Reliability Prediction Procedure for Electronic Equipment

SR-332 Table of Contents

Table of Contents Return to SR-332

1 Introduction
1.1 Purpose and Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.2 Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.3 Structure of this Report . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.4 Participants in the Development of SR-332, Issue 4 . . . . . . . . . . . . . . . . 1–3
1.5 Automated Reliability Prediction Procedure (ARPP) . . . . . . . . . . . . . . . 1–3

2 Reliability Predictions for Electronic Equipment

2.1 Purposes of Reliability Predictions . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
2.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.2.1 Equipment Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.2.2 Definition of a Failure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.2.3 Definition of Failure Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
2.2.3.1 Life Cycle of Electronic Equipment . . . . . . . . . . . . . . . . . . . 2–3
2.2.3.2 RPP Failure Rate Predictions . . . . . . . . . . . . . . . . . . . . . . 2–4
2.2.3.3 Factors Affecting Failure Rates . . . . . . . . . . . . . . . . . . . . . 2–4
2.3 Outline of Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
2.3.1 Flow of Early Life Failure Rate Calculations . . . . . . . . . . . . . . . . . 2–7
2.3.2 Flow of Steady-State Failure Rate Calculations . . . . . . . . . . . . . . . 2–7
2.3.3 Items and Factors Excluded from Failure Rate Calculations . . . . . . . . 2–8
2.3.4 Guidance for Device Types/Technologies Not in Section 8 . . . . . . . . . 2–9
2.3.5 Statistical Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.5.1 Upper Confidence Levels . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.5.2 Alternate and Supplementary Methods . . . . . . . . . . . . . . . . 2–10
2.3.6 Automated Reliability Prediction Procedure (ARPP) . . . . . . . . . . . 2–10

3 Steady State Failure Rate Prediction for Devices

3.1 Method I-D: Black Box Technique . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
3.2 Method II-D: Techniques Integrating Laboratory Data . . . . . . . . . . . . . . 3–2
3.2.1 When Laboratory Test Devices Had No Previous Burn-in . . . . . . . . . 3–2
3.2.2 When Laboratory Test Devices Had Previous Burn-in . . . . . . . . . . . 3–3
3.3 Method III-D: Techniques Integrating Field Data . . . . . . . . . . . . . . . . . 3–4
3.3.1 Total Operating Hours . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
3.3.2 Adjustment Factor (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
3.4 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6
3.4.1 Example 1: Method I-D, Black Box Technique . . . . . . . . . . . . . . . . 3–6
3.4.2 Example 2: Method II-D, Integrating Laboratory Test Data . . . . . . . . . 3–7
3.4.2.1 Example 2a: No Burn-In of Laboratory Test Devices . . . . . . . . . 3–7
3.4.2.2 Example 2b: Previous Burn-In of Laboratory Test Devices . . . . . 3–7
3.4.3 Example 3: Method III-D, Integrating Field Data . . . . . . . . . . . . . . 3–8
3.4.3.1 Example 3a: Subject Device is in Test Unit and Operated at
the Same Temperature and Electrical Stress . . . . . . . . . . . . . . 3–9
3.4.3.2 Example 3b: Subject Device is in Test Unit but Operated at
Different Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 3–9

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 SR-332
Table of Contents Issue 4, March 2016

4 Early Life Factor Prediction for Devices

4.1 Early Life Factor for Device with Limited or No Burn-In . . . . . . . . . . . . . 4–1
4.2 Early Life Factor for Device with Extensive Burn-In . . . . . . . . . . . . . . . 4–1
4.2.1 Equivalent Operating Time for Burn-in . . . . . . . . . . . . . . . . . . . . 4–1
4.2.2 Early Life Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
4.3 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
4.3.1 Example 1: Limited or No Burn-In . . . . . . . . . . . . . . . . . . . . . . 4–2
4.3.2 Example 2: Extensive Burn-In . . . . . . . . . . . . . . . . . . . . . . . . 4–3

5 Failure Rate Prediction for Units

5.1 Method I: Unit Steady-State Failure Rate Using the Parts Count Method . . . . 5–1
5.2 Method II: Integrating Laboratory Test Data on Units . . . . . . . . . . . . . . 5–3
5.2.1 When Laboratory Test Units Have No Previous Unit/Device Burn-In . . . 5–3
5.2.2 When Laboratory Test Units Had Previous Burn-in . . . . . . . . . . . . . 5–4
5.3 Method III: Integrating Field Data on Units . . . . . . . . . . . . . . . . . . . . 5–5
5.3.1 Total Operating Hours . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6
5.3.2 Adjustment Factor (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6
5.4 Unit Early Life Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.5 Sampling Method - Using Default Temperature and Stress Factors on a
Sample of Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.6 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8
5.6.1 Example 1: Method I, Parts Count Prediction . . . . . . . . . . . . . . . . 5–9
5.6.2 Example 2: Early Life Factor . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
5.6.3 Example 3: Method II, Integrating Laboratory Test Data . . . . . . . . . 5–10
5.6.3.1 Example 3a: No Previous Burn-In of Laboratory Test Units . . . . 5–10
5.6.3.2 Example 3b: Previous Burn-In of Laboratory Test Units . . . . . . 5–10
5.6.4 Example 4: Method III, Integrating Field Test Data . . . . . . . . . . . . 5–11
5.6.4.1 Example 4a: Subject Unit and Test Unit are Identical and
Operated Under the Same Conditions . . . . . . . . . . . . . . . . 5–11
5.6.4.2 Example 4b: Subject Unit and Test Unit are Identical but
Operated in Different Environments . . . . . . . . . . . . . . . . . 5–12
5.6.4.3 Example 4c: Test Unit Is Similar but Not Identical to
Subject Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.6.5 Example 5: Method I, Parts Count Prediction, Devices Within a
Device Type Have Different Operating Temperatures . . . . . . . . . 5–12

6 System Reliability (Service Affecting Reliability Data)

6.1 Serial System Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.1.1 Steady-State Failure Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.1.2 Early Life Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.2 Non-Serial Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2

7 Upper Confidence Levels for Failure Rates

7.1 Upper Confidence Level Calculation . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.2 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
7.2.1 Example 1: 90% Upper Confidence Level of the Steady-State
Failure Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
7.2.2 Example 2: 90% Upper Confidence Level of the Early Life
Failure Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2

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Reliability Prediction Procedure for Electronic Equipment
SR-332 Table of Contents

8 Device Parameter Values

8.1 Capacitor Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.2 Connector Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3 Diode Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.4 Inductor Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5
8.5 Integrated Circuit Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . 8–6
8.5.1 Analog Integrated Circuit Devices . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.5.2 Digital Integrated Circuit Devices . . . . . . . . . . . . . . . . . . . . . . . 8–8
8.5.3 Random Access Memory (RAM) . . . . . . . . . . . . . . . . . . . . . . 8–10
8.5.4 Read Only Memory (ROMS, PROMS, EPROMS) . . . . . . . . . . . . . . 8–12
8.5.5 Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–14
8.5.6 Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–15
8.5.7 Hybrid Microcircuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–15
8.5.8 Combined Analog-Digital Integrated Circuit (Gate Array and
Program Array Logic) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–16
8.6 Microwave Element Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–17
8.7 Opto-Electronic Device Parameter Values . . . . . . . . . . . . . . . . . . . . 8–18
8.7.1 Fiber Optic Communication Devices and Modules . . . . . . . . . . . . 8–18
8.7.2 Other Opto-Electronic Devices . . . . . . . . . . . . . . . . . . . . . . . 8–20
8.8 Relay Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–21
8.9 Resistor Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–22
8.9.1 Fixed Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–22
8.9.2 Variable Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–23
8.9.3 Resistor Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–24
8.10 Switch Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–25
8.11 Thermistor Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–26
8.12 Transistor Failure Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–27
8.13 Rotating and Miscellaneous Device Parameter Values . . . . . . . . . . . . . 8–29

9 Failure Rate Factors

9.1 Temperature Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–1
9.2 Electrical Stress Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–3
9.2.1 Electrical Stress Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–3
9.2.2 Electrical Stress Percentage . . . . . . . . . . . . . . . . . . . . . . . . . . 9–4
9.3 Quality Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–6
9.4 Environment Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–8

Appendix A: Failure Rate Units

Appendix B: References
B.1 Telcordia Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–1
B.2 Non-Telcordia Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–1
B.3 Documents on Derating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–1
B.4 Telcordia Documents Referencing SR-332 or a Predecessor . . . . . . . . . . . B–2
B.5 Reference Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–6
B.6 Contact Customer Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–6
B.7 Order Documents Online From the Telcordia SuperStore . . . . . . . . . . . . B–6
B.8 Web Sites for Generic Requirements Information . . . . . . . . . . . . . . . . . B–7
B.9 Licensing Agreements for Telcordia Documents . . . . . . . . . . . . . . . . . B–7

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 SR-332
Table of Contents Issue 4, March 2016

Appendix C: Glossary
C.1 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–1
C.2 Definition of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–3

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Reliability Prediction Procedure for Electronic Equipment
SR-332 List of Figures

List of Figures

Figure 2-1 Bathtub Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4

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 SR-332
List of Tables Issue 4, March 2016

List of Tables

Table 1-1 Participants in the Development of SR-332, Issue 4 . . . . . . . . . 1–3

Table 8-1 Capacitor Failure Rate Parameters . . . . . . . . . . . . . . . . . . 8–2
Table 8-2 Connector Failure Rate Parameters . . . . . . . . . . . . . . . . . . 8–3
Table 8-3 Diode Failure Rate Parameters* . . . . . . . . . . . . . . . . . . . . 8–4
Table 8-4 Inductor Failure Rate Parameters . . . . . . . . . . . . . . . . . . . 8–5
Table 8-5 Analog Integrated Circuit Failure Rates . . . . . . . . . . . . . . . . 8–7
Table 8-6 Digital Integrated Circuit Failure Rate Parameters . . . . . . . . . . 8–8
Table 8-7 Digital Integrated Circuit Failure Rates . . . . . . . . . . . . . . . . 8–9
Table 8-8 Random Access Memory Failure Rate Parameters . . . . . . . . . 8–10
Table 8-9 Static Random Access Memory (SRAM) Failure Rates . . . . . . . 8–11
Table 8-10 Dynamic Random Access Memory (DRAM) Failure Rates . . . . . 8–12
Table 8-11 Read Only Memory Failure Rate Parameters . . . . . . . . . . . . 8–13
Table 8-12 Read Only Memory Failure Rates . . . . . . . . . . . . . . . . . . . 8–13
Table 8-13 Microprocessor Failure Rate Parameters . . . . . . . . . . . . . . 8–14
Table 8-14 Bipolar and NMOS Microprocessor Failure Rates . . . . . . . . . 8–14
Table 8-15 CMOS Microprocessor Failure Rates . . . . . . . . . . . . . . . . . 8–15
Table 8-16 Microwave Element Device Failure Rate Parameters . . . . . . . 8–17
Table 8-17 Fiber Optic Communication Device/Module Failure Rate
Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–18
Table 8-18 Opto-Electronic Device Failure Rate Parameters . . . . . . . . . . 8–20
Table 8-19 Relay Failure Rate Parameters . . . . . . . . . . . . . . . . . . . . 8–21
Table 8-20 Fixed Resistor Failure Rate Parameters . . . . . . . . . . . . . . . 8–22
Table 8-21 Variable Resistor Failure Rate Parameters . . . . . . . . . . . . . 8–23
Table 8-22 Resistor Network Failure Rate Parameters . . . . . . . . . . . . . 8–24
Table 8-23 Switch Failure Rate Parameters . . . . . . . . . . . . . . . . . . . 8–25
Table 8-24 Thermistor Failure Rate Parameters . . . . . . . . . . . . . . . . . 8–26
Table 8-25 Transistor Failure Rate Parameters . . . . . . . . . . . . . . . . . 8–27
Table 8-26 Miscellaneous Device Failure Rate Parameters . . . . . . . . . . . 8–29
Table 8-27 Rotating and Miscellaneous Device Failure Rate Parameters . . . 8–30
Table 9-1 Temperature Factors πT . . . . . . . . . . . . . . . . . . . . . . . . . 9–2
Table 9-2 Electrical Stress Factors πS . . . . . . . . . . . . . . . . . . . . . . . 9–4
Table 9-3 Guidelines for Determination of Electrical Stress Percentage . . . . 9–5
Table 9-4 Device Quality Level Description and Factor πQ . . . . . . . . . . . 9–7
Table 9-5 Environmental Conditions and Multiplier Factors (πE) . . . . . . . 9–8
Table A-1 Reliability Conversion Factor . . . . . . . . . . . . . . . . . . . . . . A–1

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