STTH4R02 Diode 4A
STTH4R02 Diode 4A
Description
. $ The STTH4R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
$ $ switching mode base drive and transistor circuits.
Packaged in DPAK, SMB and SMC, this device is
. intended for use in low voltage, high frequency
60% . 60& inverters, freewheeling and polarity protection.
IF(AV) 4A
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VRRM 200 V
'3$. VF (typ) 0.76 V
Tj (max) 175 °C
trr (typ) 16 ns
Features
Negligible switching losses
High junction temperature
Very low conduction losses
Low forward and reverse recovery times
ECOPACK®2 compliant component for DPAK
on demand
1 Characteristics
Tj = 25 °C - 3
IR(1) Reverse leakage current VR = VRRM µA
Tj = 125 °C - 2 20
IF = 12 A - 1.15 1.25
Tj = 25 °C
(2)
VF Forward voltage drop - 0.95 1.05 V
IF = 4 A
Tj = 150 °C - 0.76 0.83
1. Pulse test: tp = 5 ms, < 2%
2. Pulse test: tp = 380 µs, < 2%
IF = 1 A
dIF/dt = -50 A/µs - 24 30
VR = 30 V
trr Reverse recovery time Tj = 25 °C ns
IF = 1 A
dIF/dt = -100 A/µs - 16 20
VR = 30 V
IF = 4 A
IRM Reverse recovery current Tj = 125 °C dIF/dt = -200 A/µs - 4.4 5.5 A
VR = 160 V
IF = 4 A
tfr Forward recovery time dIF/dt = 50 A/µs - 80 ns
Tj = 25 °C VFR = 1.1 x VFmax
IF = 4 A
VFP Forward recovery voltage - 1.6 V
dIF/dt = 50 A/µs
Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus forward
current (typical values)
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Figure 3. Forward voltage drop versus forward Figure 4. Relative variation of thermal
current (maximum values) impedance, junction to case, versus pulse
duration
Figure 7. Junction capacitance versus reverse Figure 8. Reverse recovery charges versus
applied voltage (typical values) dIF/dt (typical values)
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Figure 9. Reverse recovery time versus dIF/dt Figure 10. Peak reverse recovery current
(typical values) versus dIF/dt (typical values)
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Figure 11. Dynamic parameters versus junction Figure 12. Thermal resistance, junction to
temperature (reference: Tj = 125 °C) ambient, versus copper surface under each
lead
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Figure 13. Thermal resistance, junction to Figure 14. Thermal resistance, junction to
ambient, versus copper surface under each ambient, versus copper surface under tab
lead
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2 Package information
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3 Ordering information
4 Revision history
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