JHD16064 LCD Specification
JHD16064 LCD Specification
Product Specification
Ordering No: JHD16064-G13BFW
Model No: JHD16064-G13BFW
(For JHD internal use only)
Approved for pilot production. Please specify minimum quantity (if any) ________ pcs
1
REVISION HISTORY:
2
CONTENTS
1.0 GENERAL SPECIFICATION
2.0 LCM NUMBERING SYSTEM
3.0 OUTLINE DRAWING
4.0 INTERFACE PIN DESCRIPTION
5.0 BLOCK DIAGRAM
6.0 OPERATING PRINCIPLE & DRIVING METHOD
7.0 ABSOLUTE MAXIMUM RATINGS
8.0 ELECTRICAL CHARACTERISTICS
9.0 ELECTRO-OPTICAL CHARACTERISTICS
10.0 STANDARD SPECIFICATION FOR RELIABILITY
11.0 QUALITY ASSURANCE
12.0 PRECAUTIONS FOR USING LCD MODULE
13.0 MANUFACTURER CONTACT
3
1.0 GENERAL SPECIFICATION
Item Contents Unit
LCD type FSTN POSITIVE/NEGATIVE -
Viewing direction 6:00 O’Clock
4
5
)
(
双面胶T=0.1mm
补强5.00
露金3.00
OUTLINE DRAWING
深圳市晶惠迪电子有限公司
3.0
1 * 5 = 5 color:White(白色)
4.0 INTERFACE PIN DESCRIPTION
Pin No. Symbol Pin Description
1-8 D7-D0 Data bus
9 RST A reset pin.
10 CS0 Chip select signal input(low active)
11 CD/A0 Data or command select signal input
12 WR0 Write select signal input
13 WR1 Read select signal
14 BM1 Bus mode
15 BM0 Bus mode
16 ID ID pin is for production control
17 POR-DIS Power-ON reset control
18 VSS Ground
19 VDD Power supply(+3.0)
20 TST4 VPP is the power pin of embedded OTP non-volatile memory circuit
21 VLCD High voltage LCD Power Supply
22 VA0- LCD Bias Voltages
23 VA1- LCD Bias Voltages
24 VA1+ LCD Bias Voltages
25 VA0+ LCD Bias Voltages
26 VB0- LCD Bias Voltages
27 VB1- LCD Bias Voltages
28 VB1+ LCD Bias Voltages
29 VB0+ LCD Bias Voltages
30 NC NC
6
5.0 BLOCK DIAGRAM
30 1
I/F
UC1638
160
A
64
160X64
BL
K
7
6.0 OPERATING PRINCIPLE & DRIVING METHOD
8
9
7.0 ABSOLUTE MAXIMUM RATINGS (Ta = 25°C, VSS = 0 V)
10
8.0 ELECTRICAL CHARACTERISTICS
11
9.0 ELECTRO-OPTICAL CHARACTERISTICS
12
13
14
15
16
17
10.0 STANDARD SPECIFICATION FOR RELIABILITY
10.1 Standard specification of Reliability Test
No. Test Item Content of Test Test Condition
High temperature Endurance test applying the high
1 +70oC for 500Hrs
operation storage temperature for a long time.
Low temperature Endurance test applying the low -20oC for 500Hrs
2
operation storage temperature for a long time.
18
To verify the FPC/ glass connection
11 FPC peel test resistance to peel forces applied to
the FPC. Keeping the LCD fixed, pull the
FPC/FFC according to the figure above
with a force F= 10 N for cm width of
FPC at glass connection. The minimum
bending radius has to be 2 mm
Remarks:
1) For operation test, above specification is applicable when test pattern is changing during entire operation test.
2) Inspections after reliability tests are performed when the display temperature resumes back to room temperature.
3) It is a normal characteristic that some display abnormality can be seen during reliability test. If the display abnormality can
resume back to normal condition at room temperature within 24hours, there is no permanent destruction over the display. The
display still possesses its functionality after reliability tests.
19
Inspection 1 : Inspection equipments: Equipment and tools used for inspection, measuring and
Condition
testing during the inspection process.
Fluorescent
about 40 cm lamp 72 W
about 40 cm
Max 250 LUX
Polarizer
specific project
backlight
Fig 1 Fig 2
Trasflective or Transmissive LCD/LCM Reflective LCD/LCM
FPC TAB
IC
Polarizer
Zone A:
Inside Viewing Area
Zone B:
Outside Viewing Area
Fig 3
Product Configuration
20
11.2 Acceptance Criteria (Zastron internal standard: JU-MM)
Classification
Applicable
Method
Defect
Zone
Inspection Item Acceptance/Rejection Criteria
Note:
Number of spot shall not be more than 1 per each segment.
If 2 spots exist, the distance must be > 20mm between each other
21
Chip-out A. General chip-out (for glass edges and glass corner along perimeter Minor Visual B
seal) Magni
fier
Ls
X Y Z
≤2.0 ≤1.5 or ≤Ls, whichever is less ≤1/2t
≤2.0 ≤1.0 or ≤Ls, whichever is less ≤t
X = length parallel with glass edge.
Y = width perpendicular with glass edge
Z = height of glass
t = single glass thickness
Note:
Chip out shall not reach the perimeter seal.
B: Chip-out at terminal ledge or back of terminal ledge, but no Minor Visual B
exactly on terminal Magni
fier
X Y Z
≤2.0 ≤1.5 ≤1/2t
≤2.0 ≤1.0 ≤t
Note:
In the event that the distance
between the chip-out location and
the terminal is less than the width
of ITO pad Le, the acceptance
criteria of chip-out on terminal
shall apply.
22
C:Chip-out and protuberance at terminals Minor Visual B
W Magni
W U
Le fier
Meet the dimension
tolerance of the drawing
U
X Y Z
≤0.5 Le ≤0.2L or ≤2.0mm ≤1/2t
& not bridge two whichever is less
adjacent ITO pads.
Note:
Chip out and protuberance shall not co-exist on the same ITO pad.
Protuberance is not allowed if affect assembly.
D:Chip-out at corner (ITO ledge) Minor Visual B
Magni
X Y Z
fier
≤2.0 ≤2.0 ≤t
23
Black spot Visual A
White spot W Acceptable Magni
Bubble D Number fier
D≤0.15 Unlimited Minor
Foreign material
Dent
L 0.15<D≤0.25 1
D>0.25 0
W Note: If 2 spots exist, the distance
must be > 20mm between each other
L
D=(L+W)/2
Scratch line Minor Visual A
Dark line Magni
Lint W fier
L
L
Acceptable
Length Width Number
L≤3.0 W≤0.015 2
L≤1.5 W≤0.03 1
W>0.03 0
Note: If 2 line defects co-exist, the distance must be > 20mm
between each other
Endseal Minor Visual A,B
Magni
A:Length of end-sealant
fier
B:Length of seal mouth
C:Perimeter seal wi
dth
24
7. The printed patterns shall be free of stain, fingeprint and scratch. Major Visual
Magni
fier
8. Spot/pinhole on the pattern. Major Visual
D Acceptable Number
W D≤0.15 Unlimited
0.15<D≤0.25 1
D>0.25 0
L
Note:
If 2 spots exist, the distance must be >
20mm between each other
D=(L+W)/2
9. Ink pattern deformation Minor Visual A
Magni
fier
A-B≤0.15
11. Pattern misalignment Minor Visual A
25
2. FPC、HSC、FFC、shall not have folding/stress/dented mark with
sharp angle on the surface.
26
Stiffening tape 1. The tape sticking position shall meet the requirement on the Minor Visual B
MI/drawing.
Identity Label 2. Missing label/tape/marking is not acceptable.
3. The format of identification (including date code and product
Identity marking code) shall meet the requirement (eg. label,color marking, inkjet
printing) on the MI/drawing.
Metal bezel 1. Dimension and specification shall meet the requirment on the Major B
MI/drawing.
2.The lock tab of bezel shall not have wrong bending orientation, Minor Visual B
missing tab, or crack.
3.Bezel shall be free of rust, twist, deformation,finger print,oil stain and Minor B
unknown contamination.
27
12.2.2 Be sure to ground the body when handling the LCD modules. Tools
required for assembling, such as soldering irons, must be properly
grounded.
12.2.3 To reduce the amount of static electricity generated, do not conduct
assembling and other work under dry conditions. To reduce the
generation of static electricity, be careful that the air in the work is not too
dried. A relative humidity of 50%-60% is recommended.
12.2.4 The LCD module is coated with a film to protect the display surface.
Exercise care when peeling off this protective film since static electricity
may be generated.
12.2.5 When soldering the terminal of LCM, make certain the AC power source
for the soldering iron does not leak.
12.3 Precaution for soldering to the LCM
12.3.1 Observe the following when soldering lead wire, connector cable and etc.
to the LCD module.
Soldering iron temperature: 300 ~ 350C.
Soldering time: 3 sec.
Solder: eutectic solder.
Above is a recommended approach based on a 5mm distance between
soldering point and pin contact point. Due to different solder composition,
actual distance between soldering and contact point, and processing
method, it is recommended that customer to study and fine tuning their
soldering process parameters accordingly so that the temperature at pin-
LCD contact point does not exceed 85oC during soldering..
12.3.2 If soldering flux is used, be sure to remove any remaining flux after
finishing to soldering operation. (This does not apply in the case of a non-
halogen type of flux.) It is recommended that you protect the LCD surface
with a cover during soldering to prevent any damage due to flux spatters.
12.4 Precautions for Operation
12.4.1 Viewing angle varies with the change of liquid crystal driving voltage
(VO). Adjust VO to show the best contrast.
12.4.2 Driving the LCD in the voltage above the limit shortens its lifetime.
12.4.3 Response time is greatly delayed at temperature below the operating
temperature range. However, it will recover when it returns to the
specified temperature range.
12.4.4 If the display area is pushed hard during operation, the display will
become abnormal. However, it will return to normal if it is turned off and
then back on.
12.4.5 When turning the power on, input each signal after the positive/negative
voltage becomes stable (below figure is a general illustration where
typical value depends on individual product design).
28
12.5 Storage
12.5.1 When storing LCDs as spares for some years, the following precautions
are necessary.
Store them in a sealed polyethylene bag. If properly sealed, there is no
need for desiccant.
Store them in a dark place. Do not expose to sunlight or fluorescent
light, keep the temperature between 0C and 35C.
12.5.2 Environmental conditions:
Do not leave them for more than 168hrs. at 60C.
Should not be left for more than 48hrs. at -20C.
12.6 Safety
12.6.1 It is recommended to crush damaged or unnecessary LCD into pieces and
wash them off with solvents such as acetone and ethanol, which should
later be burned.
12.6.2 If any liquid leaks out of a damaged glass cell and comes in contact with
the hands, wash off thoroughly with soap and water.
29