conga-TEVAL/COMe 3.0 User's Guide
conga-TEVAL/COMe 3.0 User's Guide
0
Detailed description of the congatec COM Express™ Type 6 revision 3.0 evaluation carrier board
User’s Guide
Revision 1.1
Copyright © 2018 congatec AG TEVA2m11 1/56
Revision History
Revision Date (yyyy-mm-dd) Author Changes
1.0 2018-08-16 AEM •• Official release
1.1 2019-09-23 AEM •• Updated the title page image
•• Added section 1.3 “Order Number”
•• Corrected the storage temperature in section 4.3 “Environmental Specifications”
•• Changed conga-TEVAL2 to conga-TEVAL/COMe 3.0
•• Corrected LED D68 color description in table 9 “Power LEDs Status”
•• Changed the warning icons in sections 4.9.1 “Disk Drive Power Connector” and 4.15 “LPC/eSPI” to caution icon
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Describes the connector that must be used with the congatec COM Express™ evaluation carrier board, not the connector found on the
congatec COM Express™ evaluation carrier board.
This link icon is located in the top left corner of each page. It provides a direct link to the connector layout diagram on page 8 of this document.
Copyright Notice
Copyright © 2018, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
C N
ER
T I F I C AT I O TM
Terminology
Term Description
PCIe Peripheral Component Interface Express (PCI Express)
SDIO Secure Digital Input Output
USB Universal Serial Bus
SATA Serial AT Attachment. A serial-interface standard for hard disks
HDA High Definition Audio
I²C Bus Inter-Integrated Circuit Bus
SM Bus System Management Bus
GbE Gigabit Ethernet
LVDS Low Voltage Differential Signaling
HBR3 High Bit Rate 3
DDC Display Data Channel
GPIO General Purpose Input/Output
eDP Embedded DisplayPort
LVDS Low Voltage Differential Signaling
N.C Not connected
N.A Not available
T.B.D To be determined
7 Industry Specifications.............................................................. 56
A Computer On Module integrates all the core components and standard I/O interfaces of a common PC onto an application specific carrier
board. The key advantage of the COM in the embedded computer industries is that all the highly integrated, high speed components such as
CPU, chipsets and memory are combined on a small module form factor for easy adaptation into different applications across multiple market
segments.
COM Express™ modules have standardized form factors and specified pinouts on the two system connectors that remain the same regardless
of the vendor. The COM Express™ module reflects the functional requirements for a wide range of embedded applications. These functions
include, but are not limited to, PCI Express, PCI, Graphics, High Definition Audio, parallel ATA, serial ATA, Gigabit Ethernet and USB ports.
Two ruggedized, shielded connectors provide the carrier board interface and carry all the I/O signals to and from the COM Express™ module.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
By combining the scalability of COM Express modules, the conga-TEVAL/COMe 3.0 carrier board provides manufacturers and developers
with a platform to jump-start the development of systems and applications based on COM Express specification. This helps to reduce product
design cycle and encourages rapid innovation in system design, to meet the ever-changing needs of the market.
The various features and capabilities offered by the conga-TEVAL/COMe 3.0 makes it ideal for the integration of Compact and Basic form
factor CPU modules.
Form Factor Based on COM Express standard pinout Type 6, rev. 3.0
Supported Modules COM Express™ Type 6 compact and basic form factor
Power 1 x standard 24-pin ATX connector
1 x DC power input (4 mm banana connectors)
1 x CR2032 CMOS/RTC battery
Back Panel I/O 1 x Gigabit Ethernet RJ45 port 3 x DP++ ports
Connectors 1 x Microphone jack 4 x USB 3.1 host ports
1 x Line-OUT jack 2 x USB 2.0 host ports
1 x Optical S/PDIF-Out port
Onboard I/O 1 x USB client port 4 x SATA connectors (one connector supports SATADOM)
Connectors 1 x PEG x16 slot 1 x SATA power connector
1 x PCIe x4 slot 1 x Disk drive 4-pin connector
5 x PCIe x1 slot 1 x HDA adapter/debug header
1 x VGA port 1 x I2C EEPROM socket
1 x M.2 Key B socket 1 x SPI flash socket
1 x mini PCIe socket 1 x LPC/TPM header
2 x micro-SIM card socket 2 x COM port headers
1 x SD card socket (full-size) 1 x CAN connector
1 x LVDS connector 2 x Fan headers
1 x eDP connector 1 x SBM header
1 x Panel and Backlight header 1 x Feature connector
1 x EPI EEPROM Socket
Optional Onboard 1 x Power consumption header
Interfaces
Other Features 1 x Beeper
4 x Buttons (power, reset, sleep, lid)
4 x Ground test points
Four 14-segment displays for post code information
Multi-channel low power HD audio codec (Cirrus CS4207)
Super I/O (Nuvoton NCT6112D)
Note
The module must also support the features for them to function. Refer to the module’s user’s guide for information about supported features.
The above operating temperatures must be strictly adhered to at all times. The maximum operating temperature refers to any measurable
spot on the modules surface.
1. In ATX mode, the +3.3 V, +5 V and +12 V are derived from the ATX power supply. If you supply 12 V DC power via the DC banana jack,
the onboard DC/DC regulators will generate the 3.3 V, 5 V and 12 V.
2. Do not supply power to both the DC banana jack and the ATX connector at the same time.
Use jumper JP11 to disconnect the 5 V standby voltage from the whole system.
Note
1. The -5V power output of the ATX power supply is not used.
0N
OFF ATX mode (default)
1
ON AT mode
Connector Type
Caution
X41 X42
Do not exceed the voltage rating of the COM Express module. Doing so, will damage the module.
Connector Description
X41 Input voltage for module and carrier board (usually +12 V)
X42 Ground
0N
ON Disable 1
Connector Type
4
2
6
3-4 Connect PWR_OK signal from ATX power supply (default)
5-6 Connect PWR_OK signal from onboard DC/DC regulator (only via DC banana jack)
5
Connector Type
When the system is in a power-down system state, any system wake-up event invokes the chipset of the module to deassert the ‘SUS_S3#’
signal. With the deassertion, the system transitions to Full-On state (S0).
1
2 VCC12V_COME 2 VCC5V_SBY_COME
Connector Type
2
X3,X4: 2.54mm, 1 x 2-pin header
Note
If the conga-TEVAL/COMe 3.0 detects an incompatible module pinout, an onboard logic prevents the board from powering up the whole
system by controlling the ‘PS_ON#’ signal of the ATX power supply.
Pin Description
1-2 Connect RTC battery (default)
2-3 Disconnect the RTC battery
Warning
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
0N
OFF ON x2 PCIe link 1
ON ON x4 PCIe link
Note
Connector Type
The UIM interface of the mini PCIe socket is connected to a micro-SIM card slot (X15).
X16 D6 D7 D8
Table 17 D6-D8 - mini PCIe LEDs Description
LED Description
D6 Wireless Wide Area Network
D7 Wireless Local Area Network X15
D8 Wireless Personal Area Network
Connector Type
The M.2 connector shares PCIe lane 5 with PCIe Slot 5 (X1). To use the M.2 connector, you must set DIP SW2.1 to ON. For additional M.2
configurations, see tables 17 “SW3 Configuration” and 18 “SW4 Configuration” below.
The UIM interface of the M.2 socket is connected to a micro-SIM card slot (X13).
0N
OFF Routes PCIe lane 5 to connector X1 - PCIe slot 5 (default)
1
ON Routes PCIe lane 5 to M.2 connector
O
N
SW3.1 OFF Disconnect M.2 SMB_ALERT# (default)
1
2
3
4
ON Connect M.2 SMB_ALERT#
SW3.2 OFF Disconnect WOWWAN# (default)
ON Connect WOWWAN#
SW3.3 OFF Connect M.2 SMB_DAT/CLK (default) X12
ON Disconnect M.2 SMB_DAT/CLK
SW3.4 OFF Deactive M.2 full card power-off control
ON Activate M.2 full card power-off control
O
N
SW4.1 OFF Enable mPCIe wireless (default)
1
2
3
4
ON Disable mPCIe wireless
Connector Type
0N
1
Setting Description
OFF GPIO mode (default)
ON SDIO mode
Connector Type
X28: SD Card
4.7.1 VGA
The conga-TEVAL/COMe 3.0 provides a VGA interface on standard 15-pin DSUB connector X45. X45
Connector Type 5 1
4.7.2 DP++
The conga-TEVAL/COMe 3.0 provides three DP++ interfaces on connectors X35, X36 and X37. The DP++ ports on connector X35 (port 0) and
connector X37 (port 3) are routed through a DisplayPort re-driver to support HBR3 data rate (up to 8.1 Gbps).
You can connect a DP++ to HDMI dongle to the DP++ connectors if your module supports it. X35, X36, X37
Connector Type
4.7.3 LVDS/eDP
The conga-TEVAL/COMe 3.0 connects the module’s LVDS/eDP interface to:
•• eDP panel on connector X39
•• LVDS panel on connector X38
Use DIP SW8.1 to select the option for eDP or LVDS panel.
0N
ON eDP selection 1
OFF LVDS selection (default)
0N
2 GND 22 N.C. 1
3 eDP_TX3- 23 GND
4 eDP_TX3+ 24 GND
5 GND 25 GND
6 eDP_TX2- 26 GND
7 eDP_TX2+ 27 eDP_HPD
8 GND 28 GND
9 eDP_TX1- 29 GND
10 eDP_TX1+ 30 GND
11 GND 31 GND
12 eDP_TX0- 32 eDP_LVDS_BKLT_EN
13 eDP_TX0+ 33 eDP_LVDS_BKLT_CTRL
14 GND 34 N.C.
15 eDP]_AUX+ 35 N.C.
16 eDP_AUX- 36 N.C
17 GND 37 BKLT_PWR
18 PANEL_PWR 38 BKLT_PWR
19 PANEL_PWR 39 BKLT_PWR
20 PANEL_PWR 40 N.C.
Connector Type
0N
6 LVDS0_D0- 23 GND 1
7 LVDS0_D0+ 24 LVDS1_D1-
8 LCD0_VDD_EN 25 LVDS1_D1+
9 LVDS0_D1- 26 GND
10 LVDS0_D1+ 27 LVDS1_D2-
11 LCD0_BKLTEN 28 LVDS1_D2+
12 LVDS0_D2+ 29 GND
13 LVDS0_D2- 30 LVDS1_CLK+
14 NC 31 LVDS1_CLK
15 LVDS0_CLK- 32 NC
16 LVDS0_CLK+ 33 LVDS1_D3+
17 NC 34 LVDS1_D3-
Connector Type
The power supply for LVDS panels and backlight inverter is available on connector X40.
Connector Type
The conga-TEVAL/COMe 3.0 supports different voltages for the panel and backlight. Follow the descriptions in the tables below to set the
panel and backlight voltages, and the polarity of the backlight enable signal.
0N
1
OFF Non-inverted BKLT_EN signal (default)
Connector Type
X40
2.0A
+12V [4] +12V
1.5A
+5V [3] +5V
+3.3V
JP4 1 2 3
JP3 1 2 3
LVDS_VDD_EN
1.5A
LFP_BKLT_EN_SEL
ON
[1] VDD_LCD
1 2
[5] LCD0_VDD_EN
2.0A
SW8 [2] VDD_BKLT
[6] LCD0_BKLT_EN
LVDS_BKLT_CTRL
[8] LCD0_BKLT_PWM
[9] GND
[10] GND
The flat panel configuration data (EPI extended EDID™ 1.3 file) for most common displays is included in the congatec COM Express™ CPU
module’s system BIOS.
On the conga-TEVAL/COMe 3.0, you can store a customized EPI extended EDID™ 1.3 file in a serial EEPROM located on DIL SOIC8 socket
U35. The following EEPROMs are supported at address A0h:
U35
•• 24C02
•• 24C04
•• 24C16
Connector Type
Use DIP SW5.1 to route the shared signals to either connector X29 (host port) or connector X31 (client port).
0N
USB 3.0 USB 3.0
1
OFF USB port 0 to connector X29—host mode (default)
ON USB port 0 to connector X31—client mode USB 3.0 USB 3.0
Note
Lower slot of connector X29 will not function if you set SW1 to ON (client mode).
Connector Type
0N
1
Note
8765432 1
USB Port 7
USB Port 6
Connector Type
The SATA activity LED (D9) lights when an activity occurs on any of the SATA interfaces. The pin header X26 provides an option to connect
external SATA activity LED.
Connector Type
Caution
Do not connect more than one peripheral device to connector X25. The peripherals may damage if you do so.
Connector Type
4 GND 9 5V 14 12 V
5 GND 10 GND 15 12 V
Connector Type
USB Port 7
Green 1000 Mbit link
USB Port 6
Connector Type
1. a multi-channel low power HD audio codec (Cirrus CS4207). The codec supports:
–– MIC-In signals on connector X47 (lower jack)
–– Line-Out signals on connector X47 (upper jack)
–– Optical S/PDIF output signal on connector X48
2. an HDA adapter/debug header on connector X49
Note
1. To disable the onboard codec, set DIP SW 9.2 to ON. See section 4.11.4 “HDA Adapter/Debug Header” for DIP SW 9.2 configuration .
2. The Windows driver for the codec can be found on the congatec website at www.congatec.com in the ‘Products’ section under ‘Accessories.
Tip
Pin Jack Signal Description Ring
1 Tip MIC_L Microphone - left channel LINE-OUT
Sleeve
2 Ring MIC_R Microphone - right channel
3 Sleeve A_GND Analog ground MIC-IN
Connector Type
4.11.2 Line-Out
Table 37 Line-Out (X47) Pinout Description X47 Jack (Line-IN)
Tip
Pin Jack Signal Description
Ring
1 Tip LINE_L Line-OUT - left channel
LINE-OUT Sleeve
2 Ring LINE_R Line-OUT - right channel
3 Sleeve A_GND Analog ground MIC-IN
Connector Type
0N
1
ON Disable audio codec
10
9
CODECs external CODEC.
7
7 HDA_SDOUT Serial TDM data output to the CODEC 8 CODECSET Onboard codec disable input. Pull high to disable
5
(Input 3.3V) onboard audio codec
3
9 GND Power Ground 10 GND Power Ground
1
Connector Type
4.12 SM Bus
The SM Bus signals are available on the feature connector X56 described in section 4.23 “Feature Connector”. The SM Bus on the module is
powered by the standby power rail. To avoid current leakage, the conga-TEVAL/COMe 3.0 features a FET switch that isolates the SMB devices
that are powered by the main power rail.
The 8-pin DIL socket supports various 2-wire 3.3 V serial EEPROMS such as 24C04, 24C08 and 24C16. Use the I²C control commands implemented
in the congatec CGOS API driver to access the EEPROMs. For more information, refer to the CGOS manual and the user’s guide of the COM
Express module.
U50
Connector Type
0N
1
OFF ON Boot from carrier board SPI Flash
ON OFF Not supported
ON ON Boot from on-module firmware, but load management data from carrier SPI
Connector Type
Setting Description
ON Enable Super I/O (default) SW10
OFF Disable Super I/O 2
0N
1
Setting Description
ON Select eSPI mode
OFF Select LPC mode (default)
Note
1. These interfaces will not function if the COM Express module does not support them.
2. DIP SW10.2 controls the eSPI_ENA# signal which the conga-TEVAL/COMe 3.0 uses to set the operating mode of the LPC/eSPI bus.
Caution
Do not set DIP SW10.2 to ON if your module does not support eSPI mode.
Copyright © 2018 congatec AG TEVA2m11 43/56
Table 43 SW11 - Super IO Configuration
O
N
SW11.2 OFF Super IO key selection 87h (default)
1
2
3
4
ON Super IO key selection 88h
SW11.3 OFF Disables Super IO Port 80 control (default)
ON Enables Super IO Port 80 control
SW11.4 OFF Selects eSPI_CS0# for Super IO in eSPI mode (default)
ON Selects eSPI_CS1# for Super IO in eSPI mode
Use DIP SW10.2 to select LPC or eSPI mode. For description of the DIP SW10.2 settings, see table 15 “SW10.2 -LPC/eSPI Mode Control”.
0N
3 LPC_CLK/ESPI_CLK 4 LPC_AD3/ESPI_IO3 Key
7
6
8
1
5 KEY 6 LPC_AD2/ESPI_IO2 9 10
11 12
7 PLT_RST# 8 LPC_AD1/ESPI_IO1 13 14
9 VCC3V3 10 LPC_AD0/ESPI_IO0
11 SUS_STAT#/ESPI_RST# 12 LPC_SERIRQ/ESPI_CS1#
13 VCC3V3_SBY 14 LPC_DRQ0#/ESPI_ALERT0#
Connector Type
2
3
4
3 RXD 4 RTS#
6
5 TXD 6 CTS#
8
7 DTR# 8 RI#
10
9
9 GND 10 +5V (750mA fuse)
0N
1
ON OFF RS-232
OFF ON RS-485 half duplex
ON ON RS-485/RS-422 full duplex
0N
SW13.2 OFF Disable RS-485/422 termination 1
Connector Type
2
1 DCD# 2 DSR
4
3 RXD 4 RTS#
6
5 TXD 6 CTS#
8
7 DTR# 8 RI#
10
9
9 GND 10 +5V (750 mA fuse)
Connector Type
Note
Pins 42 and 44 of the feature connector alternatively supports CAN_TX and CAN_RX signals.
Pin Description
JP5
1-2 12 V supply voltage for auxiliary fan (default)
2-3 5 V supply voltage for auxiliary fan 1 2 3
Connector Type
Pin Configuration
JP10
1-2 12 V supply voltage (default)
1 2 3
2-3 5 V supply voltage
Connector Type
Connector Type
2 RAPID_SHUTDOWN 4
3
3 PCIE_WAKE
4 GND
Connector Type
43
44
5 I2C_DAT General purpose I²C port data I/O line. 6 SMB_CK System Management Bus bidirectional clock line.
42
41
7 I2C_CK General purpose I²C port clock output. 8 SMB_DAT System Management Bus bidirectional data line.
40
39
9 Internal use 10 GPO0 General Purpose Output 0
38
37
11 Internal use 12 GPO1 General Purpose Output 1
36
35
13 PS_ON# Power supply on (active low). 14 GPO2 General Purpose Output 2
34
33
15 SUS_S3# Suspend to RAM state. Active low output. 16 GPO3 General Purpose Output 3
32
31
17 GND Power ground 18 GND Power Ground
30
29
19 THRMTRIP# Active low output indicating that the CPU 20 SMB_ALERT# System Management Bus Alert . It can be used to wake the system or
28
27
has entered thermal shutdown. generate an SMI# (System Management Interrupt)
26
25
21 GPI1 General Purpose Input 1 22 SUS_S4# Suspend to Disk state. Active low output.
24
23
23 SUS_STAT# Indicates imminent suspend operation; 24 GPI0 General Purpose Input 0
22
21
used to notify LPC devices.
20
19
25 GPI2 General Purpose Input 2 26 SUS_S5# Indicates systems is in soft off state.
18
17
27 WDT Watchdog Trigger 28 THRM# Input from off-module temp sensor indicating an over-temp situation.
16
15
29 GPI3 General Purpose Input 3 30 LID# Module input signal, generation a LID close or open event
14
13
31 BATLOW# Indicates that external battery is low. 32 WAKE1# General purpose wake up signal. May be used to implement wake-up
12
11
on PS2 keyboard or mouse activity.
10
9
33 TPM_PP TPM Physical presence pin 34 PEG_LANE_RV# PCI Express Graphics lane reversal input strap.
7
35 SLEEP# Sleep signal, to bring system to a 36 SYS_RESET# Reset Button Input. Active low input. System is held in hardware reset
5
predefined sleep state while this input is low
6
4
3
37 GND Power ground 38 GND Power ground
1
39 PWRBTN# Power button to bring system out of S5 40 PWR_OK Power OK from main power supply. A high value indicates that the
(soft off), active on rising edge. power is good.
41 SER0_TX COM module’s serial port 0 transmit line 42 SER1_TX COM module’s serial port 1 transmit line
43 SER0_RX COM module’s serial port 0 receive line 44 SER1_RX COM module’s serial port 1 receive line
Connector Type
5.1.1 Power
When you press the power button SW16, it triggers the module’s PWRBTN# signal. The triggered event usually initiates a transition from one
power state to another (for example, from S5 to S0). However, the system’s behavior depends on the ACPI settings of the Operating System.
SW16
5.1.2 Reset
When you press the reset button SW16, it triggers the module’s SYS_RESET# signal. The triggered event usually invokes a system warm reset.
This behavior however depends on the configuration of the module.
SW17
5.1.3 LID
When you press the lid button SW18, it triggers the module’s LID# signal. The system’s behavior depends on the ACPI settings of the Operating
System.
SW18
5.2 Beeper
The beeper M25 provides audible error code (beep code) information during POST. The beeper is connected to pin B32 (SPKR signal) on the
COM Express™ module.
0N
Setting Description 1
ON Enable beeper (default)
OFF Disable beeper
M1-M4
A list of the BIOS POST codes and associated POST test and initialization routines for congatec COM Express™ modules is available at
www.congatec.com.
O
N
OFF OFF 80-84h (0xE0)
1
2
3
4
ON OFF 80-84 (0xE2)
OFF ON RSDV (0xE4)
ON ON RSVD (0xE6)
243.84
237.49
D110
C110
A110
B110
189.3
165.1
159.3
151.3
148.3
D1
C1
A1
B1
72.3
33.02
10.16
Specification Link
PICMG COM Express Module™ Base Specification
®
http://www.picmg.org/
Universal Serial Bus (USB) Specification http://www.usb.org/home
Serial ATA Specification http://www.serialata.org
High Definition Audio Specification http://www.intel.com/content/www/us/en/standards/high-definition-audio-specification.html
LVDS Owner’s Manual http://www.ti.com/lit/ml/snla187/snla187.pdf
Extended Display Identification Data Standard (EDID™) http://www.vesa.org
Enhanced Display Data Channel Specification (DDC) http://www.vesa.org
IEEE standard 802.3ab 1000BASE T Ethernet http://www.ieee.org/portal/site
Advanced Configuration and Power Interface Specification http://www.acpi.info