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SEMICONDUCTOR TECHNICAL DATA by MC145191/D

1.1 GHz PLL Frequency

Synthesizer MC145191
Includes On–Board 64/65 Prescaler
The MC145191 is a single–package synthesizer with serial interface capable
of direct usage up to 1.1 GHz. A special architecture makes this PLL very easy
to program because a byte–oriented format is utilized. Due to the patented
BitGrabber registers, no address/steering bits are required for random access F SUFFIX
of the three registers. Thus, tuning can be accomplished via a 3–byte serial 20 SOG PACKAGE
transfer to the 24–bit A register. The interface is both SPI and MICROWIRE CASE 751J
compatible. 1

The device features a single–ended current source/sink phase detector

output and a double–ended phase detector output. Both phase detectors have DT SUFFIX
ARCHIVE INFORMATION

ARCHIVE INFORMATION
linear transfer functions (no dead zones). The maximum current of the TSSOP
20
single–ended phase detector output is determined by an external resistor tied CASE 948D
from the Rx pin to ground. This current can be varied via the serial port. 1
The MC145191 has phase/frequency detectors optimized for single–sup-
ply systems of 5 V ± 10%.
The part includes a differential RF input which may be operated in a ORDERING INFORMATION
single–ended mode. Also featured are on–board support of an external crystal MC145191F SOG Package
and a programmable reference output. The R, A, and N counters are fully MC145191DT TSSOP
programmable. The C register (configuration register) allows the part to be
configured to meet various applications. A patented feature allows the C
register to shut off unused outputs, thereby minimizing system noise and
interference.
In order to have consistent lock times and prevent erroneous data from being
loaded into the counters, on–board circuitry synchronizes the update of the A PIN ASSIGNMENT
register if the A or N counters are loading. Similarly, an update of the R register
is synchronized if the R counter is loading. REFout 1 20 REFin
The double–buffered R register allows new divide ratios to be presented to
LD 2 19 Din
the three counters (R, A, and N) simultaneously.
φR
• Maximum Operating Frequency: 1100 MHz @ Vin = 200 mV p–p 3 18 CLK
• Operating Supply Current: 7 mA Nominal φV 4 17 ENB
• Operating Supply Voltage Range (VDD and VCC Pins): 4.5 to 5.5 V
VPD 5 16 OUTPUT A
• Operating Supply Voltage Range of Phase Detectors (VPD Pin):
4.5 to 5.5 V PDout 6 15 OUTPUT B
• Current Source/Sink Phase Detector OUTPUT Capability: 2 mA Maximum GND 7 14 VDD
• Gain of Current Source/Sink Phase/Frequency Detector Controllable via
Rx 8 13 TEST 2
Serial Port
• Operating Temperature Range: – 40 to + 85°C TEST 1 9 12 VCC
• R Counter Division Range: (1 and) 5 to 8191 10 11
fin fin
• Dual–Modulus Capability Provides Total Division up to 262,143
• High–Speed Serial Interface: 4 Mbps
• OUTPUT A Pin, When Configured as Data Out, Permits Cascading of Devices
• Two General–Purpose Digital Outputs — OUTPUT A: Totem–Pole (Push–Pull)
OUTPUT B: Open–Drain
• Patented Power–Saving Standby Feature with Orderly Recovery for
Minimizing Lock Times, Standby Current: 30 µA
• Evaluation Kit Available (Part Number MC145191EVK)
• See Application Note AN1253/D for Low–Pass Filter Design, and
AN1277/D for Offset Reference PLLs for Fine Resolution or Fast Hopping

NOT RECOMMENDED FOR NEW DESIGN

DEVICES TO BE PHASED OUT.
Consider MC145193 for New Designs.

BitGrabber is a trademark of Motorola Inc. MICROWIRE is a trademark of National Semiconductor Corp.

REV 1
12/99

MOTOROLA
Motorola, Inc. 1999WIRELESS SEMICONDUCTOR
MC145191
SOLUTIONS DEVICE DATA 1
 BLOCK DIAGRAM
DATA OUT
20 fR
REFin OSC OR 13–STAGE R COUNTER SELECT 16
4–STAGE PORT LOGIC
DIVIDER OUTPUT A
fV
1 (CONFIGURABLE)
REFout 3 13

DOUBLE–BUFFERED
BitGrabber R REGISTER
16 BITS LOCK DETECTOR 2
LD
AND CONTROL
18 8
CLK Rx
SHIFT
REGISTER
19 AND BitGrabber C REGISTER PHASE/FREQUENCY 6
Din PDout
CONTROL 8 BITS DETECTOR A AND CONTROL
24
LOGIC
ARCHIVE INFORMATION

ARCHIVE INFORMATION
STANDBY
POR
LOGIC
17 3
ENB PHASE/FREQUENCY φR
2 4
DETECTOR B AND CONTROL φV
BitGrabber A REGISTER
24 BITS

INTERNAL 6 12 15
CONTROL 4 OUTPUT B
6–STAGE 12–STAGE
(OPEN–DRAIN
A COUNTER N COUNTER
OUTPUT)

fin 11
INPUT 64/65 MODULUS
10 PRESCALER CONTROL 13
AMP TEST 2
fin LOGIC
SUPPLY CONNECTIONS:
9
PIN 12 = VCC (V+ TO INPUT AMP AND 64/65 PRESCALER) TEST 1
PIN 5 = VPD (V+ TO PHASE/FREQUENCY DETECTORS A AND B)
PIN 14 = VDD (V+ TO BALANCE OF CIRCUIT)
PIN 7 = GND (COMMON GROUND)

MAXIMUM RATINGS* (Voltages Referenced to GND, unless otherwise stated)

Symbol Parameter Value Unit This device contains protection circuitry to
guard against damage due to high static volt-
VCC, DC Supply Voltage (Pins 12 and 14) – 0.5 to + 6.0 V ages or electric fields. However, precautions
VDD must be taken to avoid applications of any volt-
VPD DC Supply Voltage (Pin 5) VDD – 0.5 to + 6.0 V age higher than maximum rated voltages to
this high–impedance circuit.

Vin DC Input Voltage – 0.5 to VDD + 0.5 V

Vout DC Output Voltage (except OUTPUT B, PDout, – 0.5 to VDD + 0.5 V
φR, φV)
Vout DC Output Voltage (OUTPUT B, PDout, φR, φV) – 0.5 to VPD + 0.5 V
Iin, IPD DC Input Current, per Pin (Includes VPD) ± 10 mA
Iout DC Output Current, per Pin ± 20 mA
IDD DC Supply Current, VDD and GND Pins ± 30 mA
PD Power Dissipation, per Package 300 mW
Tstg Storage Temperature – 65 to + 150 °C
TL Lead Temperature, 1 mm from Case for 260 °C
10 seconds
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics tables
or Pin Descriptions section.

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

2 SOLUTIONS DEVICE DATA
 ELECTRICAL CHARACTERISTICS
(VDD = VCC = 4.5 to 5.5 V, Voltages Referenced to GND, TA = – 40 to + 85°C, unless otherwise stated;
VPD = 4.5 to 5.5 V with VDD ≤ VPD.)
Guaranteed
Symbol Parameter Test Condition Limit Unit
VIL Maximum Low–Level Input Voltage Device in Reference Mode, dc Coupled 0.3 × VDD V
(Din, CLK, ENB, REFin)
VIH Minimum High–Level Input Voltage Device in Reference Mode, dc Coupled 0.7 × VDD V
(Din, CLK, ENB, REFin)
Vhys Minimum Hysteresis Voltage (CLK, ENB) 300 mV
VOL Maximum Low–Level Output Voltage Iout = 20 µA, Device in Reference Mode 0.1 V
(REFout, OUTPUT A)
VOH Minimum High–Level Output Voltage Iout = –20 µA, Device in Reference Mode VDD – 0.1 V
(REFout, OUTPUT A)
ARCHIVE INFORMATION

IOL Minimum Low–Level Output Current Vout = 0.4 V 0.36 mA

ARCHIVE INFORMATION
(REFout, LD, φR, φV)
IOH Minimum High–Level Output Current Vout = VDD – 0.4 V for REFout, LD – 0.36 mA
(REFout, LD, φR, φV) Vout = VPD – 0.4 V for φR, φV
IOL Minimum Low–Level Output Current Vout = 0.4 V 1.0 mA
(OUTPUT A, OUTPUT B)
IOH Minimum High–Level Output Current Vout = VDD – 0.4 V – 0.6 mA
(OUTPUT A, Only)
Iin Maximum Input Leakage Current Vin = VDD or GND, Device in XTAL Mode ± 1.0 µA
(Din, CLK, ENB, REFin)
Iin Maximum Input Current Vin = VDD or GND, Device in Reference Mode ± 150 µA
(REFin)
IOZ Maximum Output Leakage Current (PDout) Vout = VPD – 0.5 V or 0.5 V, ± 200 nA
Output in High–Impedance State
IOZ Maximum Output Leakage Current Vout = VPD or GND, ± 10 µA
(OUTPUT B) Output in High–Impedance State
ISTBY Maximum Standby Supply Current Vin = VDD or GND; Outputs Open; Device in Standby 30 µA
(VDD + VPD Pins) Mode, Shut–Down Crystal Mode or REFout–Static–Low
Reference Mode; OUTPUT B Controlling VCC per
Figure 22
IPD Maximum Phase Detector Bit C6 = High Which Selects Phase Detector A, 600 µA
Quiescent Current (VPD Pin) PDout = Open, PDout = Static Low or High, Bit C4 = Low
Which is not Standby, IRx = 113 µA
Bit C6 = Low Which Selects Phase Detector B, φR and 30
φV = Open, φR and φV = Static Low or High, Bit
C4 = Low Which is not Standby
IT Total Operating Supply Current fin = 1.1 GHz; REFin = 13 MHz @ 1 V p–p; * mA
(VDD + VPD + VCC Pins) OUTPUT A = Inactive and No Connect;
REFout ÷ 8; φV, φR, PDout, LD = No Connect;
Din, ENB, CLK = VDD or GND, Phase Detector B Selected
(Bit C6 = Low)
* The nominal value = 7 mA. This is not a guaranteed limit.

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 3
 ANALOG CHARACTERISTICS—CURRENT SOURCE/SINK OUTPUT—PDout
(Iout ≤ 2 mA, VDD = VCC = 4.5 to 5.5 V, VDD ≤ VPD. Voltages Referenced to GND)
Guaranteed
Parameter Test Condition VPD Limit Unit
Maximum Source Current Variation (Part–to–Part) Vout = 0.5 × VPD 4.5 ± 20 %
5.5 ± 20
Maximum Sink–vs–Source Mismatch (Note 3) Vout = 0.5 × VPD 4.5 12 %
5.5 12
Output Voltage Range (Note 3) Iout Variation ≤ 20% 4.5 0.5 to 4.0 V
5.5 0.5 to 5.0
NOTES:
1. Percentages calculated using the following formula: (Maximum Value – Minimum Value) / Maximum Value.
2. See Rx Pin Description for external resistor values.
3. This parameter is guaranteed for a given temperature within – 40° to + 85°C.
ARCHIVE INFORMATION

ARCHIVE INFORMATION
AC INTERFACE CHARACTERISTICS (VDD = 4.5 to 5.5 V, TA = – 40 to + 85°C, CL = 50 pF, Input tr = tf = 10 ns;
VPD = 4.5 to 5.5 V with VDD ≤ VPD)
Figure Guaranteed
Symbol Parameter No. Limit Unit
fclk Serial Data Clock Frequency (Note: Refer to Clock tw below) 1 dc to 4.0 MHz
tPLH, tPHL Maximum Propagation Delay, CLK to OUTPUT A (Selected as Data Out) 1, 5 105 ns
tPLH, tPHL Maximum Propagation Delay, ENB to OUTPUT A (Selected as Port) 2, 5 100 ns
tPZL, tPLZ Maximum Propagation Delay, ENB to OUTPUT B 2, 6 120 ns
tTLH, tTHL Maximum Output Transition Time, OUTPUT A and OUTPUT B; 1, 5, 6 100 ns
tTHLONLY, on OUTPUT B
Cin Maximum Input Capacitance – Din, ENB, CLK 10 pF

TIMING REQUIREMENTS
(VDD = VCC = 4.5 to 5.5 V, TA = – 40 to + 85°C, Input tr = tf = 10 ns unless otherwise indicated)
Figure Guaranteed
Symbol Parameter No. Limit Unit
tsu, th Minimum Setup and Hold Times, Din vs CLK 3 20 ns
tsu, th, trec Minimum Setup, Hold and Recovery Times, ENB vs CLK 4 100 ns
tw Minimum Pulse Width, ENB 4 * cycles
tw Minimum Pulse Width, CLK 1 125 ns
tr, tf Maximum Input Rise and Fall Times – CLK 1 100 µs
* The minimum limit is 3 REFin cycles or 195 fin cycles, whichever is greater.

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

4 SOLUTIONS DEVICE DATA
 SWITCHING WAVEFORMS

tf tr
VDD
90% VDD
50%
CLK 50% ENB
GND GND
10%
tw tw tPLH tPHL

1/fclk OUTPUT A 50%

tPLH tPHL
90% tPLZ tPZL
OUTPUT A 50%
(DATA OUT) 10%
OUTPUT B 50%
10%
tTLH tTHL

Figure 1. Figure 2.
ARCHIVE INFORMATION

ARCHIVE INFORMATION
tw tw
VALID
VDD
VDD
ENB 50%
Din 50%
GND GND
tsu th
tsu th trec
VDD VDD
CLK 50%
CLK 50%
GND
FIRST LAST GND
CLK CLK

Figure 3. Figure 4.

V+
TEST POINT TEST POINT
7.5 kΩ

DEVICE DEVICE
UNDER CL *
UNDER CL *
TEST TEST

*Includes all probe and fixture capacitance. *Includes all probe and fixture capacitance.

Figure 5. Test Circuit Figure 6. Test Circuit

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 5
 LOOP SPECIFICATIONS (VDD = VCC = 4.5 to 5.5 V unless otherwise indicated, TA = – 40 to + 85°C)
Guaranteed
Operating Range
Figure
Symbol Parameter Test Condition No. Min Max Unit
Vin Input Voltage Range, fin 100 MHz ≤ fin < 250 MHz 7 400 1500 mV p–p
250 MHz ≤ fin ≤ 1100 MHz 200 1500
fref Input Frequency Range, REFin Vin ≥ 400 mV p–p 8 12 27 MHz
Externally Driven in Vin ≥ 1 V p–p 4.5* 27
Reference Mode
fXTAL Crystal Frequency, Crystal Mode C1 ≤ 30 pF, C2 ≤ 30 pF, Includes 9 2 15 MHz
Stray Capacitance
fout Output Frequency, REFout CL = 30 pF 10, 12 dc 10 MHz
f Operating Frequency of the Phase Detectors dc 2 MHz
tw Output Pulse Width, φR, φV, LD fR in Phase with fV, CL = 50 pF, 11, 12 17 85 ns
ARCHIVE INFORMATION

ARCHIVE INFORMATION
VPD = 5.5 V, VDD = VCC = 5.0 V
tTLH, Output Transition Times, LD, φV, φR CL = 50 pF, VPD = 5.5 V, 11, 12 — 65 ns
tTHL VDD = VCC = 5.0 V
Cin Input Capacitance, REFin — 5 pF
*If lower frequency is desired, use wave shaping or higher amplitude sinusoidal signal.

1000 pF TEST 0.01 µF

SINE WAVE fin OUTPUT A SINE WAVE TEST
GENERATOR POINT REFin OUTPUT A
(fv) GENERATOR POINT
DEVICE DEVICE (fR)
1000 pF UNDER
Vin UNDER
fin Vin
50 Ω* TEST TEST
50 Ω TEST
VCC GND VDD REFout
POINT
VCC GND VDD
V+
V+
*Characteristic Impedance

Figure 7. Test Circuit Figure 8. Test Circuit — Reference Mode

TEST
REFin OUTPUT A POINT
C1 DEVICE (fR)
UNDER
TEST
REFout
1/f REFout
C2 VCC GND VDD
V+ REFout 50%

Figure 9. Test Circuit — Crystal Mode Figure 10. Switching Waveform

TEST POINT

tw DEVICE
90% UNDER CL *
OUTPUT 50% 10% TEST
*Includes all probe and
tTHL tTLH
fixture capacitance.

Figure 11. Switching Waveform Figure 12. Test Circuit

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

6 SOLUTIONS DEVICE DATA
 NORMALIZED INPUT IMPEDANCE AT fin — SERIES FORMAT (R + jX)
(100 MHz to 1.1 GHz)

fin (PIN 11)

SOG PACKAGE

1
ARCHIVE INFORMATION

ARCHIVE INFORMATION
2

Frequency Resistance Capacitive Capacitance

Marker (MHz) (Ω) Reactance (Ω) (pF)
1 100 338 – 785 2.03
2 500 20.2 – 183 1.74
3 800 11.5 – 109 1.83
4 1100 8.2 – 70.2 2.06

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 7
 RETURN LOSS AT fin

0 dB
1
2 3
4

– 5 dB
ARCHIVE INFORMATION

ARCHIVE INFORMATION
– 10 dB
START 50 MHz STOP 1500 MHz

STANDING WAVE RATIO AT fin

51

26

1
START 50 MHz STOP 1500 MHz

Frequency Return Loss

Marker (MHz) SWR (dB)
1 100 43.7 0.40
2 500 34.7 0.48
3 800 25.3 0.68
4 1100 17.9 0.98

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

8 SOLUTIONS DEVICE DATA
 PIN DESCRIPTIONS The 24–1/2–stage shift register is static, allowing clock
rates down to dc in a continuous or intermittent mode.
DIGITAL INTERFACE PINS Eight clock cycles are required to access the C register.
Sixteen clock cycles are needed for the first buffer of the R
Din register. Twenty–four cycles are used to access the A regis-
Serial Data Input (Pin 19) ter. See Table 1 and Figures 15, 16, and 17. The number of
clocks required for cascaded devices is shown in Figures 24
The bit stream begins with the most significant bit (MSB)
through 26.
and is shifted in on the low–to–high transition of CLK. The bit
CLK typically switches near 50% of V DD and has a
pattern is 1 byte (8 bits) long to access the C or configuration
Schmitt–triggered input buffer. Slow CLK rise and fall times
register, 2 bytes (16 bits) to access the first buffer of the R
are allowed. See the last paragraph of Din for more informa-
register, or 3 bytes (24 bits) to access the A register (see
tion.
Table 1). The values in the C, R, and A registers do not
change during shifting because the transfer of data to the NOTE
registers is controlled by ENB. To guarantee proper operation of the power–on
reset (POR) circuit, the CLK pin must be held at
CAUTION GND (with ENB being a don’t care) or ENB must
The value programmed for the N–counter must be be held at the potential of the V+ pin (with CLK be-
ARCHIVE INFORMATION

ARCHIVE INFORMATION
greater than or equal to the value of the A–counter. ing a don’t care) during power–up. As an alterna-
The 13 least significant bits (LSBs) of the R register are tive, the bit sequence of Figure 13 may be used.
double–buffered. As indicated above, data is latched into the ENB
first buffer on a 16–bit transfer. (The 3 MSBs are not double– Active Low Enable Input (Pin 17)
buffered and have an immediate effect after a 16–bit trans-
This pin is used to activate the serial interface to allow the
fer.) The second buffer of the R register contains the 13 bits
transfer of data to/from the device. When ENB is in an inac-
for the R counter. This second buffer is loaded with the con-
tive high state, shifting is inhibited and the port is held in the
tents of the first buffer when the A register is loaded (a 24–bit
initialized state. To transfer data to the device, ENB (which
transfer). This allows presenting new values to the R, A, and
must start inactive high) is taken low, a serial transfer is
N counters simultaneously. If this is not required, then the
made via Din and CLK, and ENB is taken back high. The
16–bit transfer may be followed by pulsing ENB low with no
low–to–high transition on ENB transfers data to the C or A
signal on the CLK pin. This is an alternate method of
registers and first buffer of the R register, depending on the
transferring data to the second buffer of the R register (see
data stream length per Table 1.
Figure 17).
The bit stream needs neither address nor steering bits due NOTE
to the innovative BitGrabber registers. Therefore, all bits in Transitions on ENB must not be attempted while
the stream are available to be data for the three registers. CLK is high. This puts the device out of synchro-
Random access of any register is provided. That is, the reg- nization with the microcontroller. Resynchro-
isters may be accessed in any sequence. Data is retained in nization occurs whenever ENB is high and CLK is
the registers over a supply range of 4.5 to 5.5 V. The formats low.
are shown in Figures 15, 16, and 17. This input is also Schmitt–triggered and switches near
Din typically switches near 50% of VDD to maximize noise 50% of VDD, thereby minimizing the chance of loading erro-
immunity. This input can be directly interfaced to CMOS de- neous data into the registers. See the last paragraph of Din
vices with outputs guaranteed to switch near rail–to–rail. for more information.
When interfacing to NMOS or TTL devices, either a level For POR information, see the note for the CLK pin.
shifter (MC74HC14A, MC14504B) or pull–up resistor of 1 kΩ
to 10 kΩ must be used. Parameters to consider when sizing OUTPUT A
the resistor are worst–case IOL of the driving device, maxi- Configurable Digital Output (Pin 16)
mum tolerable power consumption, and maximum data rate. OUTPUT A is selectable as f R , f V, Data Out, or Port.
Bits A22 and A23 in the A register control the selection;
Table 1. Register Access
see Figure 16.
(MSBs are shifted in first; C0, R0, and A0 are the LSBs)
If A23 = A22 = high, OUTPUT A is configured as
Number Accessed Bit f R . This signal is the buffered output of the 13–stage R
of Clocks Register Nomenclature counter. The f R signal appears as normally low and
8 C Register C7, C6, C5, . . ., C0 pulses high, and can be used to verify the divide ratio of
16 R Register R15, R14, R13, . . ., R0 the R counter. This ratio extends from 5 to 8191 and is
24 A Register A23, A22, A21, . . ., A0 determined by the binary value loaded into bits R0–R12
Other Values ≤ 32 See Figure 13 in the R register. Also, direct access to the phase detec-
Values > 32 See Figures tors via the REF in pin is allowed by choosing a divide
22 – 25 value of 1 (see Figure 17). The maximum frequency at
which the phase detectors operate is 2 MHz. Therefore,
CLK the frequency of f R should not exceed 2 MHz.
Serial Data Clock Input (Pin 18) If A23 = high and A22 = low, OUTPUT A is configured as
Low–to–high transitions on CLK shift bits available at fV. This signal is the buffered output of the 12–stage N
the Din pin, while high–to–low transitions shift bits from counter. The fV signal appears as normally low and pulses
OUTPUT A (when configured as Data Out, see Pin 16). high, and can be used to verify the operation of the prescaler,

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 9
 A counter, and N counter. The divide ratio between the fin in- listed in the Electrical Characteristics table may be directly
put and the fV signal is N × 64 + A. N is the divide ratio of the coupled to the pin. If the signal is less than this level, ac cou-
N counter and A is the divide ratio of the A counter. These pling must be used as shown in Figure 8. Due to an on–
ratios are determined by bits loaded into the A register. See board resistor which is engaged in the reference modes, an
Figure 16. The maximum frequency at which the phase external biasing resistor tied between REFin and REFout is
detectors operate is 2 MHz. Therefore, the frequency of fV not required.
should not exceed 2 MHz. With the reference mode, the REFout pin is configured as
If A23 = low and A22 = high, OUTPUT A is configured as the output of a divider. As an example, if bits R15, R14, and
Data Out. This signal is the serial output of the 24–1/2–stage R13 have an octal value of seven, the frequency at REFout is
shift register. The bit stream is shifted out on the high–to–low the REFin frequency divided by 16. In addition, Figure 17
transition of the CLK input. Upon power up, OUTPUT A is shows how to obtain ratios of eight, four, and two. A ratio of
automatically configured as Data Out to facilitate cascading one–to–one can be obtained with an octal value of three.
devices. Upon power up, a ratio of eight is automatically initialized.
If A23 = A22 = low, OUTPUT A is configured as Port. This The maximum frequency capability of the REFout pin is
signal is a general–purpose digital output which may be used 10 MHz. Therefore, for REFin frequencies above 10 MHz,
as an MCU port expander. This signal is low when the Port the one–to–one ratio may not be used. Likewise, for REFin
bit (C1) of the C register is low, and high when the Port bit is frequencies above 20 MHz, the ratio must be more than two.
ARCHIVE INFORMATION

ARCHIVE INFORMATION
high. If REFout is unused, an octal value of two should be used
for R15, R14, and R13 and the REFout pin should be floated.
OUTPUT B
A value of two allows REFin to be functional while disabling
Open–Drain Digital Output (Pin 15)
REFout, which minimizes dynamic power consumption and
This signal is a general–purpose digital output which electromagnetic interference (EMI).
may be used as an MCU port expander. This signal is low
when the Out B bit (C0) of the C register is low. When the LOOP PINS
Out B bit is high, OUTPUT B assumes the high–imped- fin and fin
ance state. OUTPUT B may be pulled up through an Frequency Inputs (Pins 11 and 10)
external resistor or active circuitry to any voltage less
These pins are frequency inputs from the VCO. These pins
than or equal to the potential of the V PD pin. Note: the
feed the on–board RF amplifier which drives the 64/65 pres-
maximum voltage allowed on the V PD pin is 5.5 V for the
caler. These inputs may be fed differentially. However, they
MC145191.
usually are used in a single–ended configuration (shown in
Upon power–up, power–on reset circuitry forces OUTPUT
Figure 7). Note that fin is driven while fin must be tied to
B to a low level.
ground via a capacitor.
REFERENCE PINS Motorola does not recommend driving fin while terminating
fin because this configuration is not tested for sensitivity. The
REFin and REFout
sensitivity is dependent on the frequency as shown in the
Reference Input and Reference Output (Pins 20 and 1)
Loop Specifications table.
Configurable pins for a Crystal or an External Reference.
This pair of pins can be configured in one of two modes: the PDout
crystal mode or the reference mode. Bits R13, R14, and R15 Single–Ended Phase/Frequency Detector Output (Pin 6)
in the R register control the modes as shown in Figure 17. This is a three–state current–source/sink output for use as
In crystal mode, these pins form a reference oscillator a loop error signal when combined with an external low–pass
when connected to terminals of an external parallel–reso- filter. The phase/frequency detector is characterized by a lin-
nant crystal. Frequency–setting capacitors of appropriate ear transfer function (no dead zone). The operation of the
values as recommended by the crystal supplier are con- phase/frequency detector is described below and is shown in
nected from each of the two pins to ground (up to a maximum Figure 18.
of 30 pF each, including stray capacitance). An external re- POL bit (C7) in the C register = low (see Figure 15)
sistor of 1 MΩ to 15 MΩ is connected directly across the pins Frequency of fV > fR or Phase of fV Leading fR: current–
to ensure linear operation of the amplifier. The device is de- sinking pulses from a floating state
signed to operate with crystals up to 15 MHz; the required Frequency of fV < fR or Phase of fV Lagging fR: current–
connections are shown in Figure 9. To turn on the oscillator, sourcing pulses from a floating state
bits R15, R14, and R13 must have an octal value of one (001 Frequency and Phase of fV = fR: essentially a floating
in binary, respectively). This is the active–crystal mode state; voltage at pin determined by loop filter
shown in Figure 17. In this mode, the crystal oscillator runs POL bit (C7) = high
and the R Counter divides the crystal frequency, unless the Frequency of fV > fR or Phase of fV Leading fR: current–
part is in standby. If the part is placed in standby via the C sourcing pulses from a floating state
register, the oscillator runs, but the R counter is stopped. Frequency of fV < fR or Phase of fV Lagging fR: current–
However, if bits R15 to R13 have a value of 0, the oscillator is sinking pulses from a floating state
stopped, which saves additional power. This is the shut– Frequency and Phase of fV = fR: essentially a floating
down crystal mode (shown in Figure 17) and can be engaged state; voltage at pin determined by loop filter
whether in standby or not. This output can be enabled, disabled, and inverted via the
In the reference mode, REFin (Pin 20) accepts a signal up C register. If desired, PDout can be forced to the floating state
to 27 MHz from an external reference oscillator, such as a by utilization of the disable feature in the C register (bit C6).
TCXO. A signal swinging from at least the VIL to VIH levels This is a patented feature. Similarly, PDout is forced to the

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

10 SOLUTIONS DEVICE DATA
 floating state when the device is put into standby (STBY bit TEST POINT PINS
C4 = high). TEST 1
The PD out circuit is powered by V PD . The phase detec- Modulus Control Signal (Pin 9)
tor gain is controllable by bits C3, C2, and C1: gain (in
amps per radian) = PD out current divided by 2π. This pin may be used in conjunction with the Test 2 pin for
φR and φV (Pins 3 and 4) access to the on–board 64/65 prescaler. When Test 1 is low,
Double–Ended Phase/Frequency Detector Outputs the prescaler divides by 65. When high, the prescaler divides
by 64.
These outputs can be combined externally to generate
a loop error signal. Through use of a Motorola patented CAUTION
technique, the detector’s dead zone has been eliminated. This pin is an unbuffered output and must be
Therefore, the phase/frequency detector is characterized floated in an actual application. This pin must be
by a linear transfer function. The operation of the phase/ attached to an isolated pad with no trace.
frequency detector is described below and is shown in
Figure 18. TEST 2
POL bit (C7) in the C register = low (see Figure 15) Prescaler Output (Pin 13)
Frequency of fV > fR or Phase of fV Leading fR: φV = nega-
This pin may be used to access to the on–board 64/65
tive pulses, φR = essentially high
prescaler output.
ARCHIVE INFORMATION

ARCHIVE INFORMATION
Frequency of fV < fR or Phase of fV Lagging fR: φV = essen-
tially high, φR = negative pulses CAUTION
Frequency and Phase of fV = fR: φV and φR remain essen- This pin is an unbuffered output and must be
tially high, except for a small minimum time period when floated in an actual application. This pin must be
both pulse low in phase attached to an isolated pad with no trace.
POL bit (C7) = high
Frequency of fV > fR or Phase of fV Leading fR: φR = nega- POWER SUPPLY PINS
tive pulses, φV = essentially high
Frequency of fV < fR or Phase of fV Lagging fR: φR = essen- VDD
tially high, φV = negative pulses Positive Power Supply (Pin 14)
Frequency and Phase of fV = fR: φV and φR remain essen- This pin supplies power to the main CMOS digital por-
tially high, except for a small minimum time period when tion of the device. The voltage range is + 4.5 to + 5.5 V
both pulse low in phase with respect to the GND pin.
These outputs can be enabled, disabled, and inter- For optimum performance, V DD should be bypassed to
changed via C register bits C6 or C4. This is a patented fea- GND using a low–inductance capacitor mounted very
ture. Note that when disabled or in standby, φR and φV are close to these pins. Lead lengths on the capacitor should
forced to their rest condition (high state). be minimized.
The φR and φV output signal swing is approximately from
GND to VPD. VCC
LD Positive Power Supply (Pin 12)
Lock Detector Output (Pin 2) This pin supplies power to the RF amp and 64/65 pre-
This output is essentially at a high level with narrow scaler. The voltage range is + 4.5 to + 5.5 V with respect to
low–going pulses when the loop is locked (fR and f V of the the GND pin. In the standby mode, the VCC pin still draws a
same phase and frequency). The output pulses low when few milliamps from the power supply. This current drain can
f V and f R are out of phase or different frequencies. LD is be eliminated with the use of transistor Q1 as shown in
the logical ANDing of φ R and φ V (see Figure 18). Figure 22.
This output can be enabled and disabled via the C register. For optimum performance, VCC should be bypassed to
This is a patented feature. Upon power up, on–chip initializa- GND using a low–inductance capacitor mounted very close
tion circuitry disables LD to a static low logic level to prevent to these pins. Lead lengths on the capacitor should be
a false “lock” signal. If unused, LD should be disabled and minimized.
left open.
The LD output signal swing is approximately from GND to VPD
VDD. Positive Power Supply (Pin 5)
Rx This pin supplies power to both phase/frequency detectors
External Resistor (Pin 8) A and B. The voltage applied on this pin must be no less than
A resistor tied between this pin and GND, in conjunction the potential applied to the VDD pin. The maximum voltage
with bits in the C register, determines the amount of current can be + 5.5 V with respect to the GND pin.
that the PDout pin sinks and sources. When bits C2 and C3 For optimum performance, VPD should be bypassed to
are both set high, the maximum current is obtained at PDout; GND using a low–inductance capacitor mounted very close
see Tables 2 and 3 for other values of current. To achieve a to these pins. Lead lengths on the capacitor should be
maximum current of 2 mA, the resistor should be about 18 minimized.
kΩ when VPD is 5.0 V. See Figure 14 if lower maximum cur-
rent values are desired. GND
When the φR and φV outputs are used, the Rx pin may be Ground (Pin 7)
floated. Common ground.

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 11
 100 ns MINIMUM

ENB

CLK
1 2 3 4 5 1 2 3 4 5 1 2 3 4 5

Din

NOTE: It may not be convenient to control the ENB or CLK pins during power up per the Pin Descriptions. If this is the case, the part may
ARCHIVE INFORMATION

ARCHIVE INFORMATION
be initialized through the serial port as shown in the figure above. The sequence is similar to accessing the registers except that the
CLK must remain high at least 100 ns after ENB is brought high. Note that 3 groups of 5 bits are needed.

Figure 13. Initializing the PLL through the Serial Port

Nominal PDout Spurious Current vs fR Frequency

(1 V PDout t
VPD – 1 V) t
fR Current
(kHz) (RMS nA)
10 3.6
20 4.6
50 17
100 75
200 244

NOTE: For information on spurious current measurement see AN1253/D,

“An Improved PLL Design Method Without ωn and ζ”.

Table 2. PDout Current, C1 = Low with OUTPUT A NOT Table 3. PDout Current, C1 = High with OUTPUT A NOT
Selected as “Port”; Also, Default Mode When Selected as “Port”
OUTPUT A Selected as “Port”
C3 C2 PDout Current C3 C2 PDout Current

0 0 70% 0 0 25%

0 1 80% 0 1 50%

1 0 90% 1 0 75%

1 1 100% 1 1 100%

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

12 SOLUTIONS DEVICE DATA
 100

90
PDout CURRENT SET TO 100%;
PDout VOLTAGE IS FORCED TO ONE–HALF OF VPD.
80

70
Rx, EXTERNAL RESISTOR (kΩ )

60

50

40

30
ARCHIVE INFORMATION

ARCHIVE INFORMATION
20
VPD = 5.5 V
VPD = 5.0 V
10 VPD = 4.5 V

0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3
Iout, SOURCE CURRENT (mA)

Nominal MC145191 PDout Source Current vs Rx Resistance

NOTE: The MC145191 is optimized for Rx values in the 18 kΩ to 40 kΩ range. For example, to achieve 0.3 mA of output current,
it is preferable to use a 30–kΩ resistor for Rx and bit settings for 25% (as shown in Table 3).

Figure 14.

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 13
 ENB

CLK 1 2 3 4 5 6 7 8 *

MSB LSB

Din C7 C6 C5 C4 C3 C2 C1 C0

* At this point, the new byte is transferred to the C register and stored. No other registers are
affected.

C7 — POL: Selects the output polarity of the phase/frequency detectors. When set high, this bit inverts the polarity
of PDout and interchanges the φR function with φV as depicted in Figure 18. Also see the phase detector
output pin descriptions for more information. This bit is cleared low at power up.
C6 — PDA/B: Selects which phase/frequency detector is to be used. When set high, enables the output of phase/
ARCHIVE INFORMATION

ARCHIVE INFORMATION
frequency detector A (PDout) and disables phase/frequency detector B by forcing φR and φV to the
static high state. When cleared low, phase/frequency detector B is enabled (φR and φV) and phase/
frequency detector A is disabled with PDout forced to the high–impedance state. This bit is cleared
low at power up.
C5 — LDE: Enables the lock detector output (LD) when set high. When the bit is cleared low, the LD output
is forced to a static low level. This bit is cleared low at power up.
C4 — STBY: When set high, places the CMOS section of device, which is powered by the VDD and VPD pins,
in the standby mode for reduced power consumption: PDout is forced to the high–impedance state,
φR and φV are forced high, the A, N, and R counters are inhibited from counting, and the Rx current
is shut off. In standby, the state of LD is determined by bit C5. C5 low forces LD low (no change).
C5 high forces LD static high. During standby, data is retained in the A, R, and C registers. The
condition of REF/OSC circuitry is determined by the control bits in the R register: R13, R14, and
R15. However, if REFout = static low is selected, the internal feedback resistor is disconnected and
the input is inhibited when in standby; in addition, the REFin input only presents a capacitive load.
NOTE: Standby does not affect the other modes of the REF/OSC circuitry.
When C4 is reset low, the part is taken out of standby in 2 steps. First, the REFin (only in one mode)
resistor is reconnected, all counters are enabled, and the Rx current is enabled. Any fR and fV signals
are inhibited from toggling the phase/frequency detectors and lock detector. Second, when the first
fV pulse occurs, the R counter is jam loaded, and the phase/frequency and lock detectors are
initialized. Immediately after the jam load, the A, N, and R counters begin counting down together.
At this point, the fR and fV pulses are enabled to the phase and lock detectors. (Patented feature.)
C3, C2 — I2, I1: Controls the PDout source/sink current per Tables 2 and 3. With both bits high, the maximum current
(as set by Rx per Figure 14) is available. Also, see C1 bit description.
C1 — Port: When the OUTPUT A pin is selected as “Port” via bits A22 and A23, C1 determines the state of
OUTPUT A. When C1 is set high, OUTPUT A is forced high; C1 low forces OUTPUT A low. When
OUTPUT A is NOT selected as “Port,” C1 controls whether the PDout step size is 10% or 25%. (See
Tables 2 and 3.) When low, steps are 10%. When high, steps are 25%. Default is 10% steps when
OUTPUT A is selected as “Port.” The Port bit is not affected by the standby mode.
C0 — Out B: Determines the state of OUTPUT B. When C0 is set high, OUTPUT B is high–impedance; C0 low
forces OUTPUT B low. The Out B bit is not affected by the standby mode. This bit is cleared low
at power up.

Figure 15. C Register Access and Format (8 Clock Cycles are Used)

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

14 SOLUTIONS DEVICE DATA
 ARCHIVE INFORMATION
SOLUTIONS DEVICE DATA
MOTOROLA WIRELESS SEMICONDUCTOR

ENB

NOTE 3

CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Figure 16. A Register Access and Format (24 Clock Cycles are Used)

ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇÇÇÇ
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ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
ÇÇÇ
ÇÇÇÇÇÇ
ÇÇÇ
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
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ÇÇÇÇÇÇ
ÇÇÇ
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
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ÇÇÇ
MSB LSB

D in A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

0 0 0 NOT ALLOWED 0 0 A COUNTER = ÷0

1 1 0 0 1 NOT ALLOWED 0 1 A COUNTER = ÷1
0 0 2 NOT ALLOWED 0 2 A COUNTER = ÷2
= ÷3
BOTH BITS
0 0 3 NOT ALLOWED 0 3 A COUNTER
MUST BE . .
HIGH 0 0 4 NOT ALLOWED . .
0 0 PORT 0 0 5 N COUNTER = ÷5 . .
0 1 D out 0 0 6 N COUNTER = ÷6 3 E A COUNTER = ÷ 62
N COUNTER = ÷7
fV
1 0 0 0 7 3 F A COUNTER = ÷ 63
1 1 fR . . .
. . . 4 0 NOT ALLOWED
. . . 4 1 NOT ALLOWED
BINARY OUTPUT A F F E N COUNTER = ÷4094 .
.
.
.
VALUE FUNCTION
(NOTE 1) F F F N COUNTER = ÷4095 . .
F F NOT ALLOWED

HEXADECIMAL VALUE
FOR N COUNTER HEXADECIMAL VALUE
FOR A COUNTER

NOTES:
1. A power–on initialize circuit forces the OUTPUT A function to default to Data Out.
2. The values programmed for the N counter must be greater than or equal to the values programmed for the A counter. This results in a total divide value = N x 64 + A.
MC145191

3. At this point, the three new bytes are transferred to the A register. In addition, the 13 LSBs in the first buffer of the R register are transferred to the R register’s second buffer.
Thus, the R, N, and A counters can be presented new divide ratios at the same time. The first buffer of the R register is not affected. The C register is not affected.
15

ARCHIVE INFORMATION
 ENB

NOTE NOTE
CLK 4 5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

MSB LSB

Din R15 R14 R13 R12 R11 R10 R9 R8 R7 R6 R5 R4 R3 R2 R1 R0

0 CRYSTAL MODE, SHUT DOWN 0 0 0 0 NOT ALLOWED

1 CRYSTAL MODE, ACTIVE 0 0 0 1 R COUNTER = ÷ 1 (NOTE 6)
2 REFERENCE MODE, REFin ENABLED and REFout 0 0 0 2 NOT ALLOWED
STATIC LOW 0 0 0 3 NOT ALLOWED
ARCHIVE INFORMATION

ARCHIVE INFORMATION
3 REFERENCE MODE, REFout = REFin (BUFFERED) 0 0 0 4 NOT ALLOWED
4 REFERENCE MODE, REFout = REFin/2 0 0 0 5 R COUNTER = ÷ 5
5 REFERENCE MODE, REFout = REFin/4 0 0 0 6 R COUNTER = ÷ 6
6 REFERENCE MODE, REFout = REFin/8 (NOTE 3) 0 0 0 7 R COUNTER = ÷ 7
7 REFERENCE MODE, REFout = REFin/16 0 0 0 8 R COUNTER = ÷ 8
· · · ·
OCTAL VALUE · · · ·
· · · ·
1 F F E R COUNTER = ÷ 8190
1 F F F R COUNTER = ÷ 8191

BINARY VALUE
HEXADECIMAL VALUE
NOTES:
1. Bits R15 through R13 control the configurable “OSC or 4–stage divider” block (see Block Diagram).
2. Bits R12 through R0 control the “13–stage R counter” block (see Block Diagram).
3. A power–on initialize circuit forces a default REFin to REFout ratio of eight.
4. At this point, bits R13, R14, and R15 are stored and sent to the “OSC or 4–Stage Divider” block in the Block Diagram. Bits R0 through
R12 are loaded into the first buffer in the double–buffered section of the R register. Therefore, the R counter divide ratio is not altered
yet and retains the previous ratio loaded. The C and A registers are not affected.
5. At this point, bits R0 through R12 are transferred to the second buffer of the R register. The R counter begins dividing by the new ratio
after completing the rest of the present count cycle. CLK must be low during the ENB pulse, as shown. Also, see note 3 of Figure 16 for
an alternate method of loading the second buffer in the R register. The C and A registers are not affected. The first buffer of the R register
is not affected.
6. Allows direct access to reference input of phase/frequency detectors.

Figure 17. R Register Access and Format (16 Clock Cycles Are Used)

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

16 SOLUTIONS DEVICE DATA
 fR VH
REFERENCE
REFin ÷ R VL
fV VH
FEEDBACK
fin ÷ (N × 64 + A) VL

* SOURCING CURRENT

PDout FLOAT
SINKING CURRENT
VH
φR
VL
VH
φV
VL
ARCHIVE INFORMATION

VH

ARCHIVE INFORMATION
LD
VL

VH = High voltage level

VL = Low voltage level
*At this point, when both fR and fV are in phase, the output source and sink circuits are turned on for a short interval.
NOTE: The PDout either sources or sinks current during out–of–lock conditions. When locked in phase and frequency, the output is high
impedance and the voltage at that pin is determined by the low–pass filter capacitor. PDout, φR, and φV are shown with the polarity
bit (POL) = low; see Figure 14 for POL.

Figure 18. Phase/Frequency Detectors and Lock Detector Output Waveforms

DESIGN CONSIDERATIONS the desired operating frequency, should be connected as

shown in Figure 19.
CRYSTAL OSCILLATOR CONSIDERATIONS The crystal should be specified for a loading capacitance
The following options may be considered to provide a ref- (CL) which does not exceed approximately 20 pF when used
erence frequency to Motorola’s CMOS frequency synthe- at the highest operating frequency of 15 MHz. Assuming
sizers. R1 = 0 Ω, the shunt load capacitance (CL ) presented across
the crystal can be estimated to be:
Use of a Hybrid Crystal Oscillator
CinCout C1 • C2
CL = + Ca + Cstray +
Commercially available temperature–compensated crystal Cin+Cout C1 + C2
oscillators (TCXOs) or crystal–controlled data clock oscilla- where
tors provide very stable reference frequencies. An oscillator Cin = 5 pF (see Figure 20)
capable of CMOS logic levels at the output may be direct or Cout = 6 pF (see Figure 20)
dc coupled to REFin. If the oscillator does not have CMOS Ca = 1 pF (see Figure 20)
logic levels on the outputs, capacitive or ac coupling to REFin
may be used (see Figure 8). C1 and C2 = external capacitors (see Figure 19)
For additional information about TCXOs and data clock Cstray = the total equivalent external circuit stray capaci–
oscillators, please consult the latest version of the eem Elec- tance appearing across the crystal terminals
tronic Engineers Master Catalog, the Gold Book, or similar The oscillator can be “trimmed” on–frequency by making a
publications. portion or all of C1 variable. The crystal and associated com-
ponents must be located as close as possible to the REFin
Design an Off–Chip Reference and REFout pins to minimize distortion, stray capacitance,
stray inductance, and startup stabilization time. Circuit stray
The user may design an off–chip crystal oscillator using
capacitance can also be handled by adding the appropriate
discrete transistors or ICs specifically developed for crystal
stray value to the values for Cin and Cout. For this approach,
oscillator applications, such as the MC12061 MECL device.
the term Cstray becomes 0 in the above expression for CL.
The reference signal from the MECL device is ac coupled to
Power is dissipated in the effective series resistance of the
REFin (see Figure 8). For large amplitude signals (standard
crystal, Re, in Figure 21. The maximum drive level specified
CMOS logic levels), dc coupling may be used.
by the crystal manufacturer represents the maximum stress
that the crystal can withstand without damage or excessive
Use of the On–Chip Oscillator Circuitry
shift in operating frequency. R1 in Figure 19 limits the drive
The on–chip amplifier (a digital inverter) along with an ap- level. The use of R1 is not necessary in most cases.
propriate crystal may be used to provide a reference source To verify that the maximum dc supply voltage does not
frequency. A fundamental mode crystal, parallel resonant at cause the crystal to be overdriven, monitor the output

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 17
 frequency (fR) at OUTPUT A as a function of supply voltage. FREQUENCY
(REFout is not used because loading impacts the oscillator.) SYNTHESIZER
The frequency should increase very slightly as the dc supply
voltage is increased. An overdriven crystal decreases in fre-
quency or becomes unstable with an increase in supply volt-
REFin REFout
age. The operating supply voltage must be reduced or R1 Rf
must be increased in value if the overdriven condition exists.
The user should note that the oscillator start–up time is pro- R1*
portional to the value of R1.
Through the process of supplying crystals for use with C1 C2
CMOS inverters, many crystal manufacturers have devel-
oped expertise in CMOS oscillator design with crystals. Dis-
cussions with such manufacturers can prove very helpful * May be needed in certain cases. See text.
(see Table 4).
Figure 19. Pierce Crystal Oscillator Circuit
RECOMMENDED READING
Technical Note TN–24, Statek Corp.
ARCHIVE INFORMATION

ARCHIVE INFORMATION
Technical Note TN–7, Statek Corp. Ca
E. Hafner, “The Piezoelectric Crystal Unit–Definitions and REFin REFout
Method of Measurement”, Proc. IEEE, Vol. 57, No. 2, Feb.
1969. Cin Cout
D. Kemper, L. Rosine, “Quartz Crystals for Frequency
Control”, Electro–Technology, June 1969. Cstray
P. J. Ottowitz, “A Guide to Crystal Selection”, Electronic
Design, May 1966.
D. Babin, “Designing Crystal Oscillators”, Machine Figure 20. Parasitic Capacitances of the Amplifier
Design, March 7, 1985. and Cstray
D. Babin, “Guidelines for Crystal Oscillator Design”,
Machine Design, April 25, 1985. CS
RS LS
1 2 1 2

CO

1 Re Xe 2

NOTE: Values are supplied by crystal manufacturer

(parallel resonant crystal).

Figure 21. Equivalent Crystal Networks

Table 4. Partial List of Crystal Manufacturers

United States Crystal Corp.

Crystek Crystal

Statek Corp.

Fox Electronics
NOTE: Motorola cannot recommend one supplier
over another and in no way suggests that
this is a complete listing of crystal man-
ufacturers.

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

18 SOLUTIONS DEVICE DATA
 PHASE–LOCKED LOOP—LOW PASS FILTER DESIGN

(A) PDout Kφ KVCO

VCO ωn =
NC
R
R Kφ KVCOC ωnRC
C ζ = =
2 N 2

1 + sRC
Z(s) =
sC

NOTE:
For (A), using Kφ in amps per radian with the filter’s impedance transfer function, Z(s), maintains units of volts per radian for the
detector/ filter combination. Additional sideband filtering can be accomplished by adding a capacitor C′ across R. The corner ω c = 1/RC′
should be chosen such that ω n is not significantly affected.
ARCHIVE INFORMATION

ARCHIVE INFORMATION
R2
(B) Kφ KVCO
ωn =
R1 C NCR1
φR –
A VCO ωnR2C
φV +
ζ = 2
R1

R2 ASSUMING GAIN A IS VERY LARGE, THEN:

C R2sC + 1
F(s) =
R1sC

NOTE:
For (B), R 1 is frequently split into two series resistors; each resistor is equal to R1 divided by 2. A capacitor C C is then placed from
the midpoint to ground to further filter the error pulses. The value of C C should be such that the corner frequency of this network does
not significantly affect ω n .
* The φR and φV outputs are fed to an external combiner/loop filter. The φR and φV outputs swing rail–to–rail. Therefore, the user should be careful
not to exceed the common mode input range of the op amp used in the combiner/loop filter.
DEFINITIONS:
N = Total Division Ratio in Feedback Loop
Kφ (Phase Detector Gain) = I PDout / 2π amps per radian for PD out
Kφ (Phase Detector Gain) = V PD / 2π volts per radian for φ V and φ R
2π∆fVCO
KVCO (VCO Transfer Function) = radians per volt
∆VVCO
For a nominal design starting point, the user might consider a damping factor ζ≈0.7 and a natural loop frequency ωn ≈ (2πfR/50) where fR is
the frequency at the phase detector input. Larger ωn values result in faster loop lock times and, for similar sideband filtering, higher fR–related
VCO sidebands.

Either loop filter (A) or (B) is frequently followed by additional sideband filtering to further attenuate fR–related VCO sidebands. This additional
filtering may be active or passive.

RECOMMENDED READING:
Gardner, Floyd M., Phaselock Techniques (second edition). New York, Wiley–Interscience, 1979.
Manassewitsch, Vadim, Frequency Synthesizers: Theory and Design (second edition). New York, Wiley–Interscience, 1980.
Blanchard, Alain, Phase–Locked Loops: Application to Coherent Receiver Design. New York, Wiley–Interscience, 1976.
Egan, William F., Frequency Synthesis by Phase Lock. New York, Wiley–Interscience, 1981.
Rohde, Ulrich L., Digital PLL Frequency Synthesizers Theory and Design. Englewood Cliffs, NJ, Prentice–Hall, 1983.
Berlin, Howard M., Design of Phase–Locked Loop Circuits, with Experiments. Indianapolis, Howard W. Sams and Co., 1978.
Kinley, Harold, The PLL Synthesizer Cookbook. Blue Ridge Summit, PA, Tab Books, 1980.
Seidman, Arthur H., Integrated Circuits Applications Handbook, Chapter 17, pp. 538–586. New York, John Wiley & Sons.
Fadrhons, Jan, “Design and Analyze PLLs on a Programmable Calculator,” EDN. March 5, 1980.
AN535, Phase–Locked Loop Design Fundamentals, Motorola Semiconductor Products, Inc., 1970.
AR254, Phase–Locked Loop Design Articles, Motorola Semiconductor Products, Inc., Reprinted with permission from
Electronic Design, 1987.
AN1253/D, An Improved PLL Design Method Without ωn and ζ, Motorola Semiconductor Products, Inc., 1995.

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 19
 THRESHOLD +5 V
DETECTOR
1 REF 20
out REFin
2 LD Din 19
INTEGRATOR
MCU
3 φR CLK
18
OPTIONAL LOOP
ERROR SIGNALS 4 φV 17
(NOTE 1) ENB
5 16 GENERAL–PURPOSE
+V VPD OUTPUT A DIGITAL OUTPUT
LOW–PASS 6 15
PDout OUTPUT B
FILTER +5 V
7 14
GND VDD
8 13
Rx TEST 2 NC Q1
ARCHIVE INFORMATION

NOTE 2

ARCHIVE INFORMATION
9 12
NC TEST 1 VCC
10 fin 11
fin
1000 pF

UHF
VCO

UHF OUTPUT
BUFFER
NOTES:
1. When used, the φR and φV outputs are fed to an external combiner/loop filter. See the Phase–Locked
Loop — Low–Pass Filter Design page for additional information.
2. Transistor Q1 is required only if the standby feature is needed. Q1 permits the bipolar section of the device to
be shut down via use of the general–purpose digital pin, OUTPUT B. If the standby feature is not needed, tie
Pin 12 directly to the power supply.
3. For optimum performance, bypass the VCC, VDD, and VPD pins to GND with low–inductance capacitors.
4. The R counter is programmed for a divide value = REFin/fR. Typically, fR is the tuning resolution required for
the VCO. Also, the VCO frequency divided by fR = NT = N × 64 + A; this determines the values (N, A) that must
be programmed into the N and A counters, respectively.

Figure 22. Example Application

DEVICE #1 DEVICE #2
OUTPUT A OUTPUT A
Din CLK ENB (DATA OUT) Din CLK ENB (DATA OUT)

CMOS
MCU
OPTIONAL

NOTE: See related Figures 24 through 26; these bit streams apply to the MC145191 and MC145201.

Figure 23. Cascading Two Devices

MC145191 MOTOROLA WIRELESS SEMICONDUCTOR

20 SOLUTIONS DEVICE DATA
 ARCHIVE INFORMATION
SOLUTIONS DEVICE DATA
MOTOROLA WIRELESS SEMICONDUCTOR

Figure 24. Accessing the C Registers

ENB
of Two Cascaded Devices

1 2 7 8 9 10 15 16 17 18 23 24 25 26 31 32 33 34 39 40 *
CLK
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ÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
D in X X X C7 C6 C0 X X X X X X C7 C6 C0

C REGISTER BITS OF DEVICE #2 C REGISTER BITS OF DEVICE #1

IN FIGURE 23 IN FIGURE 23

*At this point, the new bytes are transferred to the C registers of both devices and stored. No other registers are affected.

ENB
Figure 25. Accessing the A Registers

*
of Two Cascaded Devices

1 2 8 9 10 15 16 17 23 24 25 31 32 33 39 40 46 47 48 55 56
CLK
ÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇ
ÇÇÇÇ
ÇÇ
ÇÇ
ÇÇÇÇ
ÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇ
ÇÇÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇÇÇ
ÇÇ
ÇÇÇÇ
ÇÇ
ÇÇ
D in X X A23 A22 A16 A15 A8 A7 A0 A23 A16 A9 A8 A0

A REGISTER BITS OF DEVICE #2 A REGISTER BITS OF DEVICE #1

IN FIGURE 23 IN FIGURE 23

*At this point, the new bytes are transferred to the A registers of both devices and stored. Additionally, for both devices, the 13 LSBs in each of the first buffers of the R registers are
MC145191

transferred to the respective R register’s second buffer. Thus, the R, N, and A counters can be presented new divide ratios at the same time. The first buffer of each R register is not affected.
Neither C register is affected.
21

ARCHIVE INFORMATION
 ARCHIVE INFORMATION
22
MC145191

Figure 26. Accessing the R Registers of Two Cascaded Devices

ENB

NOTE 1 NOTE 2
1 2 8 9 10 15 16 17 23 24 25 31 32 33 39 40 41 47 48
CLK
ÇÇ
ÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇÇÇ
ÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇ
ÇÇÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
D in X X R15 R14 R8 R7 R0 X X R15 R8 R7 R0

R REGISTER BITS OF DEVICE #2 R REGISTER BITS OF DEVICE #1

IN FIGURE 23 IN FIGURE 23
MOTOROLA WIRELESS SEMICONDUCTOR

NOTES APPLICABLE TO EACH DEVICE:

1. At this point, bits R13, R14, and R15 are stored and sent to the “OSC or 4-Stage Divider” block in the Block Diagram. Bits R0 through R12 are loaded into the first buffer in the double-
buffered section of the R register. Therefore, the R counter divide ratio is not altered yet and retains the previous ratio loaded. The C and A registers are not affected.
2. At this point, the bits R0 through R12 are transferred to the second buffer of the R register. The R counter begins dividing by the new ratio after completing the rest of the present count
cycle. CLK must be low during the ENB pulse, as shown. Also, see note of Figure 25 for an alternate method of loading the second buffer in the R register. The C and A registers
are not affected. The first buffer of the R register is not affected.
SOLUTIONS DEVICE DATA

ARCHIVE INFORMATION
 PACKAGE DIMENSIONS

F SUFFIX
SOG (SMALL OUTLINE GULL–WING) PACKAGE
CASE 751J–02

NOTES:
1. DIMENSIONING AND TOLERANCING PER
-A- ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
20 11 MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
-B- PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
1 10 J PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
G EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S 10 PL K
MILLIMETERS INCHES
0.13 (0.005) M B M DIM MIN MAX MIN MAX
A 12.55 12.80 0.494 0.504
ARCHIVE INFORMATION

ARCHIVE INFORMATION
B 5.10 5.40 0.201 0.213
C — 2.00 — 0.079
D 0.35 0.45 0.014 0.018
C G 1.27 BSC 0.050 BSC
J 0.18 0.23 0.007 0.009
0.10 (0.004) M K 0.55 0.85 0.022 0.033
D 20 PL L -T- SEATING L 0.05 0.20 0.002 0.008
PLANE M 0° 7° 0° 7°
0.13 (0.005) M T B S A S S 7.40 8.20 0.291 0.323

DT SUFFIX
TSSOP (THIN SHRUNK SMALL OUTLINE PACKAGE)
CASE 948D–03

A
NOTES:
20X K REF 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
0.200 (0.004) M T 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
20 11 MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
L B INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PIN 1
IDENTIFICATION 5. DIMENSION K DOES NOT INCLUDE DAMBAR
10 PROTRUSION. ALLOWABLE DAMBAR
1 PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSIONS A AND B ARE TO BE
C DETERMINED AT DATUM PLANE –U–.

MILLIMETERS INCHES
-U- DIM MIN MAX MIN MAX
A ––– 6.60 ––– 0.260
0.100 (0.004) B 4.30 4.50 0.169 0.177
D G H C ––– 1.20 ––– 0.047
-T- SEATING
D 0.05 0.25 0.002 0.010
PLANE
F 0.45 0.55 0.018 0.022
G 0.65 BSC 0.026 BSC
K A H 0.275 0.375 0.011 0.015
K1 J 0.09 0.24 0.004 0.009
J1 M J1 0.09 0.18 0.004 0.007
K 0.16 0.32 0.006 0.013
K1 0.16 0.26 0.006 0.010
L 6.30 6.50 0.248 0.256
J M 0° 10° 0° 10 °
A
F
SECTION A-A

MOTOROLA WIRELESS SEMICONDUCTOR MC145191

SOLUTIONS DEVICE DATA 23
ARCHIVE INFORMATION

ARCHIVE INFORMATION
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.

Mfax is a trademark of Motorola, Inc.

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HOME PAGE: http://motorola.com/sps/

MC145191 ◊ MOTOROLA WIRELESS SEMICONDUCTOR

MC145191/D
24 SOLUTIONS DEVICE DATA