Data Sheet

HSMH-H150
Mono-Color Top Mount ChipLED

Description Features
 LED with AllnGaP Red
The Broadcom® HSMH-H150 is a top-view mono-color
 Compatible with IR reflow soldering
surface-mount red LED that is available in the industry-
 Available in 8-mm tape and 7-in. diameter reel
standard 3.2 mm x 1.6 mm footprint. This robust and
high-quality LED is suitable for applications requiring a  3000 units per reel
versatile and easy-to-use package. Applications
This product utilizes efficient and high-performance  Indicator
Aluminum Indium Gallium Phosphide (AlInGaP) LED die  Backlighting
technology. The LEDs are packed in tape and reel form that
is compatible with industry-standard automatic machine
placement and reflow soldering.

CAUTION! This LED is Class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions
during handling and processing. Refer to Application Note AN-1142 for additional details.

Broadcom HSMH-H150-DS100
December 16, 2022
HSMH-H150 Data Sheet Mono-Color Top Mount ChipLED

Figure 1: Package Dimensions

NOTE:
1. All dimensions are in millimeters (mm).
2. Tolerance is ±0.10 mm unless otherwise specified.

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HSMH-H150 Data Sheet Mono-Color Top Mount ChipLED

Absolute Maximum Ratings

Parameters Value Unit

DC Forward Currenta 25 mA
Power Dissipation 65 mW
LED Junction Temperature 95 °C
Operating Temperature Range –40 to +85 °C
Storage Temperature Range –40 to +85 °C
a. Derate linearly as shown in Figure 6.

Optical Characteristics (TJ = 25°C, IF = 20 mA)

Luminous Intensity Dominant Wavelength Peak Wavelength Viewing Angle
IV (mcd)a λd (nm)b λp (nm) 2θ½ (Degrees)c

Color Min. Typ. Typ. Typ.

Red 7.2 639 660 170
a. The luminous intensity, IV, is measured at the mechanical axis of the package and is tested with a single -current pulse condition. The actual
peak of the spatial radiation pattern may not be aligned with the axis.
b. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
c. θ½ is the off axis angle where the luminous intensity is ½ the peak intensity.

Electrical Characteristics (TJ = 25°C, IF = 20 mA)

Forward Voltage Reverse Current Thermal Resistance
VF (V)a IR (μA) at VR = 5Vb RθJ–S (°C/W)c

Color Min. Max. Max. Typ.

Red 1.6 2.6 10 300
a. Forward voltage tolerance is ±0.1V.
b. Indicates product final test condition. Long-term reverse bias is not recommended.
c. Thermal resistance from LED junction to solder point.

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HSMH-H150 Data Sheet Mono-Color Top Mount ChipLED

Bin Information
Intensity Bin Limits (CAT)
Luminous Intensity (mcd)

Bin ID Min. Max.

K 7.2 11.2
L 11.2 18.0
M 18.0 28.5
N 28.5 45.0
P 45.0 71.5
Q 71.5 112.5
R 112.5 180.0
S 180.0 285.0
T 285.0 450.0

Tolerance = ±15%

Color Bin Limits (BIN)

Dominant Wavelength (nm)

Bin ID Min. Max.

— 630 650

Tolerance = ±1.0 nm

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HSMH-H150 Data Sheet Mono-Color Top Mount ChipLED

Figure 2: Spectral Power Distribution Figure 3: Forward Current vs. Forward Voltage

Figure 4: Relative Luminous Intensity vs. Forward Current Figure 5: Radiation Pattern

Figure 6: Derating Curve Figure 7: Recommended Soldering Land Pattern

NOTE:
1. All dimensions are in millimeters (mm).
2. Tolerance is ±0.10 mm unless otherwise
specified.

Broadcom HSMH-H150-DS100
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HSMH-H150 Data Sheet Mono-Color Top Mount ChipLED

Figure 8: Carrier Tape Dimensions

NOTE:
1. All dimensions in are millimeters (mm).
2. Tolerance is ±0.10 mm unless otherwise specified.
3. 3000 units per reel.

Figure 9: Reel Dimensions

9.0

PRODUCT LABEL

178.5
60.0

USER FEED DIRECTION

NOTE: All dimensions are in millimeters (mm).

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HSMH-H150 Data Sheet Mono-Color Top Mount ChipLED

Precautionary Notes
Soldering Handling Precautions
 Do not perform reflow soldering more than twice. This product has a Moisture Sensitive Level 2a rating per
Observe necessary precautions of handling JEDEC J-STD-020. Refer to Broadcom Application Note
moisture-sensitive devices as stated in the following AN5305, Handling of Moisture Sensitive Surface Mount
section. Devices, for additional details and a review of proper
 Do not apply any pressure or force on the LED during handling procedures.
reflow and after reflow when the LED is still hot.  Before use:
 Use reflow soldering to solder the LED. Use hand – An unopened moisture barrier bag (MBB) can be
soldering only for rework if unavoidable, but it must be stored at <40°C/90% RH for 12 months. If the actual
strictly controlled to following conditions: shelf life has exceeded 12 months and the Humidity
– Soldering iron tip temperature = 310°C maximum Indicator Card (HIC) indicates that baking is not
– Soldering duration = 2 seconds maximum required, then it is safe to reflow the LEDs per the
– Number of cycles = 1 only original MSL rating.
– Power of soldering iron = 50W maximum – Do not open the MBB prior to assembly (for
 Do not touch the LED package body with the soldering example, for IQC). If unavoidable, MBB must be
iron except for the soldering terminals, as it may cause properly resealed with fresh desiccant and HIC. The
damage to the LED. exposed duration must be taken in as floor life.
 Confirm beforehand whether the functionality and  Control after opening the MBB:

performance of the LED is affected by soldering with – Read the HIC immediately upon opening of MBB.
hand soldering. – Keep the LEDs at <30°/60% RH at all times, and
complete all high temperature-related processes,
Figure 10: Recommended Lead-Free Reflow Soldering Profile including soldering, curing, or rework within 672
hours.
 Control for unfinished reel:
10 SEC. MAX. Store unused LEDs in a sealed MBB with desiccant or a
255 – 260°C desiccator at <5% RH.
TEMPERATURE

217°C
3°C/SEC. MAX.  Control of assembled boards:
200°C
6°C/SEC. MAX. If the PCB soldered with the LEDs is to be subjected to
150°C other high-temperature processes, store the PCB in a
3°C/SEC. MAX. sealed MBB with desiccant or desiccator at <5% RH to
ensure that all LEDs have not exceeded their floor life of
60 – 120 SEC. 60 SEC. MAX. 672 hours.
 Baking is required if:
TIME
– The HIC indicator indicates a change in color for
10% and 5%, as stated on the HIC.
– The LEDs are exposed to conditions of
>30°C/60% RH at any time.
– The LED’s floor life exceeded 672 hours.
The recommended baking condition is 60ºC ± 5ºC for
20 hours.
Baking can only be done once.

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HSMH-H150 Data Sheet Mono-Color Top Mount ChipLED

Application Precautions Eye Safety Precautions

 The drive current of the LED must not exceed the LEDs may pose optical hazards when in operation. Do not
maximum allowable limit across temperature as stated look directly at operating LEDs because it might be harmful
in the data sheet. Constant current driving is to the eyes. For safety reasons, use appropriate shielding or
recommended to ensure consistent performance. personal protective equipment.
 Circuit design must cater to the whole range of forward
voltage (VF) of the LEDs to ensure the intended drive
current can always be achieved.
 The LED exhibits slightly different characteristics at
different drive currents, which may result in a larger
variation of performance (meaning: intensity,
wavelength, and forward voltage). Set the application
current as close as possible to the test current to
minimize these variations.
 Driving the LED at low current (< 2 mA) will not cause
functional failures to the LED (i.e. open/short).
However, the variation in intensity will be larger than
existing intensity bin ratio of 1:1.6.
 If the LED is intended to be used along with LED of
other color to achieve color mixing, Broadcom does not
guarantee the consistency of the resultant color.
Contact your Broadcom Sales Representative for such
applications.
 The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When
driving the LED in matrix form, ensure that the reverse
bias voltage does not exceed the allowable limit of the
LED.
 Avoid rapid change in ambient temperature, especially
in high-humidity environments, because they cause
condensation on the LED.
 If the LED is intended to be used in a harsh or outdoor
environment, protect the LED against damages caused
by rain water, water, dust, oil, corrosive gases, external
mechanical stresses, and so on.

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