tsmc350
tsmc350
txt
* MINIMUM 0.6/0.4
* Vth 0.57 -0.81 volts
* SHORT 20.0/0.4
* Idss 466 -207 uA/um
* Vth 0.60 -0.80 volts
* Vpt 9.3 -9.7 volts
* WIDE 20.0/0.4
* Ids0 < 2.5 < 2.5 pA/um
* LARGE 50/50
* Vth 0.56 -0.77 volts
* Vjbkd 8.3 -8.5 volts
* Ijlk <50.0 <50.0 pA
* Gamma 0.64 0.37 V^0.5
*COMMENTS: Poly bias varies with design technology. To account for mask and
* etch bias use the appropriate value for the parameter XL in your
* SPICE model card.
* Design Technology XL
* ----------------- -------
* SCN4M_SUBM (lambda=0.20) -0.02
* thick oxide -0.06
* TSMC35 0.03
* thick oxide 0.04
* SCN4M (lambda=0.25) -0.12
* thick oxide -0.06
*
*
*FOX TRANSISTORS GATE N+ACTIVE P+ACTIVE UNITS
* Vth Poly >10.0 <-10.0 volts
*
*
*PROCESS PARAMETERS N+ACTV P+ACTV POLY POLY2 MTL1 MTL2 MTL3 UNITS
* Sheet Resistance 3.3 2.6 5.7 0.07 0.07 0.07 ohms/sq
* Contact Resistance 3.5 2.9 4.2 1.08 1.13 ohms
* Gate Oxide Thickness 78 angstrom
*
*PROCESS PARAMETERS MTL4 N\PLY N_WELL UNITS
* Sheet Resistance 0.04 1030 1005 ohms/sq
* Contact Resistance 1.18 ohms
*COMMENTS: SUBMICRON
*
T27K SPICE BSIM3 VERSION 3.1 PARAMETERS