EC3401 NS Unit - 5
EC3401 NS Unit - 5
The overall concept of hardware security and trust can broadly be categorized into two classes: direct
attacks on hardware, including respective countermeasures and system-level security.
The hardware attacks encompass both security issues and trust issues.
Hardware security issues arise from its vulnerability to attacks (e.g., side-channel or hardware
Trojan attacks) at different levels of abstraction (chip or PCB) and the lack of adequate hardware
support for software and system security.
On the other hand, hardware trust issues arise when the untrusted entities get associated with the
hardware’s lifecycle.
PCB-Level Attacks:
PCBs are common targets for attackers.
Primary goals for these attacks are to reverse engineer the PCB, and obtain the schematic of the
board to redesign it and create fake units.
Attackers may also physically tamper a PCB to make them leak sensitive information.
System-Level Attacks:
Class Notes (13 & 15 Marks QB) Page 2 of 18
Complex attacks involving the interaction of hardware-software components can be mounted on the
system.
By directly focusing on the most vulnerable parts in a system, such as PCB level (for example,
JTAG) and memory modules, attackers may be able to compromise the system’s security by gaining
unauthorized control and access to sensitive data.
VULNERABILITIES
Vulnerabilities refer to weakness in hardware architecture, implementation, or design/test process,
which can be exploited by an attacker to mount an attack.
Following is a description of some typical vulnerabilities in hardware systems:
Functional Bug:
Most vulnerabilities are caused by functional bugs and poor design/testing practices.
They include weak cryptographic hardware implementation and inadequate protection of assets in an
SOC.
Attackers may find these vulnerabilities by analyzing the functionality of a system for different input
conditions to look for any abnormal behaviors.
Side-Channel Bug:
These bugs represent implementation-level issues that leak critical information stored inside a
hardware component (e.g. processors or cryptochips) through different forms of side-channels.
Test/Debug infrastructure:
Test engineers provide the study internal operations and processes running in a hardware, which are
essential for debugging a hardware.
These can be misused by attackers, where extraction of sensitive information or unwanted control of
a system can be possible using the test/debug features.
Access control or information-flow issues:
A system may not distinguish between authorized and unauthorized users.
It may give an attacker access to secret assets and functionality that can be misused.
Moreover, an intelligent adversary can monitor the information flow during system operation to
decipher security-critical information.
COUNTERMEASURES
Countermeasures can either be employed at design or test time.
Figure shows the current state of the practice in the industry for SoCs in terms of:
(a) incorporating security measures in a design (referred to as “security design”), and
(b) verifying that these measures protect a system against known attacks (referred to as “security
validation”).
Both pre- and post-silicon security validation come in various forms, which vary
in terms of coverage of security vulnerabilities, the resulting confidence, and the
scalability of the approach to large designs.
Fig. State of the practice in security design and validation along the life cycle of a system on chip.
Design solutions:
Design-for-security (DfS) practices have emerged as powerful counter measures.
DfS techniques, such as obfuscation, use of reliable security primitives, side-channel resistance and
hardening schemes for Trojan insertion, can protect against many major attack vectors.
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HARDWARE TROJANS
Explain Hardware Trojans.
A hardware Trojan (HT) is defined as a malicious, intentional modification of a circuit design that
results in undesired behavior when the circuit is deployed
SoCs that are ‘infected’ by a hardware Trojan may experience changes in their functionality or may
leak sensitive information or may have unreliable performance.
Hardware Trojan Structure
Figure shows the basic structure of the Trojan at gate level.
The trigger inputs (T1, T2, ..., Tk) come from various nets in the circuit.
The payload taps the original signal Neti from the original (Trojan-free) circuit and the output of the
Trigger.
Since the trigger is expected to be activated under rare condition, the payload output stays at the
same value most of the time, Neti.
However, when the trigger is active, that is, TriggerEnable is “0”, the payload output will be
different from Neti; this could result in injecting an erroneous value into the circuit and causing error
at the output.
Trojan Modeling:
Trojan will be activated by rare circuit node conditions and will have its payload as a critical node in
terms of functionality, but low observable node in terms of testing, to evade detection during normal
functional testing.
If the Trojan includes sequential elements, such as rare-event triggered counters, then the Trojan may
be even harder to detect.
The trigger condition is an n-bit value at internal nodes, which is assumed to be rare enough to evade
normal functional testing.
The payload is defined as a node that is inverted when the Trojan is activated.
To make it more difficult to detect, one might consider a sequential Trojan, which requires the rare
event to repeat 2m times before the Trojan gets activated and inverts the payload node.
Passive attacks: observe the behavior of the device to infer information about the secret
Active Attacks: physically operate on the device to gather information about secret (e.g.
fault injection or microprobing)
Active vs. passive attacks: Active attacks exploit side-channel inputs Passive attacks exploit
side-channel outputs
What are the Side-Channels Used?
Power analysis attacks is to reveal secret information from a device by analyzing its power
consumption .it is mainly used to extract the secret key of cryptographic systems and successfully
break the Advanced Encryption Standard (AES) in a few minutes.
Types of Power Analysis
Three types of power side-channel analysis: simple power analysis (SPA), differential , power
analysis (DPA), and correlation power analysis (CPA).
SPA is a technique that aims to observe power measurements obtained while the device
under attack is in operation mode.
It can only apply a successful attack if the recorded power consumption can lead to critical
information about the device being revealed.
DPA is widely used to reveal secret keys of cryptographic systems by obtaining power traces
while the system is encrypting or decrypting data blocks.
Electromagnetic (EM) Side-Channel Attacks- An adversary usually aims to capture EM signals
that are produced by current flows of data processing stages, where most waves occur, due to the
switching activity of a device.
It allows critical information to be leaked naturally during operation. When applying EM side-
channel analysis, switching activities can be easily captured and translated into a series of events and
instances that occur in each clock cycle.
In a fault injection attack, or fault attack, a physical fault is deliberately injected in a device
during its operation with the objective of leaking critical information.
Such a fault can be injected by disturbing the clock or voltage source, or by using a laser beam, in
order to modify memory or register locations, or to induce other fault effects.
A covert channel is one that allows communication between software processes that are not
authorized to communicate within a system.
These communication channels are often not monitored, as security policies may not be able to
recognize them.
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Physical Attacks and Countermeasures
Explain about Physical Attacks and Countermeasures. (May 2023)
1) Chip-level RE:
RE of chips can be nondestructive or destructive. X-ray tomography is a nondestructive method of
RE that can provide layer-by-layer images of chips, and is often used for the analysis of internal vias,
traces, wire bonding, capacitors, contacts, or resistors.
Destructive analysis, on the other hand, might consist of etching and grinding every layer for
analysis.
During the delayering process, pictures are taken by either a scanning electron microscope (SEM),
or a transmission electron microscope (TEM).
At the chip level, the goal of the RE process is to find package materials, wire bonding, different
metal layers, contacts, vias and active layers, and interconnections between metal layers.
The RE process has several different steps:
o Decapsulation: Decapsulation exposes the internal components of the chip, which allows for
the inspection of the die, interconnections, and other features.
o Delayering: The die is analyzed layer by layer, destructively, to see each metal, passivation,
poly, and active layer.
o Imaging: An image is taken of each layer in the delayering process by using SEM, TEM, or
SCM.
Mining
The process of adding transactional details to the present digital/public ledger is called ‘mining.’
Though the term is associated with Bitcoin, it is used to refer to other Blockchain technologies as
well.
Mining involves generating the hash of a block transaction, which is tough to forge, thereby
ensuring the safety of the entire Blockchain without needing a central system.
Advantages
Decentralized network, transparency, trusty chain, unalterable and indestructible technology.
Disadvantages
High energy dependence, the difficult process of integration and the implementation's high costs.
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5. What is Vulnerabilities?
Vulnerabilities refer to weakness in hardware architecture, implementation, or design/test process,
which can be exploited by an attacker to mount an attack
b) Its behavior (i.e., how it shows up and what are its effects)