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Lecture 3

The document is a formula sheet for the course EE223, covering fundamentals of electronic devices, including intrinsic carrier concentrations, drift and diffusion current densities, and calculations related to semiconductor materials. It provides specific equations and solutions for silicon and gallium arsenide at 300 K, along with various doping scenarios. The document serves as a reference for students studying electronic device fundamentals and semiconductor properties.
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0% found this document useful (0 votes)
3 views

Lecture 3

The document is a formula sheet for the course EE223, covering fundamentals of electronic devices, including intrinsic carrier concentrations, drift and diffusion current densities, and calculations related to semiconductor materials. It provides specific equations and solutions for silicon and gallium arsenide at 300 K, along with various doping scenarios. The document serves as a reference for students studying electronic device fundamentals and semiconductor properties.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Imam Mohammad Ibn Saud Islamic University

College of Engineering
Electrical Department

EE223
Fundamentals of Electronic Devices
Formula Sheet

−𝐸𝑔
𝑘𝑇 𝑑 𝑥
𝑛𝑖 = 𝐵𝑇 3Τ2 𝑒 2𝑘𝑇 , 𝑉𝑇 = , 𝑉𝑇 𝑎𝑡 300 𝐾 = 26 𝑚𝑉, 𝐽 = 𝐸𝑞(𝑝𝜇𝑝 + 𝑛𝜇𝑛 ), 𝐽 = 𝑞𝐷 ,
𝑞 𝑑𝑥
𝐷𝑛 𝐷𝑝
= 𝜇 = 𝑉𝑇
𝜇𝑛 𝑝

2𝜀𝑠 1 1 𝑁𝑎 𝑁𝑑 𝐶𝐽0 𝜏𝑇
𝑊= +𝑁 𝑉𝑏𝑖 , 𝑄𝐽 = 𝐴𝑞𝑊 , 𝐶𝐽 = , 𝐶𝑑 = 𝐼𝐷
𝑞 𝑁𝑎 𝑑 𝑁𝑎 +𝑁𝑑 𝑉
1+𝑉 𝑅 𝑉𝑇
𝑏𝑖
𝑣𝐷
𝑞𝜀𝑠 𝑁𝑑 𝑁𝑎 1 𝐷𝑝 𝐷𝑛
𝐶𝐽0 = 𝐴 2 𝑁𝑑 +𝑁𝑎 𝑉𝑏𝑖
, 𝑖𝐷 = 𝐼𝑠 𝑒 𝑛𝑉𝑇 − 1 , 𝐼𝑠 = 𝐴𝑞𝑛𝑖2 𝐿𝑝 𝑁𝐷
+𝐿
𝑛 𝑁𝐴

𝑘 = 86 × 10−6 𝑒𝑉Τ𝐾 = 1.38 × 10−23 𝐽Τ𝐾 , 𝑞 = 1.68𝑥10−19 𝐶


For Si at temperature equals 300 K:
𝐸𝑔 = 1.1 𝑒𝑉, 𝐵 = 5.23 × 1015 𝑐𝑚−3 𝐾 −3Τ2 , 𝜀𝑠 = 1.04 × 10−12 𝐹ൗ𝑐𝑚 ,
𝑐𝑚 2 𝑐𝑚 2
𝑛𝑖 = 1.5 × 1010 𝑐𝑚−3 , 𝜇𝑛 = 1350 ൗ𝑉. 𝑠 , 𝑎𝑛𝑑 𝜇𝑝 = 480 ൗ𝑉. 𝑠
Semiconductor Materials and Properties

Q1: Calculate the intrinsic carrier concentration in silicon at T = 300 K.

Q2: Calculate the intrinsic carrier concentration in gallium arsenide at T = 300 K.

𝑘 = 86 × 10−6 𝑒𝑉 Τ𝐾
Semiconductor Materials and Properties

Sol1:
T= 300 K
−𝐸𝑔
3Τ2 2𝑘𝑻
𝑛𝑖 = 𝐵𝑻 𝑒
−1.1
15 3 Τ2 2(86 × 10−6 )(300)
𝑛𝑖 = (5.32 × 10 )(300) 𝑒

𝑛𝑖 = 1.5 × 1010 𝑐𝑚−3

Sol2: T=300 K
−𝐸𝑔
3 Τ2 2𝑘𝑻
𝑛𝑖 = 𝐵𝑻 𝑒
−1.4
14 3 Τ2 2(86 × 10−6 )(300)
𝑛𝑖 = (2.1 × 10 )(300) 𝑒

𝑛𝑖 = 1.8 × 106 𝑐𝑚−3

𝑘 = 86 × 10−6 𝑒𝑉 Τ𝐾
Semiconductor Materials and Properties
Q3: Calculate the thermal equilibrium electron and hole concentrations.

(a) Consider silicon at T = 300 K doped with phosphorus at a concentration of 1016 𝑐𝑚−3 .

(b) Consider silicon at T = 300 K doped with boron at a concentration of 5 × 1016 𝑐𝑚−3 .
Semiconductor Materials and Properties

Sol: (a) T= 300 K and 𝑁𝑑 = 1016 𝑐𝑚−3


𝑛 ≈ 𝑁𝑑 = 1016 𝑐𝑚−3
𝑛𝑖2 1.5 × 1010 2
𝑝= = 16
= 2.25 × 104 𝑐𝑚−3
𝑁𝑑 10

(b) T= 300 K and 𝑁𝑎 = 5 × 1016 𝑐𝑚−3


𝑝 ≈ 𝑁𝑎 = 5 × 1016 𝑐𝑚−3
𝑛𝑖2 1.5 × 1010 2
𝑛= = 16
= 4.5 × 103 𝑐𝑚−3
𝑁𝑎 5 × 10
Semiconductor Materials and Properties
Q4: Calculate the drift current density for a silicon at T = 300 K doped with arsenic atoms at a concentration
2 2
of 8 × 1015 𝑐𝑚−3 . Assume electron and hole mobility values are 1350 𝑐𝑚 ൗ𝑉.𝑠 and 480 𝑐𝑚 ൗ𝑉.𝑠. Assume the
applied electric field is 100 V/cm.
Semiconductor Materials and Properties

Sol: T=300 K, 𝑁𝑑 = 8 × 1015 𝑐𝑚−3


2 2
𝜇𝑛 = 1350 𝑐𝑚 ൗ𝑉.𝑠, 𝜇𝑝 = 480 𝑐𝑚 ൗ𝑉.𝑠, and E= 100 V/cm

𝑛 ≈ 𝑁𝑑 = 8 × 1015 𝑐𝑚−3
𝑛𝑖2 1.5 × 1010 2
𝑝= = 15
= 2.81 × 104 𝑐𝑚−3
𝑁𝑑 8 × 10
𝐽 = 𝐸𝜎 OR 𝐽 = 𝐸Τ𝜌
𝜎 = 𝑞(𝑝𝜇𝑝 + 𝑛𝜇𝑛 )
𝜎 = 1.68 × 10−19 2.81 × 104 480 + 8 × 1015 1350
= 1.68 × 10−19 13.488 × 106 + 10.8 × 1018
= 1.81 Ω. 𝑐𝑚 −1
𝐽 = 100 × 1.81 = 181 𝐴Τ𝑐𝑚2
Semiconductor Materials and Properties
Q5: Calculate the diffusion current density for silicon at T = 300 K. Assume the electron concentration
varies linearly from 1012 𝑐𝑚−3 to 1016 𝑐𝑚−3 over the distance from 0 to 3 μm. Assume electron diffusion
2
constant is 35 𝑐𝑚 Τ𝑠.
Semiconductor Materials and Properties

Sol:

1016
T = 300 K and 𝐷𝑛 = 35 𝑐𝑚2Τ
𝑠
1012
𝑑𝑛 𝑥
𝐽𝑛 = 𝑞𝐷𝑛 0 3 μm
𝑑𝑥
(1016 − 1012 )
𝐽𝑛 = 1.68 × 10−19 35 3 × 10−4 𝑐𝑚
(3 × 10−4 − 0)
𝐽𝑛 = 196 𝐴ൗ 2
𝑐𝑚
Semiconductor Materials and Properties

Q6: Holes are being steadily injected into a region of n-type silicon. 𝑁𝐷 = 1016 𝑐𝑚−3 , 𝑛𝑖 = 1.5 × 1010 𝑐𝑚−3 ,
2
𝐷𝑝 = 12 𝑐𝑚 Τ𝑠, and W = 50 nm find the density of the current that will flow in the x direction.
Semiconductor Materials and Properties

Sol:
𝑁𝐷 = 1016 𝑐𝑚−3 , 𝑛𝑖 = 1.5 × 1010 𝑐𝑚−3 , 𝐷𝑝 = 12 𝑐𝑚2Τ , and W = 50 nm
𝑠

𝑛 ≈ 𝑁𝑑 = 1016 𝑐𝑚−3
𝑛𝑖2 1.5 × 1010 2
𝑝𝑛 = = 16
= 2.25 × 104 𝑐𝑚−3
𝑁𝑑 10
𝑑𝑝 𝑥
𝐽𝑝 = −𝑞𝐷𝑝
𝑑𝑥
−19
𝐽𝑝 = − 1.68 × 10 12(−4.5 × 1017 )
𝐽𝑝 = 0.907 𝐴ൗ 2
𝑐𝑚
𝑑𝑝 𝑥 (2.25 × 104 − 108 × 2.25 × 104
=
Since 𝐽𝑝 is positive, the current flows in the x direction 𝑑𝑥
𝑑𝑝 𝑥
(50 × 10−7 − 0)
= −4.5 × 1017
𝑑𝑥
Semiconductor Materials and Properties
Q7: Find the current that flows in a silicon bar of 10 𝜇𝑚 length having a 5 𝜇𝑚 * 4 𝜇𝑚 cross-section and having
free-electron and hole densities of 104 𝑐𝑚−3 and 1016 𝑐𝑚−3 respectively, when a 1 V is applied end-to-end. Use
2 2
electron mobility value of 1350 𝑐𝑚 ൗ𝑉.𝑠 and hole mobility value of 480 𝑐𝑚 ൗ𝑉.𝑠.
Semiconductor Materials and Properties

Sol:

𝐽 = 𝐸𝑞 𝑝𝜇𝑝 + 𝑛𝜇𝑛 → 𝐼 = 𝐴𝐸𝑞 𝑝𝜇𝑝 + 𝑛𝜇𝑛

10 𝜇𝑚 = 1 × 10−3 𝑐𝑚

5 𝜇𝑚
4 𝜇𝑚

𝐴 = 5 𝜇𝑚 × 4 𝜇𝑚 = 5 × 10−4 × 4 × 10−4 = 2 × 10−7 𝑐𝑚2


𝑉 1
𝐸= = = 1000 V/cm
𝑙 1 × 10−3

𝐼 = (2 × 10−7 )(1000)(1.68 × 10−19 ) 1016 × 480 + 104 × 1350

𝐼 = 161 𝜇A
Semiconductor Materials and Properties

Q8: In a phosphorus-doped silicon layer with impurity concentration of 1016 𝑐𝑚−3 , find the hole and electron
concentrations at 27°C
Semiconductor Materials and Properties

Sol:
T= 27°C = 27+273= 300 K

𝑁𝑑 = 1016 𝑐𝑚−3

𝑛 ≈ 𝑁𝑑 = 1016 𝑐𝑚−3

𝑛𝑖2 1.5 × 1010 2


𝑝= = = 2.25 × 104 𝑐𝑚−3
𝑁𝑑 1016

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