EEE 329: VLSI I

LECTURE 1
INTEGRATED CIRCUIT
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AGENDA
Integrated Circuit
Classification of ICs
CMOS vs BJT Technology
Types of VLSI Design
Full Custom vs Semi Custom Design
VLSI Design Flow
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WHAT IS
INTEGRATED
CIRCUITS?

Integrated Circuits (ICs) are tiny

electronic devices that integrate a large
number of electronic components, such as
transistors, diodes, resistors, and capacitors,
onto a single semiconductor chip (usually
made of silicon).
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Classification of ICs
CLASSIFICATION

Based on Based on Level of Based on Based on Manufacturing

Functionality Integration Application Technology
Analog ICs Small Scale Integration General-Purpose ICs
(SSI) Bipolar ICs
Digital ICs Application-Specific ICs
Medium Scale Integration (MSI) (ASICs) CMOS ICs
Mixed-Signal ICs Programmable ICs
Large Scale Integration (LSI)
BiCMOS ICs
Very Large Scale Integration (VLSI)

Ultra-Large Scale Integration (ULSI)

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BASED ON
FUNCTIONALITY
a) Analog ICs (Linear ICs):
• Process continuous signals.
• Used in amplifiers, oscillators, voltage regulators, etc.
• Examples: Operational Amplifiers (Op-Amps), Analog Filters.
b) Digital ICs:
• Operate on discrete signals (0s and 1s).
• Used in logic gates, microprocessors, memory chips, etc.
• Examples: Flip-Flops, Counters, Microcontrollers.
c) Mixed-Signal ICs:
• Combine analog and digital circuitry on a single chip.
• Used in systems requiring both signal types, like communication devices.
• Examples: Analog-to-Digital Converters (ADCs), Digital-to-Analog Converters (DACs).
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BASED ON LEVEL
OF INTEGRATION
a) Small Scale Integration (SSI):
•Contains a few dozen transistors (10–100 gates).
•Used in simple circuits like basic logic gates.
b) Medium Scale Integration (MSI):
•Contains hundreds of transistors (100–1,000 gates).
•Used in adders, multiplexers, etc.
c) Large Scale Integration (LSI):
•Contains thousands of transistors (1,000–10,000 gates).
•Used in processors, memory chips, etc.
d) Very Large Scale Integration (VLSI):
•Contains millions of transistors (10,000–1,000,000+ gates).
•Used in microprocessors, FPGAs, and complex ICs.
e) Ultra-Large Scale Integration (ULSI):
•Contains billions of transistors.
•Found in modern CPUs, GPUs, and SoCs (System on Chips).
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BASED ON
APPLICATION
a) General-Purpose ICs:
•Designed for broad and varied applications.
•Examples: 555 Timer, Op-Amps.
b) Application-Specific ICs (ASICs):
•Customized for specific tasks or industries.
•Examples: ICs used in automotive, healthcare, or IoT devices.
c) Programmable ICs:
•Can be configured by the user after manufacturing.
•Examples: Field-Programmable Gate Arrays (FPGAs), Programmable
Logic Devices (PLDs).
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BASED ON
MANUFACTURING
TECHNOLOGY
a) Bipolar ICs:
•Use bipolar junction transistors (BJTs).
•Known for high speed but higher power consumption.
b) CMOS ICs:
•Use complementary metal-oxide-semiconductor technology.
•Offer low power consumption and high noise immunity.
c) BiCMOS ICs:
•Combine bipolar and CMOS technologies.
•Offer the advantages of both high speed and low power.
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DIFFERENCE BETWEEN
CMOS AND BIPOLAR
Feature CMOS ICs Bipolar ICs

Full Form Complementary Metal-Oxide-Semiconductor ICs Bipolar Junction Transistor ICs

Technology Uses MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors). Uses BJTs (Bipolar Junction Transistors).

Power Consumption Very low power consumption due to low static current. Higher power consumption because of continuous current
flow.
Speed Slower compared to Bipolar ICs for high-speed operations. Faster switching speed and better performance in high-
frequency applications.
Noise Immunity High noise immunity, suitable for digital circuits. Lower noise immunity, making them less suitable for noisy
environments.
Applications Used in low-power devices like microprocessors, mobile phones, and Used in applications requiring high speed and power, such
digital electronics. as RF amplifiers and analog circuits.
Cost Cheaper to manufacture due to simpler fabrication. More expensive because of higher power and speed
capabilities.
Thermal Stability Better thermal stability and lower heat dissipation. Poorer thermal stability with higher heat dissipation.

Integration Density High, allowing more components per chip (VLSI/ULSI). Lower integration density compared to CMOS ICs.

Switching Characteristics Relatively slower, with longer rise and fall times. Faster switching characteristics, suitable for analog and RF
circuits.
Preferred Usage Ideal for battery-operated and low-power devices. Suitable for high-speed and power-intensive applications.
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FEATURES OF IC
•Miniaturization
•High Reliability
•Low Power Consumption
•High Speed
•Cost-Effectiveness
•Lightweight
•Improved Performance
•Low Heat Dissipation
•High Integration Density
•Compatibility
•Scalability
•Durability
•Low Maintenance
•Wide Application Range
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TYPES OF VLSI
DESIGN
❑ Based on Design Methodology ❑ Based on Technology Used
a) ASIC (Application-Specific Integrated Circuit)
a) Full-Custom Design
b) FPGA (Field-Programmable Gate Array)
b) Semi-Custom Design c) SoC (System on Chip)
c) Programmable Design d) SiP (System in Package)

❑ Based on Functional Domain ❑ Based on Abstraction Level

a) Digital VLSI Design a) Behavioral Design
b) Analog VLSI Design b) RTL (Register Transfer Level) Design
c) Mixed-Signal VLSI Design c) Gate-Level Design
d) Physical Design
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DIFFERENCE BETWEEN FULL

CUSTOM AND SEMI CUSTOM DESIGN
Full Custom Semi Custom
1. Complete design, layout, geometry, 1. Some commonly used design, layout,
orientation and placement of transistor is geometry and placement of transistor is
done by designer. interfaced with given demand.
2. Entire design is made without use of any 2. Design is completed with the use of
library. multiple library.
3. Development time for design before 3. Development time for design before
maturity is more. maturity is less.
4. It has more opportunity for performance 4. It has less opportunity for performance
improvement. improvement.
5. Less dependency on existing technology. 5. Complete dependency on existing
technology.
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VLSI DESIGN FLOW

THANK
YOU
Dr. Md. Hasan Maruf
Associate Professor, EEE, GUB
[email protected]