Untitled Document
Untitled Document
Aim: To determine the overall thermal conductivity and the temperature distribution in a
composite slab made up of different materials.
Apparatus Used:
● Composite slab apparatus: A setup comprising a heater, multiple test slabs (Mild
Steel, Bakelite, Wood), and cooling elements, used to study one-dimensional heat
conduction under steady-state conditions.
● Heater: Electrically powered flat heater that provides a consistent thermal source to
the slab system.
● Thermocouples: Temperature sensors embedded at various points to record
temperature gradients across each slab layer.
● Voltmeter and Ammeter: Instruments used to measure the voltage supplied and the
current drawn by the heater circuit.
● Insulated guard heaters: These surround the main slab assembly to minimize radial
heat loss and promote one-dimensional heat flow.
Chapter 1: Introduction
Heat conduction is one of the primary modes of heat transfer and occurs when there is a
temperature gradient in a solid medium. In many practical engineering applications, heat
flows through a structure composed of more than one material, known as a composite slab.
The heat transfer in such systems is influenced by the thermal conductivities of the individual
materials and the contact resistance between them.
Chapter 2: Theory
2.0 Thermal Resistance and Electrical Analogy
V=I×R
In thermal systems, heat flow (Q) is equivalent to current, temperature difference (ΔT) to
voltage, and thermal resistance (Rₜₕ) to electrical resistance. The analogous relation is:
Q = ΔT / Rₜₕ
Where:
Where:
For multiple layers in series, the total thermal resistance is the sum of individual resistances:
R_total = R₁ + R₂ + R₃ + ... + Rₙ
This analogy helps visualize heat flow using the same principles used in analyzing electrical
circuits.
(2.1)
Where:
(2.2)
(2.3)
Where:
Chapter 5: Observations
Wall diameter: 200 mm
Wall thicknesses: Mild Steel = 25 mm, Bakelite = 19 mm, Wood = 12 mm
Observation Table:
1. Voltmeter (V) 50 60
Temperature
(°C)
T1 41 50
T2 41 50
T3 40 49
T4 40 49
T5 35 41
T6 35 41
T7 33 37
T8 33 37
Chapter 6: Calculations
1. Mean Temperatures
a) Wood Plate Temperature (T_W): T_W = (T₇ + T₈) / 2 °C = (33 + 33)/2 = 33°C (Set I), (37
+ 37)/2 = 37°C (Set II)
b) Bakelite Plate Temperature (T_B): T_B = (T₅ + T₆) / 2 °C = (35 + 35)/2 = 35°C (Set I), (41
+ 41)/2 = 41°C (Set II)
c) Mild Plate Temperature (T_M): T_M = (T₃ + T₄) / 2 °C = (40 + 40)/2 = 40°C (Set I), (49 +
49)/2 = 49°C (Set II)
d) Heater Plate Temperature (T_H): T_H = (T₁ + T₂) / 2 °C = (41 + 41)/2 = 41°C (Set I), (50
+ 50)/2 = 50°C (Set II)
Set 1
Temperature difference:
T_H = 41°C
T_W = 33°C
Heat input:
Q = V × I = 50 × 0.35 = 17.5 W
Q = 8.75 W
Cross-sectional area:
Temperature difference:
ΔT = 8°C
Thermal resistance:
t = 0.056 m
Thermal conductivity:
Set 2
Temperature difference:
T_H = 50°C
T_W = 37°C
Heat input:
Q = V × I = 60 × 0.42 = 25.2 W
Q = 12.6 W
Temperature difference:
ΔT = 13°C
Thermal resistance:
t = 0.056 m
Cross-sectional area:
A = 31.4 × 10⁻³ m²
Thermal conductivity:
Chapter 7: Results
● Heat Transfer Rate (Q): 8.75 W (Set I), 12.6 W (Set II)
● Overall Thermal Conductivity (k_eff): 1.9505 W/mK (Set I), 1.72 W/mK (Set II)
Chapter 8: Precautions
● Keep auto transformer to zero before start.
● Increase voltage slowly.
● Keep all assembly undisturbed.
● Remove air gap between plates by moving hand press gently.
● While removing plates, do not disturb thermocouples.
● Operate selector switch of temperature indicator gently.
Chapter 9: Conclusion
We see that on increasing the voltage and current, heat generated increases due to
increased power supply.
For steady-state conduction, the heat transfer rate (Q) is proportional to the temperature
gradient in a material.
Due to increased voltage and current, Set II has a higher temperature gradient compared to
Set I.
Since heat transfer rate is identical in both directions and conduction of materials (thickness
etc.) are same in both directions, temperature gradient remains the same.