Week 4a - Computer Architecture Fundamentals - Part 1
Week 4a - Computer Architecture Fundamentals - Part 1
Security Fundamentals
Week 4: Computer Architecture Fundamentals
(Part 1)
Dr. Huseyin Hisil and Dr. Xueqiao Liu
● Dynamic power
○ The power required per transistor is the product of the energy of a transition multiplied
by the frequency of transitions = ½ x Capacitive load x Voltage2 x Frequency switched.
Dynamic Energy and Power
● Example: Some microprocessors today are designed to have adjustable voltage, so
a 15% reduction in voltage may result in a 15% reduction in frequency. What would
be the impact on dynamic energy and on dynamic power?
● Solution:
Dynamic Energy and Power
● Reducing clock
frequency/rate reduces
power, not energy
○ The first microprocessors
consumed less than a watt
and the first 32-bit
microprocessors (like the
Intel 80386) used about 2
W, while a 4.0 GHz Intel
Core i7-6700K consumes
95 W.
Improve Energy Efficiency
● Techniques
○ Do nothing well - Most microprocessors turn off the clock of inactive modules to save energy
and dynamic power. E.g., if no floating-point instructions executing, the clock of the floating-
point unit is disabled. If some cores are idle, their clocks are stopped.
○ Dynamic Voltage-Frequency Scaling (DVFS) - Modern microprocessors typically offer a few
clock frequencies and voltages in which to operate that use lower power and energy.
○ Design for typical case - PMDs and laptops are often idle, memory and storage offer low
power modes to save energy. E.g., DRAMs different increasingly lower power modes to extend
battery life, so disks can spin at lower rates when idle. You cannot access DRAMs or disks in
these modes, so must return to fully active mode to read or write.
○ Overclocking - Run at a higher clock rate for short time on some cores until temperature rises.
For single threaded code, microprocessors turn off all cores but one and run it at a higher clock
rate.
Static Power
● Static power
○ Leakage current flows even when a transistor is off
○ To predict the number of good chips per wafer requires learning how many dies fit on a
wafer and how to predict the percentage of those that will work
○ Number of dies per wafer is about the area of the wafer divided by the area of the die
• The throughput of X is 1.3 times higher than Y” signifies here that the number of tasks
completed per unit time on computer X is 1.3 times the number completed on Y.
● Execution time
• Wall-clock time/response time/elapsed time: latency to complete a task (all overheads)
• CPU time: only computation time
• SPECRatio is a ratio rather than an absolute execution time, the mean must be computed
using the geometric mean
•The number of instructions executed: the instruction path length or instruction count (IC). If know
the number of clock cycles and the instruction count, can calculate the average number of clock
cycles per instruction (CPI), or the inverse of CPI (IPC)
• Use each individual CPIi and the fraction of occurrences of that instruction in a program,
i.e., ICi ÷ Instruction count: