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Qualcomm Interview

The document outlines a technical interview process that includes various topics such as FIFO, CMOS inverters, and digital design principles. It details specific questions asked during the interview, covering both theoretical concepts and practical applications. The interview also involves coding tasks and discussions about project experiences related to RISC-V and memory initialization.

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sanyam goel
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0% found this document useful (0 votes)
57 views7 pages

Qualcomm Interview

The document outlines a technical interview process that includes various topics such as FIFO, CMOS inverters, and digital design principles. It details specific questions asked during the interview, covering both theoretical concepts and practical applications. The interview also involves coding tasks and discussions about project experiences related to RISC-V and memory initialization.

Uploaded by

sanyam goel
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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2.

Technical Inte rvie w (approx 1 llour): 1 ''


• 1
~: Ask ed to intr odu ce my sel f and give a brie
11
f o.~ the p~ojects ,;:•entioned in the resume.
• Wa s asked ~o ~xplaln FIFO and wh at I
did In the project. Was also asked about
usage, apphcat,ons, advantage and disa its
dvantages. Asked about types of FIFO (shi
reg iste r, con cur ren t (sync and async) and ft
exclusive read/write).
iii. Wa s asked to explain the wor kin g of SYN
C and ASYNC FIFO in depth. Was also given
que stio n for calculating FIFO dep th. a
iv. Asked abo ut the wo rkin g of static CMOS
inverter in depth, different region, effect of
changing the sizes, and logical efforts.
v. Wa s asked abo ut the sho rt channel effects
and ways to reduce power in CMOS circuits.
Wa s del ibe rate ly asked abo ut Back Gate,
OIBL and GIDL. Was asked about GIDL point
and sub -thr esh old slope, and about oth
er devices which can reduce sub-threshold
slo pe (TFET, FinFET, FDSOI, etc).
vi. Dra w inv erte r using rati oed NMOS. was
asked to draw its VTC and advantage and
disadvantage ove r static CMOS logrc Ask
ed what will happen rf we size the NMOS and
wh at will happen if we increase/decreas
e the PUN resistor. and what will happen to

vii. ~:~~d about HI-Skew and Low-Skew circurts, their applications and VTC
of inverter for
bot h of these cases, and cha rgin g/ dischar
ging waveform for both.
- . T. · fa ro·e ct I did on RISC-V pipelrned processor.
-viii. Asked to g1\!P. an overview 0 . p J
RAM and ROM. Asked about the var,ous
ix. wa s as ked to wri te a ven log code Ior
me tho ds of initraliz1ng the memory use d th·s code (using initial block, Smemrea d.
,n '
and case statement).
d RTL vhile using case statement ar.J
X Asked abo ut the di frerent hardware mil e "' '
·11 happen ,f we remove dd, wlt conu ! , ' .
~ta tem ent . Nex t I wn~ a ~kcd about whi lt wi ' '

e and the n y,h~t v1III h,1ppen ,r we ~gain re mo \c any oth N cund1t.on f·o, . t", • •
ca~ • I ' I drd on SRAM
Mk Pd lO p1plar'1 thry:>rPIJ~,clt
I nf't hod , to iP\L llVl' lilt• \l'll' P I .,,. ' ,. ·'' ••
,,.
, 11 . r•l
A~~<·d <11Jout wtu p <1 , o <tt, 1,rm ,,nc ,
1
01) vtti.YeY~

C
1ft 10 "j g,.;"' e,yr\1
n~!)
I\ • ('

I
ii 11

(kfPe'ft.l)+ '1e.o·0 ()-')


Q\. r')(p lo.i( )
~• / 1 ,-,e,0k,,- J ,.,; ...
Ql . ~ CN\ O~ Q d(?.",ca. 0-< +~Al'\oloJ.'.f?

~3 - :r:p \/5 \J y!. ~'f°'{' ~ 1 'V'i0 JF5 r

Il
(i?'1. Dt'> JOi. t.. heQ.j , i'r-J C)'fOb l:zn1. tr) lee 'c«J <J..., c...,.·_-

[ ~r +: 1'~2c.1'.11,1t •. lTh.0.,-J .·(.-07,::1~fio'11 e,,_i, ••

I I I 1·
I 'ii) T..,_ ~,-.
111 .' .!J
}.i.,.) .. <>;

I' ... {
tt:: I

I
Round 1 : (45 m
inutes)
QI j"l\~'ttr(r,~j,()
f' .,Cl a°"rII-'ltf 111 \\111 i'lli1
Q1.. oJ! I l}/t>J ~\ 1:-wh• ;<,11i.11t·1•·•·••''' I

. (i) 1\L\\ 111 ,.J;V... t\Ot.<>


I Ii \1111 1 .J
t'.l!.. ,,, ,. ,,
·\\· ' •• ' • f)t.SiJ'
tit
•... d , ~ ; ~
() .1 ~ 1 --

k
,-!-o~ H,is.
I' I

oo~.:l f~1.-lem. T'r,u


!:..2.tf Ir ~ LJ~'

• r c ,J
W n tt e n T e s t+
ln te rv ie w l2 o r
m ore Rounds)
Round 1 : (45
minutes)
G j,.,J~a

9.:s,511
•IfI o·:..,kl-
,/
(_ 1 '

\ I
2. Round l (Digital): (45 minutes)
• What is Metastability? How to a~oid it?
• G" • •
1ven a two stage and three stage synchronizers, which one do you prefer
and why? .
, .I

• What happens to uninitialized flip-flops on a Si chip. Is the output Oor 1 or


any other? Why? • '
I
• Why do you choose 45nm ~ech·oode,lhari 65nm( My project is in 45nm tech
,I • .:. ·'·
node) I: • '
• What is the difference between institution 45nm tech node and 65nm tech
,,
node. 1
• Testing Basics - Which of the basic gahi~•can't be created using 2xl Mux
Assume complimentary inputs are 1~vailable to ~ou. Given an Nxl Mux, the m,nomurr-
• r1 ' '

number of 2x1 Muxes needed to 11i/plement 1t.


1

I I I I
1ouestions on project. i

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