BJTAssignment
BJTAssignment
Submitted to
MS. AMANPREET
1 Parav Sharma
1. Introduction
From 1904-1947, vacuum tubes dominated electronics, starting with Fleming’s diode (1904)
and De Forest’s triode amplifier (1906). Radio/TV demand surged tube production to
100 million by 1937, with tetrodes and pentodes enhancing performance. On December 23,
1947, Brattain and Bardeen at Bell Labs unveiled the first transistor, revolutionizing
electronics. Unlike bulky, power-hungry tubes, transistors were smaller, lightweight, energy-
efficient, instant-on, and rugged. This three-terminal solid-state device enabled modern
electronics by offering lower voltages, no heater loss, and higher efficiency. The transistor’s
advent marked a paradigm shift, replacing tubes and paving the way for compact, reliable
amplifiers and digital technology.
E C E C
p n p n p n
n
B B
Emitter (E):
• Heavily doped (e.g., with arsenic for npn or boron for pnp) to maximize charge carrier
injection.
• Acts as the source of majority carriers (electrons in npn, holes in pnp).
Base (B):
• Very thin (typically less than 1 micron) and lightly doped to minimize carrier
recombination.
• Controls the flow of carriers from emitter to collector.
Collector (C):
• Moderately doped and physically larger than the emitter to dissipate heat efficiently.
• Collects the majority of carriers that pass through the base.
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The base layer is intentionally kept thin and lightly doped to ensure most carriers from the
emitter reach the collector, making the transistor efficient for amplification.
Physical Layout:
The emitter and collector layers are much wider than the base. For example, in some transistors,
the width ratio of emitter-to-base-to-collector can be 150:1:150, highlighting how thin the
base is. The doping concentration of the base is also 100 times less than the emitter and
collector, increasing its resistance and reducing unwanted carrier recombination.
Transistor Operation
The operation of a BJT depends on how its two pn junctions (emitter-base and collector-base)
are biased. Proper biasing allows the transistor to function as an amplifier or a switch.
Biasing Modes:
1IE = IC + IB 1
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• Minority Carriers: Cause a small leakage current (ICO) in the reverse-biased CB
junction. ICO is temperature-sensitive but negligible in modern transistors.
B
Depletion regions
IB
+ – + –
VEE VCC
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IE IC IE IC
p n p n p n
E C E C
B B
IB IB
+ – + – – + – +
VEE VCC VEE VCC
IE IC IE IC
E C E C
IB IB
B B
(a) (b)
Figure 5. Notation and symbols used with the common-base configuration: (a) pnp transistor; (b) npn transistor.
IE = IC + IB
Figure 6. Input or driving point characteristics for a common-base silicon transistor amplifier.
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Output Characteristics (IC vs VCB ):
• Active Region: IC ≈ IE and remains nearly constant for changes in VCB . This flat curve
indicates high output impedance.
• Cutoff Region: IC = ICBO (minute leakage current, typically nanoamperes).
• Saturation Region: IC rises sharply when VCB < 0 V (both junctions forward-biased).
IC (mA)
6 mA
6
5 mA
5
4 mA
4
3 mA
3
2 mA
2
I E = 1 mA
1
ICO = ICBO
I E = 0 mA
0
−1 0 10 20 30 40 V CB (V)
Cutoff region BVCBO
Key Parameters
Current Gain ():
IC
• DC Alpha (dc): Ratio of collector to emitter current i.e., dc = . Typically, 0.95 to
IE
0.99 (always < 1 due to base recombination).
IC
• AC Alpha (ac ): Small-signal gain i.e., dc = . Nearly equal to dc in practical
IE
circuits.
• High Voltage Gain: Achieved due to low input impedance (≈ 20-100 Ω) and high
output impedance (≈ 50 kΩ-1 MΩ).
• No Phase Shift: Input and output signals are in phase.
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• Excellent High-Frequency Response: Preferred for RF and cascode amplifiers.
Disadvantages:
Applications
1. Radio Frequency (RF) Circuits: CB’s bandwidth suits tuners and oscillators.
2. Impedance Matching: Connects high-Z sources to low-Z loads.
3. Cascode Amplifiers: Combines CB with CE for enhanced performance.
KEYPOINTS
✓ The base is common to input and output, with the emitter as input and collector as output.
✓ Active mode requires EB forward-biased and CB reverse-biased (IC ≈ IE ).
✓ ≈ 0.99 for practical transistors, but ICBOICBO becomes significant at high temperatures.
✓ Voltage gain is high, but current gain () < 1 limits power amplification.
✓ Preferred for high-frequency applications due to wide bandwidth and stability.
Current Relationships:
• Emitter Current (IE ): Splits into collector current (IC ) and base current (IB ).
IE = IC + IB
7 Parav Sharma
(a) (b)
Figure 8. Notation and symbols used with the common-emitter configuration: (a) npn transistor; (b) pnp transistor.
It resembles a diode curve (exponential rise in IB with VBE ). VBE ≈ 0.7 V for Si transistors in
the active region.
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Figure 10. Characteristics of a silicon transistor in the common-emitter configuration: collector characteristics
Breakdown Region:
Figure 11. Examining the breakdown region of a transistor in the common-emitter configuration
Key Parameters
Current Gain ():
IC
• DC Beta (dc ): dc = (Typical range: 50–400).
IB
IC
• AC Beta (ac): ac = (Similar to dc in practice).
IB
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Leakage Currents:
ICEO = ( + 1) ICBO
= and =
1− 1+
Disadvantages:
Applications
1. Audio Amplifiers: CE provides high voltage and current gain.
2. Switching Circuits: Saturation (ON) and cutoff (OFF) modes.
3. Signal Processing: Used in oscillators and modulators.
KEYPOINTS
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Circuit Setup and Biasing
Terminal Roles:
Biasing Conditions:
Practical Configuration:
Figure 12. Notation and symbols used with the common-collector configuration: (a) pnp transistor; (b) npn transistor.
Output Characteristics:
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Key Parameter
Voltage Gain (AV ):
Impedance:
• Impedance Matching: Bridges high-Z sources (e.g., sensors) to low-Z loads (e.g.,
speakers).
• Stability: Less sensitive to load variations.
• No Phase Shift: Output signal is in-phase with input.
Disadvantages:
• No voltage gain (output ≈ input − 0.7 V), limiting signal amplification capability.
• Higher power dissipation due to large emitter currents, requiring careful thermal
design.
Applications
1. Voltage Buffers: Isolates amplifier stages while maintaining signal integrity.
2. Power Amplifiers: Drives low-impedance loads (e.g., audio outputs).
3. Signal Conditioning: Protects sensitive circuits from loading effects.
5. Limits of Operation
Every transistor has specific operational boundaries that must be observed to prevent
damage and maintain signal integrity. These limits, illustrated in Fig. 13, define the safe
operating area where the transistor functions optimally with minimal distortion.
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Key Operational Limits
Current and Voltage Limits:
Power Dissipation:
• The maximum power (PCmax = VCE × IC ) must not exceed rated values (e.g., 300 mW).
• Example safe operating points: 50 mA at 6 V, 15 mA at 20 V and 25 mA at 12 V.
Figure 13. Defining the linear (undistorted) region of operation for a transistor
When characteristic curves aren't available (common in datasheets), designers must ensure:
13 Parav Sharma
For common-base configurations, the same principles apply using VCB instead of VCE . Staying
within these limits ensures reliable amplification while preventing damage. Always include
safety margins (typically 20-30 % below maximum ratings) for robust circuit design.
KEYPOINTS
✓ Transistors have defined current (ICmax ), voltage (VCEO), and power (PCmax ) limits to prevent
damage and distortion.
✓ Must maintain VCEO above saturation (~ 0.3 V) and below breakdown while keeping IC and
power dissipation within ratings
✓ Safe operation requires staying within these limits with 20-30 % safety margin.
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