Doc No.

: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

D0: Problem Summary

Date of Complaint 17/03/2025

Nature of Complaint COSMETIC

Requesting Customer FINELINE CIRCUIT CO.

End Customer Embedded IT Solutions India Pvt. Ltd., Hyderabad

Customer Part Number CSM MEMS_V1 30B PCB

Manufacturing Part 13205

Date Code 08.25

Lot Number 250553/ 13205

If Any -

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 Doc No.: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

D1: Team Approach

Role Name Department / Position

Team Members

PROCESS ENGINEER BHAUMIK SHAH PROCESS

QUALITY ENGINEER OVAISH NAKUM QUALITY ASSURANCE

QUALITY HOD BIPIN TAMBOLI QUALITY ASSURANCE

QUALITY INSPECTOR GAUTAMGIRI GOSWAMI QUALITY ASSURANCE

Management
Representative

GENERAL MANAGER B.C SWAIN SIR

Team Leader

BHAUMIC SHAH PROCESS

Prepared by OVAISH NAKUM QUALITY ASSURANCE

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 Doc No.: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

D2: Problem Description

(1) FOD
(2) Copper exposure(Oxidation) at SMT pads
(3) through holes covered with green mask (MIC1 location)
(4) Damage at NPTH
(5) Gold plating at NPTH location

Photo / Problem Evidence:

(1) FOD (2) COPPER EXPOSE (3) MIC1 location (4) Damage at NPTH (5)Gold plating at NPTH

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 Doc No.: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

D3: Containment and Short Term Corrective actions

Actual Completion Date 26/03/2025

Action Taken Asked to return affected PCBs for analysis purpose.

Responsibility / Concern QUALITY FCC/ IQC EIS

Result We have re-verified the PCBs during the final qc process. As a result, we identified and reworked the defective
PCBs, which were replaced the following day. After this process, we ended up with excess PCBs, which have been
safely stored at our facility.

D4: Define and Verify Root Cause

Target Completion Date -

Actual Completion Date 28/03/2025

Action Taken Conducted a meeting and introduced responsible departments with the issue.

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 Doc No.: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

Responsibility / Concern PHOTO-MECH, MASKING, FINAL CLEANING

Result ACTION TAKEN FOR FUTRE LOTS

5 Why - Occurrence Why the problem occurred?

1-Why

D4-2:Root Cause Analysis for Problem Escape Actions / Results:

Title NPT HOLES EDGE PLATING

Target Completion Date -

Actual Completion Date 29/03/2025

Responsibility / Concern PHOTO-MECH, PLATING

Results ACTION TAKEN FOR FUTRE LOTS

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 Doc No.: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

5 Why – Escape

1-Why -

5-Why - System What is the failure of Quality for this problem?

1-Why

Failure at customer incoming ICQ

D5: Corrective Action

Title NPT HOLES EDGE PLATING

Target Completion Date -

Actual Completion Date 29/03/2025

Responsibility / Concern PLATING

Action Taken Double-check the tenting process parameters, ENIG process parameters, including mask coverage and plating

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 Doc No.: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

bath chemistry before each process.

Results ACTION TAKEN FOR FUTURE LOTS

D5-2: Corrective Action for Escape Results

Title NPT HOLES EDGE PLATING

Target Completion Date -

Actual Completion Date 29/03/2025

Responsibility / Concern PLATING

Action Taken Thought process parameters need to be checked before passing the panels, we have instructed the
respected/involved departments to closely monitor the PCBs after developer to look for the tenting broken. Also
we have instructed the visual inspection team to 100% sampling for plated holes. Training will be provided to
operators.

Results ACTION TAKEN FOR FUTURE LOTS

D6: Implement and Verify permanent Corrective Actions

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 Doc No.: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

Target Completion Date -

Actual Completion Date 29/03/2025

Responsibility / Concern PHOTOMECH,PLATING, FINAL CLEANING

Action Taken  We have conducted the meeting & documented it with duly signed with the responsible departments
and instructed to follow the above mentioned actions to avoid such inconvenience in future.
 Increased Inspection Frequency while photo-mech developer tenting failure, mask application as well as
at final cleaning to avoid such occurrence.
Results ACTION TAKEN FOR FUTURE LOTS

D7: Prevent Recurrence

Title NPT HOLES EDGE PLATING

Target Completion Date -

Actual Completion Date 29/03/2025

Responsibility / Concern PHOTOMECH,PLATING, FINAL CLEANING

Action Taken Regular monitoring of plating and tenting parameters.

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 Doc No.: EIS-QE-FORM-076
8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

Results ACTION TAKEN FOR FUTURE LOTS

D8: Congratulate the Team

Congratulate the Team Member

(1) TEAM OF EMBEDDED IT SOLUTIONS

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8D REPORT Issued No.: 001/13-01-2021
Rev No.: 002/28-12-2023

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