HW2
HW2
(a) Test the hypothesis that the two variances are equal. Use 𝛼 = 0.05.
(b) Using the results of (a), test the hypothesis that the mean burning times are equal. Use 𝛼 = 0.05. What is the P-value for
this test?
(a) Can you conclude that the two variances are equal? Use 𝛼 = 0.05.
(b) Has the filtering device reduced the percentage of impurity significantly? Use 𝛼 = 0.05.
Photoresist is a light-sensitive material applied to semiconductor wafers so that the circuit pattern can be imaged on to
the wafer. After application, the coated wafers are baked to remove the solvent in the photoresist mixture and to harden
the resist. Here are measurements of photoresist thickness (in kA) for eight wafers baked at two different tem-
peratures. Assume that all of the runs were made in random order.
(a) Is there evidence to support the claim that the higher baking temperature results in wafers with a lower mean
photoresist thickness? Use 𝛼 = 0.05.
(b) What is the P-value for the test conducted in part (a)?
Comparison of temperatures of the two baked wafers
The deflection temperature under load for two different formulations of ABS plastic pipe is being studied. Two
samples of 12 observations each are prepared using each formulation and the deflection temperatures (in F) are reported
below:
(b) Do the data support the claim that the mean deflection temperature under load for formulation 1 exceeds that of formulation 2?
Use 𝛼 = 0.05.
(c) What is the P-value for the test in part (a)?
In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to
(a) Do the data indicate that the claim that both solutions have the same mean etch rate is valid? Use 𝛼 = 0.05 and assume
equal variances.