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DCP 101

The Temptronic® ThermoSpot® DCP-101 is a benchtop temperature forcing system designed for IC characterization, offering a temperature range of -55 to 175°C with a cooling power of 20W at -40°C. It features user-programmable settings, a touch-screen interface, and supports various communication protocols. The system is compact, self-contained, and requires no external air supply, making it suitable for in-circuit and test socket applications.

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46 views2 pages

DCP 101

The Temptronic® ThermoSpot® DCP-101 is a benchtop temperature forcing system designed for IC characterization, offering a temperature range of -55 to 175°C with a cooling power of 20W at -40°C. It features user-programmable settings, a touch-screen interface, and supports various communication protocols. The system is compact, self-contained, and requires no external air supply, making it suitable for in-circuit and test socket applications.

Uploaded by

wkchiu1221
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Temptronic® ThermoSpot® DCP-101 bench top temperature forcing system

For IC characterization, test, and failure analysis with 20W capacity at -40°C

The ThermoSpot Model DCP-101 benchtop


temperature forcing system provides a highly
responsive, thermally conductive path to quickly
induce temperatures to the DUT. The system
consists of a powerful temperature source that
feeds a thermal head with an interchangeable
ThermoBridgeTM that couples directly to your IC
and can be designed to interface to your DUT
for in-circuit and test socket applications.

User-programmable temperatures, graphing,


and data logging are established through
the controller’s touch-screen or remote
communications. The system provides fast and
precise transitions of temperature at the IC,
even with variations in device power, and can
be used with Temptronic’s proven DUT Control
technology using an imbedded diode or
external thermocouple.

A ThermoBridgeTM provides the thermal interface


to match the area of your IC package.

Features

• Temperature Range: -55 to 175°C

• Cooling Power: 20W at -40°C

• 25 to -40°C <2.5 min.

• Easy and secure thermal connection to DUT

• Self-contained, quiet benchtop unit

• No facilities air supply required

• Communications: Ethernet, USB, IEEE, RS232


ThermoSpot DCP-101 Specifications

System Model ThermoSpot DCP-101


Temperature Performance 1, 2
Range: -55 to 175°C @ 23°C ambient
Accuracy: ±1.0°C
Stability: ±0.2°C
Cooling Power1 20W @ -40°C
Transition Rates 1
25 to -40°C, <2.5 min.
Temperature Sensors Main sensor: RTD, DUT sensors: K thermocouple, Diode, 100Ω RTD, Analog
Temperature Calibration Software calibrated
Communications Interface Ethernet (TCP/IP) and optional USB, IEEE488, RS232 communications
DUT Pressure Force 2 to 100 Kg/Force (depending on interface)
DUT Dimensions From 2x2mm to 100x100mm (0.078” to 3.937”)
Operator Interface 5.25” color touch-screen, programmable with 0.1°C resolution
Preset temperatures,ramp,soak,cycle.
Ramp rate control, Graphing and data logging, Web server, Offset calibration
Analog temperature inputs
Thermal Head 89mm (3.5”) diameter
Thermal Head Hose 1.8 meters (69”) long
Frost Free Thermal Head Low flow dry air or nitrogen purge 0.05cfm, -70°C (-94°F) dew point
Controlled automatically
Physical Dimensions 445mm D x 356m W x 299mm H (17.5”D x 14.0”W x 11.75”H)
System Weight 27.2 Kg (60.0 lbs.)
Noise Level 55 dBA
Power Requirements 100/115/120 VAC (±10%), 15 amp, 50/60Hz
220/230 VAC (±10%), 10 amp, 50/60Hz
Purge Dry Air Supply User supplied, regulated, -70°C (-94°F) air or nitrogen, 0.1cfm at 0.2 BAR
Operating Environment Temperature: 5 to 35°C (40 to 95°F), Humidity: 20 to 95% RH
1
as measured at thermal head, cooling power reduced by 5°C at 50Hz
2

Positioning and Alignment


1. 2.
1. Boom Stand: provides X, Y, Z
positioning of thermal head.
2. Pneumatic Stand: provides X, Y,
Z, positioning and measured downward
force to DUT.
3. Bench Stand: free-motion stand and
boom to manually position the thermal
head over DUT.
3. DUT Interfacing

Test Socket Alignment - latches and


guide pins provide easy and secure con-
nections to the test socket.
Soldered Component Alignment -
customized interfaces to accommodate
PCB layout and chip geometry.

The inTEST Thermal family includes three temperature-related corporations: Temptronic, Sigma Systems, and Thermonics.
Products include thermal chambers and plates, temperature forcing systems, and process chillers. Specifications subject to change.

inTEST Thermal Solutions [email protected] ISO 9001 Registered


41 Hampden Road www.inTESTthermal.com p/n SL11110B
Mansfield, MA 02048 USA +1.781.688.2300

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