EM06 Hardware Design

LTE-A Module Series

Rev. EM06_Hardware_Design_V1.1

Date: 2019-11-11

Status: Released

www.quectel.com
 LTE-A Module Series
EM06 Hardware Design

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About the Document

History

Revision Date Author Description

King MA/
1.0 2018-07-17 Initial
Wison HE
1. Updated CA feature of EM06-A (Table 1).
2. Updated Internet protocol features of EM06 (Table 2).
3. Deleted information about USB 3.0 and changed USB
3.0 pins into NC pins (Figure 2 and Table 4).
4. Added operating modes (Chapter 3.3)
Jared WANG/
1.1 2019-10-31 5. Added GNSS performance (Chapter 4.2)
Jeremy LI
6. Updated EM06-A current consumption (Table 35).
Added EM06-A conducted RF receiving sensitivity
(Table 39).
7. Variant EM06-A, function DFOTA and dual SIM single
standby have been fully developed.
1. Updated GNSS performance (Table 21).
2. Updated the reference circuit of (U)SIM interface with
1.2 2019-11-11 Jeremy LI normally closed (U)SIM card connector (Figure 13) and
the reference circuit of (U)SIM interface with normally
open (U)SIM card connector (Figure 14).

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Contents

About the Document .................................................................................................................................. 1

Contents ...................................................................................................................................................... 2
Table Index .................................................................................................................................................. 4
Figure Index ................................................................................................................................................ 6

1 Introduction ......................................................................................................................................... 7
1.1. Safety Information ...................................................................................................................... 8

2 Product Concept ................................................................................................................................. 9

2.1. General Description ................................................................................................................... 9
2.2. Key Features ............................................................................................................................ 10
2.3. Functional Diagram .................................................................................................................. 13
2.4. Evaluation Board ...................................................................................................................... 13

3 Application Interfaces ...................................................................................................................... 14

3.1. Pin Assignment ........................................................................................................................ 15
3.2. Pin Description ......................................................................................................................... 16
3.3. Operating Modes...................................................................................................................... 20
3.4. Power Supply ........................................................................................................................... 21
3.4.1. Decrease Voltage Drop ................................................................................................. 21
3.4.2. Reference Design for Power Supply ............................................................................. 22
3.5. Turn on and off Scenarios ........................................................................................................ 23
3.5.1. Turn on the Module ....................................................................................................... 23
3.5.1.1. Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF# 23
3.5.1.2. Turn on the Module Automatically ...................................................................... 23
3.5.2. Turn off the Module ....................................................................................................... 25
3.5.2.1. Turn off the Module Through FULL_CARD_POWER_OFF# ............................ 25
3.5.2.2. Turn off the Module via AT Command................................................................ 25
3.6. Reset the Module ..................................................................................................................... 25
3.7. (U)SIM Interfaces ..................................................................................................................... 27
3.8. USB Interface ........................................................................................................................... 30
3.9. PCM and I2C Interfaces........................................................................................................... 31
3.10. Control and Indication Signals ................................................................................................. 34
3.10.1. W_DISABLE1# Signal................................................................................................... 34
3.10.2. WWAN_LED# Signal .................................................................................................... 35
3.10.3. WAKE_ON_WAN# Signal ............................................................................................. 36
3.10.4. DPR Signal .................................................................................................................... 37
3.11. Antenna Tuner Control Interface* ............................................................................................ 37
3.12. Configuration Pins .................................................................................................................... 38

4 GNSS Receiver .................................................................................................................................. 39

4.1. General Description ................................................................................................................. 39
4.2. GNSS Performance ................................................................................................................. 39

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5 Antenna Connection ......................................................................................................................... 41

5.1. Main/Rx-diversity/GNSS Antenna Connectors ........................................................................ 41
5.1.1. Antenna Connectors ..................................................................................................... 41
5.1.2. Operating Frequency .................................................................................................... 42
5.1.3. GNSS Antenna Connector ............................................................................................ 45
5.2. Antenna Requirements ............................................................................................................ 45
5.3. Antenna Connectors and Mating Plugs ................................................................................... 46

6 Electrical, Reliability and Radio Characteristics ........................................................................... 49

6.1. Absolute Maximum Ratings ..................................................................................................... 49
6.2. Power Supply Requirements ................................................................................................... 49
6.3. I/O Requirements ..................................................................................................................... 50
6.4. Operation and Storage Temperatures ..................................................................................... 50
6.5. Current Consumption ............................................................................................................... 51
6.6. RF Output Power ..................................................................................................................... 57
6.7. RF Receiving Sensitivity .......................................................................................................... 57
6.8. ESD Characteristics ................................................................................................................. 59
6.9. Thermal Dissipation ................................................................................................................. 60

7 Mechanical Dimensions and Packaging ........................................................................................ 62

7.1. Mechanical Dimensions of the Module .................................................................................... 62
7.2. Standard Dimensions of M.2 PCI Express .............................................................................. 63
7.3. Design Effect Drawings of the Module..................................................................................... 64
7.4. M.2 Connector.......................................................................................................................... 65
7.5. Packaging ................................................................................................................................ 65

8 Appendix References ....................................................................................................................... 66

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Table Index

TABLE 1: FREQUENCY BANDS, CA COMBINATIONS AND GNSS TYPE OF EM06 SERIES MODULE........ 9
TABLE 2: KEY FEATURES OF EM06 ............................................................................................................... 10
TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 16
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 16
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 20
TABLE 6: DEFINITION OF VCC AND GND PINS............................................................................................. 21
TABLE 7: DEFINITION OF FULL_CARD_POWER_OFF# PIN ........................................................................ 23
TABLE 8: RESET# PIN DEFINITION ................................................................................................................ 25
TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 27
TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 30
TABLE 11: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 33
TABLE 12: PIN DEFINITION OF CONTROL AND INDICATION SIGNALS ...................................................... 34
TABLE 13: AIRPLANE MODE CONTROLLED BY HARDWARE...................................................................... 35
TABLE 14: AIRPLANE MODE CONTROLLED BY SOFTWARE ...................................................................... 35
TABLE 15: NETWORK STATUS INDICATIONS OF WWAN_LED# SIGNAL ................................................... 36
TABLE 16: STATE OF THE WAKE_ON_WAN# SIGNAL .................................................................................. 36
TABLE 17: FUNCTION OF THE DPR SIGNAL ................................................................................................. 37
TABLE 18: PIN DEFINITION OF ANTENNA TUNER CONTROL INTERFACE ................................................ 38
TABLE 19: PIN DEFINITION OF CONFIGURATION PINS .............................................................................. 38
TABLE 20: LIST OF CONFIGURATION PINS .................................................................................................. 38
TABLE 21: GNSS PERFORMANCE ................................................................................................................. 39
TABLE 22: EM06-E OPERATING FREQUENCIES .......................................................................................... 42
TABLE 23: EM06-J OPERATING FREQUENCIES ........................................................................................... 42
TABLE 24: EM06-A OPERATING FREQUENCIES........................................................................................... 43
TABLE 25: EM06-LA* OPERATING FREQUENCIES ....................................................................................... 44
TABLE 26: GNSS FREQUENCY ....................................................................................................................... 45
TABLE 27: ANTENNA REQUIREMENTS.......................................................................................................... 45
TABLE 28: MAJOR SPECIFICATIONS OF THE ANTENNA CONNECTORS .................................................. 46
TABLE 29: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 49
TABLE 30: POWER SUPPLY REQUIREMENTS .............................................................................................. 49
TABLE 31: I/O REQUIREMENTS ...................................................................................................................... 50
TABLE 32: OPERATION AND STORAGE TEMPERATURES .......................................................................... 50
TABLE 33: EM06-E CURRENT CONSUMPTION ............................................................................................. 51
TABLE 34: EM06-J CURRENT CONSUMPTION ............................................................................................. 53
TABLE 35: EM06-A CURRENT CONSUMPTION ............................................................................................. 55
TABLE 36: RF OUTPUT POWER ..................................................................................................................... 57
TABLE 37: EM06-E CONDUCTED RF RECEIVING SENSITIVITY ................................................................. 57
TABLE 38: EM06-J CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 58
TABLE 39: EM06-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 58
TABLE 40: ELECTROSTATIC DISCHARGE CHARACTERISTICS (TEMPERATURE: 25ºC, HUMIDITY: 40%)
................................................................................................................................................................... 59

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TABLE 41: RELATED DOCUMENTS ................................................................................................................ 66

TABLE 42: TERMS AND ABBREVIATIONS ...................................................................................................... 66

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13

FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 15
FIGURE 3: POWER SUPPLY LIMITS DURING RADIO TRANSMISSION....................................................... 21
FIGURE 4: REFERENCE CIRCUIT OF VCC.................................................................................................... 22
FIGURE 5: REFERENCE DESIGN OF POWER SUPPLY ............................................................................... 22
FIGURE 6: TURN ON THE MODULE THROUGH GPIO CONTROLLED FULL_CARD_POWER_OFF# ....... 23
FIGURE 7: TURN ON THE MODULE AUTOMATICALLY ................................................................................. 24
FIGURE 8: TIMING OF TURNING ON MODULE ............................................................................................. 24
FIGURE 9: TIMING OF TURNING OFF THE MODULE THROUGH FULL_CARD_POWER_OFF# ............... 25
FIGURE 10: REFERENCE CIRCUIT OF RESET# BY USING DRIVING CIRCUIT ......................................... 26
FIGURE 11: REFERENCE CIRCUIT OF RESET# BY USING BUTTON ......................................................... 26
FIGURE 12: TIMING OF RESETTING MODULE ............................................................................................. 26
FIGURE 13: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH NORMALLY CLOSED (U)SIM CARD
CONNECTOR .................................................................................................................................................... 28
FIGURE 14: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH NORMALLY OPEN (U)SIM CARD
CONNECTOR .................................................................................................................................................... 28
FIGURE 15: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 29
FIGURE 16: REFERENCE CIRCUIT OF USB 2.0 INTERFACE ...................................................................... 30
FIGURE 17: PRIMARY MODE TIMING ............................................................................................................ 32
FIGURE 18: AUXILIARY MODE TIMING .......................................................................................................... 32
FIGURE 19: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 33
FIGURE 20: WWAN_LED# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 35
FIGURE 21: WAKE_ON_WAN# BEHAVIOR .................................................................................................... 36
FIGURE 22: WAKE_ON_WAN# SIGNAL REFERENCE CIRCUIT DESIGN .................................................... 37
FIGURE 23: ANTENNA CONNECTORS ON THE MODULE ........................................................................... 41
FIGURE 24: DIMENSIONS OF THE RECEPTACLES (UNIT: MM) .................................................................. 46
FIGURE 25: SPECIFICATIONS OF MATING PLUGS USING Ø0.81MM COAXIAL CABLES ......................... 47
FIGURE 26: CONNECTION BETWEEN RECEPTACLE AND MATING PLUG USING Ø0.81MM COAXIAL
CABLE ............................................................................................................................................................... 47
FIGURE 27: CONNECTION BETWEEN RECEPTACLE AND MATING PLUG USING Ø1.13MM COAXIAL
CABLE ............................................................................................................................................................... 48
FIGURE 28: THERMAL DISSIPATION AREA ON BOTTOM SIDE OF MODULE (TOP VIEW) ....................... 60
FIGURE 29: MECHANICAL DIMENSIONS OF EM06 (UNIT: MM)................................................................... 62
FIGURE 30: STANDARD DIMENSIONS OF M.2 TYPE 3042-S3 (UNIT: MM) ................................................. 63
FIGURE 31: M.2 NOMENCLATURE ................................................................................................................. 63
FIGURE 32: TOP VIEW OF THE MODULE ...................................................................................................... 64
FIGURE 33: BOTTOM VIEW OF THE MODULE .............................................................................................. 64

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1 Introduction
This document defines EM06 module and describes its air interface and hardware interfaces which are
connected with customers’ applications.

This document helps customers quickly understand the interface specifications, electrical and mechanical
details, as well as other related information of the module. To facilitate its application designs in different
fields, reference design is also provided for customers’ reference. With this hardware design, application
notes and user guides, customers can use the module to design and set up mobile applications easily.

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1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating EM06 module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for customers’ failure to comply with these precautions.

Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes distraction
and can lead to an accident. Please comply with laws and regulations restricting the
use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in hospitals,
clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with unpaid
bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON,
it receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off
wireless devices such as mobile phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats, fuel
or chemical transfer or storage facilities, areas where the air contains chemicals or
particles such as grain, dust or metal powders, etc.

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2 Product Concept

2.1. General Description

EM06 is a series of LTE-A/UMTS/HSPA+ wireless communication module with receive diversity. It provides
data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks
with standard PCI Express M.2 interface.

EM06 supports embedded operating systems such as Windows, Linux and Android, and also provides
GNSS1) and voice functionality2) to meet specific application demands. EM06 contains four variants: EM06-
E, EM06-J, EM06-A and EM06-LA*. Customers can select a dedicated type based on the region or
operator.

The following table shows the frequency bands, CA combinations and GNSS type of EM06 series module.

Table 1: Frequency Bands, CA Combinations and GNSS Type of EM06 Series Module

Mode EM06-E EM06-J EM06-A EM06-LA*

LTE-FDD B2/B4/B5/B7/B12/
B1/B3/B5/B7/ B1/B3/B8/B18/B19/ B2/B3/B4/B5/B7/B8/
(with B13/B25/B26/B293)/
B8/B20/B28/B323) B26/B28 B20/B28
Rx-diversity) B30/B66
LTE-TDD
(with B38/B40/B41 B41 B41 Not supported
Rx-diversity)
B2+B2/B5/B12/
B1+B1/B5/B8/
B13/B293);
B20/B28; B2+B2/B5/B8/
B4+B4/B5/B12/
B3+B3/B5/B7/ B20/B28;
B1+B1/B8/B18/B19/ B13/B293);
B8/B20/B28; B3+B3/B5/B7/
B26/B28; B5+B5/B7/B25/
B7+B5/B7/B8/ B8/B20/B28;
2×CA B3+B3/B8/B18/B19/ B30/B66;
B20/B28; B4+B4/B5/B8/
B26/B28; B7+B7/B12/B26;
B20+B323); B20/B28;
B41+B41 B12+B12/B25/B30/
B38+B38; B7+B5/B7/B8/
B66;
B40+B40; B20/B28
B13+B66;
B41+B41
B25+B25/B26;

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B30+B293);
B66+B293)/B66;
B41+B41
WCDMA
B1/B3/B6/B8/ B2/B3/B4/B5/
(with Rx- B1/B3/B5/B8 B2/B4/B5
B19 B8
diversity)
GPS, GPS, GPS, GPS,
GLONASS, GLONASS, GLONASS, GLONASS,
GNSS 1) BeiDou/Compass BeiDou/Compass BeiDou/Compass BeiDou/Compass
Galileo, Galileo, Galileo, Galileo,
QZSS QZSS QZSS QZSS

NOTES
1) GNSS
1. function is optional.
2)
2. EM06 series module (EM06-E/EM06-J/EM06-A/EM06-LA*) contains Telematics version and
Data-only version. Telematics version supports voice and data functions, while Data-only version
only supports data function.
3. 3) LTE-FDD B29 and B32 support Rx only and are only for secondary component carrier.
4. “*” means under development.

EM06 can be applied in the following fields:

 Rugged Tablet PC and Laptop Computer

 Remote Monitor System
 Vehicle System
 Wireless POS System
 Smart Metering System
 Wireless Router and Switch
 Other Wireless Terminal Devices

2.2. Key Features

The following table describes the detailed features of EM06.

Table 2: Key Features of EM06

Features Details

Function Interface PCI Express M.2 Interface

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Supply voltage: 3.135V~4.4V

Power Supply
Typical supply voltage: 3.7V
Class 3 (23dBm±2dB) for LTE-FDD bands
Transmitting Power Class 3 (23dBm±2dB) for LTE-TDD bands
Class 3 (24dBm+1/-3dB) for WCDMA
Support up to LTE Cat 6
Support 1.4MHz to 40MHz (2×CA) RF bandwidth
LTE Features Support MIMO in DL direction
 FDD: Max 300Mbps (DL)/50Mbps (UL)
 TDD: Max 226Mbps (DL)/28Mbps (UL)
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
UMTS Features  DC-HSDPA: Max 42Mbps (DL)
 HSUPA: Max 5.76Mbps (UL)
 WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)
 Support PPP/QMI/NTP*/TCP*/UDP*/FTP*/HTTP*/PING*/HTTPS*/
Internet Protocol Features SMTP*/MMS*/FTPS*/SMTPS*/SSL* protocols
 Support protocols PAP and CHAP usually used for PPP connection
Text and PDU modes
Point to point MO and MT
SMS
SMS cell broadcast
SMS storage: ME by default
 Support (U)SIM card: 1.8V, 3.0V
(U)SIM Interfaces  Include USIM1 and USIM2 interfaces
Support Dual SIM Single Standby
Support one digital audio interface: PCM interface
WCDMA: AMR/AMR-WB
Audio Feature
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
 Used for audio function with external codec
 Support 16-bit linear data format
PCM Interface  Support long frame synchronization and short frame synchronization
 Support master and slave modes, but must be the master in long frame
synchronization
 Compliant with USB 2.0 specifications, with maximum transmission
rates up to 480Mbps on USB 2.0.
 Used for AT command communication, data transmission, firmware
USB Interface upgrade, software debugging, GNSS NMEA sentence output and voice
over USB*
 Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6~5.4,
Android 4.x/5.x/6.x/7.x/8.x/9.x

Antenna Connectors Include main antenna, diversity antenna and GNSS antenna connectors

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Rx-diversity Support LTE/WCDMA Rx-diversity

Gen8C Lite of Qualcomm

GNSS Features Protocol: NMEA 0183
Data rate: 1Hz
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
AT Commands
commands
Size: (42.0±0.15)mm × (30.0±0.15)mm × (2.3±0.1)mm
Physical Characteristics
Weight: approx. 6.0g
Operation temperature range: -30°C~ +70°C 1)
Temperature Range Extended temperature range: -40°C~ +85°C 2)
Storage temperature range: -40°C ~ +90°C

Firmware Upgrade Upgrade via USB 2.0 interface or DFOTA

RoHS All hardware components are fully compliant with EU RoHS directive

NOTES

1. 1) Within operation temperature range, the module is 3GPP compliant.

2)
2. Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like Pout might reduce in their value and exceed the specified tolerances. When the temperature
returns to normal operation temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.

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2.3. Functional Diagram

The following figure shows a block diagram of EM06.

VCC

FULL_CARD_POWER_OFF#
PMIC

APT
RESET#
PCI Express M.2 Key-B Interface

Control
19.2M
XO

Tx
USB 2.0 ANT_MAIN
(U)SIM1&(U)SIM2
PRx
W_DISABLE1# IQ

Tx/Rx Blocks
Transceiver
WWAN_LED#
WAKE_ON_WAN# Baseband
PCM ANT_GNSS
Control
GPIOs
W_DISABLE2#

DRx
ANT_DIV

NAND +
DDR2 SDRAM

Figure 1: Functional Diagram

2.4. Evaluation Board

In order to help customers develop applications conveniently with EM06, Quectel supplies the evaluation
board (M.2 EVB), USB to RS-232 converter cable, USB type-C cable, earphone, antenna and other
peripherals to control or test the module. For more details, please refer to document [1].

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3 Application Interfaces
The physical connections and signal levels of EM06 comply with PCI Express M.2 specifications. This
chapter mainly describes the definition and application of the following interfaces, signals and pins of EM06:

 Power supply
 (U)SIM interfaces
 USB interface
 PCM and I2C interfaces
 Control and indication signals
 Antenna tuner control interface*
 Configuration pins

NOTE

“*” means under development.

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3.1. Pin Assignment

The following figure shows the pin assignment of EM06. EM06 module and antenna connectors are on the
top side.

Pin Name No.

No. Pin Name CONFIG_2 75
74 VCC GND 73
72 VCC GND 71
70 VCC CONFIG_1 69
68 NC RESET# 67
66 USIM1_DET ANTCTL3 65
64 RESERVED ANTCTL2 63
62 RESERVED ANTCTL1 61
PIN75
60 RESERVED PIN74 ANTCTL0 59
58 I2C_SCL GND 57
56 I2C_SDA NC 55
54 NC NC 53
52 NC GND 51
50 NC NC 49
48 USIM2_VDD NC 47
46 USIM2_RESET GND 45
44 USIM2_CLK NC 43
42 USIM2_DATA NC 41
40 USIM2_DET GND 39
38 NC NC 37
BOT TOP NC 35
36 USIM1_VDD
34 USIM1_DATA GND 33
32 USIM1_CLK NC 31
30 USIM1_RESET NC 29
28 PCM_SYNC GND 27
26 W_DISABLE2# DPR 25
24 PCM_OUT WAKE_ON_WAN# 23
22 PCM_IN CONFIG_0 21
20 PCM_CLK Notch
Notch Notch
Notch Notch
PIN11
Notch PIN10 Notch
Notch GND 11
10 WWAN_LED# USB_DM 9
8 W_DISABLE1# PIN2
PIN1 USB_DP 7
6 FULL_CARD_POWER_OFF# GND 5
4 VCC GND 3
2 VCC CONFIG_3 1

Figure 2: Pin Assignment

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3.2. Pin Description

The following tables show the pin definition and description of EM06 on the 75-pin application.

Table 3: Definition of I/O Parameters

Type Description

IO Bidirectional

DI Digital Input

DO Digital Output

OD Open Drain

PI Power Input

PO Power Output

Table 4: Pin Description

M.2 Socket 2
Pin
USB 3.0-Based EM06 Pin Name I/O Description Comment
No.
Pinout

1 CONFIG_3 CONFIG_3 Not connected internally. .

Vmin=3.135V
2 3.3V VCC PI Power supply Vnorm=3.7V
Vmax=4.4V

3 GND GND Ground

Vmin=3.135V
4 3.3V VCC PI Power supply Vnorm=3.7V
Vmax=4.4V

5 GND GND Ground

A signal to control power-on/-off

of the module. When it is at low
FULL_CARD_ FULL_CARD_ Pulled down
6 DI level, the module powers off.
POWER_OFF# POWER_OFF# internally
When it is at high level, the
module powers on.

7 USB_D+ USB_DP IO USB 2.0 differential data bus (+)

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Airplane mode control. 1.8V/3.3V

8 W_DISABLE1# W_DISABLE1# DI
Active low. power domain

9 USB_D- USB_DM IO USB 2.0 differential data bus (-)

It is an open collector and active

low signal.
3.3V power
10 GPIO_9 WWAN_LED# OD It allows the module to provide
domain
RF status indication via LED
devices provided by the system.

11 GND GND Ground

12 Key Notch Notch

13 Key Notch Notch

14 Key Notch Notch

15 Key Notch Notch

16 Key Notch Notch

17 Key Notch Notch

18 Key Notch Notch

19 Key Notch Notch

PCM data bit clock.

In master mode, it serves as an
GPIO_5 output signal. 1.8V power
20 PCM_CLK IO
(AUDIO_0) In slave mode, it serves as an domain
input signal.
If unused, keep it open.

21 CONFIG_0 CONFIG_0 Connected to GND internally.

GPIO_6 1.8V power
22 PCM_IN DI PCM data input
(AUDIO_1) domain
A signal to wake up the host.
GPIO_11 WAKE_ON_ 1.8V power
23 OD It is an open collector and active
(WOWWAN#) WAN# domain
low signal.
GPIO_7 1.8V power
24 PCM_OUT DO PCM data output
(AUDIO_2) domain
Dynamic power reduction. 1.8V power
25 DPR DPR DI
High level by default. domain
GPIO_10 GNSS enablement control. 1.8V/3.3V
26 W_DISABLE2# DI
(W_DISABLE2#) Active low. power domain

27 GND GND Ground

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GPIO_8 PCM data frame 1.8V power

28 PCM_SYNC IO
(AUDIO_3) synchronization signal domain

29 USB3.0-TX- NC NC

1.8V/3.0V
30 UIM-RESET USIM1_RESET DO (U)SIM1 card reset
power domain

31 USB3.0-TX+ NC NC

1.8V/3.0V
32 UIM-CLK USIM1_CLK DO (U)SIM1 card clock
power domain

33 GND GND Ground

Pulled up to
34 UIM-DATA USIM1_DATA IO (U)SIM1 card data USIM2_VDD
internally

35 USB3.0-RX- NC NC

1.8V/3.0V
36 UIM-PWR USIM1_VDD PO Power supply for (U)SIM1 card
power domain

37 USB3.0-RX+ NC NC

38 N/C NC NC

39 GND GND Ground

GPIO_0 Pulled up
40 USIM2_DET DI (U)SIM2 card insertion detection
(SIM_DET2) internally

41 N/C NC NC

Pulled up to
GPIO_1
42 USIM2_DATA IO (U)SIM2 card data USIM2_VDD
(SIM_DAT2)
internally

43 N/C NC NC

GPIO_2 1.8V/3.0V
44 USIM2_CLK DO (U)SIM2 card clock
(SIM_CLK2) power domain

45 GND GND Ground

GPIO_3 1.8V/3.0V
46 USIM2_RESET DO (U)SIM2 card reset
(SIM_RST2) power domain

47 N/C NC NC

GPIO_4 1.8V/3.0V
48 USIM2_VDD PO Power supply for (U)SIM2 card
(SIM_PWR2) power domain

49 N/C NC NC

50 N/C NC NC

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51 GND GND Ground

52 N/C NC NC

53 N/C NC NC

54 N/C NC NC

55 N/C NC NC

I2C serial data.

56 N/C I2C_SDA IO
Used for external codec.

57 GND GND Ground

I2C serial clock.

58 N/C I2C_SCL DO
Used for external codec.
1.8V power
59 ANTCTL0 ANTCTL0 DO Antenna tuner control.
domain

60 COEX3 RESERVED Reserved

1.8V power
61 ANTCTL1 ANTCTL1 DO Antenna tuner control.
domain

62 COEX2 RESERVED Reserved

1.8V power
63 ANTCTL2 ANTCTL2 DO Antenna tuner control.
domain

64 COEX1 RESERVED Reserved

1.8V power
65 ANTCTL3 ANTCTL3 DO Antenna tuner control.
domain
Pulled up
66 SIM_DETECT USIM1_DET DI (U)SIM1 card insertion detection
internally

67 RESET# RESET# DI System reset. Active low.

68 SUSCLK (32kHz) NC NC

69 CONFIG_1 CONFIG_1 Connected to GND internally.

Vmin=3.135V
70 3.3V VCC PI Power supply Vnorm=3.7V
Vmax=4.4V

71 GND GND Ground

Vmin=3.135V
72 3.3V VCC PI Power supply Vnorm=3.7V
Vmax=4.4V

73 GND GND Ground

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Vmin=3.135V
74 3.3V VCC PI Power supply Vnorm=3.7V
Vmax=4.4V

75 CONFIG_2 CONFIG_2 Not connected internally.

 NOTE

Please keep all NC, reserved and unused pins unconnected.

3.3. Operating Modes

The table below summarizes different operating modes of EM06.

Table 5: Overview of Operating Modes

Mode Details

Software is active. The module has registered on the network, and it is

Idle
Normal ready to send and receive data.
Operating mode Network connection is ongoing. In this mode, the power consumption is
Talk/Data
decided by network setting and data transfer rate.
Minimum AT+CFUN=0 command can set the module to a minimum functionality mode without
Functionality removing the power supply. In this case, both RF function and (U)SIM card will be
Mode invalid.
AT+CFUN=4 command or driving W_DISABLE1# pin to low level can set the module
Airplane Mode
to airplane mode. In this case, RF function will be invalid.
In this mode, the current consumption of the module will be reduced to the minimal
Sleep Mode level. During this mode, the module can still receive paging message, SMS, voice call
and TCP/UDP data from the network normally.
In this mode, the power management unit shuts down the power supply. Software is
Power Down
not active. The USB interface is not accessible. Operating voltage (connected to VCC)
Mode
remains applied.

NOTE

Please refer to document [2] for more details about AT+CFUN command.

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3.4. Power Supply

The following table shows pin definition of VCC pins and ground pins.

Table 6: Definition of VCC and GND Pins

Pin Name Pin No. I/O Power Domain Description

VCC 2, 4, 70, 72, 74 PI 3.135V~4.4V 3.7V typical DC supply

3, 5, 11, 27, 33,

GND Ground
39, 45, 51, 57, 71, 73

3.4.1. Decrease Voltage Drop

The power supply range of the module is from 3.135V to 4.4V. Please make sure that the input voltage will
never drop below 3.135V, otherwise the module will be powered off automatically. The following figure
shows the maximum voltage drop during radio transmission in 3G and 4G networks.

Max Tx power Max Tx power

VCC Ripple
Drop
Min.3.135V

Figure 3: Power Supply Limits during Radio Transmission

To decrease voltage drop, a bypass capacitor of about 220µF with low ESR (ESR=0.7Ω) should be used,
and a multi-layer ceramic chip capacitor (MLCC) array should also be reserved due to its ultra-low ESR. It
is recommended to add three ceramic capacitors (100nF, 33pF, 10pF) close to the VCC pins for composing
the MLCC array. The main power supply from an external application has to be a single voltage source.
The width of VCC trace should be no less than 2mm. In principle, the longer the VCC trace is, the wider it
will be.

In addition, in order to get a stable power source, it is recommended to use a zener diode with a reverse
zener voltage of 5.1V and dissipation power more than 0.5W. The following figure shows a reference circuit
of VCC.

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VCC

Module

VCC
+
D1 C1 C2 C3 C4 C5

5.1V 220uF 1uF 100nF 33pF 10pF

Figure 4: Reference Circuit of VCC

3.4.2. Reference Design for Power Supply

Power design for the module is very important, as the performance of the module largely depends on the
power source. The power supply is capable of providing sufficient current up to 2A at least. If the voltage
drop between the input and output is not too high, it is suggested that an LDO should be used to supply
power for the module. If there is a big voltage difference between the input source and the desired output
(VCC), a buck converter is preferred to be used as the power supply.

The following figure shows a reference design for +5V input power source. The typical output of the power
supply is about 3.7V and the maximum load current is 3A.

MIC29302WU U1

LDO_IN VCC
2 IN OUT 4
GND

ADJ
EN

D1 R1 R2
C1 C2
100K 1%R4
1

TVS 470uF 100nF 51K C3 C4 C5 C6

R3 470R 470uF 100nF 33pF 10pF

R5 51K 1%
4.7K

MCU_POWER R6
_ON/OFF 47K

Figure 5: Reference Design of Power Supply

NOTE

In order to avoid damages to the internal flash, please do not switch off the power supply directly when
the module is working. It is suggested that the power supply can be cut off after pulling down
FULL_CARD_POWER_OFF# for about 100ms.

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3.5. Turn on and off Scenarios

3.5.1. Turn on the Module

Driving the FULL_CARD_POWER_OFF# pin to a high level will power on the module. The following table
shows the definition of FULL_CARD_POWER_OFF#.

Table 7: Definition of FULL_CARD_POWER_OFF# Pin

Pin Name Pin No. Description DC Characteristics Comment

A signal to control power-on/-off

FULL_CARD of the module. When it is at low VIHmax=4.4V
Pulled down
_POWER_ 6 level, the module powers off. VIHmin=0.7V
internally.
OFF# When it is at high level, the VILmax=0.5V
module powers on.

3.5.1.1. Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF#

It is recommended to use a GPIO from host to control FULL_CARD_POWER_OFF#. A simple reference

circuit is illustrated in the following figure.

Host
3.3V Module

GPIO FULL_CARD_POWER_OFF#
GND GND

Figure 6: Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF#

3.5.1.2. Turn on the Module Automatically

If FULL_CARD_POWER_OFF# is pulled up to 3.3V with a 5kΩ~10kΩ resistor, the module will be powered
on automatically when the power supply for VCC is applied, and will be powered off when the power supply
is removed.

A reference circuit is shown in the following figure.

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Module

3.3V

10K

FULL_CARD_POWER_
OFF#

Figure 7: Turn on the Module Automatically

The power-on scenario is illustrated in the following figure.

NOTE

VCC

RESET#
VIH≥1.19V

FULL_CARD_POWER_OFF#
VIL≤0.2V
≥12.5s

Module Status OFF Booting Active

Figure 8: Timing of Turning on Module

NOTE

Please ensure that VCC is stable for no less than 30ms before pulling down
FULL_CARD_POWER_OFF#.

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3.5.2. Turn off the Module

3.5.2.1. Turn off the Module Through FULL_CARD_POWER_OFF#

Driving the FULL_CARD_POWER_OFF# pin to low will turn off the module.

The power-off scenario is illustrated in the following figure.

VCC

FULL_CARD_POWER_OFF#

Module
ON RUNNING OFF
Status

Figure 9: Timing of Turning off the Module Through FULL_CARD_POWER_OFF#

3.5.2.2. Turn off the Module via AT Command

The module can also be turned off by AT+QPOWD command. For more details about the command,
please refer to document [2].

3.6. Reset the Module

The RESET# pin is used to reset the module. The module can be reset by driving RESET# to a low level
voltage for 250ms~600ms.

Table 8: RESET# Pin Definition

Pin Name Pin No. Description DC Characteristics Comment

VIHmax=2.1V
RESET# 67 Reset the module VIHmin=1.3V
VILmax=0.5V

An open collector/collector driver or button can be used to control the RESET# pin.

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RESET#

4.7K

Reset pulse

47K

Figure 10: Reference Circuit of RESET# by Using Driving Circuit

S2
RESET#

TVS

Close to S2

Figure 11: Reference Circuit of RESET# by Using Button

The reset scenario is illustrated in the following figure.

VCC
≤600ms
≥250ms
RESET# VIH≥1.3V
VIL≤0.5V

Module Running Resetting Restart

Status

Figure 12: Timing of Resetting Module

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NOTE

Please ensure that there is no large capacitance on RESET# pin.

3.7. (U)SIM Interfaces

The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards
are supported, and Dual SIM Single Standby function is supported.

Table 9: Pin Definition of (U)SIM Interfaces

Pin Name Pin No. I/O Description Comment

Power supply for (U)SIM1 Either 1.8V or 3.0V is supported by

USIM1_VDD 36 PO
card the module automatically.

USIM1_DATA 34 IO (U)SIM1 card data

USIM1_CLK 32 DO (U)SIM1 card clock

USIM1_RESET 30 DO (U)SIM1 card reset

Pulled up internally.
(U)SIM1 card insertion When (U)SIM1 card is present, it is
USIM1_DET 66 DI detection. at high level.
Active high. When (U)SIM1 card is absent, it is
at low level.
Power supply for (U)SIM2 Either 1.8V or 3.0V is supported
USIM2_VDD 48 PO
card by the module automatically.

USIM2_DATA 42 IO (U)SIM2 card data

USIM2_CLK 44 DO (U)SIM2 card clock

USIM2_RESET 46 DO (U)SIM2 card reset

Pulled up internally.
(U)SIM2 card insertion When (U)SIM2 card is present, it is
USIM2_DET 40 DI detection. at high level.
Active high. When (U)SIM2 card is absent, it is
at low level.

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EM06 supports (U)SIM card hot-plug via the USIM_DET pin, which is a level trigger pin. The USIM_DET
is normally short-circuited to ground when (U)SIM card is not inserted. When the (U)SIM card is inserted,
the USIM_DET will change from low to high level. The rising edge will indicate insertion of the (U)SIM card.
When the (U)SIM card is removed, the USIM_DET will change from high to low level. This falling edge will
indicate the absence of the (U)SIM card.

The following figure shows a reference design of (U)SIM interface with normally closed (U)SIM card
connector (CD switch closed).

USIM_VDD GND

15K
100nF (U)SIM Card Connector

USIM_VDD
VCC GND
USIM_RESET 22R
RST VPP
Module USIM_CLK Switch
CLK IO
USIM_DET 22R CD GND
USIM_DATA 22R

33pF 33pF 33pF

GND GND

Figure 13: Reference Circuit of (U)SIM Interface with Normally Closed (U)SIM Card Connector

Normally Closed (U)SIM Card Connector:

 When the (U)SIM card is absent, the switch is closed and USIM_DET is at low level.
 When the (U)SIM card is inserted, the switch is open and USIM_DET is at high level.

The following figure shows a reference design of (U)SIM interface with normally open (U)SIM card
connector.

USIM_VDD GND
1.8V

15K
4.7K
100nF (U)SIM Card Connector

USIM_VDD
VCC GND
USIM_RESET 22R
RST VPP
Module USIM_CLK Switch
CLK IO
USIM_DET 22R CD GND
USIM_DATA 22R

33pF 33pF 33pF 33K

GND GND

Figure 14: Reference Circuit of (U)SIM Interface with Normally Open (U)SIM Card Connector

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Normally Open (U)SIM Card Connector:

 When the (U)SIM card is absent, the switch is open and USIM_DET is at low level.
 When the (U)SIM card is inserted, the switch is closed and USIM_DET is at high level.

If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit
for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.

USIM_VDD

15K
USIM_GND 100nF
(U)SIM Card Connector
USIM_VDD
VCC GND
USIM_RESET 22R
RST VPP
Module USIM_CLK
CLK IO
22R
USIM_DATA 22R

33pF 33pF 33pF

GND GND

Figure 15: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector

In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please
follow the criteria below in (U)SIM circuit design:

 Keep placement of (U)SIM card connector as close as possible to the module. Keep the trace length
as less than 200mm as possible.
 Keep (U)SIM card signals away from RF and VCC traces.
 Assure the ground traces between the module and the (U)SIM card connector short and wide. Keep
the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.
 To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield
them with surrounded ground.
 In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic
capacitance not exceeding 10pF. The 22Ω resistors should be added in series between the module
and the (U)SIM card connector so as to suppress EMI spurious transmission and enhance ESD
protection. The 33pF capacitors are used to filter out RF interference. Please note that the (U)SIM
peripheral circuit should be close to the (U)SIM card connector.
 The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
and sensitive occasion are applied and should be placed close to the (U)SIM card connector.

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3.8. USB Interface

EM06 provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0
specifications and supports high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB
interface is used for AT command communication, data transmission, GNSS NMEA output, software
debugging, firmware upgrade and voice over USB*.

The following table shows the pin definition of USB interface.

Table 10: Pin Definition of USB Interface

Pin Name Pin No. I/O Description Comment

USB_DP 7 IO USB 2.0 differential data bus (+)

Require differential impedance
of 90Ω
USB_DM 9 IO USB 2.0 differential data bus (-)

For more details about the USB 2.0 specifications, please visit http://www.usb.org/home.

The USB interface is recommended to be reserved for firmware upgrade in customers’ designs. The
following figure shows a reference circuit of USB 2.0 interface.

Minimize these stubs Test Points

NM_0R
R3 NM_0R
R4
ESD Array
R1 0R USB_DM
USB_DM
R2 0R
USB_DP USB_DP

GND GND

Module MCU

Figure 16: Reference Circuit of USB 2.0 Interface

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In order to ensure the integrity of USB 2.0 data line signal, R1/R2/R3/R4 components must be placed close
to the module, capacitors C1 and C2 have been placed inside the module, capacitors C3 and C4 must be
placed close to the MCU, and these components should be placed close to each other.

In order to ensure the USB interface design corresponding with USB 2.0 specifications, please comply
with the following principles:

 It is important to route the USB 2.0 signal traces as differential pairs with total grounding.
For USB 2.0 routing traces, the trace impedance of the differential pair should be 90Ω, and the
trace length difference between the differential pair should be less than 2mm.
 Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is
important to route the USB 2.0 differential traces in inner-layer with ground shielding on not only upper
and lower layers but also right and left sides.
 If a USB connector is used, please keep the ESD protection components as close as possible to the
USB connector. Pay attention to the influence of junction capacitance of ESD protection components
on USB 2.0 data traces. The capacitance value of ESD protection components should be less than
2.0pF for USB 2.0.
 If possible, reserve a 0R resistor on USB_DP and USB_DM lines respectively.

NOTE
S
“*” means under development.

3.9. PCM and I2C Interfaces

EM06 supports audio communication via Pulse Code Modulation (PCM) digital interface and I2C interface.

The PCM interface supports the following modes:

 Primary mode (short frame synchronization, works as both master and slave)
 Auxiliary mode (long frame synchronization, works as master only)

In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz,
512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at
16kHz PCM_SYNC.

In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a
256kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC only.

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EM06 supports 16-bit linear data format. The following figures show the primary mode’s timing relationship
with 8kHz PCM_SYNC and 2048kHz PCM_CLK, as well as the auxiliary mode’s timing relationship with
8kHz PCM_SYNC and 256kHz PCM_CLK.

125us

PCM_CLK 1 2 255 256

PCM_SYNC

MSB LSB MSB

PCM_OUT

MSB LSB MSB

PCM_IN

Figure 17: Primary Mode Timing

125us

PCM_CLK 1 2 31 32

PCM_SYNC

MSB LSB
PCM_OUT

MSB LSB

PCM_IN

Figure 18: Auxiliary Mode Timing

The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio
codec design.

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Table 11: Pin Definition of PCM and I2C Interfaces

Pin Name Pin No. I/O Description Comment

PCM_IN 22 DI PCM data input 1.8V power domain.

PCM_OUT 24 DO PCM data output 1.8V power domain.

PCM data frame

PCM_SYNC 28 IO 1.8V power domain.
synchronization signal
1.8V power domain.
In master mode, it serves as an
output signal.
PCM_CLK 20 IO PCM data bit clock
In slave mode, it serves as an
input signal.
If unused, keep it open.

I2C_SCL 58 DO I2C serial clock Used for external codec.

Require an external pull-up to
I2C_SDA 56 IO I2C serial data 1.8V.

The clock and mode can be configured by AT command, and the default configuration is master mode
using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. Please refer to
document [2] for details about AT+QDAI command.

The following figure shows a reference design of PCM interface with an external codec IC.

MICBIAS

INP
BIAS

PCM_CLK BCLK
INN
PCM_SYNC LRCK
PCM_OUT DAC
PCM_IN ADC

LOUTP
I2C_SCL SCL
I2C_SDA SDA LOUTN
4.7K
4.7K

Module Codec

1.8V

Figure 19: Reference Circuit of PCM Application with Audio Codec

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NOTES
1. It is recommended to reserve an RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for
PCM_CLK.
2. EM06 works as a master device pertaining to I2C interface.

3.10. Control and Indication Signals

The following table shows the pin definition of control and indication signals.

Table 12: Pin Definition of Control and Indication Signals

Pin Name Pin No. I/O Power Domain Description

It is an open collector and active low

signal.
WWAN_LED# 10 OD 3.3V
It is used to indicate the RF status of
the module.
A signal to wake up the host.
WAKE_ON_WAN# 23 OD 1.8V It is an open collector and active low
signal.

W_DISABLE1# 8 DI 1.8V/3.3V Airplane mode control. Active low.

W_DISABLE2# 1) 26 DI 1.8V/3.3V GNSS enablement control. Active low.

Dynamic power reduction. High level by

DPR 25 DI 1.8V
default.

 NOTE

1) means
GNSS enablement control function is under development.

3.10.1. W_DISABLE1# Signal

EM06 provides a W_DISABLE1# signal to disable or enable airplane mode through hardware operation.
The W_DISABLE1# pin is pulled up by default. When AT+CFUN=1, driving W_DISABLE1# to low level
will make the module enter airplane mode. In airplane mode, the RF function will be disabled.

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Table 13: Airplane Mode Controlled by Hardware

W_DISABLE1# RF Function Status Module Operating Mode

High level RF enabled Normal mode

Low level RF disabled Airplane mode

Software method can be controlled by AT+CFUN, and has the same effect with W_DISABLE1# signal
function, the details are as follows.

Table 14: Airplane Mode Controlled by Software

AT+CFUN=? RF Function Status Module Operating Mode

0 RF and (U)SIM disabled Minimum functionality mode

1 RF enabled Normal mode

4 RF disabled Airplane mode

3.10.2. WWAN_LED# Signal

The WWAN_LED# signal is used to indicate the RF status of the module, and its typical current
consumption is up to 40mA.

In order to reduce the current consumption of the LED, a resistor must be placed in series with the LED,
as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at a low voltage level.

WWAN_LED# R
VCC

Figure 20: WWAN_LED# Signal Reference Circuit Diagram

The following table shows the RF status indicated by WWAN_LED# signal.

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Table 15: Network Status Indications of WWAN_LED# Signal

WWAN_LED# Level Description

Low Level (LED ON) RF function is turned on

RF function is turned off if any of the following circumstances occurs:

 The (U)SIM card is not powered
High Level (LED OFF)
 W_DISABLE1# signal is at low level (airplane mode enabled).
 AT+CFUN=4 (RF function disabled)

3.10.3. WAKE_ON_WAN# Signal

The WAKE_ON_WAN# signal is an open collector signal, which requires a pull-up resistor on the host.
When a URC returns, a 1s low level pulse signal will be outputted to wake up the host. The module
operation status indicated by WAKE_ON_WAN# is shown as below.

Table 16: State of the WAKE_ON_WAN# Signal

WAKE_ON_WAN# State Module Operation Status

Output a 1s low level pulse signal Call/SMS/Data is incoming (to wake up the host)

Always at high level Idle/Sleep

High 1s
(external pull-up)

Low
Wake up the host

Figure 21: WAKE_ON_WAN# Behavior

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VCC from the Host

Module Host

10K

WAKE_ON_WAN#

Figure 22: WAKE_ON_WAN# Signal Reference Circuit Design

3.10.4. DPR Signal

EM06 provides a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate)
detection. The signal is sent by a host system proximity sensor to EM06 module to provide an input trigger
which will reduce the output power in the radio transmission.

Table 17: Function of the DPR Signal

DPR Level Function

High/Floating Max transmitting power will NOT be backed off

Max transmitting power will be backed off by executing AT+QCFG=”sarcfg”

Low
command

NOTE

Please refer to document [2] for more details about AT+QCFG=”sarcfg” command.

3.11. Antenna Tuner Control Interface*

ANTCTL[0:3] signals are used for antenna tuner control and should be routed to an appropriate antenna
control circuitry.

More details about the interface will be added in the future version of the document.

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Table 18: Pin Definition of Antenna Tuner Control Interface

Pin Name Pin No. I/O Description Comment

ANTCTL0 59 DO Antenna tuner control 1.8V power domain

ANTCTL1 61 DO Antenna tuner control 1.8V power domain

ANTCTL2 63 DO Antenna tuner control 1.8V power domain

ANTCTL3 65 DO Antenna tuner control 1.8V power domain

NOTE

“*” means under development.

3.12. Configuration Pins

EM06 provides 4 configuration pins, and they are configured as WWAN-USB.

Table 19: Pin Definition of Configuration Pins

Pin No. Pin Name I/O Power Domain Description

21 CONFIG_0 0 Connected to GND internally.

69 CONFIG_1 0 Connected to GND internally.

75 CONFIG_2 0 NC

1 CONFIG_3 0 NC

The 4 pins on EM06 module are defined as below:

Table 20: List of Configuration Pins

Config_0 Config_1 Config_2 Config_3 Module Type and Port

(Pin 21) (Pin 69) (Pin 75) (Pin 1) Main Host Interface Configuration

GND GND NC NC WWAN-USB 2

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4 GNSS Receiver

4.1. General Description

EM06 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of
Qualcomm (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS).

EM06 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via
USB interface by default.

By default, EM06 GNSS engine is switched off. It has to be switched on via AT command. For more details
about GNSS engine technology and configurations, please refer to document [3].

4.2. GNSS Performance

The following table shows the GNSS performance of EM06.

Table 21: GNSS Performance

Parameter Description Conditions Typ. Unit

Cold start Autonomous -145 dBm

Sensitivity
Reacquisition Autonomous -157 dBm
(GNSS)
Tracking Autonomous -157 dBm

Autonomous 43 s
Cold start
@open sky
XTRA enabled 10.5 s
TTFF
Autonomous 35 s
(GNSS) Warm start
@open sky
XTRA enabled 4.5 s

Hot start Autonomous 4.5 s

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@open sky XTRA enabled 3.5 s

Accuracy Autonomous
CEP-50 2.5 m
(GNSS) @open sky

NOTES

1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep
positioning for at least 3 minutes continuously).
2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain
lock within 3 minutes after loss of lock.
3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position
successfully within 3 minutes after executing cold start command.

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5 Antenna Connection
EM06 is mounted with three 2mm x 2mm antenna connectors (receptacles) for external antenna
connection: a Main antenna connector, an Rx-diversity antenna connector which is used to resist the fall
of signals caused by high speed movement and multipath effect, and a GNSS antenna connector. The
impedance of the antenna connectors is 50Ω.

5.1. Main/Rx-diversity/GNSS Antenna Connectors

5.1.1. Antenna Connectors

The Main, Rx-diversity and GNSS antenna connectors are shown as below.

Main Rx-diversity GNSS

Figure 23: Antenna Connectors on the Module

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5.1.2. Operating Frequency

Table 22: EM06-E Operating Frequencies

3GPP Band Transmit Receive Unit

WCDMA B1 1920~1980 2110~2170 MHz

WCDMA B3 1710~1785 1805~1880 MHz

WCDMA B5 824~849 869~894 MHz

WCDMA B8 880~915 925~960 MHz

LTE B1 1920~1980 2110~2170 MHz

LTE B3 1710~1785 1805~1880 MHz

LTE B5 824~849 869~894 MHz

LTE B7 2500~2570 2620~2690 MHz

LTE B8 880~915 925~960 MHz

LTE B20 832~862 791~821 MHz

LTE B28 703~748 758~803 MHz

LTE B32 1) - 1452~1496 MHz

LTE B38 2570~2620 2570~2620 MHz

LTE B40 2300~2400 2300~2400 MHz

LTE B41 2545~2655 2545~2655 MHz

Table 23: EM06-J Operating Frequencies

3GPP Band Transmit Receive Unit

WCDMA B1 1920~1980 2110~2170 MHz

WCDMA B3 1710~1785 1805~1880 MHz

WCDMA B6 830~840 875~885 MHz

WCDMA B8 880~915 925~960 MHz

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WCDMA B19 830~845 875~890 MHz

LTE B1 1920~1980 2110~2170 MHz

LTE B3 1710~1785 1805~1880 MHz

LTE B8 880~915 925~960 MHz

LTE B18 815~830 860~875 MHz

LTE B19 830~845 875~890 MHz

LTE B26 814~849 859~894 MHz

LTE B28 703~748 758~803 MHz

LTE B41 2545~2655 2545~2655 MHz

Table 24: EM06-A Operating Frequencies

3GPP Band Transmit Receive Unit

WCDMA B2 1850~1910 1930~1990 MHz

WCDMA B4 1710~1755 2110~2155 MHz

WCDMA B5 824~849 869~894 MHz

LTE B2 1850~1910 1930~1990 MHz

LTE B4 1710~1755 2110~2155 MHz

LTE B5 824~849 869~894 MHz

LTE B7 2500~2570 2620~2690 MHz

LTE B12 699~716 729~746 MHz

LTE B13 777~787 746~756 MHz

LTE B25 1850~1915 1930~1995 MHz

LTE B26 814~849 859~894 MHz

LTE B29 1) - 716~728 MHz

LTE B30 2305~2315 2350~2360 MHz

LTE B66 1710~1780 2110~2200 MHz

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LTE B41 2496~2690 2496~2690 MHz

Table 25: EM06-LA* Operating Frequencies

3GPP Band Transmit Receive Unit

WCDMA B2 1850~1910 1930~1990 MHz

WCDMA B3 1710~1785 1805~1880 MHz

WCDMA B4 1710~1755 2110~2155 MHz

WCDMA B5 824~849 869~894 MHz

WCDMA B8 880~915 925~960 MHz

LTE B2 1850~1910 1930~1990 MHz

LTE B3 1710~1785 1805~1880 MHz

LTE B4 1710~1755 2110~2155 MHz

LTE B5 824~849 869~894 MHz

LTE B7 2500~2570 2620~2690 MHz

LTE B8 880~915 925~960 MHz

LTE B20 832~862 791~821 MHz

LTE B28 703~748 758~803 MHz

NOTES

1. 1) LTE-FDD B29 and B32 support Rx only and are only for secondary component carrier.
2. “*” means under development.

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5.1.3. GNSS Antenna Connector

The following table shows frequency specification of GNSS antenna connector.

Table 26: GNSS Frequency

Type Frequency Unit

GPS/Galileo/QZSS 1575.42±1.023 MHz

GLONASS 1597.5~1605.8 MHz

BeiDou/Compass 1561.098±2.046 MHz

5.2. Antenna Requirements

The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.

Table 27: Antenna Requirements

Type Requirements

Frequency range: 1559MHz ~ 1609MHz

Polarization: RHCP or linear
VSWR: < 2 (Typ.)
GNSS 1) Passive antenna gain: > 0dBi
Active antenna noise figure: < 1.5dB
Active antenna gain: > 0dBi
Active antenna embedded LNA gain: < 17dB
VSWR: ≤ 2
Efficiency: > 30%
Max Input Power: 50W
Input Impedance: 50Ω
Cable insertion loss: < 1dB
WCDMA/LTE
(WCDMA B5/B6/B8/B19, LTE B5/B8/B12/B13/B18/B19/B20/B26/B28/B29)
Cable insertion loss: < 1.5dB
(WCDMA B1/B2/B3/B4, LTE B1/B2/B3/B4/B25/B32/B66)
Cable insertion loss < 2dB
(LTE B7/B38/B40/B41/B30)

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NOTE
1)
It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of
active antenna may generate harmonics which will affect the GNSS performance.

5.3. Antenna Connectors and Mating Plugs

The receptacle dimensions are illustrated as below.

Figure 24: Dimensions of the Receptacles (Unit: mm)

Table 28: Major Specifications of the Antenna Connectors

Item Specification

Nominal Frequency Range DC to 6GHz

Nominal Impedance 50Ω

Temperature Rating -40°C to +85°C

Meet the requirements of:

Voltage Standing Wave Ratio (VSWR) Max 1.3 (DC~3GHz)
Max 1.45 (3GHz~6GHz)

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The receptacle accepts two types of mating plugs to meet two maximum mated heights: 1.20mm (using a
Ø0.81mm coaxial cable) and 1.45mm (using a Ø1.13mm coaxial cable).

The following figure shows the specifications of mating plugs using Ø0.81mm coaxial cables.

Figure 25: Specifications of Mating Plugs Using Ø0.81mm Coaxial Cables

The following figure illustrates the connection between the receptacle antenna connector on EM06 and
the mating plug using a Ø0.81mm coaxial cable.

Figure 26: Connection between Receptacle and Mating Plug Using Ø0.81mm Coaxial Cable

The following figure illustrates the connection between the receptacle antenna connector on EM06 and
the mating plug using a Ø1.13mm coaxial cable.

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Figure 27: Connection between Receptacle and Mating Plug Using Ø1.13mm Coaxial Cable

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6 Electrical, Reliability and Radio

Characteristics

6.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed
in the following table.

Table 29: Absolute Maximum Ratings

Parameter Min. Max. Unit

VCC -0.3 4.7 V

Voltage at Digital Pins -0.3 2.3 V

6.2. Power Supply Requirements

The typical input voltage of EM06 is 3.7V, as specified by PCIe M.2 Electromechanical Spec Rev1.0. The
following table shows the power supply requirements of EM06.

Table 30: Power Supply Requirements

Parameter Description Min. Typ. Max. Unit

VCC Power Supply 3.135 3.7 4.4 V

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6.3. I/O Requirements

Table 31: I/O Requirements

Parameter Description Min. Max. Unit

VIH Input high voltage 0.7 × VDD18 1) VDD18+0.3 V

VIL Input low voltage -0.3 0.3 × VDD18 V

VOH Output high voltage VDD18-0.5 VDD18 V

VOL Output low voltage 0 0.4 V

NOTE

1) V
DD18 refers to I/O power domain.

6.4. Operation and Storage Temperatures

Table 32: Operation and Storage Temperatures

Parameter Min. Typ. Max. Unit

Operation Temperature Range 1) -30 +25 +70 ºC

Extended Temperature Range 2) -40 +85 ºC

Storage temperature Range -40 +90 ºC

NOTES
1) Within
1. operation temperature range, the module is 3GPP compliant.
2) Within
2. extended temperature range, the module remains the ability to establish and maintain a voice,
SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also
no effects on radio spectrum and no harm to radio network. Only one or more parameters like P out
might reduce in their value and exceed the specified tolerances. When the temperature returns to the
normal operation temperature levels, the module will meet 3GPP specifications again.

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6.5. Current Consumption

Table 33: EM06-E Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 50 uA

AT+CFUN=0 (USB disconnected) 2.77 mA

WCDMA PF=64 (USB disconnected) 4.06 mA

WCDMA PF=128 (USB disconnected) 3.66 mA

WCDMA PF=256 (USB disconnected) 3.48 mA

LTE-FDD PF=64 (USB disconnected) 4.49 mA

Sleep state
LTE-FDD PF=128 (USB disconnected) 3.89 mA

LTE-FDD PF=256 (USB disconnected) 3.59 mA

LTE-TDD PF=64 (USB disconnected) 4.54 mA

LTE-TDD PF=128 (USB disconnected) 3.91 mA

IVBAT LTE-TDD PF=256 (USB disconnected) 3.59 mA

WCDMA PF=64 (USB disconnected, band 1) 22.1 mA

WCDMA PF=64 (USB connected, band 1) 26.27 mA

LTE-FDD PF=64 (USB disconnected, band 1) 20.61 mA

Idle state
LTE-FDD PF=64 (USB connected, band 1) 20.72 mA

LTE-TDD PF=64 (USB disconnected, band 38) 20.56 mA

LTE-TDD PF=64 (USB connected, band 38) 20.96 mA

WCDMA B1 HSDPA CH10700 @23dBm 565 mA

WCDMA data WCDMA B1 HSUPA CH10700 @22.4dBm 557 mA

transfer
(GNSS OFF) WCDMA B3 HSDPA CH1338 @22.7dBm 582 mA

WCDMA B3 HSUPA CH1338 @22.1dBm 580 mA

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WCDMA B5 HSDPA CH4407 @22.6dBm 584 mA

WCDMA B5 HSUPA CH4407 @22dBm 572 mA

WCDMA B8 HSDPA CH3012 @22.3dBm 566 mA

WCDMA B8 HSUPA CH3012 @21.8dBm 553 mA

LTE-FDD B1 CH300 @23.8dBm 670 mA

LTE-FDD B3 CH1575 @23.8dBm 830 mA

LTE-FDD B5 CH2525 @23.3dBm 647 mA

LTE-FDD B7 CH3100 @23.48dBm 880 mA

LTE data LTE-FDD B8 CH3625 @23.2dBm 640 mA

transfer
(GNSS OFF) LTE-FDD B20 CH6300 @22.8dBm 770 mA

LTE-FDD B28 CH27460 @22.7dBm 692 mA

LTE-TDD B38 CH38000 @23.8dBm 341 mA

LTE-TDD B40 CH39150 @23.6dBm 377 mA

LTE-TDD B41 CH40740 @23.8dBm 345 mA

LTE-FDD B1+B1 @21.8dBm 811 mA

LTE-FDD B1+B5 @21.7dBm 749 mA

LTE-FDD B1+B8 @21.8dBm 761 mA

LTE-FDD B1+B20 @21.9dBm 810 mA

LTE-FDD B1+B28 @21.8dBm 821 mA

2CA data
LTE-FDD B3+B3 @21.3dBm 757 mA
transfer
LTE-FDD B3+B5 @21.2dBm 734 mA

LTE-FDD B3+B7 @21.2dBm 795 mA

LTE-FDD B3+B8 @21.2dBm 744 mA

LTE-FDD B3+B20 @21.2dBm 801 mA

LTE-FDD B3+B28 @21.2dBm 810 mA

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LTE-FDD B7+B5 @20.6dBm 798 mA

LTE-FDD B7+B7 @21.5dBm 803 mA

LTE-FDD B7+B8 @21.2dBm 811 mA

LTE-FDD B7+B20 @20.7dBm 840 mA

LTE-FDD B7+B28 @20.1dBm 830 mA

LTE-FDD B20+B32 @21.9dBm 701 mA

LTE-TDD B38+B38 @21.4dBm 424 mA

LTE-TDD B40+B40 @21.8dBm 464 mA

LTE-TDD B41+B41 @21.5dBm 435 mA

WCDMA B1 CH10700 @23.1dBm 663 mA

WCDMA B3 CH1338 @22.6dBm 665 mA

WCDMA voice
call
WCDMA B5 CH4407 @22.7dBm 625 mA

WCDMA B8 CH3012 @22.9dBm 633 mA

Table 34: EM06-J Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 47 uA

AT+CFUN=0 (USB disconnected) 2.96 mA

WCDMA PF=64 (USB disconnected) 3.76 mA

Sleep state WCDMA PF=128 (USB disconnected) 3.29 mA

IVBAT WCDMA PF=512 (USB disconnected) 3.14 mA

LTE-FDD PF=32 (USB disconnected) 5.12 mA

WCDMA PF=64 (USB disconnected) 19.5 mA

Idle state WCDMA PF=64 (USB connected) 21.4 mA

LTE-FDD PF=64 (USB disconnected) 21.9 mA

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LTE-FDD PF=64 (USB connected) 21.4 mA

LTE-TDD PF=64 (USB disconnected) 20.1 mA

LTE-TDD PF=64 (USB connected) 21.1 mA

WCDMA B1 HSDPA CH10700 @23.4dBm 700 mA

WCDMA B1 HSUPA CH10700 @22.2dBm 635 mA

WCDMA B3 HSDPA CH1338 @23.4dBm 704 mA

WCDMA B3 HSUPA CH1338 @22.7dBm 655 mA

WCDMA data WCDMA B6 HSDPA CH4175 @23.7dBm 589 mA

transfer
(GNSS OFF) WCDMA B6 HSUPA CH4175 @23.5dBm 578 mA

WCDMA B8 HSDPA CH3012 @23.4dBm 653 mA

WCDMA B8 HSUPA CH3012 @22.4dBm 584 mA

WCDMA B19 HSDPA CH738 @23.4dBm 628 mA

WCDMA B19 HSUPA CH738 @22.4dBm 575 mA

LTE-FDD B1 CH300 @23.3dBm 707 mA

LTE-FDD B3 CH1575 @23.1dBm 769 mA

LTE-FDD B8 CH3625 @24.1dBm 710 mA

LTE data LTE-FDD B18 CH5925 @24.2dBm 728 mA

transfer
(GNSS OFF) LTE-FDD B19 CH6075 @23.4dBm 651 mA

LTE-FDD B26 CH8865 @23.4dBm 604 mA

LTE-FDD B28 CH27460 @23.5dBm 705 mA

LTE-TDD B41 CH40740 @24.2dBm 363 mA

LTE-FDD B1+B1 @22.5dBm 815 mA

LTE-FDD B1+B8 @22.6dBm 861 mA

2CA data LTE-FDD B1+B18 @22.6dBm 913 mA

transfer LTE-FDD B1+B19 @23.1dBm 835 mA

LTE-FDD B1+B28 @23.2dBm 812 mA

LTE-FDD B3+B3 @23dBm 861 mA

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LTE-FDD B3+B8 @23dBm 913 mA

LTE-FDD B3+B18 @22.3dBm 878 mA

LTE-FDD B3+B19 @22.4dBm 857 mA

LTE-FDD B3+B28 @22.4dBm 864 mA

LTE-TDD B41+B41 @23.6dBm 507 mA

WCDMA B1 CH10700 @23.7dBm 735 mA

WCDMA B3 CH1338 @23.8dBm 740 mA

WCDMA voice
WCDMA B6 CH4175 @23.7dBm 610 mA
call
WCDMA B8 CH3012 @23.8dBm 675 mA

WCDMA B19 CH738 @23.9dBm 650 mA

Table 35: EM06-A Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 50 uA

AT+CFUN=0 (USB disconnected) 2.96 mA

WCDMA PF=64 (USB disconnected) 3.76 mA

Sleep state WCDMA PF=128 (USB disconnected) 3.29 mA

WCDMA PF=512 (USB disconnected) 3.14 mA

LTE-FDD PF=32 (USB disconnected) 5.12 mA

WCDMA PF=64 (USB disconnected) 21.3 mA

IVBAT
WCDMA PF=64 (USB connected) 28.2 mA

LTE-FDD PF=64 (USB disconnected) 21.9 mA

Idle state
LTE-FDD PF=64 (USB connected) 28.5 mA

LTE-TDD PF=64 (USB disconnected) 21.6 mA

LTE-TDD PF=64 (USB connected) 28.49 mA

WCDMA data WCDMA B2 HSDPA CH9800 @23dBm 520 mA

transfer
(GNSS OFF) WCDMA B2 HSUPA CH9800 @23dBm 520 mA

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WCDMA B4 HSDPA CH1638 @22.9dBm 500 mA

WCDMA B4 HSUPA CH1638 @23dBm 510 mA

WCDMA B5 HSDPA CH4407 @22.9dBm 600 mA

WCDMA B5 HSUPA CH4407 @22.9dBm 600 mA

LTE-FDD B2 CH900 @23dBm 700 mA

LTE-FDD B4 CH2175 @22.8dBm 650 mA

LTE-FDD B5 CH2525 @23.1dBm 680 mA

LTE-FDD B7 CH3100 @24.2dBm 895 mA

LTE-FDD B12 CH5095 @22.9dBm 670 mA

LTE data
transfer LTE-FDD B13 CH5230 @22.7dBm 660 mA
(GNSS OFF)
LTE-FDD B25 CH8365 @23dBm 705 mA

LTE-FDD B26 CH8865 @22.9dBm 650 mA

LTE-FDD B30 CH9820 @23dBm 700 mA

LTE-FDD B66 CH132322 @23dBm 720 mA

LTE-TDD B41 CH40740 @23dBm 390 mA

LTE-FDD B2+B2 @23.2dBm 825 mA

LTE-FDD B4+B4 @22.6dBm 910 mA

2CA data LTE-FDD B7+B7 @22dBm 950 mA

transfer LTE-FDD B25+B25 @22.5dBm 800 mA

LTE-FDD B66+B66 @21.7dBm 800 mA

LTE-TDD B41+B41 @23.1dBm 550 mA

WCDMA B2 CH9800 @23.1dBm 540 mA

WCDMA voice
WCDMA B4 CH1638 @23.2dBm 530 mA
call
WCDMA B5 CH4407 @22.9dBm 610 mA

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6.6. RF Output Power

The following table shows the RF output power of EM06 module.

Table 36: RF Output Power

Frequency Max. Min.

WCDMA bands 24dBm+1/-3dB < -50dBm

LTE- FDD bands 23dBm±2dB < -40dBm

LTE-TDD bands 23dBm±2dB < -40dBm

6.7. RF Receiving Sensitivity

The following tables show conducted RF receiving sensitivity of EM06 module.

Table 37: EM06-E Conducted RF Receiving Sensitivity

Frequency Primary (Typ.) Diversity (Typ.) SIMO1) (Typ.) SIMO2) (Worst Case)

WCDMA B1 -109.5dBm -109dBm -111dBm -106.7dBm

WCDMA B3 -109dBm -109dBm -111dBm -103.7dBm

WCDMA B5 -109dBm -109dBm -111dBm -104.7dBm

WCDMA B8 -109dBm -109dBm -111dBm -103.7dBm

LTE-FDD B1 (10MHz) -97.5dBm -97dBm -100dBm -96.3dBm

LTE-FDD B3 (10MHz) -97dBm -97dBm -100dBm -93.3dBm

LTE-FDD B5 (10MHz) -97dBm -99dBm -100.5dBm -94.3dBm

LTE-FDD B7 (10MHz) -95.5dBm -98dBm -99.5dBm -94.3dBm

LTE-FDD B8 (10MHz) -97.5dBm -98dBm -100.5dBm -93.3dBm

LTE-FDD B20 (10MHz) -96.5dBm -98.5dBm -100.5dBm -93.3dBm

LTE-FDD B28 (10MHz) -96.5dBm -98.5dBm -100.5dBm -94.8dBm

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LTE-TDD B38 (10MHz) -96dBm -97.5dBm -99dBm -96.3dBm

LTE-TDD B40 (10MHz) -96dBm -97.5dBm -98.5dBm -96.3dBm

LTE-TDD B41 (10MHz) -95.5dBm -97.5dBm -98.5dBm -94.3dBm

Table 38: EM06-J Conducted RF Receiving Sensitivity

SIMO2)
Frequency Primary (Typ.) Diversity (Typ.) SIMO1) (Typ.)
(Worst Case)

WCDMA B1 -109dBm -109dBm -111dBm -106.7dBm

WCDMA B3 -109dBm -109dBm -111dBm -103.7dBm

WCDMA B6 -108dBm -109dBm -111dBm -106.7dBm

WCDMA B8 -109dBm -109dBm -111dBm -103.7dBm

WCDMA B19 -109dBm -109dBm -111dBm -106.7dBm

LTE-FDD B1 (10MHz) -97.5dBm -97dBm -100dBm -96.3dBm

LTE-FDD B3 (10MHz) -97dBm -97dBm -100dBm -93.3dBm

LTE-FDD B8 (10MHz) -97.5dBm -99dBm -100.5dBm -93.3dBm

LTE-FDD B18 (10MHz) -96.5dBm -98dBm -100dBm -96.3dBm

LTE-FDD B19 (10MHz) -96.5dBm -98dBm -99.5dBm -96.3dBm

LTE-FDD B26 (10MHz) -96dBm -97.5dBm -98.5dBm -96.3dBm

LTE-FDD B28 (10MHz) -96.5dBm -98.5dBm -100.5dBm -94.8dBm

LTE-TDD B41 (10MHz) -95.5dBm -97.5dBm -98.5dBm -94.3dBm

Table 39: EM06-A Conducted RF Receiving Sensitivity

SIMO2)
Frequency Primary (Typ.) Diversity (Typ.) SIMO1) (Typ.)
(Worst Case)

WCDMA B2 -110dBm -110dBm -112dBm -106.7dBm

WCDMA B4 -110dBm -110dBm -112dBm -103.7dBm

WCDMA B5 -110dBm -110dBm -112dBm -106.7dBm

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LTE-FDD B2 (10MHz) -97.5dBm -97dBm -100dBm -96.3dBm

LTE-FDD B4 (10MHz) -98dBm -98.5dBm -101dBm -93.3dBm

LTE-FDD B5 (10MHz) -98dBm -99dBm -101dBm -93.3dBm

LTE-FDD B7 (10MHz) -97dBm -97dBm -99.5dBm -96.3dBm

LTE-FDD B12 (10MHz) -98.5dBm -98dBm -101dBm -96.3dBm

LTE-FDD B13 (10MHz) -98.5dBm -98dBm -100.5dBm -96.3dBm

LTE-FDD B25 (10MHz) -97.5dBm -98dBm -100dBm -96.3dBm

LTE-FDD B26 (10MHz) -98dBm -98dBm -100.5dBm -96.3dBm

LTE-FDD B30 (10MHz) -97.5dBm -98.5dBm -100dBm -94.8dBm

LTE-FDD B66 (10MHz) -97.5dBm -98dBm -100dBm -94.8dBm

LTE-TDD B41 (10MHz) -95.5dBm -97.5dBm -98.5dBm -94.3dBm

NOTES
1) SIMO
1. is a smart antenna technology that uses a single antenna at the transmitter side and multiple
(two for EM06) antennas at the receiver side, which can improve Rx performance.
2. 2) As per 3GPP specification.

6.8. ESD Characteristics

The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.

The following table shows the module electrostatic discharge characteristics.

Table 40: Electrostatic Discharge Characteristics (Temperature: 25ºC, Humidity: 40%)

Interfaces Contact Discharge Air Discharge Unit

VCC, GND ±5 ±10 kV

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Antenna Interfaces ±4 ±8 kV

Other Interfaces ±0.5 ±1 kV

6.9. Thermal Dissipation

EM06 is designed to work over an extended temperature range. In order to achieve a maximum
performance while working under extended temperatures or extreme conditions (such as with maximum
power or data rate, etc.) for a long time, it is strongly recommended to add a thermal pad or other thermally
conductive compounds between the module and the main PCB for thermal dissipation.

The thermal dissipation area (i.e. the area for adding thermal pad) is show as below. The dimensions are
measured in mm.

Figure 28: Thermal Dissipation Area on Bottom Side of Module (Top View)

There are some other measures to enhance heat dissipation performance:

 Add ground vias as many as possible on PCB.

 Maximize airflow over/around the module.
 Place the module away from other heating sources.
 Module mounting holes must be used to attach (ground) the device to the main PCB ground.
 It is NOT recommended to apply solder mask on the main PCB where the module’s thermal dissipation
area is located.
 Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical
enclosure) of the application device that integrates the module so that it provides good thermal
dissipation.
 Customers may also need active cooling to pull heat away from the module.

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 If possible, add a heatsink on the top of the module. A thermal pad should be used between the
heatsink and the module, and the heatsink should be designed with as many fins as possible to
increase heat dissipation area.

NOTE

For more detailed guidelines on thermal design, please refer to document [5].

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7 Mechanical Dimensions and

Packaging
This chapter mainly describes mechanical dimensions and packaging specifications of EM06 module. All
dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05mm unless
otherwise specified.

7.1. Mechanical Dimensions of the Module

Figure 29: Mechanical Dimensions of EM06 (Unit: mm)

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7.2. Standard Dimensions of M.2 PCI Express

The following figure shows the standard dimensions of M.2 PCI Express. Please refer to document [4] for
detailed A and B.

Figure 30: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm)

According to M.2 nomenclature, EM06 is Type 3042-S3-B (30.0mm × 42.0mm, max component height on
the top is 1.5mm and single-sided, key ID is B).

Figure 31: M.2 Nomenclature

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7.3. Design Effect Drawings of the Module

Figure 32: Top View of the Module

Figure 33: Bottom View of the Module

NOTE
These are renderings of EM06 module. For authentic dimension and appearance, please refer to the
module that you receive from Quectel.

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7.4. M.2 Connector

EM06 adopts a standard PCI Express M.2 connector which compiles with the directives and standards
listed in the document [4].

7.5. Packaging

EM06 modules are packaged in trays. Each tray contains 10 modules. The smallest package contains 100
modules.

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8 Appendix References

Table 41: Related Documents

SN Document Name Remark

[1] Quectel_M.2_EVB_User_Guide M.2 EVB User Guide

EP06, EG06 and EM06 AT

[2] Quectel_EP06&EG06&EM06_AT_Commands_Manual
Commands Manual
Quectel_EP06&EG06&EM06_GNSS_AT_Commands_ EP06, EG06 and EM06 GNSS AT
[3]
Manual Commands Manual

[4] PCI Express M.2 Specification PCI Express M.2 Specification

Thermal Design Guide for LTE

[5] Quectel_LTE_Module_Thermal_Design_Guide
modules

Table 42: Terms and Abbreviations

Abbreviation Description

bps Bits Per Second

CA Carrier Aggregation

DC-HSPA+ Dual-carrier High Speed Packet Access +

DFOTA Delta Firmware upgrade Over-The-Air

DL Downlink

ESD Electrostatic Discharge

FDD Frequency Division Duplexing

GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global

GLONASS
Navigation Satellite System

GNSS Global Navigation Satellite System

GPS Global Positioning System

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GSM Global System for Mobile Communications

HR Half Rate

HSPA High Speed Packet Access

HSUPA High Speed Uplink Packet Access

kbps Kilo Bits Per Second

LED Light Emitting Diode

LTE Long Term Evolution

Mbps Million Bits Per Second

ME Mobile Equipment

MIMO Multiple-Input Multiple-Output

MLCC Multiplayer Ceramic Chip Capacitor

MMS Multimedia Messaging Service

MO Mobile Originated

MT Mobile Terminated

PDU Protocol Data Unit

PPP Point-to-Point Protocol

RF Radio Frequency

Rx Receive

SAR Specific Absorption Rate

SMS Short Message Service

Tx Transmit

UART Universal Asynchronous Receiver & Transmitter

UL Uplink

URC Unsolicited Result Code

(U)SIM (Universal) Subscriber Identity Module

WCDMA Wideband Code Division Multiple Access

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