Course: INTEGRATED ELECTRONICS

1. Introduction to Integrated Circuits

By

Dr. M Faraz
Lecturer
ENCD UET Taxila
https://www.wellpcb.com/integrated-circuits.html
 Integrated Circuits
• Integrated Circuits (IC’s):- is a miniature low-cost electronic circuit that consists
of both active and passive elements fabricated on single-crystal silicon.
• The integrated circuit is made of semiconductor material.

Silicon Substrate

https://lightmachinery.com/optics-catalog/thin-wafers/ https://components101.com/articles/active-vs-passive-components
Integrated Circuits
• IC’s are commonly known as Silicon chip or Computer chip or Micro chip.
Few examples of Silicon chips

Applications:
IC’s perform several operations such as
amplification, timer, counter, oscillator,
microcontroller or computer memory.
Integrated Circuits
Few IC Packages
• Dual Inline Packages (DIP)

• Plastic Dual In-Line Package (PDIP)

•
• Molded Dual In-Line Package (MDIP)
•
• Zig-Zag in Line Packages (ZIP)

• Pin Grid Array (PGA)

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Integrated Circuits
Integrated Circuits
Why Integrated Circuits?
• Miniaturization and hence increased equipment density
• Batch processing resulting in lower cost
• Improved system reliability due to the elimination of soldered joints
• Better functional performance
• Matched devices
• Increased operating speed
• Reduction in the power consumption
Types of Integrated Circuits
• Integrated circuits are based on many parameters. They are

1. Based on Application
2. Based on Technology
3. Based on Integration level

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Types of Integrated Circuits
• Based on Application

LM380 for audio

amplification
Types of Integrated Circuits
• Based on Application
Types of Integrated Circuits
• Based on Application
Types of Integrated Circuits
• Based on Technology

Operational amplifier ceramic substrate that

IC741. carries many silicon chips.
GaAs chips along with
silicon chips

https://www.geeksforgeeks.org/types-of-integrated-circuits/
Types of Integrated Circuits
• Based on Integration
IC density of integration

http://slideplayer.com/slide/4620852/15/images/5/IC+Density+of+Integration.jpg
Digital logic families in the Integrated circuits

Transistor transistor logic Emitter coupled logic Metal Oxide Semiconductor Complementary metal-
(TTL) (ECL) (MOS) oxide-semiconductor
• Standard TTL. In this digital logic This digital logic family is (CMOS)
• Speed TTL family, Emitters of the designed simpler with low In CMOS basic gates are
• Low Power TTL. transistors are power. The basic gate in the NOR and NAND. CMOS is
• Schottky TTL. coupled and also MOS circuit is the NAND designed with a
• Low Power Schottky those transistors are gate. There are two types of combination of PMOS and
TTL operated in more MOS circuits. NMOS. There are some
• Advanced Schottky TTL active regions than • NMOS: It has more types of CMOS.
• Advanced Low Power saturation regions. number of n-type areas • Static CMOS
Schottky TTL The basic gate in the than p-type. • Pseudo-nMOS
• Fast Schottky ECL circuit is OR and • PMOS: It has more
NOR gates. number of p-types areas
than n-type.

https://www.geeksforgeeks.org/types-of-integrated-circuits/
Few Disadvantages of the Integrated circuit

6. Integrated circuits are not flexible. https://www.geeksforgeeks.org/types-of-integrated-circuits/

Monolithic Integrated Circuits
• The word “monolithic” comes from the Greek words monos meaning single
and lithos meaning stone.

• Hence monolithic IC’s refer to a single stone or a single crystal.

• The single crystal refers to a single silicon chip as the semiconductor material,
on top of which all the passive and active components are interconnected.

• Monolithic IC’s are considered to be the best mode of manufacturing IC as:

1. It can be made identical
2. High reliability
3. Bulk manufacturing in very less time
4. Low cost
Limitations of Monolithic Integrated Circuits
• They have low power rating.

• They cannot be used for higher power (more than 1W) applications.

• The isolation between the components within the IC is poor.

• Components such as inductors and transformers cannot be fabricated.

• The passive components within the IC will have small values and an external
connection is required from the IC pins to obtain higher values.

• Fabrication of flexible circuit is not possible.

Thin and Thick Film Integrated Circuits
• These IC’s are larger than monolithic IC’s and smaller than discrete
circuits.

• They can be used in high power applications.

• Cannot be integrated with diodes and transistors.

• Diodes and transistors can be externally connected on to its

corresponding pins.

• Resistors and capacitors can be integrated.

Thin vs Thick Film IC’s
Thin Film IC’s Thick Film IC’s
Advantages of Thin and Thick Film IC’s
They have some advantages when compared to monolithic IC’s

• Better tolerance

• Better isolation between components

• Flexibility in circuit design

Note: This technology cannot be used to fabricate active components

as it will further result in increased size.
Stretchable ultrasonic transducer arrays

Schematics and design of the stretchable ultrasonic transducer array. Hu et al., Sci. Adv. 2018; 4 : eaar3979
Flexible Microcontact Printing

Schematic diagram showing the process flow of embedding conductive composite patterns in PDMS by combining microcontact
printing and cast molding techniques. J. Micromech. Microeng. 19 (2009) 085019
 Stretchable Electronics

Schematic illustration depicting the material-based approach for the fabrication of stretchable
electronics. Adv. Mater. 2019, 1902743
 Stretchable Electronics

Heterogeneous assembly methods for the fabrication of intrinsically stretchable conductors Adv. Mater. 2019, 1902743
Hybrid or Multi Chip IC’s
Hybrid or Multi Chip IC’s
• Hybrid circuit serves as a component on a PCB in the same way as a
monolithic integrated circuit; the difference between the two types of devices
is in how they are constructed and manufactured.
• Hybrid circuits are often hermetically sealed by encapsulating the finished
part in either epoxy or plastic.
• Hybrid Integrated Circuits are manufactured using thick or thin film passive
components (resistors, capacitors) built onto a ceramic substrate.
• Active devices (monolithic Integrated Circuits, discrete transistors, choke coils,
Etc.) are separately fabricated and soldered onto the same substrate.
• The active and passive compnents are electrically connected by way of metal
interconnects built onto the ceramic substrate.
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