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STTH4R02 Diode 4A

The STTH4R02 is an ultrafast recovery diode designed for low voltage, high frequency applications, utilizing ST's 200 V planar Pt doping technology. It features negligible switching losses, high junction temperature, and low conduction losses, making it suitable for switching mode base drive and transistor circuits. The diode is available in DPAK, SMB, and SMC packages, with a maximum repetitive peak reverse voltage of 200 V and an average forward current of 4 A.

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0% found this document useful (0 votes)
21 views14 pages

STTH4R02 Diode 4A

The STTH4R02 is an ultrafast recovery diode designed for low voltage, high frequency applications, utilizing ST's 200 V planar Pt doping technology. It features negligible switching losses, high junction temperature, and low conduction losses, making it suitable for switching mode base drive and transistor circuits. The diode is available in DPAK, SMB, and SMC packages, with a maximum repetitive peak reverse voltage of 200 V and an average forward current of 4 A.

Uploaded by

yannsaussez9
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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STTH4R02

Ultrafast recovery diode

Datasheet  production data

Description
. $ The STTH4R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
$ $ switching mode base drive and transistor circuits.
Packaged in DPAK, SMB and SMC, this device is
. intended for use in low voltage, high frequency
60% . 60& inverters, freewheeling and polarity protection.

. Table 1. Device summary


.
Symbol Value

IF(AV) 4A
1& 1&
$ $
VRRM 200 V
'3$. VF (typ) 0.76 V
Tj (max) 175 °C
trr (typ) 16 ns
Features
 Negligible switching losses
 High junction temperature
 Very low conduction losses
 Low forward and reverse recovery times
 ECOPACK®2 compliant component for DPAK
on demand

November 2016 DocID12360 Rev 6 1/14


This is information on a product in full production. www.st.com 14
Characteristics STTH4R02

1 Characteristics

Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified)


Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 200 V


DPAK 10
IF(RMS) Forward rms current A
SMB / SMC 70

Average forward current, DPAK Tc = 160 °C


IF(AV) 4 A
δ = 0.5, square wave SMB / SMC TL = 95 °C
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 70 A
Tstg Storage temperature range -65 to +175 °C
Tj Maximum operating junction temperature 175 °C

Table 3. Thermal parameters


Symbol Parameter Max. value Unit

Rth(j-c) Junction to case DPAK 3.5


°C/W
Rth(j-l) Junction to lead SMB / SMC 20

Table 4. Static electrical characteristics


Symbol Parameter Test conditions Min. Typ. Max. Unit

Tj = 25 °C - 3
IR(1) Reverse leakage current VR = VRRM µA
Tj = 125 °C - 2 20
IF = 12 A - 1.15 1.25
Tj = 25 °C
(2)
VF Forward voltage drop - 0.95 1.05 V
IF = 4 A
Tj = 150 °C - 0.76 0.83
1. Pulse test: tp = 5 ms,  < 2%
2. Pulse test: tp = 380 µs,  < 2%

To evaluate the conduction losses, use the following equation:


P = 0.67 x IF(AV) + 0.04 x IF2(RMS)

2/14 DocID12360 Rev 6


STTH4R02 Characteristics

Table 5. Dynamic electrical characteristics


Symbol Parameter Tests conditions Min. Typ. Max. Unit

IF = 1 A
dIF/dt = -50 A/µs - 24 30
VR = 30 V
trr Reverse recovery time Tj = 25 °C ns
IF = 1 A
dIF/dt = -100 A/µs - 16 20
VR = 30 V
IF = 4 A
IRM Reverse recovery current Tj = 125 °C dIF/dt = -200 A/µs - 4.4 5.5 A
VR = 160 V
IF = 4 A
tfr Forward recovery time dIF/dt = 50 A/µs - 80 ns
Tj = 25 °C VFR = 1.1 x VFmax
IF = 4 A
VFP Forward recovery voltage - 1.6 V
dIF/dt = 50 A/µs

DocID12360 Rev 6 3/14


Characteristics STTH4R02

Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus forward
current (typical values)

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Figure 3. Forward voltage drop versus forward Figure 4. Relative variation of thermal
current (maximum values) impedance, junction to case, versus pulse
duration

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Figure 5. Relative variation of thermal Figure 6. Relative variation of thermal


impedance, junction to ambient, versus pulse impedance, junction to ambient, versus pulse
duration (SMB) duration (SMC)

=WK MD 5WK MD  =WK MD 5WK MD 


 
 60%  60&
 6&8 FPð  6&8 FPð
 
 
 
 
 
 
 W3 V  W3 V
 
( ( ( ( ( ( ( ( ( (

4/14 DocID12360 Rev 6


STTH4R02 Characteristics

Figure 7. Junction capacitance versus reverse Figure 8. Reverse recovery charges versus
applied voltage (typical values) dIF/dt (typical values)

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Figure 9. Reverse recovery time versus dIF/dt Figure 10. Peak reverse recovery current
(typical values) versus dIF/dt (typical values)

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Figure 11. Dynamic parameters versus junction Figure 12. Thermal resistance, junction to
temperature (reference: Tj = 125 °C) ambient, versus copper surface under each
lead

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) (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P '3$.
95 9  


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DocID12360 Rev 6 5/14


Characteristics STTH4R02

Figure 13. Thermal resistance, junction to Figure 14. Thermal resistance, junction to
ambient, versus copper surface under each ambient, versus copper surface under tab
lead

5WK MD ƒ&:  5WK MD ƒ&: 


 
 (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P 60% (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P 60&
 


 

 
 



 

 6 FPð  6 FPð
&8 &8
 
                     

6/14 DocID12360 Rev 6


STTH4R02 Package information

2 Package information

 Epoxy meets UL94,V0


 Cooling method: by conduction (C)
 Band indicates cathode
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

2.1 DPAK package information


Figure 15. DPAK package outline

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/ (

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+ 5

/

$
H E 5
H F

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/
/
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 SODQH

Note: This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.

DocID12360 Rev 6 7/14


Package information STTH4R02

Table 6. DPAK package mechanical data


Dimensions

Ref. Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 2.18 2.40 0.085 0.094


A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
b 0.64 0.90 0.025 0.035
b4 4.95 5.46 0.194 0.214
c 0.46 0.61 0.018 0.024
c2 0.46 0.60 0.018 0.023
D 5.97 6.22 0.235 0.244
D1 4.95 5.60 0.194 0.220
E 6.35 6.73 0.250 0.264
E1 4.32 5.50 0.170 0.216
e 2.28 0.090
e1 4.40 4.70 0.173 0.185
H 9.35 10.40 0.368 0.409
L 1.00 1.78 0.039 0.070
L2 1.27 0.050
L4 0.60 1.02 0.023 0.040
V2 -8° +8° -8° 8°

Figure 16. DPAK footprint dimensions (in mm)

  

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% 
7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ  $ %

8/14 DocID12360 Rev 6


STTH4R02 Package information

2.2 SMB package information


Figure 17. SMB package outline

(

'

$

F $
/ E

Table 7. SMB package mechanical data


Dimensions

Ref. Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096


A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059

DocID12360 Rev 6 9/14


Package information STTH4R02

Figure 18. SMB footprint, dimensions in mm (inches)







  


  

10/14 DocID12360 Rev 6


STTH4R02 Package information

2.3 SMC package information


Figure 19. SMC package outline

(

'

$

F $
( / E

DocID12360 Rev 6 11/14


Package information STTH4R02

Table 8. SMC package mechanical data


Dimensions

Ref. Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096


A2 0.05 0.20 0.002 0.008
(1)
b 2.90 3.20 0.114 0.126
c(1) 0.15 0.40 0.006 0.016
D 5.55 6.25 0.218 0.246
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
L 0.75 1.50 0.030 0.059
1. Dimensions b and c apply to plated leads

Figure 20. SMC footprint, dimensions in mm (inches)







  


  

12/14 DocID12360 Rev 6


STTH4R02 Ordering information

3 Ordering information

Table 9. Ordering information


Order code Marking Package Weight Base qty Delivery mode

STTH4R02B-TR STTH 4R02 DPAK 0.32 g 2500 Tape and reel


STTH4R02U 4R2U SMB 0.110 g 2500 Tape and reel
STTH4R02S 4R2S SMC 0.243 g 2500 Tape and reel

4 Revision history

Table 10. Document revision history


Date Revision Changes

03-May-2006 1 First issue.


10-Oct-2006 2 Added SMC package
Updated ECOPACK statement. Updated dimensions
13-Apr-2010 3
tables for SMB and SMC.
Separated junction to lead values from junction to case
01-Jul-2010 4
values in Table 3.
Removed TO-220AC, TO-220FPAC and DO-201AB
20-Nov-2014 5
package informations.
Updated DPAK package information and reformatted to
02-Nov-2016 6
current standard.

DocID12360 Rev 6 13/14


STTH4R02

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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
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acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2016 STMicroelectronics – All rights reserved

14/14 DocID12360 Rev 6

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