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Materials and Tools

The document outlines objectives and practical steps for using electronic special tools and equipment, including soldering, desoldering, and degaussing. It details the required tools and equipment, as well as the process for fabricating a casing for electronic devices according to specifications. Additionally, it includes sections for practical observations and results related to various electronic measurements and tasks.

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tinashe mandinika
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7 views5 pages

Materials and Tools

The document outlines objectives and practical steps for using electronic special tools and equipment, including soldering, desoldering, and degaussing. It details the required tools and equipment, as well as the process for fabricating a casing for electronic devices according to specifications. Additionally, it includes sections for practical observations and results related to various electronic measurements and tasks.

Uploaded by

tinashe mandinika
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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MATERIALS AND TOOLS

Objec1ve:
1. To iden*fy and use electronic special tools such as soldering irons, desoldering tools,
and degaussing coils.
2. To iden*fy and use electronic equipment like mul*meters, oscilloscopes, signal
generators, hot air sta*ons, frequency counters, and wa=meters.
3. To demonstrate the ability to fabricate a casing according to given specifica*ons.

Equipment and Tools Required:


Special Tools:
1. Soldering Iron
2. Desoldering Pump/Solder Wick
3. Degaussing Coil
Electronic Equipment:
1. Digital Mul*meter (DMM)
2. Oscilloscope
3. Signal Generator
4. Hot Air Sta*on
5. Frequency Counter
6. Wa=meter
Fabrica1on Tools:
1. Measuring Tape/Ruler
2. CuUng Tools (Hacksaw, Dremel, etc.)
3. Drilling Machine
4. Screwdrivers and Fasteners
5. Enclosure/Casing Material (Plas*c/Metal)

Prac1cal Steps

4.2.2 Iden1fy and Use Electronic Special Tools

1. Soldering
Objec1ve:
To solder electronic components onto a PCB.
Steps:
1. Prepara1on:
o Clean the soldering iron *p using a damp sponge.
o Tin the *p by applying a small amount of solder.
2. Soldering:
o Place the component leads through the PCB holes.
o Heat the joint with the soldering iron and apply solder to the joint.
o Ensure the solder flows smoothly and forms a shiny, cone-shaped joint.
3. Inspec1on:
o Check for cold joints, bridges, or insufficient solder.

2. Desoldering
Objec1ve:
To remove solder and components from a PCB.
Steps:
1. Desoldering Pump:
o Heat the solder joint with the soldering iron.
o Press the plunger on the desoldering pump and release it to suck up the
molten solder.
2. Solder Wick:
o Place the solder wick over the solder joint.
o Heat the wick with the soldering iron to absorb the solder.
3. Inspec1on:
o Ensure all solder is removed and the component can be safely extracted.

3. Degaussing Coils
Objec1ve:
To demagne*ze tools and components.
Steps:
1. Prepara1on:
o Turn on the degaussing coil and hold it close to the object to be
demagne*zed.
2. Degaussing:
o Slowly move the coil in a circular mo*on around the object.
o Gradually move the coil away from the object while con*nuing the circular
mo*on.
3. Verifica1on:
o Use a magnet to verify that the object is no longer magne*zed.

4.2.3 Iden1fy and Use Electronic Equipment

1. Mul1meter
Objec1ve:
To measure voltage, current, and resistance.
Steps:
1. Voltage Measurement:
o Set the mul*meter to the voltage mode (AC or DC).
o Connect the probes across the component or circuit.
2. Current Measurement:
o Set the mul*meter to the current mode.
o Break the circuit and connect the mul*meter in series.
3. Resistance Measurement:
o Set the mul*meter to the resistance mode.
o Connect the probes across the resistor.

2. Oscilloscope
Objec1ve:
To visualize and measure waveforms.
Steps:
1. Setup:
o Connect the probe to the oscilloscope and the circuit.
o Set the *mebase and voltage scale.
2. Measurement:
o Observe the waveform on the screen.
o Measure amplitude, frequency, and phase.

3. Signal Generator
Objec1ve:
To generate test signals.
Steps:
1. Setup:
o Connect the signal generator to the circuit or oscilloscope.
2. Signal Genera1on:
o Set the desired frequency, amplitude, and waveform (sine, square, triangle).
o Verify the output using the oscilloscope.

4. Hot Air Sta1on


Objec1ve:
To solder or desolder surface-mount components.
Steps:
1. Setup:
o Set the temperature and airflow according to the component specifica*ons.
2. Soldering/Desoldering:
o Direct the hot air nozzle at the component pins.
o Apply solder paste for soldering or use tweezers to remove components for
desoldering.

5. Frequency Counter
Objec1ve:
To measure the frequency of a signal.
Steps:
1. Setup:
o Connect the frequency counter to the signal source.
2. Measurement:
o Read the frequency displayed on the counter.

6. WaVmeter
Objec1ve:
To measure power in a circuit.
Steps:
1. Setup:
o Connect the wa=meter in series with the load.
2. Measurement:
o Read the power (in wa=s) displayed on the wa=meter.

4.2.4 Fabricate a Casing to Given Specifica1ons


Objec1ve:
To design and fabricate a casing for an electronic device.
Steps:
1. Design:
o Measure the dimensions of the electronic device.
o Sketch the casing design, including holes for connectors, switches, and
ven*la*on.
2. Material Selec1on:
o Choose appropriate material (plas*c, metal, or wood).
3. Fabrica1on:
o Cut the material to the required dimensions using a hacksaw or Dremel.
o Drill holes for moun*ng screws, connectors, and switches.
o Assemble the casing using screws or adhesive.
4. Tes1ng:
o Ensure the device fits securely inside the casing.
o Verify that all connectors and switches are accessible.

Prac1cal Observa1ons and Results


1. Soldering:
o Quality of solder joints: _____
o Issues encountered: _____
2. Desoldering:
o Effec*veness of desoldering: _____
o Issues encountered: _____
3. Degaussing:
o Verifica*on of demagne*za*on: _____
4. Mul1meter:
o Voltage measurement: _____ V
o Current measurement: _____ A
o Resistance measurement: _____ Ω
5. Oscilloscope:
o Waveform observed: _____
o Amplitude: _____ V
o Frequency: _____ Hz
6. Signal Generator:
o Signal generated: _____
o Frequency: _____ Hz
o Amplitude: _____ V
7. Hot Air Sta1on:
o Component soldered/desoldered: _____
o Issues encountered: _____
8. Frequency Counter:
o Frequency measured: _____ Hz
9. WaVmeter:
o Power measured: _____ W
10. Casing Fabrica1on:
o Dimensions: _____
o Material used: _____
o Fit and finish: _____

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