Fault Detection and Localization Clean Version
Fault Detection and Localization Clean Version
establish a mapping relationship, similar to system dynamics, the conventional reliability quantification approach can not
between the input features and output labels [17]. Then, based guarantee the real-time diagnosis performance of a data-
on this correlation, the trained data-driven model is employed driven approach. Moreover, for a data-driven algorithm to
to distinguish between different system states. Moreover, a work effectively, the sum of computational and communication
highly consistent, clean, correctly labeled and balanced data delays should always be less than the feature extraction time-
set can enhance the learning curve of a data-driven model. window size. Therefore, a data-driven approach with a simplis-
Therefore, various signal pre-processing techniques, such as tic feature extraction scheme and a data-driven classifier with
FFT, principle component analysis (PCA), wavelet packet less computational burden is always preferred. In this regard,
transform, and FFT+Relief, are used for input data dimen- various previously discussed data-driven schemes that use sig-
sionality reduction and highly correlated feature extraction in nal preprocessing techniques for feature extraction are exposed
[16], [18]–[22]. These methodologies utilize random vector to high computational load. On the other hand, in the proposed
functional link (RVFL), Bayesian networks, multiclass rel- scheme, the inherent segregation property of an ATM-based
evance vector machine, long short-term memory (LSTM), scheme is used as leverage to capture the dynamics of each
and extreme learning machine (ELM)-based RVFL as OCF semiconductor device in a three-phase inverter, which further
diagnosis algorithms for two-level and multilevel inverters. acts as a reliable dataset for OCF diagnosis without the need
Apart from using frequency domain features, various time for any signal preprocessing technique. So, the contributions
domain statistical features as diagnostic signals can also be of this work can be summarized as follows:
used as in [23], [24] with a data-driven classifier for abnor- 1) Existing data-based approaches typically use conven-
malities detection. Moreover, in [25], [26], convolution neural tional classification accuracy as the primary reliability
network (CNN)-based fault diagnosis methods are proposed, metric. However, this reliability score can demean at
where time-domain diagnostic signals are converted into 2-D certain vulnerable instances, such as at high RPMs,
images for OCF feature extraction. So, these feature extraction during the real-time operation of MDS. To address this
schemes can be categorized into frequency, time, and image- limitation, we propose a comprehensive reliability score
based approaches. Furthermore, in [27], various data-driven that incorporates not only classification accuracy but also
schemes have been evaluated for fault diagnosis in power factors like feature extraction time, model computation
electronics applications, showing that deep learning algorithms time, and data transfer delay, ensuring a more robust
(i.e., LSTM, CNN, recurrent neural network, auto-encoder) evaluation in realistic scenarios before online diagnosis.
perform better than machine learning (i.e., support vector 2) The OCF is a single power switch can induce increased
machine, ELM, decision tree) and neural network algorithms thermal stress on the healthy switches, which is rarely
(i.e., multilayer perceptron, backpropagation neural network, discussed in the existing literature. Therefore, this work
radial basis function, and fuzzy neural network). However, this also illustrates the real-time influence of various OCF
proposition can vary based on the application. modes on the junction temperature of power switches.
The diagnostic speed of these data-based schemes relies 3) Combining data processing techniques like FFT with
heavily on feature extraction window size, data-driven model complex data-driven models can improve classification
computational time, and data communication delay. In this accuracy but often results in high computational costs
regard, several past studies used the fixed window size to [9]. To address this, this work introduces a simplified
achieve balanced OCF diagnosis, as in [16], [20], [28], [29], conduction loss profile-based dataset derived from ATM-
which is suitable for a motor drive system (MDS) with a short based MPC as a novel OCF feature extraction method.
speed range. However, for a wide-speed domain, it can lead This approach leverages predefined control layer signals,
to inadequate or excessive diagnosis data, particularly when eliminating additional computational and hardware de-
the fundamental period is significantly smaller or larger than mands. Furthermore, the proposed dataset’s effectiveness
the window size, which may result in misclassifications or in OCF diagnosis is evaluated using a reliability score
slow diagnosis. Therefore, to overcome these shortcomings, a quantification scheme across various data-driven classi-
dynamic feature extraction time window as a function of the fiers.
fundamental period is preferred in this work, where the input In the rest of this paper, section III explains the MDS mod-
diagnostic data transfer rate will be proportional to the varying eling with ATM-based MPC and conduction loss estimation.
fundamental period of MDS. The proposed loss-based feature extraction dataset acquisition
Moreover, in existing data-based approaches, the diagnosis and reliability score formulation are elaborated in section IV.
performance solely considers the predicted output and ground Finally, the thermal impact analysis and OCF diagnosis via
truth for accuracy evaluation during offline validation. Under real-time experimentation are showcased in section V.
this approach, a highly accurate data-driven classifier may
work perfectly during online diagnosis when the sum of the
computational latency of the data-driven model and commu- III. S YSTEM L AYOUT AND FAULT L ABELLING
nication delay is less than the feature extraction time-window The typical structure of the MDS with two-level, three-
size. However, at high RPMs with a fundamental period of a phase VSI is shown in Fig. 1. The control signals are generated
few milliseconds, the delay can exceed the window size, which via an ATM-based MPC, which considers the electrical and
may lead to congestion in the communication framework, thermal attributes of a power converter for cost function
overruns, slow diagnosis, and consistent false alarms. Hence, minimization [30]. A simplified RC network known as a
IEEE TRANSACTIONS ON POWER ELECTRONICS 3
. (a) (b)
(a)
. (c) (d)
Fig. 2. Various OCF modes of inverter (a) SS-OCF (b) SDS-OCF (c) CDS-
OCF (d) PDS-OCF
(b)
TABLE II
Fig. 5. Conduction loss in MOSFET-1 during normal operation and OCF
C URRENT C ONDUCTION S EQUENCE FOR MOSFET S AND D IODES IN
P HASE -A UNDER VARIOUS OPERATING CONDITIONS
T
j
S1 S2 Current Conduction pattern (Phase-A) Where Ids is drain-to-source current, and Rds(on) is obtained
State State Direction S1 S2 D1 D2 via (1). For (2b), IF is the current flowing through the anti-
ON OFF ia > 0 Y es No No No parallel diode, and VF is the voltage drop across the diode
ON OFF ia < 0 No No Y es No
under forward-bias condition. The total power loss for each
OFF ON ia > 0 No No No Y es
of the semiconductor module per sampling period can be
OFF ON ia < 0 No Y es No No
OFF OFF ia > 0 No No No Y es
calculated by using (2c). Conduction losses vary significantly
OFF OFF ia < 0 No No Y es No in the presence of OCFs in power transistors, resulting in
distinct dynamic behaviors depending on the fault category. In
this context, Fig. 3b illustrates the impact of conduction losses
the relationship between Ids and the normalized on-state on D1 and S2 for a specific OCF case. The results show that
resistance of the MOSFET, as shown in Fig. 2 of the same the OCF influences the switching sequence, with S2 remaining
datasheet. However, since the datasheet provides these values continuously ON for more than half of the negative half-cycle
only for specific junction temperatures, the on-state resistance of phase A. This phenomenon is discussed in detail in the
for intermediate junction temperatures is calculated using the following section.
following approach,
α Tj −Tj(ref ) B. Conduction Loss Dynamics During OCFs
Tj Tj(ref )
Rds(on) = Rds(on) 1+ (1) Fig. 5 shows the variation in conduction losses of power
100
switches and anti-parallel diodes in phase-A when OCF oc-
T
j(ref )
Here, Tj represents the junction temperature, Rds(on) is curred in S1 . During normal operation, the conduction losses
the on-state resistance at a predefined junction temperature behave consecutively for each power switch and diode, where
(as specified in the datasheet), and α denotes the thermal the diode has a higher loss value than the power switch. The
factor, which is the rate of change of on-state resistance with total conduction losses for the power switch and diode in one
respect to the junction temperature. Using these parameters, cycle remain the same for both MOSFETs of each phase.
Tj
Rds(on) refers to the on-state resistance corresponding to the Whereas, when OCF occurred in S1 , the conduction loss for
required junction temperature. The junction temperature, Tj , is S1 and D2 turns to zero because conduction of the positive
calculated using the LPTN-based Cauer-type thermal network current of phase-A is no longer possible. Moreover, there is
described in [30]. The calculated value of Tj is then used an increase in the conduction losses for D1 and S2 due to the
Tj
to estimate Rds(on) using (1), as illustrated by the dotted associated rise in a negative current. Therefore, after the OCF
lines in Fig. 4. Additionally, the current values for each in S1 , the total losses in one cycle for the upper MOSFET
MOSFET switch and diode under various switching states are higher because the diode conducts with inherently higher
can be determined using the conduction pattern of Phase-A, conduction losses. In addition, as these characteristics are
as shown in Table II. Hence, the conduction losses for the independent of any triggering thresholds and load variations,
MOSFET switch and diode can be formulated as given in they can be used as a reliable feature for fault diagnosis. When
(2a) and (2b), respectively. an SS-OCF occurs in one phase, the impact on frequency,
magnitude, and phase also propagates to the remaining phases
mf t 2 j T
Pcond = Ids ∗ Rds(on) (2a) as well, which can be examined via FFT algorithm. In this
d
Pcond = IF ∗ VF (2b) regard, Fig. 6 shows the propagating impact of OCF in S1 , on
total mf t d
the conduction losses for the remaining MOSFETs, in phases
Pcond = Pcond + Pcond (2c) B and C. In Fig. 6, the highlighted instances where losses
IEEE TRANSACTIONS ON POWER ELECTRONICS 5
become zero are because of the MOSFET irregular behavior Fig. 7. Proposed conduction losses based OCF diagnosis algorithm flowchart
of continuous conduction controlled by switching states, also
shown in detail in Fig. 3b. Finally, these distortions in losses
for all six semiconductor modules with distinct dynamics can they require no additional computation beyond the MDS
be fed to train a data-driven algorithm for OCF diagnosis. control layer.
This simplicity becomes particularly important when de-
IV. P ROPOSED M ETHOD FOR OCF D ETECTION AND ploying ML classifiers in power electronics applications,
L OCALIZATION where high computational loads can lead to overruns. An over-
run occurs when the incoming data frequency from the MDS
The proposed data-driven machine learning (ML) approach exceeds the processing speed of the ML network—resulting
for an OCF diagnosis in a three-phase inverter, leveraging in slow diagnosis and potential false alarms. Therefore, it is
conduction losses as a key feature, is illustrated in Fig. 7. This crucial to consider the diagnostic data rate and the execution
approach involves two main stages: offline training of the ML time of ML classifiers during reliability testing and before
network and its online deployment in a target environment for real-time deployment of the model. To address these chal-
real-time OCF diagnosis. lenges, this work introduces a conduction loss-profile-based
Conduction losses serve as a highly effective feature for dataset as a new feature extraction approach and proposes a
OCF detection and localization due to the inherent ability of novel reliability quantification scheme for evaluating various
the ATM-based MPC approach to segregate electrical losses, ML classifiers in OCF diagnosis. These contributions ensure
enabling optimal thermal stress control for each semiconductor robust, real-time performance while minimizing computational
device. The advantages of conduction losses over traditional overhead during deployment.
three-phase current measurements for OCF diagnosis have
been demonstrated in [32]. Unlike methods that rely on
three-phase current combined with computationally intensive A. Feature Extraction and Preprocessing
processes such as FFT for fault frequency extraction and the The database, providing prior knowledge to an ML model
ReliefF algorithm for feature selection and dimensionality about the operational characteristics of each MOSFET in an
reduction [16], conduction losses offer a more streamlined inverter, acts as a foundation to ensure the accuracy and
and efficient alternative. Since conduction loss dynamics are reliability of the associated ML classifier. In this regard, 22
inherently generated within the ATM-based MPC framework, different operation modes of the inverter are considered, as
IEEE TRANSACTIONS ON POWER ELECTRONICS 6
i = {1, 2, 3, 4, 5, 6} Where yi (n) represents the output from the FC layer’s ith
neuron at n learning sample, and nc is the total number of
Where T is the estimated fundamental time period, and ωe target classes. Finally, the output from softMax is fed into the
′
is the electrical rotor speed (rad/s). Moreover, X(i) represents categorical cross-entropy cost function to minimize the error
the average values of conduction losses for the conduction between predicted labels and ground truth while obtaining the
period of each power switch and diode illustrated as tsc optimal weights for hidden and output layers.
(i) (i)
and tdc respectively. In addition, ns and nd illustrate the X
total number of non-zero values in the conduction period min J = H(y, ŷ) = − yi · log(ŷi ) (10)
of each power switch and diode, respectively. Furthermore, i
the effectiveness of various ML classifiers for the suggested Where yi and ŷi represent the true (one-hot encoded) and
OCF feature extraction method can be assessed using diverse the predicted probability of class i, respectively. The negative
performance metrics such as accuracy, precision, and recall sign turns the cross-entropy minimization into a maximization
IEEE TRANSACTIONS ON POWER ELECTRONICS 7
(a)
. (a) (b)
Fig. 17. Effect of OCFs on conduction losses for phases A, B, and C (a) (b)
SDS-OCF (b) PDS-OCF
Fig. 18. Thermal imbalance among MOSFETs and increased thermal stress
due to various OCF scenarios (a) SS-OCF (b) SDS-OCF
(a)
TABLE III
P ERFORMANCE C OMPARISON A MONG VARIOUS ML C LASSIFIERS
(a)
(a)
(b)
(b)
Fig. 21. Accuracy curves for two neural networks. (a) FNN (b) LSTM
berry Pi. The communication delay is not always fixed due to (c)
the dynamic nature of the communication network, as shown Fig. 22. Real-time OCF diagnosis for different ML classifiers. (a) 3-phase
in Fig.22b, where the diagnosis delay for four different ML current under OCF-S1 (b) OCF diagnosis time (c) Accuracy dip.
classifiers is compared. The detection sequence based on tml ex
remains the same, with FNN showing the least OCF diagnosis
time of approx. 1.0ms.
These different diagnosis periods are primarily associated
with tmlex , and the bidirectional data transfer delay for the less overall accuracy, slow diagnosis, probable congestion in
UDP framework used in the experimental testbed, which the communication network at high RPMs, and false alarms.
is approx. 0.5ms. This value is obtained via various data- Therefore, it is important to consider the timing profiles during
transfer loopback tests between OPAL-RT and Raspberry reliability quantification as in (14) to scale the practical effec-
Pi. The delay can vary for other communication protocols tiveness of an ML-based approach across MDSs spanning a
such as Transmission Control Protocol (TCP), control area wide speed range. So, considering the temporal analysis of ML
network (CAN) buses, FlexRay communication, and local networks and the communication framework, the reliability
interconnect network (LIN). Moreover, Fig. 22c shows the score for each ML classifier is given in Table III. Thus,
real-time accuracy dip for different classifiers caused by the considering the offline validation results and reliability scores,
misclassifications due to OCF detection latency. The classifier FNN is opted as a reliable ML classifier to further validate the
with the highest latency has the highest dip, thus resulting in performance of the proposed OCF diagnosis scheme.
IEEE TRANSACTIONS ON POWER ELECTRONICS 13
. (a) (b)
Fig. 23. CHIL OCF diagnosis results for an SS-OCF
Fig. 25. CHIL OCF diagnosis results (a) CDS-OCF (b) PDS-OCF
. (a) (b)
(a)
Fig. 24. CHIL OCF diagnosis results (a) SS-OCF (b) SDS-OCF
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IEEE TRANSACTIONS ON POWER ELECTRONICS 15