
PCB Origin 0.00 0.00
PCB Size 228.00 135.47
PCB Fiducial 1 0.00 0.00 0 0.00 0.00 NotUse
BLOCK Fiducial 1 0.00 0.00 0 0.00 0.00 NotUse
PCB Badmark 1 0.00 0.00 NotUse
BLOCK Badmark 1 0.00 0.00 NotUse
PCB Comment for_mntchip2
Pcb/Schedule/Block 0 0 0
Operation condition Unloader Count/Max 0 0
setting area
Co-Planarity Not Use PcbFixDevice Pin+PushUP Data Check With Check
Production UseVacChk Conv. Timer 0sec PCB Trans. Normal
Pre Dispense Skip Precede Pick Use Local Fiduc. Not Use
Dot Dispense Skip LocalBadmark Not Use
LineDispense Skip Prod. Type Continuous
Mount Exec
Alignment UseAlign Sp.Function Not Use

2 Enter “PCB Origin”.

The PCB origin is the reference XY position on the PCB. Refer to “6.2 PCB
origin” in this chapter for more details.
3 Enter “PCB Size”.
Enter the length of the PCB in the XY directions in millimeters. The conveyor
width (W-axis) will be adjusted according to the Y length in automatic
operation.
X coordinate: Length in the PCB flow direction
Y coordinate: Length in the conveyor width direction when the PCB is set
on the conveyor

PCB Size
10023031-00

PCB
Y [mm]

Direction of
PCB flow
X [mm]

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4 Enter “PCB Fiducial”.
The PCB Fiducial settings correct the position of the entire PCB by using a pair
of fiducial marks. When a pair of fiducial marks are provided on the entire
PCB, make these settings as needed. Refer to “5. Using the fiducial functions”
in Chapter 5 to make settings.
If you do not use this fiducial function, check that the Skip? column is set to
“NotUse” and advance to the next step.
5 Enter “BLOCK Fiducial”.
The BLOCK Fiducial settings correct the position of each block by using a pair
of fiducial marks. When a pair of fiducial marks are provided for each block,
make these settings. Refer to “5. Using the fiducial functions” in Chapter 5 to
make settings.
If you do not use this block fiducial function, check that the Skip? column is
set to “NotUse” and advance to the next step.
6 Enter “PCB Badmark”.
The PCB Badmark settings determine whether to search the badmark or not.
Refer to the table below to make this setting. When PCBs with or without a
badmark are fed on the conveyor, the PCB badmark function reduces the
production time. Refer to “6. Using the badmark functions” in Chapter 5 to
make settings.
If you do not use this function, check that the Skip? column is set to “NotUse”
and advance to the next step.
7 Enter “BLOCK Badmark”.
The BLOCK Badmark settings determine whether to perform or to skip
component mount in each block. When you want to mount components in
some blocks, but not on other blocks, the block badmark function is very
useful. Refer to “6. Using the badmark functions” in Chapter 5 to make
settings.
If you do not use this function, check that the Skip? column is set to “NotUse”
and advance to the next step.
8 Enter a comment in the PCB Comment.
You can enter a comment for the PCB in the Comment column as necessary.

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9 Specify “Pcb/Schedule/Block” for production.
In these columns, specify the PCB count when you want to specify the
quantity of PCB production. Enter a proper figure, referring to the description
below.
• Pcb (X/X1)
The number of PCBs already produced is displayed in this column. Set
this to “0” as a start.
• Schedule (Y/Y1)
Enter the number of PCBs that you want to produce. When this is set to
“0”, the machine continues to produce PCBs as long as they are fed on
the conveyor.
• Block (X2)
Enter the number of blocks on a PCB. This setting affects “BLOCK
NUMBERS” in <1/3/A2 PCB INF.>.
Reference
For more information about the block settings, see “2. Using the block repeat function” in
Chapter 5.

0 Specify “Unloader Count/Max”.

In the Y/Y1 column of this parameter, specify the number of PCBs that can be
stored in one rack of the unloader. When the specified number of PCBs has
been produced and transferred out into the unloader, the machine stops
transfer of the production PCB until the unloader replaces the rack.
• Unloader Count
The number of PCBs transferred into the unloader is displayed in this
column. Set this to “0” as a start.
• Max
Specify the maximum number of PCBs that can be stored in one rack of
the unloader. If this is set to “0”, the machine continues production
without checking the number of PCBs transferred out into the unloader.
Enter “0” except under the following conditions.
The unloader being used provides a rack switching signal output.
This setting data is to be used for the machine just before reflowing.
q Set operating conditions.
Using the [Space], [INS] or [DEL] key, specify the necessary operating
conditions displayed on the lower half of the screen,

c
• Co-Planarity
Since the co-planarity detection (bent lead detection) is not available for
the YV100II, always set this parameter to “NotUse”.
• Production
Set to “UseVacChk”. This setting allows the machine to check whether
components are being picked up during operation.

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• Pre Dispense
This parameters is used specifically for dispenser machines. Set to “Skip”.
• Dot Dispense
This parameters is used specifically for dispenser machines. Set to “Skip”.
• Line Dispense
This parameters is used specifically for dispenser machines. Set to “Skip”.
• Mount
Set to “Exec” to perform component mounting.
• Alignment
Set to “UseAlign”. This setting allows the machine to check component
recognition during pickup.
• PcbFixDevice
Select the proper PCB clamping method according to the PCB to be
produced.
“Locate Pin” : A PCB is clamped on the conveyor only
with the locate pins.
“Pin+PushUP” : A PCB is clamped on the conveyor with
the locate pins and push-up pins. This
method is most accurate and preferred.
“Edge Clamp” (option) : A PCB is clamped on the conveyor with
the edge clamps, push-in unit and push-
up pins, without using the locate pins.
• Conv. Timer
Set to “0sec” for normal shape PCBs. If specially configured PCBs (for
example, PCBs with cutout parts or through-holes) are used and the exit
sensor cannot detect them reliably, try increasing this parameter to
“1sec”, “2sec” or “3sec”.
• Precede Pick
Normally, set to “NotUse”. When this is set to “Use”, the head assembly
starts moving to pick up and recognize components as soon as the
preceding PCB has been carried out and the next PCB is carried in. This
will shorten the cycle time.
• Data Check
Set to “WithCheck”. This setting allows the machine to check the selected
PCB data before mounting components.
• PCB Trans.
Set to “Normal” in most cases.
• Local Fiduc.
Set to “Use” when using the local fiducial correcting function, and
“NotUse” when not using this function. This parameter is available only
when the data is input in “Local Fidu. Info.” in the main window menu.
Refer to “5. Using the fiducial functions” in Chapter 5 for more details.
• Local Badmark
Set to “Use” when using the local badmark function, and “NotUse” when
not using this function. This parameter is available only when the data is
input in “Local BadMrkInfo.” in the main window menu. Refer to “6.
Using the badmark functions” in Chapter 5 for more details.

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• Prod. Type
Set to “Continuous” to perform continuous operation. If you want to
produce just one PCB, set to “Single”.
• Sp. Function
This parameter is not displayed for standard machines. If the machine has
a special function, set to “Use” when using it, or “NotUse” when not
using.

w Save the data.

Press the [ESC] key after setting, and execute <2/1/D8 SAVE PCB DATA>.

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6.2 PCB origin
The reference point for the XY coordinates on a PCB is called the PCB origin.
The PCB origin is specified by the “PCB Origin” parameter in the PCB
Information.
The PCB origin must always be set since the PCB mark positions, component
mounting positions and the block repeat positions (refer to Chapter 5) are
specified by their coordinates relative to the PCB origin.
PCB origin
30023036-00

PCB
origin

Mark position

Component
mounting position

Block repeat

PCB origin setting (PCB Info. screen)

70023014-03

PCB :
OBJ :PCB Info
MARK X/X1 Y/Y1 MRK2 X2 Y2 Skip?
PCB origin PCB Origin 0.00 0.00
PCB Size 228.00 135.47
PCB Fiducial 1 0.00 0.00 0 0.00 0.00 NotUse
BLOCK Fiducial 1 0.00 0.00 0 0.00 0.00 NotUse
PCB Badmark 1 0.00 0.00 NotUse
BLOCK BADmark 1 0.00 0.00 NotUse
PCB Comment for_mntchip2
Pcb/Schedule/Block 0 0 0
Unloader Count/Max 0 0

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6.2.1 Normal PCB origin position setting
For standard machines with the front conveyor rail fixed, the center of the
fixed locate pin is specified as X=0.00, Y=0.00, which is 5mm (X and Y) away
from the forward corner of the PCB on the front conveyor rail side. The PCB
origin is normally set to the same position as the center of the fixed locate pin.
In this case, enter “0.00” in the “X/X1” and “Y/Y1” columns of the PCB
Origin parameter on the PCB Info. screen.
PCB origin
10023037-02

Direction of PCB flow Direction of PCB flow

Y Y

5mm 5mm

X X
5mm 5mm
Front conveyor rail fixed

Direction of PCB flow Direction of PCB flow

5mm
Y
5mm 5mm

Y 5mm

X X
Rear conveyor rail fixed

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6.2.2 Setting the PCB origin at a position other than
the locate pin position
When setting the PCB origin at a position other than the locate pin as shown
below, enter the XY coordinates relative to the locate pin position in the “X/
X1” and “Y/Y1” columns of the PCB Origin parameter.

Setting the PCB origin at a position other than the locate pin
10023038-02

Direction of PCB flow

Y

When setting the PCB

origin at point A, enter
“X=5.00” and Y=5.00.
5mm

5mm

X
5mm 5mm

Setting the PCB origin at the corner of the PCB

10024021-00

Y
Direction of PCB flow

When setting the PCB origin at

the corner of a PCB in right-to-
left flow (with the front rail fixed),
enter “X=-5.00” and Y=-5.00.
5mm

X
5mm

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6.2.3 Setting the PCB origin for multi-block PCB
In the case of multi-block PCBs, the PCB origin should be set to the same
position as the block repeat position of the 1st block.
PCB origin position for multi-block PCB
10023039-02

Direction of PCB flow

Y

No.1 No . 2 No.3
When setting the PCB origin at the
block repeat point in the 1st block
in right-to-left flow as shown at left,
enter “X=5.00” and Y=3.00.
3mm
5mm

X
5mm 5mm

Reference
If you are not sure the correct coordinates of the PCB origin, the following procedure will
prove convenient.
1. Set the teaching conditions by selecting “Camera” as the teaching unit
and “NotUse” for fiducial correction.
2. Manipulate the YPU joystick to move the camera so that the center of the
PCB origin is positioned in the center of the vision monitor.
3. When the position is determined, press the [F10] key, and the teaching
position is now entered.

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7. Creating the mount information
The Mount Information specifies the data on mounting position coordinates,
component numbers to be mounted and other information related to mounting.
Flow chart for creating the mount information
30023014-02

Open Mount Info.

Enter
land pattern name

Enter
component number Secure PCB ☞ 5

NO

YES
Enter XY data by teaching? Is a PCB secured?

NO YES

Teach
Enter XY data
mounting position

Enter R data ☞ 7.3

Check head number

Set fiducial mark

☞ Chapter 5

Set badmark
☞ Chapter 5

Set to "Exec"

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VIOS structure for Mount Info.
30924006-00

1/OPERATION/M 2/DATA/M 3/MAINTE/M 4/SHELL/M 0/EXIT

1/EDIT_DATA 2/DATA_ 3/DATABASE 4/MANUAL 0/EXIT

GENETAROR
A/DISPLAY A1 MAIN WINDOW PCB Info.
A2 SUB WINDOW Mount Info.
A3 VIEW DATABASE NO. Component Info.
A4 VISION ALIGNMENT DIC. Mark Info.
A5 Blk Repeat Info.
A6 VIEW/DEL. TEMPLET NO. Local Fidu.Info.
A7 FIND NEXT LocalBadMrkInfo.
A8 JUMP
A9 SWITCH WINDOW
A0 RETURN TO EDIT
B/UTILITY B1 ADJUST ASSISTANT
C/EDIT_TOOL B2 SET FROM DATABASE
D/FILE B3 SET FROM DATABASE ALL
B4 DRAW THE SHAPE (CMP)
B5
B6 SET PALLET
B7 CONVEYOR UNIT
B8 TRACE
B9 TEACHING
B0 TEACH,TRACE CONDITION

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1 Open the Mount Info. screen.
From the edit object list, select “Mount Info.” and press the [ENTER] key.
(When you are editing other information, pressing the [F3] key directly
displays the edit object list.)

3
Mount Info. screen
70023016-01

PCB :
OBJ : Mount Info.
No. SignOfLandPattern Comp X Y R Head FidMk BadMk Skip?
1
2
3

2 Enter the land pattern name.

Enter the land pattern name or symbol (ex., R23, U12, etc.) printed on the PCB
in the SignOfLandPattern column.
Reference
If you have no material showing the land pattern names in this step, you can enter them when
you confirm and correct the mounting position as described later in “8.2 Checking the mount
information”.

3 Enter the component number.

Enter the number of the component (data No. in the component information)
to be mounted in the Comp column.
Reference
Pressing the [F4] key displays part of the Component Info. in the sub-window on the right of
the screen as shown below. To close the Component Info. display, press the [F4] key again

Mount Info. and Component Info. screen

70023017-01

PCB :
OBJ : Mount Info. OBJ: Component Info.
No. SignOfLandPattern Comp X Y No. COMPONENT NAME
1 1 R1608
2 2 R2125
3 3 R3126

Main window: mount information Sub-window: component information

4 Enter the XY data.

For single PCBs, enter the XY coordinate data of the center of the mounting
position relative to the PCB origin (see “6.2” in this chapter). In the case of
multi-block PCBs, enter the position data relative to the block repeat No.1 (see
Chapter 5).
You can also use the teaching function to enter the XY coordinate data as
explained below.

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Mounting position relative to the PCB origin
30023042-01

Center of mounting position

Block 1 Block 2

PCB origin Block repeat No.1

To perform teaching to enter the XY coordinate data, proceed as follows:
1. Move the cursor to the “X” or “Y” column on the Mount Info. screen.
2. Manipulate the joystick to move the teaching camera so that the cross

;
cursor on the vision monitor is aligned with the teaching position.
For single point input, press the [F10] key twice.
For multi-point inputs, press the [SHIFT]+[F10] keys twice at the first point
and once at the second and third points, then press the [F10] key only at
the final point.

0
The following table shows typical teaching methods. Use any desired teching
method.

Teaching method for each component

50023041-02

Component type CHIP Tr. SOP QFP

Teaching method 1 or 2-point input 1 or 3-point input 2 or 4-point input 2 or 4-point input

Teaching point

: Teaching point

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5 Enter the mounting angle in the “R” column.
Enter the angle through which the component must be rotated after recogni-
tion before it is mounted on the PCB. When the pickup angle (in the
PICK&MOUNT sub-window of the Component Info.) is 0 degrees, enter the
rotating angle from the loading position, with the counterclockwise direction
specified as a plus value when viewed from above. When the pickup angle is
90 or -90 degrees, see the table below.

Mounting angle
50923007-00

Loading position

Pickup angle 90º -90º

0º
Mounting angle

180º

90º

-90º

Reference
Refer to the “Pickup & mounting angle quick reference” in Supplement in this manual.)

6 Check the head number in the “Head” column.

The head number to be used for mounting is indicated in the “Head” column.
Since the optimum head number is automatically selected when you execute
the DATA_GENERATOR command described later, it is not necessary to enter
it here. (Refer to “9. Data optimization” in this chapter for details.)
If you do not use the DATA_GENERATOR command, enter the head number
you will use for component mounting.
7 Set the fiducial mark number in the “FidMk” column.
Enter the number of the fiducial mark (point, local or 4-point fiducial) to be
used for this mount data. (Refer to “5.2 Local fiducial function” in Chapter 5.)
Note that this setting is valid only when necessary data is input in the Local
Fidu. Info. Enter “0” when not using the fiducial function.
8 Set the badmark number in the “BadMk” column.
Enter the number of the local badmark to be used for this mount data. (Refer to
“6.2 Local badmark” in Chapter 5.) Note that this setting is valid only when
necessary data is input in the LocalBadMrkInfo. Enter “0” when not using the
local badmark function.

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9 Set the “Skip?” column.
Select “Exec.” to execute this mount data, and select “Skip” when not
executing it.

c
n Note
If block conversion in <2/2/DATA_GENERATOR> is executed on the multi-block PCB data (to
convert multi-block PCB data into single PCB data), the “Exec” settings in the original data
will be saved as “NOTE DATA”.

0 Save the data.

After setting all mount data, press the [ESC] key, then select <2/1/D8 SAVE
PCB DATA> and press the [ENTER] key.

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8. Checking the data
It is suggested that you check the newly created data. This section explains
how to check the pickup position registered in the component information and
the mounting position registered in the mount information.

8.1 Checking the component information

When you have created component information while off-line and set the Pos.
Definition parameter to other than “Automatic”, you must check the pickup
position. Follow the steps below.
1 Open the Component Info. screen.
If the Component Info. screen is already displayed, omit this step.
When another information screen is open, press the [F3] key to directly
display the menu box. Select “Component Info.” from the menu and press
the [ENTER] key.

3
2 Set the component feeder on the feeder plate.
When you use a multistick feeder, securely install it on the feeder plate by
inserting the knock pins into the position that matches the Feeder Set No.
registered in the USER ITEMS sub-window.
When using tray components, set the components on the pallet specified in
the Tray sub-window.
3 Check the pickup position.
You can use the trace function (see “12. Teaching and trace”) to check the
pickup position.
1. Move the cursor to the Feeder Pos_X or Y parameter in the USER ITEMS
sub-window.
2. Press the [F9] key (or execute the <2/1/B0 TEACH, TRACE CONDITION>
command) and then set the following conditions.
Teaching unit : Camera
Speed : About 20
Fiducial correction : NotUse
After setting the teaching (trace) conditions, the display returns to the
Component Info. screen.

9
3. Press the [F9] key to perform trace.
The camera moves to the pickup position that is currently registered. Check
to see if the correct pickup position is displayed on the vision monitor.

9
4. If the pickup position is not correct, perform teaching referring to “3.2
Setting the stick feeder component data” or “3.3 Setting the tray component
data” in this chapter, to enter the correct pickup position.

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Reference
When you perform teaching for the following components, the camera may not reach the
pickup position. You should select the proper head as the teaching unit in these cases.
Components supplied from an external tray changer
Components supplied from a manual tray feeder.
The automatic trace function described in “12. Teaching and trace” allows making easy
checks of the pickup positions of all feeders to be used.

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8.2 Checking the mount information
While displaying the component mounting position on the vision monitor,
check and correct the mounting position, land pattern names and component
numbers.
Flow chart for checking and correcting the mounting position
30023015-02

Open Mount Info.

NO
Is PCB secured? Secure the PCB

☞ 5

YES

Select mount number

whose mounting position
is to be checked

Confirm
mounting position
YES

NO
Correct component
Continue?
mounting position ?

YES NO

Teach optimum
Save data
coordinate data

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1 Open the Mount Info. screen.
If the Mount Info. screen is already displayed, omit this step.
When another information screen is open, press the [F3] key to directly
display the edit object menu box. Select “Mount Info.” from the menu and
press the [ENTER] key.

3
2 Co-display the Component Info. screen.
Press the [F10] key, and part of the Component Info. will be displayed on the
right of the screen.
Use the [TAB] key to move the cursor between the Mount Info. on the left and
he Component Info. on the right of the screen.

4k
Mount Info. and Component Info. screen
70023017-01

PCB :
OBJ : Mount Info. OBJ: Component Info.
No. SignOfLandPattern Comp X Y No. COMPONENT NAME
1 1 R1608
2 2 R2125
3 3 R3126

Main window: mount information Sub-window: component information

3 Set the conditions to check the position.

Press the [F10] key (or execute the <2/1/B0 TEACH, TRACE CONDITION>
command) and then set the following conditions.
Teaching unit : Camera
Speed : 20 to 40
Fiducial correction : For PCB data using fiducial mark, select “Use”
For PCB data using no fiducial mark, select
“NotUse”.

0
After setting the teaching conditions, the display returns to the Mount Info.
screen.

n Note
When you correct, add or create the PCB data using fiducial marks, selecting “Fiducial
correction: Use” allows the machine to recognize fiducial marks on the PCB so that corrected
mount data is automatically obtained. This makes it possible to perform accurate teaching or
tracing of the specified position. To use this function, the fiducial mark coordinates and mark
data must be set correctly in advance.

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4 Move the cursor to the first data line on the Mount Info.
screen (left screen).
5 Check the mounting position by trace.
Press the [F9] key to perform the trace function. The camera moves to over the
position of the selected mount data. Check that the cross cursor on the vision
monitor is aligned with the mounting position.

9
Vision display during trace
30023047-00

Cross cursor

Land pattern

6 Correct the XY data.

If the cross cursor on the vision monitor shifts from the center of the compo-
nent mounting position, correct the XY data by teaching. Manipulate the YPU
joystick to move the camera to the center of the mounting position and press
the [F10] key twice to perform teaching.

d0
Reference
If you want to perform teaching input more accurately, use multi-point teaching or vision
cursor teaching. For details, refer to “12. Teaching and trace” in this chapter.

7 Check the land pattern name.

Check that the land pattern name or symbol (ex., R23, U12, etc.) printed on
the PCB matches the land pattern name entered in “SignOfLandPattern” on the
Mount Info. screen. If no land pattern names are entered, enter the name here.
If necessary, use the joystick to move the camera so that the land pattern name
printed on the PCB is brought into view.
8 Check the component number.
Check that the mounting position displayed on the vision monitor and the
component of the input component number are correct. You can refer to the
component No. and name list displayed on the right of the screen.
9 Press the [SHIFT] + [F9] keys to perform trace to the next
point.
The cursor moves down to the next data line to perform another trace. Check
the mounting position in the same manner.

h9
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0 Save the data
After all mount data have been checked and corrected, select <2/1/D8 SAVE
PCB DATA> and press the [ENTER] key. If you have changed correct data by
mistake, select <2/2/D9 ABORT PCB DATA> and press the [ENTER] key.

n Note
When you press the [Ctrl] + [F9] keys, the cursor moves down to the subsequent data lines
while performing continuous trace, until an empty data line is reached or any key is pressed.
This is called the automatic trace.

Automatic trace screen

70023053-00

PCB :
OBJ :Mount Info.
No. SignOfLandPattern Comp X Y R Head FidMk Badmk S kip?
1 R1005 1 10.75 8.00 0.00 3 0 0 Exec
2 1 13.75 9.50 180.00 3 0 0 Exec
3 1 22.75 11.00 0.00 3 0 0 Exec
4 1 22.75 8.00 0.00 3 0 0 Exec
5 1 34.75 8.00 0.00 3 0 0 Exec

The blinking cursor in the No. column shows

the data number being currently traced.

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9. Data optimization
PCB production data you have created can be automatically optimized in the
<2/2/DATA_GENERATOR> mode, so that the PCB data can be used more
efficiently with a minimum cycle time.
For example, to optimize the PCB data on the feeder set position, head number
and mounting sequence, follow the procedure explained in this section.
Data optimization flow
30023016-02

Select data to be
optimized ☞ 9.1

Set conditions
☞ 9.2

Optimize data
☞ 9.3

c Caution
The PCB data is changed when data optimization is performed.

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9.1 Selecting the data
1 Select the data to be optimized.
Enter the DATA_GENERATOR mode, then select <2/2/A1 OBJECT SELEC-
TION> and press the [ENTER] key. The OBJECT SELECTION box then appears.

OBJECT SELECTION box

70023018-00

OBJECT SELECTION
PCB SELECTION
FIXED PCB SELECTION
CANCEL SELECTION

NZL.CONDITION SEL.
FEEDER PLATE PRIO.
FIXED COMP. MASK
DISPLAY OBJECT
QUIT

2 Select “PCB SELECTION” and press the [ENTER] key.

A list of registered PCB names then appears.
3 Select the PCB data.
Select or enter the PCB name to be optimized and press the [ENTER] key. The
OBJECT SELECTION box then reappears.
4 Quit the settings.
Select “QUIT” from the OBJECT SELECTION box and press the [ENTER] key.
The PCB data to be optimized has now been selected.

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9.2 Setting optimization conditions
1 Select <2/2/A4 CONDITION SETTING> and press the [EN-
TER] key.
The DATA GENERATOR CONDITION box then appears.

DATA GENERATOR CONDITION box

70023060-00

DATA GENERATOR CONDITION

BLOCK CONVERSION COND. NO
FEEDER SET CONDITION NO

2 Set conditions.
Set the conditions while referring to the description below. Select the setting
with the [INS], [DEL] or [Space] key. The settings marked with an asterisk (*)
are typical settings for single PCBs (not applicable to multi-block PCBs).

c
• BLOCK CONVERSION COND
NO *
This setting does not allow block conversion (See “2.2 Block conversion” in
Chapter 5.) Always select “NO” when not using a multi-block PCB.
BLK.COND1: CONVERSION WITH NOTE DATA
The multi-block PCB data is converted into single PCB data while keeping
the original data. In this case, the data can be returned to the original multi-
block data.
BLK.COND2: CONVERSION WITHOUT NOTE DATA
The multi-block PCB data is converted into single PCB data without
keeping the original data. In this case, the data cannot be returned to the
original multi-block data.
BLK.COND3: CONVERSION BACK TO BLOCK REPEAT
This is used to reconvert the data which was converted with BLK.COND1
into the original multi-block PCB data.
Reference
See Chapter 5 for detailed information on “block conversion”.

• FEEDER SET CONDITION

NO
No mount data (mounting sequence, head number and feeder set position)
is optimized.
SET.COND1
The mounting sequence and head selection are optimized, but the feeder
set position is not optimized.

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SET.COND2
In addition to optimizing the mounting sequence and head number, the
optimum feeder set number is assigned only to the component data whose
feeder position is unspecified (Feeder Set No. in the Component Info. is set
to “0”.)
SET.COND3
This carries out the same operations as “SET.COND4”.
SET.COND4 *
In addition to optimizing the mounting sequence and head number, an
optimum feeder set number is assigned to all component data registered.
SET.COND5
This setting allows performing the operations of “SET.COND4” and static
component matching. (Refer to “4. Static components” in Chapter 5 for
detailed information.) This is invalid when static components are not used.

3 Quit the settings.

Press the [ENTER] or [ESC] key to close the DATA GENERATOR CONDITION
box. This completes the settings for the DATA GENERATOR.

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9.3 Optimizing the data
When you have selected the data, perform the data optimization in the DATA
GENERATOR mode.
1 Select <2/2/A5 EXECUTE> and press the [ENTER] key.
The DATA GENERATOR SEQUENCE MONITOR box appears to start the data
optimization. When the optimization is complete, the “nozzle settings” screen
appears.

DATA GENERATOR monitor box and optimized results

70923003-00

DATA GENERATOR SEQUENCE MONITOR

PCBNAME PCB1 MACHINE
17. WRITING PCB DATA

E685
Nozzle setting are shown below.

XY TABLE[Upper=Head No., Lower= Nozzle Type]

Head 1 2 3 4 5 6 7 8
Nzl. 0 31 0 31 0 31 0 31

Ensure SAFETY and hit [ENTER] key.

Reference
On the above nozzle setting screen, nozzle number “0” indicates that the nozzle can be
changed automatically.

2 Save the data.

Select <2/2/C5 RENAME & EXIT> and press the [ENTER] key. The optimized
data will be saved.

c Caution
The original data will be overwritten when the optimized data is saved with the <2/2/C0
SAVE & EXIT> command. To keep the original data, rename and save the data with the <2/
2/C5 RENAME & EXIT> command.

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10. Mounting test and data correction
Component mounting test should be performed to confirm that the production
data is correct. Follow the flow chart below to perform the mounting test and
data correction.
Mounting test and data correction flow
30023017-02

Preparetion for
mounting test

Select
1/RUNNING

Select PCB name

YES
PCB data error? Correct PCB data

☞ 10.3
NO

Setup

Start operation

YES
Error occurs? Correct data
☞ 10.3

NO

Complete component Execute

1/1/E4 Halfway continue
mounting

Confirm mounting
results and correct data ☞ 10.4

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10.1 Making setups for mounting test
Before starting mounting test, select the PCB data and make necessary setups.
1 Enter the <1/1/RUNNING> mode and select the PCB name.
When you enter the <1/1/RUNNING> mode, a list of PCB names appears.
Select the PCB to be produced and press the [ENTER] key, then the PCB data
will be loaded. If an error occurs during data loading, refer to section “10.3.1
Error countermeasures” in this chapter.

PCB name box

70023004-01

pcb name
CONVEYOR 1994-08-16
ANC_TEST 1998-02-11
PALLET_88 1998-02-23
PCB1 1997-11-24

n Note
To change the production PCB, press the [F2] key.

2 Check the nozzle type attached to each head.

e When your machine is not equipped with a nozzle station, check whether the
correct nozzle is attached to each head. If not, press the emergency stop
button and fit the correct nozzle to each head by hand.
Reference
To see the list of nozzles to be used, select <1/1/D4 RUNNING UTILITY>
→”REQUIRED NOZZLE” and press the [ENTER] key.

3 Check the conveyor setups as follows.

1. Execute <1/1/B6 RUNNING CONDITION> and check the PCB securing
method (PcbFixDevice). If you want to change the method, move the
cursor to “PcbFixDevice” and select the desired setting with the [INS],
[DEL] or [SPACE] key.

c
Running Condition Editor box
70023020-00

Running Condition Editor

PcdFixDevice Pin+PushUP

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2. Execute <1/1/D4/RUNNING UTILITY>.
The UTL. FOR RUNNING box appears, then select “CONVEYOR UNITS”
and press the [ENTER] key.

UTL. FOR RUNNING menu box

70023021-01

UTL. FOR RUNNING

CONVEYOR UNITS

3. Select “CONVEYOR WIDTH” and press the [ENTER] key to adjust the
conveyor width.
The conveyor width is automatically adjusted according to the “PCB Size”
Y data in the PCB Information. Set the PCB on the conveyor to confirm that
the width is correct. If not, quit automatic operation by executing the <1/1/
E0 EXIT FROM RUNNING> command, then select <1/2/PRD.
DATA>→”PCB Info.” to correct the “PCB Size” Y data.

CONVEYOR UNIT menu box

70023022-00

CONVEYOR UNIT

CONVEYOR WIDTH

c Caution
The conveyor rails moves, so use caution.

n Note
When the automatic width adjustment option is not installed, the CONVEYOR WIDTH
adjustment command is not available. Adjust the conveyor width manually.

4. After checking that the conveyor width is correct, operate and arrange each
conveyor unit so that the PCB can be secured on the conveyor.
Finally, remove the PCB.
Reference
Refer to “8. Changing the setup” in Chapter 3 for details on the conveyor unit setups.

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4 Set up the components (feeder set).
Execute the <1/1/D4 RUNNING UTILITY> command, and select “COMPO-
NENT ASSIGNMENT” to check the setup of the components. A list of feeder
mounting positions appears as shown below.

COMPONENT ASSIGNMENT screen

70023023-01

↑ No. Feeder Type Component Name SetNo. Counter / Total

14 32mmTape SOP16P F3
9 8mmTape R1608 F9
10 8mmTape R2125 F10
11 8mmTape R3216 F11
12 8mmTape M.M.TR. F12
13 8mmTape MELF F13 0 / 100
↓ 15 Ext. TC QFP100pin P1-5

Reference
For details on the component setups, refer to the separate feeder user’s manual or external
tray changer user’s manuals.

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10.2 Starting the mounting test
Now, try producing only one PCB to check how components are mounted. We
recommend using a PCB with double-sided tape affixed across the mounting
position.
1 Unplug the GATE-IN connector.
When the mounter is installed on a production line, unplug the GATE-IN
connector on the lower right panel on the front of the machine. If you perform
a mounting test with this connector still plugged, the PCB may flow into the
downstream process after component mounting, or the PCB may drop.

GATE-IN connector
30923017-00

GATE IN GATE OUT

Unplug from this

connector

2 Start operation.
Start PCB production as follows.
1. Place the PCB at the conveyor entrance so the entrance sensor responds to
the PCB.

Entrance sensor
30023050-01

Transfer Entrance sensor

direction
PCB

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2. Press the [SPEED] key on the YPU, or execute the <1/1/B1 RUNNING
SPEED> command, and set the speed to approx. 40 to 60%.

i
Speed setting box
70023024-00

Spead1 = 100
Spead2 = 80
Spead3 = 60
Spead4 = 40
Spead5 = 20

3. Execute the <1/1/A2 AUTO RUNNING> command or press the [RUN] key
on the YPU to start operation. Make sure that no part of your body is in the
axis movement range before execution.

g
4. Execute the <1/1/D6 CONVEY OUT PCB>.
This command carries out the PCB without requesting the next PCB to carry
in.

CONVEYOR OUT PCB command

70924020-00

<<<APPLICATION>>> 1/OPERATION/M
<<MODE>> 1/RUNNING
<COMMAND_LIST> D/INITIALIZE

Condition

D6 CONVEY OUT PCB

Reference
For details on the CONVEYOR OUT PCB command, refer to “6. Finishing the PCB produc-
tion” in Chapter 3.

3 Proceed as follows if an error occurs.

If an error occurs during PCB data loading, component pickup or component
mount, take corrective action referring to the next section, “10.3 Error
countermeasures during mounting test”. You can inspect pickup and mount
movements by pressing the [Space] bar to temporarily stop the machine. To
resume operation after correcting the problem, press the [Space] bar again.

w WARNING
NEVER ENTER ANY PART OF THE BODY IN THE AXIS MOVEMENT AREA OF
THE MOUNTER EVEN DURING TEMPORARY STOP. ALWAYS PRESS THE
EMERGENCY STOP BUTTON BEFORE ACCESSING A PART IN THE AXIS
MOVEMENT AREA.

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4 Finish the component mount.
Test mounting has been completed when the PCB is transferred out and stops
at the position of the conveyor exit sensor. Press the emergency stop button or
reset the data.

Exit sensor
30923018-01

PCB Transfer direction

Exit sensor

5 Check the mounting results.

Check the mounting results and correct the data if mounting position errors are
found. Refer to “10.4 Correcting the data after mounting test” for more details.

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10.3 Error countermeasures during
mounting test
If any error occurs during machine operation, take necessary corrective action
as explained below.
1 Press the [ESC] key to stop the alert sound.
2 Check the error message.
The error message is displayed on the operation monitor, so check and make a
note of the contents and error code.
3 Press the [ESC] key again to clear the error message.
4 Take corrective action.
To take corrective action, refer to the following sections which describe five
typical errors and the countermeasures.

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10.3.1 PCB data error
Take the following measure if an error occurs while loading the PCB data.
1 Check the error message.
If an error occurs, check the error message displayed on the operation monitor.

PCB DATA ERROR screen example

70023025-02

E150
PCB DATA ERROR
Illegal component shape data
or component data is not defined.

Component data ……………………

If this component is :FixCmpRef.

execute "FIX COMP. MATCH" in "DATA_GENERATOR"
Input the "Alignment Type" in "Component Info."
If executing "AUTO DISTRIBUTION" , execute the
optimization for each machine.

Ensure SAFETY and hit [ ENTER ] key.

2 Select the data and make corrections.

Select <1/2/PRD.DATA> and press the [ENTER] key, then select the data to be
corrected. Make necessary corrections according to the error message.

Edit object selection box

70023026-01

OBJECT
PCB Info.
Mount Info.
Component Info.
Mark Info.
Blk Repeat Info.
Local Fidu. Info.
Local BadMrk Info.

3 Confirm the corrected data.

Execute the <1/2/C8 PCB DATA CHECK> command, and confirm that the error
has been corrected.

n Note
The data check carried out with <1/2/C8 PCB DATA CHECK> is the same as that carried out
when executing the <1/1/D3 SWITCH PCB> command.

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10.3.2 Fiducial mark recognition error
If an error occurs during fiducial mark recognition or no mark can be recog-
nized, correct the data with the procedure below.
1 Enter the teaching mode.
If a fiducial mark recognition error occurs during automatic operation, the
following error message appears. Then, press the [F10] key to enter the
teaching mode.

0
Mark recognition error message screen
70023058-00

E56
MARK DETECTION ERROR
Failed to detect frfined mark.
(MarkNo. 1)
Do you execute VISION-CURSOR-TEACHING

[F10] key to execute

Any othr key to abort.

2 Perform vision cursor teaching.

When the teaching mode is entered, the following message is displayed.
Perform vision cursor teaching for the target mark while referring to the
procedure explained in “12. Teaching and trace” in this chapter.
Press the [ENTER] key after teaching, the teaching position coordinates are
then entered and the machine resumes automatic operation.

Vision cursor teaching screen

70023059-00

E57
VISION-CURSOR-TEACHING
Please teach fiducial mark while looking
VISION-MONITOR

[ESC] : Abort
[ENTER] : Teaching
[Arrows] : Moving at TEACH-WINDOW
[SHIFT]+[Arrows] : Moving at TEACH-WINDOW
[TAB] : Changing at TEACH-WINDOW

Reference
The initial size of the teaching window displayed when the teaching mode is entered is the size
specified by the “MarkOutSize” parameter in the Mark Information.

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3 Check the parameters and correct them.
If the same error occurs even after you have performed vision cursor teaching,
the Mark Info. settings are probably incorrect. Check the Mark Info. parameters
and correct them.
1. Select <1/2/PRD DATA>→”Mark Info.” and press the [ENTER] key.
The Mark Info. screen then appears.
2. Line up the cursor with the target mark data line and check its parameter
settings (such as “Mark Type”, “Mark OutSize”, “Shape Type” and “Surface
Type” while switching the right-hand sub-windows with the [F4] key.
Correct these parameter settings as necessary.

4
3. Press the [F6] to execute the Adjust Assistant and check or adjust so that the
mark is recognized correctly.

6
4. Press the [ESC] key and execute the <1/2/C7 UPDATE VISION DATA>
command to update the data.
5. Execute the <1/2/C0 SAVE & EXIT> command to save the data.

4 Resume the automatic operation.

Execute the <1/1/A2 AUTO RUNNING> command to resume the automatic
operation.
Reference
For detailed information on the Mark Info. parameter settings and the Adjust Assistant
commands, refer to “4. Creating the mark information” in this chapter.

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10.3.3 Component pickup error
If components cannot be picked up from the tape feeder or tray, or components
are picked up at an incorrect position (picked up on the side, slantly or at a
position off the center), inspect how the nozzle reaches a component. To do
this, press the [Space] bar to temporarily stop the machine at the instant the
nozzle picks up a component and check to see if it reaches the component. As
an alternative, set the operating speed to 10% or less by using the YPU
[SPEED] key to observe the nozzle movement over the feeder or tray. In
particular, check and correct the following points.

Check point 1: Component feed

Check to see if the nozzle tip center matches the center of a component on the
feeder when the nozzle picks up the component.
If not, check the feed pitch and movement of the feeder. For details on feeder
adjustments, refer to the separate feeder operation manual.

n Note
The teaching and trace functions help you check and correct the pickup point. Refer to “12.
Teaching and trace” and “8.1 Checking the component information” in this chapter.

Check point 2: Pickup height

Check whether the nozzle height is appropriate when the nozzle picks up a
component from the feeder.
If the nozzle presses on the component too much or does not reach the
component, correct the data as follows.
1. When the machine operation is interrupted due to an error, reset the
error and exit the RUNNING mode with the <1/1/E0 EXIT FROM RUN-
NING> command.
2. Select <1/2/PRD DATA>→”Component Info.” and press the [ENTER] key.
Line up the cursor with the data line of the target component.
3. Press the [F4] key to switch the right-hand sub-window to “PICK &
MOUNT”, then enter an appropriate value in the Pick Height column.
Normally, enter 0 to -0.5 when components are fed on paper tape, while
enter 0 to 0.5 when fed on embossed tape. (See the reference description
below.)

4
4. When data correction is complete, press the [ESC] key and execute the <1/
2/C0 SAVE & EXIT> command.

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Reference
For components fed on paper tape, their surface (delivery height) is about 0.5mm higher than
the typical reference height (the nozzle tip height when the Pick Height parameter in the PICK
& MOUNT sub-window is set to 0.0mm. So, enter 0 to -0.5mm in the Pick height parameter
column. It is advisable to enter a value that allows the nozzle to press the component by about
0.2mm. But, carefully select this value to prevent the nozzle from pressing the component too
much, otherwise the tape bottom may be broken causing the component to stand on its side.
For components fed on embossed tape, their surface is about 0.5mm lower than the typical
reference height, so enter “0 “to “0.5mm” for the Pick height parameter.

Component delivery height

10924007-00

Paper tape Embossed tape

0.5mm
Reference height
0.5mm

Checkpoint 3: PICK & MOUNT parameters

If you found nothing wrong by visual check, try adjusting the PICK & MOUNT
parameters in the Component Information as explained below.
• Pick Timer:
Set this parameter to a value slightly larger than the current setting.
• Pickup Speed:
Set this parameter to a value slightly smaller than the current setting.
When the data has been corrected, press the [ESC] key and execute the <1/
2/C0 SAVE & EXIT> command.

Checkpoint 4: Feeders
If the component cannot be still picked up even after taking corrective action
according to checkpoints 1 to 3, try replacing the feeder with another one. If
no error occurs with the new feeder, the former feeder probably has a
problem. Contact the YAMAHA sales representatives in your area.

Checkpoint 5: Nozzle
If the component cannot be still picked up even after taking corrective action
according to checkpoints 1 to 4, check and correct the following points.
• Check to see if the nozzle tip is worn or scratched.
• Try to specify another nozzle type for “Required Nozzle” in the USER
ITEMS sub-window of Component Information.

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10.3.4 Component recognition error
If a component cannot be recognized correctly, the VISION or SHAPE sub-
window parameter settings may not be appropriate, or adjustments with the
Adjust Assistant commands may not be satisfactory.
1 Exit the RUNNING mode.
1. If the mounter operation is interrupted by error, press the [ENTER] key to
reset the error.
2. Execute the <1/1/E0 EXIT FROM RUNNING> command.

2 Select the data line.

Select “Component Info.” in the <1/2/PRD.DATA> mode, and move the cursor
to the data line of the corresponding component.
3 Check the data.
Press the [F4] key to change the sub-window to the VISION and SHAPE
screens, and check that the parameters on each screen are correct. To
correct the data, press the [TAB] key to move the cursor to the sub-window.

4k
4 Perform the Adjust Assistant.
Press the [F6] key to execute the <1/2/B1/ADJUST ASSISTANT> command.
Refer to “3. Creating the component information” in this chapter for details on
the Adjust Assistant. When the component has been recognized properly, exit
the Adjust Assistant.

6
5 Update the corrected data.
Execute the <1/2/C7 UPDATE VISION DATA> command.
6 Quit the data correction.
Press the [ESC] key twice, then select <1/2/C0 SAVE & EXIT> and press the
[ENTER] key. The corrected data will be saved.
7 Resume automatic operation.
Execute the <1/1/A2 AUTO RUNNING> command to resume automatic
operation.

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10.3.5 Component mount error
If the component bounces on the PCB or drops off the nozzle before reaching
the PCB, inspect the cause first. To do this, press the space bar to temporarily
stop the machine at the instant the nozzle picks up a component, to see if it
properly reaches the component. As an alternative, set the operating speed to
10% or less by using the <1/1/B1 RUNNING SPEED> command or pressing
the [SPEED] key on the YPU, then observe the nozzle movement over the
feeder and check the following points.

Checkpoint 1: Component height

Open the Component Info. screen and check the Body Size Z parameter in the
SHAPE sub-window. Correct it if not appropriate.

Checkpoint 2: Air blow

Immediately after a component has been mounted on the PCB, an instantane-
ous air blow is performed to separate the component smoothly from the
nozzle tip. If this air blow amount and timer are not correct, the component
may bounce on the PCB or the nozzle may take the component back without
mounting it. The air blow amount and timer must therefore be set correctly.

Air blow for component mounting

10924004-00

1 2 3

In the above figure:

1 Air blow amount and timer are correct.
2 Air blow pressure is too high or timer is too long, causing the component to
bounce on the PCB.
3 Air blow amount is too low or timer is too short, causing the nozzle to take
the component back .before mounting it.

Air blow amount

To check and correct the air blow amount, processed as follows.
1. Open the output monitor in MANUAL mode and line up the cursor with
“HEAD BLOW” (TH09 - 16).
2. Position the cursor on the head you want to check and press the [ENTER]
key to turn on the air blow.
The output monitor digit reads “1” when the air blow is on.
3. Check the air blow operation by comparing it with the air blow from other
heads with no mount errors, by placing your finger over the nozzle tip
opening. (Use a pressure gauge if needed.)
4. If the air blow pressure is too low, the nozzle tip or air circuit is probably
clogged, so clean it. (See the mounter service manual for more informa-
tion.)

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Output monitor (Head Blow)
70924010-00

<<MODE>> 4/MANUAL

Out Monitor

TH09 HEAD1 BLOW

USUAL 0 / BLOW 1

NAME OUT NAME IN

Head Blow TH09-16 10000000

Select the head to be checked.

Air blow timer
To check and correct the air blow timer, proceed as follows.
1. Select <3/3/B1 ADJUST TARGET> and then “Position”.
2. Move the cursor to the Feeder column in the Discard Point row, and adjust
the setting as follows.
If the component bounces on the PCB, enter a value smaller than the
current setting. If the component is brought back with the nozzle, enter a
value larger than the current setting.

Position screen (for air blow timer setting)

70924011-00

<<<APPLICATION>>> 3/MAINTE/M
<<MODE>> 3/MCH_ADJUST
Editing Object Position

Object Feeder

Discard point 50

Enter here

Checkpoint 3: PICK & MOUNT parameters

Open the PICK & MOUNT sub-window in the Component Info. and adjust the
following parameters.
• Mount Timer
Set to a value larger than the current setting.
• Mount Speed
Set to a value smaller than the current setting.

Checkpoint 4: Reference pickup/mount vacuum pressures

Referring to ”3.5 Executing the Adjust Assistant commands” in this chapter,
check and adjust the settings for reference pickup and mount vacuum
pressures.

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Checkpoint 5: Nozzle
If mount errors still occur even after checking all the above points and making
necessary corrections, the nozzle may have problems. Check the following
points.
Check to see if the nozzle tip is worn or nicked.
Try using another nozzle type by changing the Required Nozzle setting on the
USER ITEMS sub-window in the Component Info.

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10.4 Correcting the data after mounting test
This section explains countermeasures you should take when mounting
position errors are found in the mounting test.

1. Mounting position errors at a specific point

When mounting position errors occur at a specific point on the PCB, the
component mount coordinate data is probably incorrect. Correct the data as
follows.
Mounting position error at a specific point
30023054-00

Mounting position error

1 Open the Mount Info. screen in the <1/2/PRD.DATA> mode.

2 Perform trace to the mounting position.
1. Move the cursor to the “X” or “Y” column of the data line whose mounting
position deviates.
2. Set the trace/teaching conditions and perform trace.
Press the [F9] key (or execute the <1/2/B0 TEACH, TRACE CONDITION>
command), then select “Camera” for the teaching unit, a slow speed, and a
fiducial correction setting as necessary.
Then, press the [F9] key again to perform trace. The moving camera moves
to above the mounting position. The cross cursor displayed on the vision
monitor indicates the current mounting position.

9
Reference
For details on the trace and teaching functions, refer to “12. Teaching and trace” in this
chapter.

3 Check the data.

If the cross cursor shifts from the center of the land patterns as shown in B, you
must correct the mount data by teaching. (You do not need to correct the data
when the cross cursor is at the center as shown in A.)

Mounting position indicated on the vision monitor

30023053-00

Cross cursor Cross cursor

A B

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4 Perform teaching to correct the mounting position.
1. Manipulate the YPU joystick so that the cross cursor is aligned with the
center of the land patterns.

d
2. Press the [F10] key twice to enter the correct coordinates of the center of
the land patterns.

0
2. Particular component shift from the mounting positions
When a particular component shifts from its mounting position, the compo-
nent may not be recognized correctly. Open the Component Info. screen in
the <1/2/PRD.DATA> mode and execute the Adjust Assistant for the data you
want to check.
Refer to “3. Creating the component information” for details on the Adjust
Assistant.

3. Mounting position shift on the entire PCB or in a particular block

When the mounting position for the entire PCB shifts, the “PCB Origin”
settings in the PCB Info. are probably incorrect (A in the figure). When the
mounting position for a particular block shifts, the coordinate settings in the
Blk Repeat Info. are probably incorrect (B in the figure).

Correcting mounting position errors

70024050-00

A: When mounting position shift occurs on the entire PCB :

<<<APPLICATION>>> 2/DATA/M
<<MODE>> 1/EDIT_DATA
PCB :
OBJ :PCB Info.
MARK X/X1 Y/Y1 MRK2 X2 Y2 Skip?
PCB Origin 10.00 10.00

Correct these values.

B: When mounting position shift occurs in particular block:
<<<APPLICATION>>> 2/DATA/M
<<MODE>> 1/EDIT_DATA
PCB :
OBJ :Blk Repeat Info.
No. Block Comment X Y R Skip?
1 0.00 0.00 0.00 Exec
2

Correct these values.

1 Open the corresponding screen.

In the <1/2/PRD.DATA> mode, open the PCB Info. screen to correct the PCB
origin, and open the Blk Repeat Info. screen to correct the block repeat
settings.

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2 Enter the mounting error.
If the position shifts in the plus direction (A in the figure below), subtract the
error from the current coordinate value, and add the error if the position shifts
in the minus direction (B in the figure below).
10024022-00

A B

3 Save the data.

When you have corrected the data, select <1/2/C0 SAVE & EXECUTE> and
press the [ENTER] key. The corrected data will be saved.

4. Mounting position errors even when fiducial marks are used

When the mounting position of the entire PCB or a particular block has shifted
even if the PCB corrections have been made by using the fiducial marks, an
extraneous mark may be recognized due to incorrect settings for the fiducial
mark coordinates. Open the Mark Info. screen in the <1/2/PRD.DATA> mode,
and perform the Adjust Assistant to adjust the data you want to check. Refer to
“4. Creating the mark information” in this chapter for details on the Adjust
Assistant.

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11. Data backup
Making a backup copy of data is recommended for cases in which the regis-
tered PCB data is corrupted or lost. To make a backup copy of PCB data, you
need a PCB data disk specially formatted for the YAMAHA mounters. This
section explains how to format a PCB data disk and make a backup.
Data backup flow
30023022-02

NO
4/1/D4/FORMAT&
Floppy disk formatted?
MAKE PCB DATA DISK

☞ 11.1

YES

NO
4/1/D3/MAKE
Backup disk created? PCB DATA DISK

☞ 11.2
YES

Insert floppy disk

into machine.

Back up data. ☞ 11.3

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11.1 Formatting and creating the PCB data
disk
A PCB data disk properly formatted for the machine is required to make a
backup. To format and create a PCB data disk using an unformatted disk,
follow the procedure below.

c Caution
When you use a floppy disk which is already formatted for the YAMAHA mounters, you can
skip this procedure and use the procedure explained in “11.2 Creating the PCB data disk”.

1 Insert a floppy disk into the floppy disk drive.

Insert an unformatted floppy disk for backup into the floppy disk drive of this
machine.
2 Select the formatting command.
Open the <4/1/DATA_FILE_MNG> mode, press the [ESC] key to display the
command menu window, then select <4/1/D4 FORMAT&MAKE PCB DISK>
and press the [ENTER] key. The dialogue box for formatting a disk appears.

Dialogue box for formatting a disk

70023033-00

Format Floppy Disk

Please insert new floppy disk in disk drive
Select disk type? :CANCEL

3 Select the disk type.

Select the matching disk type using the [INS] or [DEL] key.

c
Disk type
50023044-00

Type Selection item

2HD 1.44MB
2DD 720KB

4 Execute formatting.
Press the [ENTER] key to start formatting. When formatting is complete, the
disk is then automatically segmented to match the VIOS specifications, and the
PCB data disk is created.

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11.2 Creating the PCB data disk
To create a PCB data disk using a formatted disk, follow the procedure below.

c Caution
To create a PCB data disk, the disk must be formatted correctly. If not formatted, follow the
procedure explained in “11.1 Formatting and creating the PCB data disk”.

1 Insert a floppy disk into the floppy disk drive.

Insert a formatted floppy disk for back up into the floppy disk drive of this
machine.
2 Select the command
Open the <4/1/DATA_FILE_MNG> mode, press the [ESC] key to display the
command menu window, then select <4/1/D3 MAKE PCB DATA DISK> and
press the [ENTER] key. The dialogue box for creating a data disk appears.
3 Set the “Select Execute” parameter to “EXECUTE” with the
[INS] or [DEL] key.

c
Dialogue box for creating a data disk
70023034-00

MAKE PCB DATA DISK for VIOS

Please insert formatted floppy disk in disk drive
Select Execute :EXECUTE

Set this item.

4 Execute the command.

When the [ENTER] key is pressed, the inserted disk is automatically segmented
to match the VIOS specifications, and the PCB data disk is created.

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11.3 Data backup
Follow these steps to back up the data.
1 Insert the floppy disk into the floppy disk drive.
Be sure to use the PCB data disk.
2 Execute the <4/1/A1 SEARCH DRIVE> command.
When this command is executed, the PCB data registered in the hard disk is
displayed on the left screen, and the PCB data registered in the PCB data disk
on the right screen.

SEARCH DRIVE screen

70023035-00

Hard disk in mounter Floppy disk drive

<VIOS PCB> /Drv : C <VIOS PCB> /Drv : A

Vios Pcb Name Date Time Vios Pcb Name Date Time
STATIC_COMPONENTS_ 95-09-05 07 : 58
CONVEYOR 95-12-13 17 : 08
ADJUST 94-02-23 10 : 01

3 Select the PCB data to be backed up.

Move the cursor to the PCB data to be backed up on the left screen. When
the [INS] key is pressed, that PCB data will be selected. Repeat this step for all
PCB data items to be backed up. To cancel the selection press the [DEL] key.
After selecting all required data items, press the [ESC] key to display the
command menu window, then select <4/1/B1 COPY PCB FILE> and press the
[ENTER] key.

c
4 Follow the messages to execute the command.
Confirm the contents, and if they are okay, press the [SPACE] bar to set the last
item to “EXECUTE”, and then press the [ENTER] key. The data will be copied
onto the PCB data disk.

COPY PCB FILE screen

70023036-00

Copy PCB file

Source
Drive : C
Machine : Machine
PCB NAME : ADJUST
Distination
Drive : A
Machine : ___
PCB NAME : ADJUST NOT EXIT
Select Execute : CANCEL

Set this item to “EXECUTE”.

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12. Teaching and trace
This section explains basic operations of trace and teaching often used when
creating or checking new PCB data.

12.1 Trace
The trace function allows a teaching unit such as camera or head to automati-
cally move to a specified position. This is mainly used to check the settings for
the XY coordinates. The steps below explain the procedure for tracing in the
DATA Manager.
1 Set trace conditions.
When you select <2/1/B0 TEACH, TRACE CONDITION> and press the
[ENTER] key, the trace/teaching conditions setting boxes appear, so make
settings referring to the description below.
TEACH-UNIT SEL (Teaching/trace unit selection):
Using the up/down arrow keys, select the trace unit to move to the
specified point from among “Head 1”, “Head 8” or “Camera”, and press
the [ENTER] key.
SPEED SELECT (Axis moving speed selection):
Using the up/down keys, select the speed at which to perform trace from
among “Speed 1” to “Speed 5”, and press the [ENTER] key.
FIDUCIAL SEL (Fiducial correction option):
Select whether or not to use fiducial correction and press the [ENTER] key.
Select “Use” when you are going to create or edit PCB data using a fiducial
mark. The machine will automatically recognize the PCB fiducial mark to
obtain corrected data, enabling more accurate trace or teaching of the
position. Note that correct coordinates of the fiducial mark must be
specified in advance when using this function.
Reference
When the teach/trace conditions are set, they are displayed on the upper right of the screen as
shown below.

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Teach/trace condition display
70924014-00

<<<APPLICATION>>> 2/DATA/M
<<MODE>> 1/EDIT_DATA
PCB : CAM 100% X: 17.00 Y: 19.00
OBJ :Mount Info.

Teaching unit
Current position
CAM: Camera Axis moving speed
The current position of
H1: Head 1 Displayed in percent
teaching unit
H8: Head 8

2 Secure a PCB on the conveyor.

Use the <2/1/B7 CONVEYOR UNITS> utility to secure the PCB on the
conveyor.
3 Align the cursor with the item for which you want to perform
trace.
On the Mount Info. screen, for example, move the cursor to the line of the
data to which you want to perform trace.
4 Check the surrounding area for safety.
The teaching unit will immediately move when you perform trace, so placing
any part of your body within the axis movement range can be hazardous. Be
sure to stay out of the movement range.
5 Press the [F9] key to perform trace.
The teaching unit moves to the position you specified in Step 3.

9
Reference
Trace can also be performed by executing the <2/1/B8 TRACE> command.
In addition, when you press the [Shift]+[F9] keys, the cursor moves down to the next data line
after performing the trace. You can also perform continuous trace by holding down the
[Shift]+[F9] keys, or automatic trace by pressing the [Ctrl]+[F9] keys starting from the
selected line running towards lower lines until an empty line is reached. (See “12.3 Automatic
trace” in this chapter for more details.)

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12.2 Teaching
The teaching function is used to teach the machine a position such as XY
coordinates. There are two teaching methods: “point teaching” and “vision
cursor teaching”.
12.2.1 Point teaching
Point teaching is further divided into “single point input” and “multi-point
input”. The “single point input” allows the teaching data to be directly entered,
while the “multi-point input” gives the center coordinates in the multiple
positions which are specified. The steps below explain the teaching procedure
in the DATA Manager.
1 Set teaching conditions.
As with the trace function, use the <2/1/B0 TEACH, TRACE CONDITION>
command. (Refer to Step 1 in the previous section “12.1 Trace”.)
2 Secure a PCB on the conveyor.
Use the <2/1/B7 CONVEYOR UNITS> utility to secure the PCB on the
conveyor.
3 Move the cursor to the item for which you want to perform
teaching.
On the Mount Info. screen, for example, move the cursor to the line of the
data for which you want to perform teaching.
4 Move the teaching unit to the target position.
Check safety and stay out of the axis movement range, then manipulate the
YPU joystick to move the teaching unit to the target position.
5 Press the [F10] key to perform teaching as follows.
For “single point input”:
Press the [F10] key twice.
When you first press the [F10] key, a short beep sounds, then press the [F10]
key again to enter the teaching data.

0
For “multi-point input”:
1. At the first teaching point, press the [F10] key twice while holding down
the [Shift] key.
2. At the subsequent teaching points, press the [F10] key once per point while
holding down the [Shift] key.

h0

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3. At the last point, press the [F10] key only.
The center coordinates in the area specified by multiple teaching points are
now entered for the data at which the cursor is aligned.

0
4. If you want to cancel the teaching data, select <2/1/D9 ABORT PCB
DATA> and press the [ENTER] key.
Reference
Teaching can also be performed by executing the <2/1/B9 TEACHING> command. For
manipulating the YPU joystick, refer to “3. Manual operation” in Chapter 2.

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12.2.2 Vision cursor teaching
Vision cursor teaching allows you to obtain position data which is more
accurate than normal point teaching. A teaching window with any desired size
is displayed on the vision monitor and its center position obtained. The target
mark or pattern must be displayed on the vision monitor.
1 Secure the PCB on the conveyor and set teaching conditions.
As with point teaching, secure the PCB on the conveyor, and set teaching
conditions by executing the <2/1/B0 TEACH, TRACE CONDITION> com-
mand. In this case, the teaching unit must be set to “Camera”.
2 Move the camera to the target position.
Ensure safety and stay out of the axis movement range, then manipulate the
YPU joystick to move the camera to above the target position.

d
3 Press the [Ctrl] + [F10] keys.
A teaching window appears on the vision monitor as shown below.

l0
Vision cursor teaching
30923010-00

∗(180, 170) - (338, 331)

;;;
Teaching window
;

Land pattern

4 Adjust the teaching window position and size to match the

pattern or mark size.
At the top left of the vision monitor, the coordinates of two diagonal corners of
the window are displayed. Adjust the window position and size to match the
pattern or mark size as follows:
1. Use the arrow keys to move the window so that its upper left or lower right
corner is properly positioned for the target land patterns or mark.
When an asterisk (*) is prefixed to each of the two coordinates, pressing the
arrow keys allows the window to move in the direction indicated by arrow.

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2. Adjust the window size to match the pattern or mark size.
When you press the [TAB] key, the asterisk (*) of the right-hand coordinates
disappears as shown in the figure below. This state allows you to enlarge or
reduce the window size by changing the position of the upper left corner
with the arrow keys (the lower right corner is stationary in this case).

k
Adjusting the window size with the lower right corner fixed
30024025-01

∗(180, 170) - (338, 331)

∗(180, 170) - (338, 331)

Teaching window
;;
;
Land pattern Start (stationary)
point

3. When you want to adjust the window size by changing the position of the
lower right corner, press the [TAB] key again. The asterisk (*) of the left-
hand coordinate pair disappears but an asterisk reappears at the right-hand
coordinates, as shown in the figure below. This state allows you to enlarge
or reduce the window size by changing the position of the lower right
corner with the arrow keys (the upper left corner is stationary in this case).

k
Adjusting the window size with the upper left corner fixed
30024026-01

(180, 170) -∗(338, 331)

(180, 170) - ∗(338, 331)

Start (stationary)
point Teaching window
;
;;

Land pattern
;

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4. When you press the [TAB] once more, an asterisk (*) is prefixed to each of
the two coordinate pairs, allowing you to move the entire window using
the arrow keys.

k
Moving the entire window
30024027-02

∗(180, 170) - ∗(338, 331)

∗(180, 170) - ∗(338, 331)

Teaching window
;;
;
Land pattern

5. Enclose the target patterns or mark as follows.

Appropriate teaching window size

30923011-00

For teaching the center of patterns For teaching a mark

;;;
;;;
∗(180, 170) - (338, 331) ∗(180, 170) - (338, 331)
;
;
Pattern Mark

Teaching window

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Reference
Two sets of coordinates are displayed during vision cursor teaching. The left-hand coordinates
indicate the position of the upper left corner of the teaching window, and the right-hand
coordinates indicate the position of lower right corner, both represented in pixel units.

Teaching window position coordinates

10024013-01

A B

∗(180, 170) - ∗(338, 331)

∗(180, 170) - ∗(338, 331)

;;
; B

5 Press the [F10] key to perform teaching.

The center coordinates of the teaching window have now been entered.

0
n Note
Before performing vision cursor teaching, you must set teaching conditions. If you press the
[Ctrl]+[F10] keys without setting these conditions, the teaching window may not be displayed.

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12.3 Automatic trace
This function allows the head or camera to perform automatic trace. When
used with the Mount Information, the successive mount points can be continu-
ously traced, and when used with the Component Information, the successive
pickup points can be continuously traced .
1 Open the Mount Info. or Component Info. screen.
2 Set trace conditions.
See Step 1 in “12.1. Trace” in this chapter.
3 Secure the PCB on the conveyor.
Use the <2/1/B7 CONVEYOR UNITS> utility to secure the PCB on the
conveyor.
4 Move the cursor to the data line from which you want to
perform trace.
5 Check the surrounding area for safety.
The teaching unit will move immediately when automatic trace starts. Stay
outside of the axis movement range.
6 Press the [Ctrl] + [F9] keys to perform automatic trace.
Continuous trace proceeds until an empty line is reached. On the Mount Info.
screen, the cursor blinks in the No. column indicating which mount point is
currently traced. On the Component Information screen, the cursor blinks in
the COMMENT column indicating which pickup point is currently traced.

l9
Automatic trace
70023054-00

Mount Info. screen

PCB :
OBJ :Mount Info.
No. SignOfLandPattern Comp X Y R Head FidMk Badmk Skip?
1 R1005 1 10.75 8.00 0.00 3 0 0 Exec
2 1 13.75 9.50 180.00 3 0 0 Exec
3 1 22.75 11.00 0.00 3 0 0 Exec
4 1 22.75 8.00 0.00 3 0 0 Exec
5 1 34.75 8.00 0.00 3 0 0 Exec

Currently traced point

Component Info. screen

PCB :
OBJ :Component Info. USER ITEMS
No. COMPONENT NAME COMMENT Edit Term :
1 R1005 FixCompRef. : 0
2 R1005 Comp. Package : Tape
3 R1005 Feeder Type : 8mm1005cmp
4 R1005 Database No. : 0
5 R1005 Use feeder opt. : Yes

n Note
To interrupt automatic trace, press any key.

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13. Data editing for production PCB
13.1 Data editing
On a data editing screen, you can copy or move the specified data to another
line, another PCB data, and a static component data file. When adding or
deleting the data, you can insert or delete one or more lines, or one or more
columns as necessary. In addition, it is possible to copy and delete the data
registered in the database.

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13.1.1 Copying the specified range
You can copy a specified range of data on the database screen or any editing
screen except the PCB Info. screen. To perform a copy, first select the range of
copy source data, then specify the copy destination. You can copy the selected
range between different types of PCB data or into the database (user’s area).
1 Designate the copy source.
1. Use the arrow keys to line up the cursor with the first line of data to be
copied.
2. Press the [ESC] key to exit the current editing screen, then select <2/1/C4
SELECT DATA> (<2/3/C4> in DATABASE mode) and press the [ENTER] key.
The top line will be highlighted on the screen.
3. Use the arrow keys to move the cursor through the last line of data to be
copied.
4. Press the [ENTER] key to select the range.
The selected range highlighted will slightly change.

Selecting the range

70023044-00

<<<APPLICATION>>> 2/DATA/M
<<MODE>> 1/EDIT_DATA
PCB:
OBJ: Component Info. USER ITEMS
No. COMPONENT NAME COMMENT Edit Term :
1 R1608 FixCmpRef. : 0
2 R2125 Comp. Package : Tape

<COMMAND_LIST> C/EDIT_TOOL

No. COMPONENT NAME

1 R1608
2 R2125
3 R3216 C4 SELECT DATA

<<MODE>> 1/EDIT_DATA
PCB:
OBJ: Component Info. USER ITEMS
No. COMPONENT NAME COMMENT Edit Term :
1 R1608 FixCmpRef. : 0
2 R2125 Comp. Package : Tape
3 R3216 Feeder Type : 8mmTape

PCB:
OBJ: Component Info. USER ITEMS
No. COMPONENT NAME COMMENT Edit Term :
1 R1608 FixCmpRef. : 0
2 R2125 Comp. Package : Tape
3 R3216 Feeder Type : 8mmTape
4

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2 Specify the copy destination.
• To copy to another line:
Use the arrow keys to line up the cursor with the line you want to copy to.
• To copy into another PCB data file:
Press the [F2] key and select the PCB data into which you want to copy.
The information screen of the selected PCB data will be displayed, so line
up the cursor with the line you want to copy to.

2
• To copy into the Static Component Information:
Press the [F2] key and select “STATIC_COMPONENTS_” to open the Static
Component Information screen. Use the arrow keys to line up the cursor
with the line you want to copy to. (This can be used only for the Compo-
nent Information.)

2
3 Copy the selected range.
1. Select <2/1/C6 COPY SELECTED LINES> and press the [ENTER] key. (Select
<2/3/C6> for the database.)
The “HOW TO COPY?” dialogue box then appears.
2. Select “INSERT” or “OVERWRITE” and press the [ENTER] key.

c Caution
Note that selecting “INSERT” causes the data numbers after the insertion line to shift. This
may affect the PCB data in the static components and database. Likewise, the data numbers
will be shifted when component or fiducial mark data is copied.

4 Cancel the specified range.

Press the [ESC] key to exit the current editing screen, then select <2/1/C5
CANCEL SELECTION> and press the [ENTER] key. The highlighting disappears.

n Note
With the above procedure, it is not possible to copy the data between DATABASE mode and
EDIT_DATA mode (Component Info. or Mark Info. screen). When you want to copy into the
database, execute the <SET FROM DATABASE> command or a reverse of the <SET FROM
DATABASE> command. For more details, see “3. Creating the user database” in Chapter 5.

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13.1.2 Deleting the specified range
You can delete a specified range of data on the database screen or any editing
screen except the PCB Information screen.
1 Designate the range to be deleted.
Refer to the procedure explained in step 1 in the preceding section, “13.1.1
Copying the specified range”.
2 Perform deletion
1. Select <2/1/C7 DELETE SELECTED LINES> (or select <2/3/C7> in DATA-
BASE mode) and press the [ENTER] key.
The “HOW TO DELETE?” dialogue box then appears.
2. Select “DEL EMPTY LINES” or “CLEAR” and press the [ENTER] key.
“DEL EMPTY LINES” : Note that selecting “DEL EMPTY LINES” causes
the data numbers after the deleted lines to move
up. This may affect the PCB data in the static
components and database. Likewise, the data
numbers will be shifted when component or
fiducial mark data is deleted.
“CLEAR” : The deleted range remains as empty lines. The
data numbers will not be shifted by data deletion.

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13.1.3 Inserting one line
By executing the <2/1/C2 INSERT 1 LINE> command, you can insert a data
line on an editing screen except the PCB Information screen. You cannot insert
a data line on the database screen.
1 Line up the cursor with the position into which you want to
insert a data line.
2 Press the [ESC] key, then select <2/1/C2 INSERT 1 LINE> and
press the [ENTER] key.
A dialogue box then appears asking if you want to insert or cancel.

Inserting one line

70023045-00

HOW TO INSERT?
INSERT
CANCEL

3 Select “INSERT” and press the [ENTER] key.

One data line will be inserted into the position at which the cursor is placed.
All other lines under the insertion line move down one line.

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13.1.4 Deleting one line
By executing the <2/1/C3 or 2/3/C3 DELETE 1 LINE> command, you can
delete a data line on the database or an editing screen except the PCB Informa-
tion screen.
1 Use the arrow keys to move the cursor to the line you want to
delete.
2 Press the [ESC] key, then select <2/1/C3 DELETE 1 LINE> (or
<2/3/C3 > in DATABASE mode) and press the [ENTER] key.
A dialogue box then appears asking you how to delete.

Deleting one line

70023046-00

HOW TO DELETE?
DEL EMPTY LINES
CLEAR
CANCEL

3 Select “DEL EMPTY LINE” or “CLEAR” and press the [ENTER]

key.
“DEL EMPTY LINE” : Note that selecting “DEL EMPTY LINE” causes the
data numbers after the deleted line to move up.
This may affect the PCB data in the static compo-
nents and database. Likewise, the data numbers
will be shifted when component or fiducial mark
data is deleted.
“CLEAR” : The deleted line remains as an empty line. The
data numbers will not be shifted by data deletion.

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13.2 Data replace
The setting data in mount information and component information can be
replaced at time.

13.2.1 Data replace in mount information

1 Open the mount information
2 Select the REPLACE command in the <2/1/EDIT_DATA>
mode.
1. Press the [ESC] key to display the <2/1/C/ EDIT_TOOL> menu window.
2. Select <2/1/C1 EDITOR ASSISTANT> and press the [ENTER] key.
The EDITOR ASSISTANT submenu box then appears.
3. Select “REPLACE” and press the [ENTER] key.

3 Set “Select condition item”.

1. Use the up/down arrow keys to select the parameter item (shown in red)
and then the setting you want to replace in the blue column just under the
parameter item.
Comp : Select the Comp column setting in the mount
information with the number keys.
X : Select the X column setting in the mount
information with the number keys.
Y : Select the Y column setting in the mount
information with the number keys.
R : Select the R column setting in the mount
information with the number keys.
Head : Select the Head column setting in the mount
information with the number keys.
Fid Mk : Select the FidMk column setting in the mount
information with the number keys.
Bad Mk : Select the BadMk column setting in the mount
information with the number keys.
Skip? : Select the Skip? column setting in the mount
information with the [INS], [DEL] or [Space] key.

c
LandPattren : Select the SignOflandPattern column setting in the
mount information with the [INS], [DEL] or
[Space] key.

c
ALL : Specify “ALL” if you want to replace all the data
registered in the mount information.

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2. When all the necessary settings are complete, press the [ENTER] key to
perform replace.

Setting for “Select change item” (Mount Info.)

70023055-00

Select condition item

Use arrow keys to Comp
make selection 3 Use number keys, [INS] or
[DEL] key to make setting
Select change item
Skip?
Skip

4 Set “Select condition item”.

Specify the parameters and enter their new settings.
1. Use the up/down arrow keys to select the parameter (shown in red) you
want to change. Then, enter or select the new setting for the selected
parameter with the number keys, or [INS], [DEL] or [Space] key.
Comp : Specify the Comp column setting in the mount
information with the number keys.
X : Specify the X column setting in the mount
information with the number keys.
Y : Specify the Y column setting in the mount
information with the number keys.
R : Specify the R column setting in the mount
information with the number keys.
Head : Specify the Head column setting in the mount
information with the number keys.
Fid Mk : Specify the FidMk column setting in the mount
information with the number keys.
Bad Mk : Specify the BadMk column setting in the mount
information with the number keys.
Skip? : Specify the Skip? column setting in the mount
information with the [INS], [DEL] or [Space] key,
to determine whether to perform component
mount.

c
X offset / Y offset : Enter the desired offset to add to or subtract from
the current XY data in the mount information. For
example, if you want to shift the mounting
position selected in Step 3 by - 1mm in the X or Y
direction, enter “-1.00” here with the number
keys.

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R offset : Enter the desired offset to add to or subtract from
the current R data in the mount information. For
example, if you want to change the angle selected
in Step 3 by 90 degrees, enter “90.00” here with
the number keys.
X / Y Sign Reverse : If you want to reverse the plus / minus signs for
the current X data in the mount information, select
“Use” with the [INS], [DEL] or [Space] key. If not,
select “None”. For example, when set to “Use”, a
setting of “14.00” and vice versa.

c
2. When all the necessary settings are complete, press the [ENTER] key to
perform replace.

Setting for “Select change item” (Mount Info.)

70025009-00

Select condition item

Comp
3

Select change item

Skip? Use arrow keys to
Skip make selection

Use number keys, [INS] or

[DEL] key to make setting

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13.2.2 Data replace in component information
1 Open the component information
2 Select the REPLACE command in the <2/1/EDIT_DATA>
mode.
1. Press the [ESC] key to display the <2/1/C/ EDIT_TOOL> menu window.
2. Select <2/1/C1 EDITOR ASSISTANT> and press the [ENTER] key.
The EDITOR ASSISTANT submenu box then appears.
3. Select “REPLACE” and press the [ENTER] key.

3 Set “Select condition item”.

1. Use the up/down arrow keys to select the parameter item (shown in red)
and then the setting you want to replace in the blue column just under the
parameter item.
Component name : Select the COMPONENT name in the component
information with the [INS], [DEL] or [Space] key.

c
Nozzle Type : Select the Required Nozzle setting in the USER
ITEMS sub-window of the component information.
Use the [INS], [DEL] or [Space] key to make a
selection.

c
Feeder Type : Select the Feeder Type setting in the USER ITEMS
sub-window of the component information. Use
the [INS], [DEL] or [Space] key to make a
selection.

c
Data Base No. : Select the Database No. setting in the USER ITEMS
sub-window of the component information. Use
the number keys to make a selection.
Comment : Select the COMMENT column setting in the
component in the component information. Use
the character keys to make a selection.

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2. When you have made necessary selections, press the [ENTER] key.
The editing cursor now moves down to the light blue column.

Setting for “Select condition item” (Component Info.)

70023056-00

Select condition item

Use arrow keys to Component name
make selection R1005 Use number keys, [INS] or
[DEL] key to make setting
Select change item
Retry Times
2

4 Set “Select change item”.

Specify the parameters and enter their new settings.
1. Use the up/down arrow keys to select the parameter (shown in red) you
want to change. Then, enter or select the new setting for the selected
parameter with the number keys, or [INS], [DEL] or [Space] key.
Pick Angle Deg : Specify the Pick Angle deg setting in the
PICK&MOUNT sub-window of the component
information. Use the [INS], [DEL] or [Space] key
to make a setting.

c
Pick /Mount Timer : Specify the Pick Timer or Mount Timer setting in
the PICK&MOUNT sub-window of the
component information. Use the [INS], [DEL] or
[Space] key to make a setting.

c
Pick /Mnt Height : Specify the Mount Height or Mnt Height setting in
the PICK&MOUNT sub-window of the component
information. Use the number keys to make a
setting.
Dump Way : Specify the Dump Way setting in the
PICK&MOUNT sub-window of the component
information. Use the [INS], [DEL] or [Space] key
to make a setting.

c
Retry Times : Specify the Retry Times setting in the
PICK&MOUNT sub-window of the component
information. Use the [INS], [DEL] or [Space] key
to make a setting.

c
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Mount Action : Specify the Mount Action setting in the
PICK&MOUNT sub-window of the component
information. Use the [INS], [DEL] or [Space] key
to make a setting.

c
Mount/Pickup Speed: Specify the Mount Speed or Pickup Speed setting
in the PICK&MOUNT sub-window of the compo-
nent information. Use the [INS], [DEL] or [Space]
key to make a setting.

c
Vacuum Check : Specify the Vacuum Check setting in the
PICK&MOUNT sub-window of the component
information. Use the [INS], [DEL] or [Space] key
to make a setting.

c
Pick/Mount Vacuum : Specify the Pick Vacuum or Mount Vacuum setting
in the PICK&MOUNT sub-window of the compo-
nent information. Use the number keys to make a
setting.
Pick/Mount Timer offset : Enter the desired offset to add to or subtract
from the current Pick Timer or Mount Timer
data in the PICK&MOUNT sub-window of the
component information. Use the number keys
to make a setting.
Pick/Mount Height offset: Enter the desired offset to add to or subtract
from the current Pick Height or Mount Height
data in the PICK&MOUNT sub-window of the
component information. Use the number keys
to make a setting.
Database No. : Specify the Database No. in the USER ITEMS
sub-window. Use the number keys to make a
setting.
Nozzle Type : Specify the Required Nozzle in the USER ITEMS
sub-window. Use the [INS], [DEL] or [Space] key
to make a setting.

c
Feeder Type : Specify the Feeder Type in the USER ITEMS
sub-window. Use the [INS], [DEL] or [Space] key
to make a setting.

c
Comment : Enter a comment for the component information,
using the alphanumeric keys.

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2. When all the necessary settings are complete, press the [ENTER] key to
perform replace.

Setting for “Select change item” (Component Info.)

709225010-00

Select condition item

Component name
R1005

Select change item

Retry Times Use arrow keys to
2 make selection

Use number keys, [INS] or

[DEL] key to make setting

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13.3 Data sort
You can sort the mount data in ascending or descending order according to the
selected conditions.
SORT ITEM box
70023057-00

SORT ITEM
1 Comp Use [INS], [DEL] or [Space]
2 SignOfLandPattern
3 Non keys to make selection
Sorting priority
4 Non
5 Non
6 Non
7 Non
8 Non
9 Non
Upper Dir Use [INS] or [DEL] key
Press [ENTER] to execute Execute to make selection
data sort

1 Open the Mount Information screen.

2 Select the DATA SORT command.
1. Press the [ESC] key to display the <2/1/C/ EDIT_TOOL> menu window.
2. Select <2/1/C1 EDITOR ASSISTANT> and press the [ENTER] key.
The EDITOR ASSISTANT submenu box then appears.
3. Select “DATA SORT” and press the [ENTER] key.
The SORT ITEM box then appears.

3 Specify the sorting conditions.

Here you must specify the sorting conditions (sorting items and their priority).
Numbers listed in the SORT ITEM box indicate the sorting priority, with the
highest priority at No.1 and the lowest at No. 9, so you can specify up to 9
items.
1. Line up the cursor with No.1 in the SORT ITEM box.
2. Use the [INS], [DEL] or [Space] keys to select the sorting item.

c
3. Specify other sorting items as needed, by moving the cursor to No. 2 and
then the subsequent numbers.

4 Select the sorting order.

Move the cursor to “Upper Dir” and select the sorting order with the [INS],
[DEL] or [Space] keys.
Select “Upper Dir” when you want to sort the data in the ascending order
(from A to Z for alphabet characters or from 0 to a larger number), and select
“Lower Dir” when you want to sort it in the descending order.

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5 Execute the sorting.
Move the cursor to “Execute” and press the [ENTER] key.
The sorting will now start according to the selected conditions.

n Note
If you do not want to save the sorted data, select <D0 ABORT DATA> when you exit the
<EDIT_DATA> mode.

c Caution
The results obtained with the <DATA_GENERATOR> command will be lost by data sorting.

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