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project1-macroflow

The document outlines a project involving the analysis of airflow and heat transfer in a telecommunications cabinet containing 13 printed circuit board arrays. It specifies the configuration, including fan trays and power supply units, and poses questions regarding maximum flow rates, temperature estimates, and modifications for uniform board temperatures. The report requires a detailed examination of the system's thermal dynamics and airflow characteristics.

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4 views

project1-macroflow

The document outlines a project involving the analysis of airflow and heat transfer in a telecommunications cabinet containing 13 printed circuit board arrays. It specifies the configuration, including fan trays and power supply units, and poses questions regarding maximum flow rates, temperature estimates, and modifications for uniform board temperatures. The report requires a detailed examination of the system's thermal dynamics and airflow characteristics.

Uploaded by

anhtri.journal
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOC, PDF, TXT or read online on Scribd
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Project 1:

Due: 2/28/2005
e-mail: Report with pictures and macroflow file (electronic) or
submit paper report with floppy including macroflow files

Problem Description :

The following is a cross-sectional view of an electronic cabinet containing 13 printed


circuit board arrays. The system configuration represents a telecommunications cabinet.
The airflow is driven by four fan trays at the front of the cabinet. Two 150-watt power-
supply units (70% efficiency) are situated next to the fan trays to pull air through a
common inlet screen that covers the whole front-side of the cabinet. This screen has a
wire-mesh that is 35% open with a wire size of 0.1 inches. Air at room temperature (25
C) is drawn through this inlet screen by the fans and the power-supply and spreads in the
area before the mid-plane of the cabinet. The mid-plane has a screen that is very similar
to the inlet-screen (wire-mesh) and is located in the middle of the cabinet. The air from
this plenum area goes through the mid-plane to cool the PCB’s. The PCB assembly
contains two sections. The bottom section has a set of thirteen I/O boards (6 Watts each)
that are 4 inches tall and 15 inches long (oriented vertically). The top section has two
motherboards that are separated by 1” oriented horizontally and occupies the entire
section. These motherboards dissipate 140 Watts and 50 Watts respectively. Air moves
through these two sections and then exits the cabinet through the outlet screen (similar to
the inlet screen in properties).

The size and the distribution of the chips on the I/O boards and motherboards can be
ignored. Use the following pressure loss (DP) vs. flow rate relationship for the power
supply.

Power supply: DP (Pa) = 50,000 Q2 (flow rate in m3/s)

Each fan tray has two fans (92mm) in series. Pick a fan from the library that delivers
close to a maximum flow rate of 100 cfm and a maximum head of 0.2 inches of water.
The power supply units have two fans in parallel each with 18 cfm maximum flow rate
and a maximum head of 0.14” of water. [Use a fan that is closest to the above
specification roughly 1.5 “ in diameter]

Questions :

Analyze the heat transfer and flow inside the box and write a report discussing the flow
inside the box and discuss the following items.

1. Maximum flow rate and maximum pressure drop through each of the components.
2. What is the maximum temperature of the air leaving the cabinet ? Does this match
your ‘back-of-the envelope’ calculations ?
3. What is the estimate for average board temperature for the mother boards ?
4. If you want all the boards to have the same average temperature, how would you
modify the system ?
Mid-plane screen
Power [wire-mesh]
Supply x2

Fan-
tray 4
50-cm wide

Fan
tray-3
Inlet
Outlet
Fan
tray-2

Fan-
tray 1

80 – cm Long
13 Cards (I/O)
4 Fan trays in parallel : 100 equally spaced
cfm free-flow with 0.2”
water pressure head for each
fan

Mid-plane screen Motherboards


[wire-mesh]

Mother boards in top section

6 inches
tall Fan
Trays

Power Supply

Side View

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