Chematic Spo2
Chematic Spo2
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
18 pF 8 MHz 18 pF
0Ω
0Ω
R17
R16
TP11
130 Ω
130 Ω
R15 0 Ω
XIN_MSP
DNI
RX_DIG_SUP
RX_ANA_SUP
R20
R22
C10
C9 0.1 µF
0.1 µF
40
39
38
37
36
35
34
33
32
31
RX_ANA_SUP U1 RX_DIG_SUP
AFE4400
VCM_SHIELD TP6
XOUT
RX_ANA_GND
XIN
RX_ANA_GND
RX_OUTN
RX_ANA_SUP
RX_OUTP
RX_ANA_SUP
RX_DIG_GND
RX_DIG_SUP
DET_N
TP8
3
R98
TP12 10 kΩ
2 1 TP13
LED_DRV_GND
D2
DB9-F BAV99W-7-F C41 C42
TXM
TXP
J2 75 V 2.2 µF 2.2 µF
EP
5
9
4
12
13
14
15
16
17
18
19
20
41
11
8
10 3
7
11 2 AFE_PDNZ
AFE_PDNZ
6
1 TX_CTRL_SUP LED_DRV_SUP
DB9-F-TP
C16 C15
LED_DRV_SUP 0.1 µF 1 µF
TP22
TP25
2 1
D3
BAV99W-7-F
75 V
TP23
2 1
TP30
D4
BAV99W-7-F
75 V
NOTE: The following signals must be considered as two sets of differential pains and routed as adjacent signals within each pair:
TXM, TXP and INM, INP.
INM and INP must be guarded with VCM_SHIELD the signal. Run the VCM_SHIELD signal to the DB9 connector and back to the device.