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Unit1 Part 2

The document discusses stick diagrams as a method for representing topography and layer information in circuit design, highlighting their advantages and limitations. It outlines rules for drawing stick diagrams, including how to indicate electrical contacts and the proper use of demarcation lines in CMOS designs. Additionally, it covers layout design rules, lambda-based rules, and standard cell design methodologies to optimize circuit layout and reliability.

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Niju Rajan
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0% found this document useful (0 votes)
12 views6 pages

Unit1 Part 2

The document discusses stick diagrams as a method for representing topography and layer information in circuit design, highlighting their advantages and limitations. It outlines rules for drawing stick diagrams, including how to indicate electrical contacts and the proper use of demarcation lines in CMOS designs. Additionally, it covers layout design rules, lambda-based rules, and standard cell design methodologies to optimize circuit layout and reliability.

Uploaded by

Niju Rajan
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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07-02-2025

Stick Diagrams Contd............


• Stick diagrams are a means of capturing topography and layer information using ➢Does show
simple diagrams. • All components/vias.
• Stick diagrams convey layer information through color codes (or monochrome • relative placement of components.
encoding). ➢Does not show
• Acts as an interface between symbolic circuit and the actual layout. • Exact placement of components

• Transistor sizes

• Wire lengths, wire widths, tub boundaries.

• Any other low-level details such as parasitic

2/7/2025 EC3006-1_VLSI_NR 102 2/7/2025 EC3006-1_VLSI_NR 103

Stick Diagram Notations Stick Diagram Rules – 1


• Can define your own notation. No Rule as such • When two or more ‘sticks’ of the same type cross or touch each other that
represents electrical contact.

2/7/2025 EC3006-1_VLSI_NR 104 2/7/2025 EC3006-1_VLSI_NR 105

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07-02-2025

Stick Diagram Rules – 2 Stick Diagram Rules – 3


• When two or more ‘sticks’ of different type cross or touch each other there is no • When a poly crosses diffusion, it represents a transistor.
electrical contact.

• If a contact is shown then it is not a transistor


• If contact is needed we have to show explicitly

2/7/2025 EC3006-1_VLSI_NR 106 2/7/2025 EC3006-1_VLSI_NR 107

Stick Diagram Rules – 4 How to draw Stick Diagrams - 1


• In CMOS a demarcation line is drawn to avoid touching of p-diff with n-diff.
• Only Poly and Metal can go across the demarcation line.

2/7/2025 EC3006-1_VLSI_NR 108 2/7/2025 EC3006-1_VLSI_NR 109

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07-02-2025

How to draw Stick Diagrams - 2 How to draw Stick Diagrams - 3

2/7/2025 EC3006-1_VLSI_NR 110 2/7/2025 EC3006-1_VLSI_NR 111

Layout Design Rules Contd………..


• Layout design rules describe how small features can be and how closely they can be • Lambda-based rules are necessarily conservative because they round up
reliably packed in a particular manufacturing process. dimensions to an integer multiple of λ.
• Objective is to obtain a circuit with optimum yield in as small an area as possible without • Designers often describe a process by its feature size.
compromising reliability of a circuit
• Industrial design rules are usually specified in microns. • Feature size refers to minimum transistor length, so λ is half the feature size.
• This makes migrating from one process to a more advanced process or a different • MOSIS has developed a set of scalable lambda-based design rules that covers a
foundry’s process difficult because not all rules scale in the same way. wide range of manufacturing processes.
• Mead and Conway popularized scalable design rules based on a single parameter, λ, that • The rules describe the minimum width to avoid breaks in a line, minimum spacing
characterizes the resolution of the process.
to avoid shorts between lines, and minimum overlap to ensure that two layers
• λ is generally half of the minimum drawn transistor channel length. completely overlap.
• This length is the distance between the source and drain of a transistor and is set by the
minimum width of a polysilicon wire.
• For example, a 180 nm process has a minimum polysilicon width (and hence transistor
length) of 0.18 μ m and uses design rules with λ = 0.09μm.

2/7/2025 EC3006-1_VLSI_NR 112 2/7/2025 EC3006-1_VLSI_NR 113

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07-02-2025

Lambda(λ)- based Rules Simplified Lambda(λ)- based Rules

• Metal and diffusion have minimum width and spacing of 4λ


• Contacts are 2λ × 2λ and must be surrounded by 1λ on the layers above and below.

• Polysilicon uses a width of 2λ.


• Polysilicon overlaps diffusion by 2λ where a transistor is desired and has a spacing of
1λ away where no transistor is desired.
• Polysilicon and contacts have a spacing of 3λ from other polysilicon or contacts.
• N-well surrounds pMOS transistors by 6λ and avoids nMOS transistors by 6λ

2/7/2025 EC3006-1_VLSI_NR 114 2/7/2025 EC3006-1_VLSI_NR 115

Layout Contd........
➢Layout can be very time consuming

• Design gates to fit together nicely

• Build a library of standard cells

➢Standard cell design methodology


• VDD and GND should abut (standard height)

• Adjacent gates should satisfy design rules

• nMOS at bottom and pMOS at top


• All gates include well and substrate contacts

2/7/2025 EC3006-1_VLSI_NR 116 2/7/2025 EC3006-1_VLSI_NR 117

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07-02-2025

Layout Design Layout Design

2/7/2025 EC3006-1_VLSI_NR 118 2/7/2025 EC3006-1_VLSI_NR 119

Inverter Layout Contd.........

• The polysilicon gates of the nMOS


and the pMOS transistors are
usually aligned.
• The final step is the local
interconnections in metal, for the
output node and for the VDD and
GND contacts.
• In order to be biased properly, the
n-well region must also have a VDD
contact

2/7/2025 EC3006-1_VLSI_NR 120 2/7/2025 EC3006-1_VLSI_NR 121

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07-02-2025

Layout Example: NOR & NAND

2/7/2025 EC3006-1_VLSI_NR 122 2/7/2025 EC3006-1_VLSI_NR 123

3 input NAND gate and NOR gate

2/7/2025 EC3006-1_VLSI_NR 124 2/7/2025 EC3006-1_VLSI_NR 125

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