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Solutions for the end-of-the-chapter exercises in

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Chapter 2
2.1 Which of the following transduction mechanisms can be used to realize a micromachined
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accelerometer? (a) piezoresitivity, (b) piezoelectricity, (c) Peltier effect, (d) Hall effect, and
(e) photoelectric effect. For those transduction techniques useful in making an accelerometer,
draw a sketch and explain how such an accelerometer would work.
Solution
Piezoresistive and piezoelectric effects are widely used in making micromachined
accelerometers. Hall effect is used to make proximity (distance-measuring) sensor chips. So,
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it can also be used to measure acceleration. Peltier and photoelectric effects are suitable for
measuring acceleration directly.

2.2 As compared with the size of the other components (e.g. fan, lamp, lens, etc.) in a digital
projector, the size of the micromirror array chip is quite small. Argue why it is necessary to
make the chip so small. What happens if the size of each mirror is increased?
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Solution
If the micro-mirror is large, we need a bigger beam of light to call on it. More scattering
occurs when light travels over larger distances involved in a larger mirror. Also, more energy
is needed to move larger mirrors. Hence, making them small makes sense. Perhaps slightly
larger size might not be too bad either if it results in cheaper fabrication even if the
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performance is slightly compromised.

2.3 Collect data on electrostatic comb-drives to answer the following questions:

a. Why is a comb arrangement with many interdigitated fingers used?
b. Is the force vs. deflection characteristic of a comb-drive actuator linear?
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c. How much force and displacement can be generated with a typical comb-drive?
d. Will a comb-drive work in aqueous environments?
Solution
a. More fingers means more force.
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b. Actually, to first order, the force is constant with displacement. If fringing fields are
taken into account, some nonlinearity will be evident.
c. A few 10s of µN force (perhaps a mN with difficulty) over a few µm can be generated
with an electrostatic comb-drive micro-actuator.
d. No, unless the water is de-ionized and made non-conducting.

2.4 We discussed a conductometric gas sensor in this chapter. What are other methods that
are used to detect gases? Which one has been used in microsystems? Which ones could be
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used and which ones cannot be used? Support your answers with suitable arguments.
Solution
Correlation spectrometry can be used for detecting gases, even remotely. Here, by using
reference spectrum cell, one can check what wavelengths are missing from the light coming
from a gas. Microsystems technology has been used for generating the reference
wavelengths. There is company called Polychromix that makes such devices.
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2.5 Find an used inkjet print head. Break it open to see where the chip is and how it is
connected to the components that are around it. Do the same for the ink-cartridge. Identify

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different components that make the microsystems chip in them useful in practice. Comment
on the importance of packaging in microsystems in this example.
Solution
It is a hands-on exercise to encourage students to be curious about things. Modern ink-
cartridges are quite simple: they contain an ink-reservoir and a nozzle at the end. The plastic
case is the main component in it. The inkjet printhead is more complicated. One has to open
it up to see what is inside.

2.6 Visit a molecular biology laboratory that uses a PCR system and discuss with its users
how they use it and what for what purpose. If they are using a system that does not use
microsystems components, how would you convince them to switch over to a microsystems-
based PCR system?
Solution
Small sample size, perhaps less time for analysis, ease of handling, and lower price are some
of the reasons that can be used to “sell” micromachined PCR systems. Novel techniques are
now available in which there is no need to cycle the temperature in a PCR. This is much
cheaper and much more convenient.

2.7 This chapter included a description of smart materials. A beam made of a ‘‘normal’’
material bends when a load is applied to it. A beam made of a ‘‘smart’’ piezoelectric
material not only bends but produces an electric charge when a load is applied. Both
materials behave in their specific ways. Then, why is that we consider some materials to be
smart? Does smartness lie in the way we use the material or in their very nature?
Solution
This is a debatable point. Whatever behaviour that are observed more recently (say in 20th
century and after) are considered smart even if it is simply the very nature of materials.
Another way to look at this is if the observed phenomenon involves one energy domain or
more than one. But then expansion due to heating is not considered smart even though it
involves more than one energy domain. So, whatever is common and known for a long time
is not considered smart.

2.8 Search the literature and identify a few devices that use smart materials. Which of these
have been miniaturized using microsystems technology?
Solution
A cigarette lighter or a gas-stove lighter use piezoelectric materials. Microphones and buzzers
also use piezoelectric materials. The latter are miniaturized already. Shape memory alloys are
used in dental braces (no need to miniaturize) and stents (miniature to the extent needed).
Other smart materials are not used as widely in consumer applications.

2.9 Choose a system that you consider ‘‘smart’’ and explain why you think it is smart. Is
mobile phone a smart system? Is a motorcycle a smart system? How about a washing
machine and a home water-purifier?
Solution
Many appliances and transport vehicles today are smart. Cars and motorcycles tell us when
they are out of fuel. They have many other sensors and actuators that function automatically
in response to changing environmental conditions. A mobile phone is certainly smart: it
knows where it is; can take pictures; some can even guide on eating patterns, etc. Washing
machine and water purifier are relatively less smart as they do not have that many sensors.
So, equipping a thing with sensors decides the ‘smartness’.
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2.10 Are biological materials smart in the sense we call some materials smart? Explain with
examples.
Solution
Most certainly. Living biological materials can do a lot of sensing and can appropriately
respond to the external stimuli. They can also heal themselves under certain conditions. They
can make their own food too. So, they are undoubtedly smarter than engineered materials.

3
 Solutions to Exercise Problems in Chapter-3

Exercise 3.1: It is required to fabricate a polysilicon cantilever beam whose dimensions are: length × breadth ×
thickness = 2000 m × 10 m × 2 m. The sacrificial oxide thickness is 1 m. Discuss the anchor pad size you would
choose and explain whether it is possible to realize such a structure by surface micromachining. Give reasons for your
answer.

Solution:
During sacrificial layer etching , the etchant etches from either siude of the breadth of the beam . As the width of the
breadth of the beam is 10m , by the time the beam is released by etching the sacrificial oxide underneath it, the timeing
should be such that the lateral oxide is etched 5m laterally. Therefore the anchor pad should be at least 50m x 50m,
so that after the beam is released the anchored area is 45m x 45m.
As the beam thickness is only 2 m , the spring constant of the beam is very low with a beam length of 2mm
(=2000m). Therefore it will be difficult to realize this structure by surface micromachining using polycrystalline
silicon.
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Exercise 3.2: In one of the designs of an accelerometer, the structure of the seismic mass (500 m x500m ) and the
four supporting springs (20m wide) were first obtained by etching a silicon layer of thickness 10 m. [FIG3.43] The
top view of this structure and the anchor pads are shown in Fig. 3.43. It was required to release the mass and the spring
while keeping the oxide below the anchor pads (150m x150m) intact. The oxide is only 1m thick. Suggest any
modifications that would be necessary in the structure for its successful release.
Solution:
When the mass (500m x 500m ) is released by etching the 1m thick oxide underneath them using the pattern
shown in the figure, the pad whose size is only 150m x 150m would collapse because all the oxide underneath would
be etched fully. The mask pattern should modified and etch hole patterns must be provided on the mass pattern so that
by the time the beam is released the mass is also released. This can be achieved with the modified the mask pattern
shown below. The hole size and the number of holes in the mass pattern should be chosen such that the gap between the
holes should be equal to the breadth (=20m) of the beam. With this pattern,, the anchor region after releasing the
beams and the mass will be 140m x 140m when the mass is just released.

Exercise 3.3: A silicon wafer has been etched through square a window opening of size 10 m × 10 m in the oxide
layer. Draw cross-sectional profiles and mark all dimensions of etched silicon for the following cases: