Operating Instructions

Confirmation
Operating Procedure
Screen Printer

Preparation
Model No. NM-EJP5A

Screen Printer

Operating

Production
Instructions

Data editing
administration
System
Thank you for purchasing a
Panasonic brand equipment.
● Be sure to read the Operating

Options
Instructions for proper and
safe usage.
● Before placing the machine in
service, be sure to read the

At a glance
Safety precautions.
● Please keep these operating
instructions for future
reference.

N7201A455E02
SPD S-2 N7201A455E02
 Original Instructions

Use of this equipment …

About this equipment

●This equipment is designed and manufactured to be used for screen printing of solder paste on PCBs or
similar boards. It should not be used for any other purpose.
●This equipment requires board handling equipment, i.e. conveyors, at the entrance and exit side of the
machine.

For proper operation

●This machine should only be operated by operators who have received and completed a dedicated
training curriculum.
●Only a person who has received special training shall operate the machine.
●For information regarding available training courses, please contact Panasonic Factory Solutions Co.,
Ltd. or Panasonic Factory Solutions Europe.

Manufactured by : Panasonic Factory Solutions For Service and Supply of Spares in Europe
Co., Ltd. you may contact Panasonic Europe:
1375 Kamisukiawara, Showa-cho, Nakakoma- Continental Europe
gun, Yamanashi Panasonic Factory Solutions Europe
409-3895, Japan Winsbergring 15
TEL: 81-55-275-6223 22525 Hamburg Germany
FAX: 81-55-243-4972 Phone number:0049-(0)40-85386-321
Fax number:0049-(0)40-85386-332
United Kingdom
Panasonic Factory Solutions Europe
Panasonic House, Willoughby Road
Bracknell, Berks. RG12 8 FP
Phone number:0044-(0)1344-853267
Fax number:0044-(0)1344-425970

Contents of CE Declaration of Conformity

(Manufacturer) (Council directive)
Panasonic Factory Solutions Co., Ltd. Machinery Directive: 2006/42/EC
2-7, Matsuba-cho, Kadoma, Osaka 571- EMC Directive: 2004/108/EC
8502 Japan (Harmonized standards)
(Product) EN 60204-1:2006 +A1:2009,
Screen Printer EN ISO 12100-2:2003 +A1:2009,
(Trade Name) EN 61000-6-4:2007, EN 61000-6-2:2005
Panasonic (Authorised Representative in EU)
(Model ID) Panasonic Testing Centre
SPD Panasonic Marketing Europe GmbH
(Model No.) Winsbergring 15, 22525 Hamburg, F.R.
NM-EJP5A Germany
(Statement)
The object of the declaration described
above is in conformity with the
requirements of the following EU
legislations and harmonized standards:

SPD S-3 N7201A455E02

 System evolution according to

High productivity Screen printer

 High-speed production
Printing the same product on the front and
rear printing stages enables the response to
high-production line.
 Nonstop changeover
Independently used the front and rear
stages allow to prepare for the next product
during production.
 Production of different types of
PC board
You can print different products on the front
and rear printing stages.

High quality
 Hybrid squeegee head
It reduces the printing time and the prevention
of air entrapped in the cream solder.
 Load detection unit
It can monitor the printing pressure during
printing and measure the solder amount
attached to the squeegee.
 PCB support function
It ensures to support the back side of PC
board from end to end, which realizes the
stabilization of printing quality.

A variety of options
 Automatic solder supply unit
Automatically supplying (X-direction
positioning) solder enables a long period of
continuous printing.
Stencil height detection
Optimizing a contact of PC boards with
stencils enables to provide stable and high
quality printing.
Stencil vacuum support stencil-
release
Controlling stencil shift or warp during printing
enables to provide stable and high quality
printing.

SPD S-4 N7201A455E02

 JISSO
Organization of Manuals
Preparation
and how to use
Chip mounter  Operating Procedure
Describes overall operating
procedure from production
preparation including material
setting to data creation and
modification.

Required checks
and cleaning
 Maintenance
Describes contents of regularly
required checks, adjustments and
cleaning including procedures to
exchange consumable parts.

Getting help
 Troubleshooting
Troubleshooting Describes errors
or problems that may occur on the
equipment and associated
countermeasures.

 Please note that contents of this manual are

subject to change without notice.
 Options of this equipment are outlined in a different
manual.

Related Documentation

 Parts list
(Mechanical/ Electrical)

 Wiring Diagram

SPD S-5 N7201A455E02

 Table of Contents
for Operator

-1
1
Safety precautions
Confir- -2 Precautions

mation -3 Warning labels

-4 Safety management
Safety switches / Key management /
Maintenance placard
-5 Handling of SD card and
serial number plate
-6 Disposing of the gas spring
-7 Handling the used battery
-8 Disposal of consumable items
-9 Component names
-9-1 Appearance diagram/
Operating units
-9-2 Operation switch
-9-3 Touch screen
-9-4 Support button
-9-5 Menu structure
-9-6 Main units

-1
Prepa-
2
Basic operation
-1-1 Start of equipment
-1-2
ration -1-3
Setting of password
Mode switching
-1-4 LNB connection screen

-2 File operation
-2-1 Loading and saving of file
-2-2 To [File editing] screen
-2-3 Loading production data
-2-4 Loading machine parameter
-2-5 Saving production data
-2-6 Saving machine parameter
-2-7 Clearing production data /
Initialization of SD card
-2-8 Sorting production data

(Continued on next page)

SPD S-6 N7201A455E02

 Confirmation
Prepa-
2 -3 Continuous preparation
-3-1 Overview of continuous preparation
-3-2
ration -3-3
Change of task setting
File operations

Preparation
-3-4 Squeegee exchange
-3-5 PCB support exchange
-3-6 Stencil set
-3-7 Supplying solder paste
-3-8 Solder kneading

Production
-3-9 Counter reset
-3-10 Setting of planned production volume
-4 Individual preparation

Data editing
Pro-
3 -1 Production
-1-1 Test print

duction -1-2 Production start and stop

-1-3 How to check screen during

administration
production, when stationary and after

System
production
solder squeegee
-2 Replenishment of material
-2-1 Cleaning paper exchange
-2-2 Replenishing cleaning solvent
Stencil

Options
PCB

At a glance

PCB support

Cleaning unit
SPD S-7 N7201A455E02
 Table of Contents（to be continued）
for Engineer

Data
4 -1 Production data editing
-1-1 PCB data edit
-1-2 PCB recognition data edit
editing -1-3
-1-4
PCB positioning data edit
Stencil data edit
-1-5 Stencil recognition data edit
-1-6 Batch teaching data edit
-1-7 Print position data edit
-1-8 Print process parameter edit
-1-9 Print counter edit
-1-10 Function switch edit
-1-11 Data check

-2 Production data teaching

-2-1 Before starting teaching operations
-2-2 Recognition target condition data
-2-3 Batch teaching
-2-4 PCB recognition teach
-2-5 Stencil recognition teach
-2-6 Print positioning teach
-2-7 Printing pressure teach
-2-8 Height detection

-1
System
5
Machine adjustment
-1-1 To[machine adjustment menu] screen
-1-2 Origin return/conveyor width adjustment
adminis- -1-3 Transfer motion/PCB recognition
-1-4 Confirmation of print motion
tration -1-5
-1-6
Confirmation of stencil cleaning motion
Confirmation of stencil recognition/solder
supply motion
-1-7 Confirmation of input/output
-1-8 Confirmation of axis information
-2 Machine setting
-2-1 Setting of adjustment switch/time setting
-2-2 Gathering of recognition results/setting of
back light
-2-3 Operator level customization
-2-4 Printing accuracy

SPD S-8 N7201A455E02

 Confirmation
-3
System
5
Machine parameter
-3-1 To[machine parameter] screen
-3-2 Origin offset
adminis- -3-3 Error tolerance value/camera

Preparation
-3-4 Other offset/signal tower

tration -3-5
-3-6
Setting of motion parameter
Option setting
-3-7 Data check
-3-8 Teaching menu

Production
-3-9 Network configuration (with LNB
(Option) enabled)

-1
6
Options
Option

Data editing
-1-1 Mounting of solder leak prevention
plate
-1-2 Mounting of PCB support
-1-3 PCB vacuum box
-1-4 Automatic solder paste supply unit

administration
-1-5 Setting of PCB hold down

System
motion/PCB transfer test

-1
7
Specifications
When -1-1 Equipment specifications/outline

Options
dimensions
required -1-2 Applicable PCB specifications /
stencil specifications

At a glance

SPD S-9 N7201A455E02

 How to read operating
instructions
Easy-to-find titles ／Tag headlines／Page number

Title

Chapter Sub-Section Sub-Section title

Maintenance
Replace-
4-1-4 ment Replacing battery 1

Section Section title ●Sequence number when

same title is utilized

Side Index

Page number
4 - 1 -4 - 1 When multiple pages
have the same title
Chapter, Section, Sub-Section,
Replacement

Sub-Section Page number

■About reference Major classification
（→P. 2 - 3 -1 ） title

Reference number
Symbol to show reference

SPD S-10 N7201A455E02

 Visual procedure／operation by reading
Operating procedure
Operation button

Contents of operation

1 2 Start production 3
SERVO

ENABLING START ENABLING

ON

Shows to turn in the direction of Operation switch

the arrow. Shows to push another switch or button
while holding down the ENABLING switch.
(Position of switches may vary.)
Shows the next button operation
(Hierarchy procedure) after the
operation mode is selected.

Shows to push the

screen Operation operation button.
procedure
2 1

1 Select the reset item

2
3 +

(Completes continuous
preparation.)

Shows the Shows to push another

operation switch or button while
results. holding down the
3 ENABLING switch.

SPD S-11 N7201A455E02

SPD S-12 N7201A455E02
 Operation
-1
1
Safety precautions
Confirmation -2 Precautions
-3 Warning labels
-4 Safety management
Safety switches / Key management /
Maintenance placard
-5 Handling of SD card and
serial number plate
-6 Disposing of the gas spring
-7 Handling the used battery
-8 Disposal of consumable
items
-9 Component names
-9-1 Appearance diagram/
Operating units
-9-2 Operation switch
-9-3 Touch screen
-9-4 Support button
-9-5 Menu structure
-9-6 Main units
 Operating procedure

1-1 Safety precautions 1

Precautions that must be observed in order to prevent

injury to the user or other persons, and damage to
property are described below.
■ The degree of danger or injury resulting from
To prevent accidents,
incorrect usage are classified and described as
follows. electric shock and
major injury.
Indicates an imminently
hazardous situation that could
DANGER result in death, severe bodily
injury or major property damage. Emergency stop switch
(Located in front and rear)
Indicates a potentially hazardous
situation that could result in
WARNING death, severe bodily injury or
property damage.

Indicates a potentially hazardous

situation that could result in
CAUTION minor or moderate injury and
property damage.

■Precautions that must be observed are classified

by the symbols shown and described below.

Indicates actions that must

not be carried out.

Indicates actions that must

be carried out.

Indicates matters to which

attention must be paid.

If you sense any danger or abnormalities, press

the emergency stop switch to stop operation.
(If you continue to operate the machine in a
dangerous or abnormal state, an accident will
occur)

●When you push the emergency stop switch, both

front and rear sides of the machine stop.
●Push the nearest emergency stop switch( two
locations).
Either switch stops the machine.
[How to reset]
When you are ready to restart operation, turn the
emergency stop switch clockwise and pull out after
checking and clearing any danger or
abnormalities.

SPD 1-1-1 N7201A455E02

 Confirmation
DANGER

Do not disable safety switches.

(Risk of injury)
●When safety switches on safety covers are activated during operation , both
front and rear sides of the machine stop simultaneously.

Safety switches
(Under rear safety cover)

Safety switches
(Under front safety cover)

Solvent tank

Use the recommended

solvent for cleaning.
(To prevent explosion or fire).

●Recommended solvent:
Industrial detergent Elease M2800
(Maker: Asahi Kasei Chemicals Corporation)

SPD 1-1-2 N7201A455E02

 Operating procedure

1-1 Safety precautions 2

DANGER

Observe the following when placing any part of

your body into a moving part of the machine.
(Risk of electric shock or injury if the machine is actuated)

Please handle according to your task.

ON
●When repairing control units.

→ Cut off the power supply to this machine.

OFF

ON
●When performing periodic maintenance or
exchanging consumable parts.

→Turn off the main power supply switch and lock OFF
out the machine.

● When performing changeovers or daily

maintenance, placing / removing a PCB from
the conveyor, maintenance of the inside of the
machine
OFF ON
→Turn off the servo switch(of working side and)
open the safety cover.

Servo switch

Main power
supply switch
(Front side)

SPD 1-1-3 N7201A455E02

 Confirmation
WARNING
To prevent
electric shock, Shut off power
burn or injury. before performing
maintenance work.
(Risk of injury or electric shock)
● When you shut off the power
source, the air source is
automatically shut off in conjunction.
●Lock the main power supply switch
with the padlock.
●Put a maintenance placard during
maintenance.

Be aware of the
possibility of electric
shock to the
primary line during
maintenance work.
(Risk of electric shock)

●Be aware of the possibility of electric

shock during maintenance work.

Primary line
(The power is being supplied)

Main power supply

Main terminal switch
L1
L2

PE

SPD 1-1-4 N7201A455E02

 Operating procedure

1-1 Safety precautions 3

WARNING
Take care not to pinch your
Receive special hands
(Risk of injury)
training before ●This graphic symbol, a warning label,
operating, adjusting is put on parts which contain the
potential risk of squeezing hands.
or repairing the ●Direct particular attention to any of the
following.
machine. ・When closing the cover.
(Risk of injury due to uncontrolled or ・When adjusting the width between rails
incorrect motion of the machine caused by manually or automatically.
improper operation) ・When moving XY table, the head and
●Contact us about training. the axis by hand.

Be sure to ground the machine

(Risk of electric shock or leak)
Take care not to ●Consult a professional electrical
touch hot surfaces. contractor.

(Risk of burns ) Do not touch an electrified part

●This graphic symbol, a warning label, is with conductive materials such as
put on parts which may increase in a wire.
temperature. (Risk of electric shock)
●They may remain heated even after
●Current-carrying parts including the
stopping operation.
connector and the terminal.

Do not place your hands or body

into the moving parts of the
Take care not to machine even while the machine
is stopped.
receive an electric (Risk of injury)
shock. ●When the machine is in single stop or
cycle stop state, moving parts of the
(Risk of electric shock)
machine may start running
●This graphic symbol, a warning label, is unexpectedly if the sensors are
put on parts which carry the potential activated.
risk of electrical shock.
Perform maintenance of
pneumatic equipment after
exhausting residual pressure
Do not bring any (Risk of injury due to residual pressure
flame sources close moving the movable parts)
to the machine. Do not touch the edge of the
(Risk of igniting cleaning solvent) clamp claw
(Risk of injuring your hands or fingers)

SPD 1-1-5 N7201A455E02

 Confirmation
CAUTION
To prevent
injury or Do not put any objects
electric shock around emergency stop
switches.
(Risk of an accident due to being
unable to press the switch to stop
the machine in case of emergency)

Do not climb on equipment, Be careful in handling solder

peripheral devices and paste.
moving parts (Risk of adverse effects of harmful
substances on the human body
(Cause of damage by load or injury by
depending on the type of solder paste)
falling or being stuck in the equipment.) ●Observe the safety precautions noted
●Covers in the operating instructions for the
solder paste.

Do not apply any impact to Wear a hard hat or helmet

motors or other electrical and protective goggles
equipment. (Risk of electric shock, during maintenance work.
cause of electrical leakage (Risk of injury)
●Motor or control boxes ●Motor or control boxes

Do not inhale the cleaning Observe the precautions

solvent fumes for extended described in the Product's
periods. [Material Safety Data Sheet].
(Risk of organic solvent poisoning) (Cause of injury or damage by chemical
●When you handle cleaning solvent or substances)
cleaning paper, proper ventilation is ●Material Safety Data Sheets can be
necessary. found in the Maintenance of the
Instruction manual.

SPD 1-1-6 N7201A455E02

 Operating procedure

Precautions
1-2
Precautions in use
●Do not move noise sources such as welders close to equipment. A malfunction may occur.
●During the operation of equipment, avoid turning OFF the power switch of the main controller, the servo
witch and the air unnecessarily. Because equipment operates independently without being controlled,
breakage may occur.
●During instruction or when moving a unit manually with the servo free from stress, be sure that there is
no interference. Breakage may occur.
●Do not take apart or alter the main body of equipment or the unit. It may affect the level of safety and
quality control of products.
●Data should only be changed by authorized personnel, who have received special training. A
malfunction may occur due to improper input.
●Do not block the fan outlet and inlet. Abnormal action arising from the increase in temperature inside
the control box may occur.
● Do not turn OFF the servo switch during operation. It may cause machine to malfunction. Turn it OFF
when the machine is in a temporary stop state (single stop or cycle stop) or operation stop state.
●We would assume no responsibility of the following conditions.
・Troubles or damages due to user's misoperation or unfair repair and remodel
・ Accidental damage arising from the machine use or fail such as loss of business interests, or change
or deletion of memory data
・Troubles or damages due to relocation, transport or drop related to installation after shipped
・Troubles or damages due to fire, earthquake, water damage, lightning stoke and other natural
disasters, and environmental salt damage, gas damage (e.g. sulfidizing gas), abnormal voltage,
use power supply (e.g. voltage, frequency) other than specified
・Troubles or damages occurred when transported by a vehicle or a ship
・ Damage arising from not observing the listed terms in the manual

Precautions for Maintenance and Inspection

■Follow the instruction manual when engaged in maintenance or inspection.
●Refer to [Instruction manual (Maintenance)] for performing maintenance and inspection.
●Turn OFF the main power switch before work. Locking is recommended to ensure your safety.
●When cleaning parts of the equipment not mentioned in the instruction manual, wipe with a soft dry
cloth. For dirty spots, dampen a cloth with a neutral detergent diluted with water, and wipe the spots
after wringing out the wet cloth. After cleaning with the damp cloth, dry with a dry cloth.
●When cleaning inside the clean room, use cleaning implements provided for the clean room.
●Do not use an organic solvent or the like because it contributes to the following.
・Cracking or deterioration of plastic components
・Rapid decline in antistatic effect
・Danger to health

■Clean the area around equipment when the equipment is not in use. When cleaning
equipment, be sure to turn the power source off and do not use an air gun.
●The unit and products may be exposed to dust, thereby causing adverse influence on equipment and
products.

SPD 1-2-1 N7201A455E02

 Confirmation
Handling of Stencil height sensor(option)
Stencil height sensor
■As the stencil height sensor is equivalent to the class 1 (IEC60825-1) of the laser
safety standard , it is safe in normal use basically . However do not stare at it during
maintenance or operation.
■The stencil height sensor can be mounted in front and / or rear side of the machine.
Maximum output of the laser element is 0.3mW. Laser emission from the sensor
head does not stop during disassembling. Never disassemble the sensor head to
avoid laser exposure.

Stencil height
sensor

Item Laser specification

Manufacturer Panasonic Factory Solutions Co., Ltd.

Model number N610125990AA

Wavelength 655 nm

Output 0.3 mW

Class Class 1
Mount position See the left figure.
Regulation IEC60825-1 2001

■Laser class label affixed on the machine

The following label is affixed on the machine installed the mask height sensor (option).

SPD 1-2-2 N7201A455E02

 Operating procedure

Warning labels 1
1-3
Be sure to follow the instructions on warning labels in the following figures.
If the label is peeled, confirm the part number of the label on parts list and order to our company
and affix it on the correct position.

Danger

Front side Rear side

PD0116M1

Front side Rear side

PD0101M1

SPD 1-3-1 N7201A455E02

 Confirmation
Warning Caution

Front side Front side Rear side

PW0104M1 PC0107M1

PCB positioning lifter

Front side Rear side

Front side

PC0133M1

SPD 1-3-2 N7201A455E02

 Operating procedure

Warning labels 2
1-3
Warning
Front side Rear side

Left side Right side

SPD 1-3-3 N7201A455E02

 Confirmation
Warning
Front side Plan Rear side

When selecting options, put

warning label

Left side Right side

SPD 1-3-4 N7201A455E02

 Operating procedure Safety switches / Key
1-4 management / Maintenance
placard

Safety switches
Safety covers on the machine are equipped with safety switches. In the event that one of the safety covers
is opened accidentally during automatic production, the machine will come to an emergency stop to ensure
the safety of the operators.

Safety Covers
●Before starting automatic production, ensure that all safety covers are closed.
●When material replenishment is needed, a message will be displayed on the screen instructing you
which corresponding cover can be opened to replenish the materials.
Servo Switch
●When working inside the machine like performing changeovers or maintenance tasks, be sure to turn
OFF the servo switch on the side that is being worked on to ensure operator safety.
●If the servo switch is turned OFF, all axes will be disabled.
●Before starting production, verify whether the servo switches on the front and rear control panel have
been turned ON.

Key management
When you encounter a section in the manuals that reads [Turn off the main power supply as well as
stopping air supply], a lock is needed. The key for the lock should be managed by a trained person,
according to the customer's management standard.
Lock plate
■ Locking/Unlocking procedure
1 Rotate the knob to left to the
1
position where marks on the lock
plate and the case match.
3 2
2 Push in the lock plate.
Knob
key 4 Turn the knob to [OFF] position
Mark on the 3
Φ5～Φ8 case with holding the lock plate.

Lock plate Put the padlock through the

4
key center hole to lock.

5 Place the maintenance placard

indicating maintenance work in
30～50 ｍｍ progress.
Placard

SPD 1-4-1 N7201A455E02

 Confirmation
Maintenance placard
Before performing maintenance, affix the included maintenance placard (see below) to prominent positions in
the vicinity of the operating panel, for safety. During maintenance by two or more persons in particular, in
addition to using these warning sheets to ensure safety, be sure to send signals to each other.
● This maintenance placard uses a magnet. Do not use it or
store it near magnetic media or any other items susceptible to
magnetic influence.

1-4-2
 Operating procedure
Handling of SD card and
1-5 serial number plate

Handling of SD card
■SD card using in this machine (Recommended SD card)
Capacity Product number (Panasonic brand)
SD card 2GB RP-SDP02GJ1K (as of August, 2010)
・The product number is subject to change without notice.
Notice ●SDHC memory cards are not supported.
●SD cards can save a maximum of 235 items, regardless of memory capacity.
(SD cards with a capacity of 64MB can save a maximum of 200 items.)
●The available card capacity is from 64MB to 2GB.
●A defect SD card may not function properly. If so, please remove and insert
again.
■Write protection
It is possible to mechanically protect the stored data from an accidental deletion or overwrite.
"Released" position ""Write protect" position
Enables deleting and saving. Disables deleting and saving.

■Handling precautions
●Avoid severe shock, bending, dropping or exposure to water.
●Avoid placing heavy objects on the disk.
●Avoid applying excessive force to the disk.
●Do not touch metal terminals by hand or metal objects.
●Do not remove attached labels.
●Do not affix another one over the label.
●Avoid storing or leaving in areas exposed to the following conditions.
・High or low temperature ・High humidity ・Dusty ・Direct sunlight・Corrosive gas
●Avoid using cases not specifically provided for storage and carrying.
●While the drive access lamp (→P.1-9-1-2) is lit, avoid ejecting SD card or turning off the power supply.
●Execute virus check when the inserted SD card to the PC is used so that you can prevent from virus
infection.
●Even though the longer use of the SD card may warm up the card, it is not broken.
●Since the SD memory card has life duration. If you use it longer time, you may not write or delete the data.
●We would assume no responsibility of damage due to data deletion.

SPD 1-5-1 N7201A455E02

 Confirmation
SD card type
■Key disk (Engineer)
Uses when a password of each mode is changed.
●Key disk is necessary to set a password. Keep it in a safe place.
●If you lose your disk, please contact us.
■Install disk
Uses when the software is saved and upgraded.
■Parameter disk
Uses when the production data or machine parameters are saved.

Serial number plate

The serial number plate indicating
the product name (Model ID) and
serial number of the machine is Rear side
affixed at the following location.

Note, * is replaced with a

numeric value.

SPD 1-5-2 N7201A455E02

 Operating procedure
Disposing of the gas
1-6 spring

The gas spring is used to open/close covers. It is very dangerous to dispose of it as it is, because
high-pressure air is sealed into it. When disposing a gas spring, be sure to degas when disposed.
To remove or dispose, please send a request to the gas spring manufacturer.

■Locations where the gas spring is used

Hexagon socket
head cap screw

Gas spring

Hexagon socket
head cap screw
(4 locations)

Front side

■Removing gas spring

Turn the hexagon socket head cap screws counterclockwise and remove the spring.

■Disposing gas spring

Make a hole with the drill and degas completely inside the gas spring.

Drilled hole

Wear a hard hat or helmet and protective

CAUTION goggles during maintenance work.
(Risk of injury)

SPD 1-6 N7201A455E02

 Operating procedure

Handling the used battery

1-7

Confirmation
Information for users in EU member states
Information for Users on Collection and Disposal of Old Equipment and used Batteries

These symbols on the products, packaging, and/or accompanying documents mean that
used electrical and electronic products and batteries should not be mixed with general
household waste.
For proper treatment, recovery and recycling of old products and used batteries, please
take them to applicable collection points, in accordance with your national legislation and
the Directives 2002/96/EC and 2006/66/EC.
By disposing of these products and batteries correctly, you will help to save valuable
resources and prevent any potential negative effects on human health and the environment
which could otherwise arise from inappropriate waste handling.
For more information about collection and recycling of old products and batteries, please
contact your local municipality, your waste disposal service or the point of sale where you
purchased the items.
Penalties may be applicable for incorrect disposal of this waste, in accordance with national
legislation.

For business users in the European Union

If you wish to discard electrical and electronic equipment, please contact your dealer or
supplier for further information.

[Information on Disposal in other Countries outside the European Union]

These symbols are only valid in the European Union. If you wish to discard these items,
please contact your local authorities or dealer and ask for the correct method of disposal.
Note for the battery symbol (bottom two symbol examples):
This symbol might be used in combination with a chemical symbol. In this case it complies
with the requirement set by the Directive for the chemical involved.

No. Location Battery type Reference page

1. CPU board Lithium battery See [Replacing battery] (P.4-1-4)
2. NCIO board Lithium battery See [Replacing battery] (P.4-1-4)

● Lithium battery is a primary cell. You cannot charge the battery.

SPD 1-7 N7201A455E02

 Operating procedure
Disposal of consumable
1-8 items

When consumable items used in production, adjustment or maintenance are disposed, be

careful of the followings;
Please dispose of it in conformity with the laws or regulations of each country, or contact
your local authorities for more information.

■Oil (grease)
Be careful when handing used oil, and keep away from open fire or flame
■Gloves, lint free cloth (contaminated during work)
■Exchange parts (e.g. battery)
The disposal procedure varies depending on the exchange parts. Please ask us if you have any
question.

SPD 1-8-1 N7201A455E02

 Confirmation

SPD 1-8-2 N7201A455E02

 operating procedure Compo-
Appearance diagram/
1-9-1 nent
names Operating units

Appearance diagram
Front side

Front safety cover

Front touchscreen

Front cover

Rear side Rear safety cover

Rear touchscreen

Regulator Knob
Adjusts supplied air
pressure

Drain bottle
Collects drainage
from air piping and
Rear cover regulator and
drainage solvent of
the stencil cleaning.

SPD 1-9-1-1 N7201A455E02

 Confirmation
signal tower
Red: Illuminates when you push emergency stop switch or in case of error
stop.
Yellow: Illuminates in case of material shortage.
Green: Illuminates in automatic operation.

Red: Illuminates when you push emergency stop switch or in case of error
stop.
●You can change the above setting.(see P.5-3-4)
● Please refer to the [Maintenance] for illumination check.
(see P.3-4-11)
●The signal tower is placed sideways when shipped , however the angle can be adjusted.

Operating units
Operating units/Front side

Various operation switches

Controls operation start / stop.

Emergency stop switch

Stops operation immediately.
Servo switch
Turns ON/OFF the power of servo
units.

Main power supply switch

Turns ON/OFF the power and air
supply.
(When you turn off the power
supply switch, the air supply is shut
off also.)

SD card reader
Reading and writing of programming data.

Access lamp
(Green LED)

SPD 1-9-1-2 N7201A455E02

 operating procedure Compo-
Operation switch
1-9-2 nent
names

START
Starts production.
●Restarts production when in temporary stop.

SPD 1-9-2-1 N7201A455E02

 Confirmation
ENABLING
Safety measure to prevent
machine movement if this switch
is not pressed in conjunction with
an Operation Switch.
(For risk prevention)

STOP
Temporarily stops production
(single stop).

SUPPORT
Displays support menu screen.
(Available only for [home
screen ]and [in production
screen ].) (→P.1-9-4)

SERVO
Turns ON / OFF the motor power
supply.
●Turn on when you start
production.
●Be sure to turn off before
placing your hands into the
moving parts of the machine.

Emergency stop switch

Stops the machine immediately.
●Turn in the direction of the
arrow and pull the switch to
release.
(Total 2 switches in front and
rear.)

Emergency Released
stop state state

SPD 1-9-2-2 N7201A455E02

 operating procedure Compo-
Touch screen
1-9-3 nent
names

Type of operation button

Explains the contents displayed in each area of the touch screen.

●Displays home menu.

●Starts automatic
production.

●Confirms required setting

or motion for production.

●Displays the information obtained

during automatic production.

●Creates or edits the

production data.

●Teaches PCB
recognition,stencil
recognition and printing
pressure.

●Saves or loads production

data and machine parameter.

●Confirms or adjusts the

motion of each part of the
machine.

●Sets up or changes the default

parameters of the machine. Reverse side screen display.
●Displays the reverse side screen.
●Sets up the machine Internal lighting
configuration which does not ●Turns on / off the internal lighting.
depend on production data.
Stops buzzer
●Checks daily maintenance tasks.
●Stops the sound of a buzzer.

Exchanges language.
●Sequentially exchange the letters on the screen.
Japanese → Chinese → English.
Superimposition.
●Displays superimposed on recognition screen.
Sequentially exchanges as follows.
Full size → half size at the upper left
→ half size at the lower right → half size at the lower right
→ half size at the lower left→ no display.
Saves screenshot
●Saves screen data to an SD card.

SPD 1-9-3-1 N7201A455E02

 Confirmation
Type of operation

■How to select.

Display area for

hierarchy,mode and menu
name.
●States of displayed screen.

Display area for year,

month, day, time and data
name
Submenu area
●Usable buttons in each menu.

Display area for status, Choose one. Switch by pushing

buttons and messages.
●Displays present working
states or contents.
■How to input. 1 2
Status area
●Operation guidance, etc.

Return key
●Push when finished.
(Go back to the previous screen)

Help key
●Displays the explanation of
currently displayed screen.
Sequentially exchanges as
follows.
Screen on the left → screen on
the right → half size at the left. 3

1 Select an item
(Press the filed to input)

Input numerical values

2 (Use BS key for modification.)

3
key to confirm.

SPD 1-9-3-2 N7201A455E02

 Operating procedure Compo-
Support button
1-9-4 nent
names

SUPPORT
On the Home screen, in
production screen

A G
B H
C I
D J
E Solder replacement K
F L

Cleaning 1 round Stencil set

A ●Performs one round cleaning of the
stencil during machine stop.
G ●Sets the stencil

Cleaning 2 round Stencil Clamp

B ●Performs two round cleaning of the
stencil during machine stop.
H ●Turns the stencil clamp OFF to
remove the stencil.

Cleaning paper exchange Stencil back side wipe

C ●Moves the cleaning unit toward you
for cleaning paper replacement.
I ●Moves the cleaning unit to the
machine rearward to clean the stencil
back side.

Send out air of solvent PCB extraction

D ●Drives the pump to remove air in the
pipe when a solvent is supplied to the
J ●Drives the PCB transfer conveyor to
remove the PCB on the conveyor.
tank.

Squeegee up Solder replacement (option)

E ●Moves the squeegee head toward you
for squeegee maintenance.
K ●Moves the syringe of the automatic
solder dispensing unit to the
replacement position for replacement.

SQ. escape ESC

F ●Escapes the squeegee to origin. L ●Ends the support menu

SPD 1-9-4 N7201A455E02

 Operating procedure Compo-
Menu structure 1
1-9-5 nent
names

Confirmation
The following shows the menu structure of operation buttons under the operator mode.

Operator mode

Display home menu.

Operator
mode
Start automatic production.

Carry out series of change over tasks.

squeegee Set squeegee.

Production settings and
motion confirmation. セット

Exchange PCB
maskセット support.

maskセット Set stencil.

Supply solder
solder供給
paste.

Carry out solder

solderならし
kneading.

Reset counter

Specify production PCB count.

Reset counter

Display operating information during

operation.
Display information for
Display stop information during operation.
automatic production.

Display cleaning and solder supply count.

Reset production information.

SPD 1-9-5-1 N7201A455E02

 Operating procedure Compo-
Menu structure 2
1-9-5 nent
names

Engineer mode

Edit PCB data.

Engineer Create, edit and teach Edit PCB recognition data.

mode production data.

Edit conditions to fix PCB.

Mask data Edit stencil data.

Edit stencil recognition

coordinates.

Edit batch recognition

coordinates.

Edit correct print position by

Print pos data
teaching.

Print process param Edit print motion condition.

Edit print and solder paste

Print counter supply count.

Function switch Edit motion condition.

Check created and edited

Data check production data.

Carry out PCB recognition, stencil recognition and printing

pressure teaching.

Read and save production

data.

Save and read production Read and save machine

data and machine parameters and initialize SD
parameter on internal card.
memory and external
memory.

SPD 1-9-5-2 N7201A455E02

 Confirmation
origin return Return all axes to origins.

Confirm and adjust motions Adjust conveyor width.

Engineer
mode of machine units.
transfer motion Transfer PCB on conveyor.

Correct PCB recognition

coordinate.

printmotion Confirm print motion.

Confirm stencil cleaning

motion.
Correct stencil recognition
coordinate.
Confirm motion of automatic
solder supply unit.
Confirm production motion
and carry out solder kneading.
Display with address and
change conditions of equipment
and sensors.
Display with address and
change conditions of valves and
sensors.
Display all axes information.

Carry out maintenance and

axisinformation motion confirmation of
recognition unit.

Pressure precision Verify print pressure.

Change and set equipment reference after maintenance or parts

exchange.

Set motion condition for

Adjustment switch adjustment.

Set equipment state Time set Set time.

independent from production
data. Display the last 100
PCB recog result recognition results.
Customize permission range
Customize operator in operator mode.

Back light set Set back light.

Print precision Display print precisions.

Check daily maintenance checks.

SPD 1-9-5-3 N7201A455E02

 operating procedure Compo-
Main units
1-9-6 nent
names

XY table
Moves the PCB positioning
lifter.

PCB positioning
lifter
Controls PCB positioning
and stencil snap off at
printing position.

Transfer
搬送コンベア conveyor
Loading and unloading of
基板を搬入・搬出する。
PCBs.

SPD 1-9-6-1 N7201A455E02

 Confirmation
Recognition unit
Carries out stencil recognition
after exchanging stencil and
correction of PCB position.

Cleaning unit
Cleans the back side of
the stencil.

Squeegee head
Prints solder paste on PCBs.

Temperature
control unit
Controls temperature of solder
paste on the stencil to maintain
printing quality.

SPD 1-9-6-2 N7201A455E02

SPD 1-9-6-3 N7201A455E02
 Operation
2
Preparation -1 Basic operation
-1-1 Start of equipment
-1-2 Setting of password
-1-3 Mode switching
-1-4 LNB connection screen

-2 File operation
-2-1 Loading and saving of file
-2-2 To [File editing] screen
-2-3 Loading production data
-2-4 Loading machine parameter
-2-5 Saving production data
-2-6 Saving machine parameter
-2-7 Clearing production data /
Initialization of SD card
-2-8 Sorting production data

-3 Continuous preparation
-3-1 Overview of continuous preparation
-3-2 Change of task setting
-3-3 File operations
-3-4 Squeegee exchange
-3-5 PCB support exchange
-3-6 Stencil set
-3-7 Supplying solder paste
-3-8 Solder kneading
-3-9 Counter reset
-3-10 Setting of planned production volume

-4 Individual preparation
 Operating procedure
Basic
Start of equipment
2-1-1 operation

Confirm air
1 2 3 pressure.
SERVO

ON

Air pressure

●Wait one to two minutes.

(After the system starts,
the main screen as Rear side
shown below is
displayed)

●Confirm that the air

pressure is between 0.50
to 0.55MPa.
●In the event the air
pressure is out of range,
confirm the supply
pressure in the factory.
(see [Maintenance
Manual] P 3-2-1)

(Inside the rear cover)

Start up
operation is
completed.
Start the individual operation.

SPD 2-1-1 N7201A455E02

 Operating procedure
Basic
Setting of password
2-1-2 operation

Set a password to switch screen to engineer mode.

Insert the [Password Change] SD

1 card.

Preparation
●Insert the SD card (included key disk)
for changing password to the SD card
reader.

4 5 7

3
Input [New password].
4 ● Length: one to ten characters
(Symbols allowed)
●We recommend to input more than 4
characters for security

6 3 6 Re-enter [New password].

7
SPD 2-1-2 N7201A455E02
 Operating procedure
Basic
Mode switching 1
2-1-3 operation

■[Home menu] screen under Operator mode

Operator
mode

■To switch to operator mode.

SPD 2-1-3-1 N7201A455E02

 ■To switch to Engineer mode.

Preparation
Input the password
2 ●Setting password
(→P.2-1-2)

3
2 3

■ [Home menu] screen under Engineer mode

Engineer
mode

SPD 2-1-3-2 N7201A455E02

 Operating procedure
Basic
Mode switching 2
2-1-3 operation

■Operator customize mode (see P.5-2-3-1)

1

2 Input the password

2 3

The mode you set is displayed.

Present mode
Icons with authority to use are displayed

SPD 2-1-3-3 N7201A455E02

 Operating procedure
Basic
LNB connection screen
2-1-4 operation

■Screen when the LNB is connected

Preparation
A When the LNB is
connected:
If failed to connect to the
LNB

●For settings of LNB, see [5-3-9 Network configuration (with LNB (Option) enabled)]
●For LNB connection, see [LNB operating manual]

SPD 2-1-4 N7201A455E02

 Operating procedure
File Loading and saving of
2-2-1 operations
files

Method for loading and saving

When performing changeover, load the production data into machine memory before starting work. Only
one data can be load to the memory. Modified memory data can be saved to the hard disk (HDD) or to the
SD card.

Inside the machine

Loading the production Loading the production
data.(→P.2-2-3-1) data.(→P.2-2-3-1)
Loading the machine parameter Loading the machine parameter
data. (→P.2-2-4) data. (→P.2-2-4)

Memory Memory
(Front) HDD HDD (Rear)
(Front) (Rear)
Saving the Saving the
production data. production data.
(→P.2-2-5-1) (→P.2-2-5-1)

Loading the production

data.(→P.2-2-3-1)
Loading the production
Loading the machine parameter.
data.(→P.2-2-3-1)
(→P.2-2-4)
Loading the machine parameter.
(→P.2-2-4)

Loading the production data. Loading the production data.

(→P.2-2-3-2) (→P.2-2-3-2)
Loading the machine parameter. Loading the machine parameter.
(→P.2-2-4)
SD (→P.2-2-4)

card
Saving the production data. Saving the production data.
(→P.2-2-5-3) (→P.2-2-5-3)
Saving the machine parameter data. Saving the machine parameter data.
(→P.2-2-6) (→P.2-2-6)

Loading the production data. Loading the production data.

(→P.2-2-3-3) (→P.2-2-3-3)

DGS
Notice
• When an SD card is used in the machine for the first time, initialization is required.
(→P.2-2-7)

SPD 2-2-1-1 N7201A455E02

 Loading and saving flow

Start

Preparation
No
Is the production data in the
memory changed?

Yes

No Does the file under the

same name exist in the
HDD or the SD card?

Yes
No
Save the file to the HDD or
the SD card.
No
Do you want to overwrite the
Return file and save to the HDD or
Yes
the SD card?

Yes Input the file name

Save

No
Load

Return Yes

Load

End

SPD 2-2-1-2 N7201A455E02

 Operating procedure
File
To [File editing] screen
2-2-2 operations

How to choose the stage to display

■[File operation] screen
1

1 or

Self stage:
Operator's stage
Other side stage :
Another side stage of the operator

How to edit files on a hard disk.

■[Hard disk operation] screen
1

How to edit files on an SD card.

■[SD card operation] screen
2
1 Insert the SD card.

2
SPD 2-2-2-1 N7201A455E02
 When handling the DGS file

Preparation
■[DGS operation] screen
1

SPD 2-2-2-2 N7201A455E02

 Operating procedure
File
Loading production data 1
2-2-3 operations

From the hard disk to the memory in the machine

From [Hard disk operation] screen (→P.2-2-2-1)

1 2
Select the data to be load.
1 (The selected data is highlighted.)

3 ■When the data in the memory is changed

Confirm message.
YYYY.MM.DD HH:MM:SS
XXXXXXXXX

3
●When the data is not changed

To the step 6

■When the same data name exists in the HDD

Confirm message.
4
●When there is no same data name

Confirm the message and press

(The file is saved)

(Return to the previous screen)

SPD 2-2-3-1 N7201A455E02

 ■To overwrite and save the file
5
Confirm message.
5

Preparation
(The file is saved)
●To change the file name

Input the file name

(The file is saved)

To the step 6

■When the loading confirmation

message to the memory appears
6
YYYY.MM.DD HH: MM: SS
XXXXXXXXX

Confirm message.
6
(The file is loaded)

●When the file is not loaded)

(Return to the previous screen)

Notice
● The data name should be up to 14 alphabetic characters.

From the SD card to the memory in the machine

From [SD card operation] screen (→P.2-2-2-1)
This procedure is as same as the one that the file is loaded from the HDD to the memory.

SPD 2-2-3-2 N7201A455E02

 Operating procedure
File
Loading production data 2
2-2-3 operations

From the SD card to the hard disk

From [Hard disk operation] screen (→P.2-2-2-1)

2 1

2
(All data is loaded from the SD card to
the HDD.)

From DGS to the memory

From [DGS operation] screen(→P.2-2-2-2)
1 2
Choose the data to load
1 (The selected data is highlighted)

Confirm the message

3
● When the data is not loaded
3

(Return to the previous screen)

SPD 2-2-3-3 N7201A455E02

 Preparation
The data is start loading.

SPD 2-2-3-4 N7201A455E02

 Operating procedure
File Loading machine
2-2-4 operations
parameter

From the hard disk to the memory in the machine

From [Hard disk operation] screen (→P.2-2-2-1)

2 3 1

1
Select the data to be loaded.
2 (The selected data is highlighted)

■When the loading confirmation message of

4 the machine parameter appears
YYYY.MM.DD HH: MM: SS
XXXXXXXXX

4 Confirm message

●When the file is not loaded)

(Return to the previous screen)

■When the loading confirmation message of

the system parameter appears
5 Confirm message
5
(The file is saved)
●When the file is not loaded)

(Return to the previous screen)

From the SD card to the memory in the machine

From [SD card operation] screen. (→P.2-2-2-1)
This procedure is as same as the one that the file is loaded from the HDD to the memory.

SPD 2-2-4 N7201A455E02

 Operating procedure
File Saving production
2-2-5 operations
data 1

Explains how to save the file after the file name is changed in P.2-2-3-2 and how to load
the file to the machine
From the hard disk to the memory in the machine

Preparation
From [Hard disk operation] screen(→P.2-2-2-1)
1

2 ■To overwrite and save the file

(The file is saved)

■ To change the file name

(To 3 )

3
Input the file name
3
(The file is saved)
●When the file is not saved

(Return to the previous screen)

Notice
● The data name should be up to 14
alphabetic characters.

SPD 2-2-5-1 N7201A455E02

 Operating procedure
File Saving production
2-2-5 operations
data 2

From the hard disk to the SD card

How to save all production data on the hard disk to the SD card.
From [Hard disk operation] screen (→P.2-2-2-1)
2 1

2 Insert an SD card.

■To overwrite and save the file

4 Confirm message
4
(The file is saved)
●To change the file name

Input the file name

(The file is saved)

■When the same file name exists

5
Confirm message
5
(The file is overwritten and saved

(All files are saved)

(The file under saving is not saved)

(The saving is cancelled)

SPD 2-2-5-2 N7201A455E02

 From the memory in the machine to the SD card

From [SD card operation] screen (→P.2-2-2-1)

Preparation
This procedure is as same as the one that the file is loaded from the HDD to the memory.
■The production data and the machine parameter should be taken backups regularly just in case of machine
trouble and data loss.

SPD 2-2-5-3 N7201A455E02

 Operating procedure
File Saving machine
2-2-6 operations
parameter

From the memory to the SD card

From [SD card operating] screen (→P.2-2-2-1)

2 1

3
Confirm message.
3
●When the files is not saved

(Return to the previous screen)

■The production data and the machine parameter should be taken backups regularly just in case of machine
trouble and data loss.

SPD 2-2-6 N7201A455E02

 Operating procedure
File Clearing production data
2-2-7 operations
/ Initialization of SD card

How to delete the production data

From [Hard disk operation] or [SD card operating] screen (→ P.2-2-2-1)

Preparation
2 1
1
Select the data to be deleted.
2 (The selected data is highlighted.)

3 Confirm message
4
●When the SD card is not delete
4
Notice
(Return to the previous screen)
● The machine parameter is not deleted.
● The production data in the HDD and the SD card can be deleted. (Operation method is the same)

How to initialize the SD card

From [Hard disk operating] or [SD card operating] screen (→ P.2-2-2-1)

2 3 Insert an SD card to initialize

1
2
3
Confirm message.
4
●Wait until the message
[Disc initializing] disappears.
●When the SD card is not initialized
4
(Return to the previous screen)

SPD 2-2-7 N7201A455E02

 Operating procedure
File Sorting production
2-2-8 operations
data

From [Hard disk operation] screen (→ P.2-2-2-1)

■[Main editing] screen
1

1
●Alternates each time when pressed.

By number

File name (A→Z)

File name (Z→A)

Date(New → Old)
■[Sub editing] screen
1
Date(Old → New)

SPD 2-2-8 N7201A455E02

 Operating procedure
Continuous Overview of continuous
2-3-1 preparation
preparation

Provides an outline of continuous preparation for proven production data.

■For individual preparation (→P.2-4)

Preparation
■Continuous changeover mode screen
1

1 +

Performs tasks in order.

2 (→P.2-3-2 to 2-3-8)
■Press the following when you
are ready to proceed to the
next task.

■Press the following when you

●Time want to interrupt the preparation
Individual time for each task task.
and the total time.

(Return to the home menu)

■ When you want to define the

task contents. (→P.2-3-2)
■Contents of each task.

Task name Contents

File operations Loading or saving the production data for changeover.

Exchanging or cleaning the squeegee.

Squeegee exchange
(While preforming this operation, the squeegee unit moves to the front position.

Exchanging the PCB support.

PCB Support exchange (While performing this operation, the rails open up to the maximum position and
the squeegee unit moves to the rear position.

Stencil setting Setting of the stencil. After setting, the stencil recognition starts automatically.

Supply of solder paste. After the solder paste is supplied, the print start position
Solder supply
should be specified.

Solder kneading Printing action for solder kneading.

Counter reset Resetting the production information, paste counter and cleaning counter.

SPD 2-3-1 N7201A455E02

 Operating procedure
Continuous
Change of task setting
2-3-2 preparation

For each continuous preparation task, you can specify which tasks to perform and not to
perform.

2 Set each task content.

Task contents setting switch .

A Item to perform → [ON]
Item not to perform →[OFF]

PCB transfer confirmation.

B After exchanging the support,select
whether to confirm transfer motion or
not.
Confirm →[ON]
Not confirm →[OFF]
A C
Batch exchange
C PCBsupport(option).
After exchanging PCB support, select
the states of the conveyor width.
Maximum width →[ON]
Adjust to PCB width →[OFF]

SPD 2-3-2 N7201A455E02

 Operating procedure
Continuous
File operations
2-3-3 preparation

2 3 4

Preparation
1 +

2 or
●For [SD card]
Insert an SD card. (→P.2-2-2-1)
Select the data to be loaded.
3 (The selected data name is highlighted.)

4
Confirm message.
5

After completion of loading

6

5 6

7 +

(Move to the next screen)

SPD 2-3-3 N7201A455E02

 Operating procedure
Continuous
Squeegee exchange
2-3-4 preparation

Remove the
1 Check if axes are 2 3 squeegee unit.
stopped.

SERVO
OFF

Hook

4 Install the new squeegee unit.

●Remove at the front first,
●Install at the rear side then remove at the rear.
first ,then install at the
front side.
Hook
●How to exchange the
squeegee blade.
(→[Maintenance]
P.4-1-1)

5 6 SERVO 7
ON
ENABLING

SPD 2-3-4-1 N7201A455E02

 Types of squeegee units
There are the metal squeegee and the plastic squeegee (option) for the squeegee unit.
They are switched in the Data edit, Printing process parameter, squeegee material (→P.4-1-8).

Preparation

SPD 2-3-4-2 N7201A455E02

 Operating procedure
Continuous
PCB support exchange
2-3-5 preparation

Check if axes are Remove the

1 stopped. 2 3 stencil

SERVO
OFF

Remove the PCB

11 10 support. 9
(→P.6-1-2)

Complete the
12 13 PCB support
SERVO exchange.

ON
ENABLING

SPD 2-3-5-1 N7201A455E02

 Preparation
4 Remove the PCB support plate
5
■If the PCB width is as
same size as or
smaller than the
previous produced
PCB, go to the step 10 .

PCB support block (option)

8 7 6
SERVO Confirm message SERVO
OFF ENABLING
ON

(Conveyor width is
automatically adjusted.)

SPD 2-3-5-2 N7201A455E02

 Operating procedure
Continuous
Stencil set
2-3-6 preparation

Check if axes
1 are stopped. 2 3 Set the stencil.

SERVO
OFF

Stencil stopper

Stencil frame
●To prevent confusion of
the front and the back of
the stencil, confirm the
PCB pattern.
●Push the stencil until it
contacts the stencil
stopper.

SPD 2-3-6-1 N7201A455E02

 Preparation
4 5 6
SERVO
ENABLING
ON

(Carries out recognition

automatically. After
completion, moves to
[Solder supply].)

8 7
Confirm message.
ENABLING ENABLING

SPD 2-3-6-2 N7201A455E02

 Operating procedure
Continuous
Supplying solder paste
2-3-7 preparation

● When using automatic solder paste supply unit (option). (→P.6-1-4)

Check if axes are Supply solder

1 stopped. 2 3 paste.

SERVO
OFF

●Confirm the residual quantity

of solder paste and print
direction, then, supply solder
paste of about 350mm to the
outline of the stencil opening
part in 50mm width.

6 5 SERVO 4
ON

●If you press

[Interruption], the
window is closed.

Press Front or Rear

7 at which solder is 8 9
supplied in the
step 3 .
ENABLING ENABLING

or

●When solder kneading is

not performed

SPD 2-3-7 N7201A455E02

 Operating procedure
Continuous
Solder kneading
2-3-8 preparation

Preparation
1

2 3

2
●Our recommended printing pressure:
10 x 10-2 to 15 x 10-2 N
●F: Squeegee unit in the front side
R: Squeegee unit in the rear side

3 + Each switch

● Sequentially perform the motion

tasks shown

Displays print condition data.

SPD 2-3-8 N7201A455E02

 Operating procedure
Continuous
Counter reset
2-3-9 preparation

2 1
Select items to be reset.
1
●Production management information:
Clears production and counter
information.
●Paste count:
Resets to the value of print counter
data value.
●Cleaning count:
Resets to cleaning data value.

Confirm message.
3
●When it is not reset

(Return to the previous screen)

3 4
5

5 +

SPD 2-3-9 N7201A455E02

 Operating procedure
Continuous Setting of planned
2-3-10 preparation
production volume

When the planned production volume is completed, the machine can stop automatically.

Preparation
1
When the planned production volume is
1 set to [Unused],
set to [Used] by pressing

2 Input planed production volume.

SPD 2-3-10 N7201A455E02

 Operating procedure

Individual preparation
2-4
How to carry out changeover task individually is shown here.
(When the product has not been run previously)

1 Select tasks to be performed.

2 Carry out each task.

●Squeegee unit exchange
(→P.2-3-4)
● PCB support exchange
(→P.2-3-5)
● Stencil set
(→P.2-3-6)
● Supplying solder paste
(→P.2-3-7)
● Solder kneading
(→P.2-3-8)
1 3 ● Counter reset
(→P.2-3-9)
(In individual preparation mode, you
can not perform file editing tasks.)

3
(Return to [Individual preparation mode]
screen)

SPD 2-4 N7201A455E02

 Operation
Production
3 -1 Production
-1-1 Test print
-1-2 Production start and stop
-1-3 How to check screen during
production, when stationary and after
production

-2 Replenishment of material
-2-1 Cleaning paper exchange
-2-2 Replenishing cleaning solvent
 Operating procedure

Test print
3-1-1 Production

Here, you can confirm the operations from PCB loading to unloading. Printing pressure adjustment and the
solder kneading are performed for the solder kneading printing. By carrying out the solder kneading and print
state check, you can expect accurate printing with little variations in printing accuracy.
Preparation: ●Attach the stencil.

1 +

(Perform origin return)

2 +

(Carries out stencil recognition and

calculates print position)

1
3 Confirm message.

2 4

4
(Carries out solder kneading and adjusts
printing pressure)

Select a squeegee unit to set

5 printing pressure.
●F:Squeegee unit at the front side.
R:Squeegee unit at the rear side.
5 6 7
Set printing pressure by buttons
6 below.

15.0 ●Our recommended printing pressure is

10×10-2 to 15×10-2 N

7 + Each switch

●Specify to carry out each motion.

Displays print condition data.

8
8

SPD 3-1-1-1 N7201A455E02

 9

Production
C B A

10 +
(Starts check)

Confirm contents to check.

11
Modify parameters.
12 ■To make fine adjustments to
print position. (→P.4-1-7)

12 13
■To readjust printing pressure or
squeegee speed (in case
One cycle printing time Cleaning solder paste remains on the
A time stencil)

Print direction
B
13
Items in operation are illuminated. (To[Home menu] screen)
C When the operation is finished, the
result is displayed.
When "NG" is shown, confirm the
item.

SPD 3-1-1-2 N7201A455E02

 Operating procedure

Production start and stop

3-1-2 Production

Start poduction
●Start the machine according to the following procedure.

Confirm before
starting production
1 2
●Confirm the position of the SERVO
emergency stop switchs
and their operating method. ON
●When error occurs, push
the switch immediately.
(To release, turn in the
direction of the arrow)

●When normal

(Each axis returns to the origin) (Carries out self-diagnosis to (Enter the set count)
check for errors)

■When an error is found from self-diagnosis

(Error item is displayed)
1

1
(The recovery method

Production is displayed)

start Modify error as

2 indicated.

SPD 3-1-2-1 N7201A455E02

 Stop production
■To stop production immediately. <single stop>

■To restart production.

3 1
+

Production
■To stop production.

●When you push "YES" after

confirming the message, the
screen returns to [Home
menu].
●Production stops

■To stop production after the PCB during printing is completed.

<cycle stop>
■ To restart production.
4 Start production 1
+
ENABLING START

■To stop production.

●When you push "YES" after

confirming the message, the
● Production stops after
screen returns to [Home menu].
the PCB during printing
is completed

Turn off the servo switch, when placing hands or body into
moving parts.
(Risk of injury if the machine is actuated.)
● When the servo switch is turned off, the touch screen is locked.

Warning Do not place your hands or body into the moving parts of
the machine that is in the temporary stop state. (Risk of injury)
● When the machine is in single stop or cycle stop state, moving parts
of the machine could be actuated unexpectedly if the sensors are
activated.

SPD 3-1-2-2 N7201A455E02

 Operating procedure How to check screen during
3-1-3 Production production, when stationary and
after production 1

How to check screen during production.

Displays production information and operation status during production.

B A E G D

YYYY.MM.DD HH:MM:SS
XXXXXXXXX

B
After printing the producing PCB, carry
out stencil cleaning.
After cleaning, the machine keeps
printing without stopping.

Status
C Present status of the machine.

D
After printing the producing PCB, stops
production temporarily.
C F H

A Production information E Presence or absence of PCB

Presence of PCB on the conveyor.

●PCB’s to process ●Yes:

Number of PCBs produced.
●Operating rate
Operating rate of the machine ●No:
●Cycle time
Time from PCB loading & printing to
the next PCB loading. ●Printed PCB:
●Cycle time + Trans time
Total time of cycle time and transfer
time. (including waiting time for
process)
●Throughput F Operation status
Production plan sheets/time Operation status of the machine.

Printing pressure
G ([N]/[0.01N/mm])
Actual printing pressure is shown

Temperature/Humidity
H
* G and H are shown when
Machine parameter/Foreign material
detection function (option setting) is enabled.

SPD 3-1-3-1 N7201A455E02

 How to check screen when stationary.

I J K

Production
I Detailed production information.

J
When the planned production count is
completed, production stops
automatically.

K
Displays and resets the cleaning count
and paste count.
L M N
■When you set the [Production Schedule]
(above J )

Estimated time to end

L Estimated completion time of production.
Accuracy may vary as it is estimated
using cycle time.

Remaining count
M Remaining number of PCBs to produce.

N Progress rate/Progress bar

Progress rate for production plan
sheets( % )
((planned production count-remaining
count)/ planned production count
×100)
●Informs operators that the time set by
the motion parameter [Time to notice
the estimated production end] is
approaching.
(Indicated by a flashing progress bar,
signal tower or buzzer.)

SPD 3-1-3-2 N7201A455E02

 Operating procedure How to check screen during
3-1-3 Production production, when stationary and
after production 2

How to check screen when stationary

O P Q

O
Modify production data. (→P.5-2-2)
●When operator customized setting is
[used], it is also displayed in operator
mode.

P
Modify the machine status which is
independent of the production data.
●When operator customized setting is
[used], it is also displayed in operator
mode.

Q Switch between operator mode and

engineer mode.
●You need a password to switch from
the operator mode to the engineer
mode.

SPD 3-1-3-3 N7201A455E02

 Production

SPD 3-1-3-4 N7201A455E02

 Operating procedure
Replenish-
Cleaning paper exchange
3-2-1 ment of
material

1 2 3
SERVO
When the buzzer beeps
OFF

●Stops buzzer.

Wind up cleaning paper.

6 ●To prevent separation of the cleaning paper, wind up after
fixing the tip to the paper tube with packing tape.

New cleaning paper

Machine rear Operator side
side

Paper core of
the supply side Paper core: take-up side

Cleaning
nozzle

7 8 9 Restart production.
SERVO
ENABLING START
ON

SPD 3-2-1-1 N7201A455E02

 Remove the paper core. (Operator side and machine rear side)
4
3

Production
2 1 3 Remove the paper core

2 Lift up in the direction shown, 1 Move towards the left direction

5 Mount paper core.

●Remove the paper core on

the machine rear side and
mount it to the operator
side (wind up side).
Mount the new paper tube
to the machine rear side
(supply side).
●Put the convex part of the
paper core into the notch.
Convex Notch
part

● Avoid using the reverse side of the cleaning paper.

It may cause solder deposit or printing defect due to adhesive solder drop.
●Never use the high chargeable chemical fiber cleaning paper.
Please use our specified cleaning paper.
The chargeable material may be ignited by electrostatic sparks.
<Out specified material>
We are specified the following product made from pure cotton.
A roll paper of [Bemliese] or [BEMCOT] manufactured by Asahi kasei
Type : TS-507

SPD 3-2-1-2 N7201A455E02

 Operating procedure
Replenish- Replenishing cleaning
3-2-2 ment of
material solvent

1 2 Remove the solvent tank.

When the buzzer beeps

●Stops buzzer. Solvent tank(2 L)

Close the cap and Open the cap and Insert the tube into
5 set the tube to the 4 pour in the solvent. 3 the drain bottle.
solvent tank.

tube

Drain
bottle

<Recommended solvent>
[Elease] manufactured by Asahi Kasei Chemicals.
Type: M2800
6 Restart cleaning
●See the [Maintenance] (→P.3-2-1) for how to handle
liquid accumulated in the drain bottle.
ENABLING ●Use new (unused) cleaning solvent.

If a non-recommended solvent is used, it may leak the

solvent or causes unstable supply.
Using solvents such as acetone, methanol (methyl alcohol),
hydrocarbon solvents or any other flammable solvent may
damage or have trouble of a solvent pump or tube,
causing leakage of solvent, smoke generation or ignition.
Never use them.

SPD 3-2-2 N7201A455E02

 Operation
Data
4 -1 Production data editing
-1-1 PCB data edit
-1-2 PCB recognition data edit
editing -1-3
-1-4
PCB positioning data edit
Stencil data edit
-1-5 Stencil recognition data edit
-1-6 Batch teaching data edit
-1-7 Print position data edit
-1-8 Print process parameter edit
-1-9 Print counter edit
-1-10 Function switch edit
-1-11 Data check

-2 Production data teaching

-2-1 Before starting teaching operations
-2-2 Recognition target condition data
-2-3 Batch teaching
-2-4 PCB recognition teach
-2-5 Stencil recognition teach
-2-6 Print positioning teach
-2-7 Printing pressure teach
-2-8 Height detection
 Operating procedure
Production
PCB data edit
4-1-1 data
editing

■[Data editing] screen

1 2

3 4 5

SPD 4-1-1-1 N7201A455E02

 Edit point
PCB size

1 Input PCB size.

Select coordinate reference

2 position.

■When PCB angle is set to origin of

coordinates

3 Input origin offset

Data editing
■For special PCBs such as a wafer or
a flexible PCB

4 Select Conveyor speed Origin offset Conveyor speed

Coordinate reference

5
(Returns to [Home menu] screen.

■PCB size
Input length(the length of the transfer direction), width (the length of the plane perpendicular to the
transfer direction) and thickness.
(Enter up to 2 decimal places)
●Input range
L (length): 50 to 350 mm
W (width): 50 to 300 mm
T (thickness): 0.3 to 8.0 mm

■Coordinate reference
Select a corner of the PCB for coordinate reference.
●Selected corner becomes the origin(0,0).

■Origin offset
Input the distance from the corner of coordinate reference to the origin reference position. (Enter up to 2
decimal places)
●Input range (Maximum value conform to the PCB size.)
X : -20 to 350 mm
Y : -20 to 300 mm

■Conveyor speed
Select conveyor speed from one of the four speed settings:
High speed(standard)→middle speed→low speed→ultralow speed.

SPD 4-1-1-2 N7201A455E02

 Operating procedure
Production
PCB recognition data edit
4-1-2 data
editing

1 Select "Recognition mode".

Input the recognition coordinates

2 for A point.

2 3 4
Select recognition method.
4 ●[Shape set (automatic)] (recommended)
(Automatically adjusts the lamp value
when the PCB is first recognized.)
● [Shape set (manual)]
(Specify the lamp value through PCB
recognition teach)
●[One point block] (Recognizes an image
using pattern matching, not with a mark.
Batch teaching is not available.)
・Go to step
7

When [Shape set] is selected, specify the

5 color and shape of the mark and input
the size.

6
Input the remaining data for B point, Pa
7 point, and Pb point by repeating steps
through
1 4

8 After completion

5 6 8 (Returns to[Home menu]screen)

SPD 4-1-2-1 N7201A455E02

 Edit point

Recognition mode

■Recognition mode
● Points A and B
Recognition with Points A and B.
Corrects deviations for Δx, Δy and Δθ obtained
from the two points.
● Points A B + Pa
Recognition with A, B and one pattern point(Pa)
● Points A B + Pa Pb
Recognition with A, B and two pattern points
(Pa, Pb).

Data editing
(Use this mode when wishing to compensate for
a specific pitch pattern selectively.)
point A, B → correction of Δθ and θ direction
point Pa(Pb)→ correction of Δx, Δy and x, y
direction
※This mode cannot be used when the same
pattern exists within 5 mm of each other.
Recognition position
●PCB point A
Recognition with only point A. Corrects only with
Δx, Δy of point A. Correction of Δθ is not carried
out.
(This mode is effective when the required PCB
accuracy can be obtained and when there is a
need for faster tact time.)

■Recognition position
● Recognition point coordinate (X,Y)
Select and input two marks on the PCB as the
recognition points A and B. (Select two distant
points on a diagonal plane.)

(In case of right-rear side reference)

Origin (0,0)
X1
X2

A Y1

Pa Y2

Pb
B

PCB transfer
direction PCB recognition mark

SPD 4-1-2-2 N7201A455E02

 Operating procedure
Production
PCB positioning data edit
4-1-3 data
editing

1 2 3
1
Select "Y axis clamp“[ Upper limit] or
[Lower limit]

2
Select "Support stroke" [Unused (small)]
or [Use (large)]

Input the cutout dimensions for the PCB

3 stopper.

4 Set PCB vacuum.

5 6 4 7
5
Select [ON] or [OFF] (→P.6-1-5)

Set PCB clamp pressure (option)

6
7
(Returns to [Home menu] screen)

Edit point
■Y axis clamp
When clamping PCBs, input the PCB support position where clamping is started.
● [Upper limit: a PCB material is ceramic or steel
PCB Clamping starts after the PCB support block has reached the upper limit and the [Time lag] time
has elapsed.
● [Lower limit: a PCB material is glass epoxy, paper phenol.
PCB Clamping starts after the PCB support block has started to move and the [Timelag] time has
elapsed.
Incase of [Upper limit] [Delay] time
●Default value: [Lower limit]
PCB transfer PCB stop Support rise PCB clamp

Incase of [Lower limit]

PCB transfer PCB stop Support rise

[Delay] time

PCB clamp

SPD 4-1-3-1 N7201A455E02

 ■ Support stroke
●Select the existence of large parts on the bottom side of PCB.
(During PCB transfer, depending on the setting the amount the PCB support is lowered differs.)
●[Use (Large) ]: Default
●[Unused (Small)]: Lowers the position of the PCB support by 16mm from the position of [Use Large)].

■PCB flattening
●Normally select [OFF].For thin or warped PCBs, select [ON].
● [ON] is recommended when [PCB vacuum] is [ON].

■PCB stop position

●Displays where on the XY table the PCB is clamped. (display only)
(Automatically calculated with PCB size X, plate-making reference and plate-making reference origin
(X).)
■Cutout length related to PCB stopper.

Data editing
Set the position of the PCB stopper with a camera unit.
●Normally input [0.00].
(Set position at the center of the PCB.)
●If a cutout is located, the stopper position needs to be offset. (Achieves stable loading.)
●When the PCB detection sensor shows incorrect motion due to the PCB support, move the sensor to
the position where the sensor does not detect the PCB supports.
Example1) Example 2)
(Left to right flow): Cutout is located near the center. (Left to right flow): Cutout has a flat part in it.

PCB

(0,Y) (X,Y)

Cutout dimensions
(Input the value to shift the stopper)
■PCB vacuum-holding
To prevent shifts of PCB during positioning or printing, select whether to use PCB vacuum-holding with a
vacuum-holding block Z (option). Also sets vacuum start and end time to decide the timing for PCB
clamping.

●Vacuum-holding :Set [ON]when carrying out PCB vacuum-holding or [OFF] when not.
●Vacuum start :Input about + 0.3 seconds of delay time to the [Y axis clamp].
(The time when the PCB support start to rise equivalent to [0.00 second].
●Vacuum end :If the PCB bounds when vacuum-holding ends, input about + 0.1 second.
(The time when the PCB is unloaded and the PCB support starts to go down equivalent
to [0.00 second]).
●Vacuum-holding during printing :Set whether to carry out vacuum-holding during printing. Set to [OFF]
if the solder paste bleeds due to vacuum-holding with through-hole
PCBs.
(Vacuum-hold again after snap off motion.)
●PCB clamp :Normally set [ON].Set [OFF]when PCB warps or is difficult to be held adequately by
clamping in case of very thin PCB or similar.
(Hold PCB only with vacuum-holding.)
■Clamp pressure (option)
Adjust the pressure applied to the PCB during PCB clamping. Adjustment range: 0.10MPa to 0.45 Mpa
(1.178 [N] to 52.99 [N])

SPD 4-1-3-2 N7201A455E02

 Operating procedure
Production
Stencil data edit
4-1-4 data
editing

2 1
Input stencil registration No.
1 and registration name.

3
Select stencil type.
3

4 After completion
(Returns to [Home menu] screen.)

SPD 4-1-4-1 N7201A455E02

 Edit point
■Stencil registration No.
To identify stencil data, input stencil registration No. and registration name.

■Stencil type
●Applicable stencil type

Data editing
B

A Standard frame type

・736 x736 mm frame (PCB size 580 x 508 mm)
・736 x736 mm frame (PCB size 510 x 460 mm)
・736 x736 mm frame (PCB size 330 x 250 mm)
・736 x736 mm frame (PCB size 350 x 300 mm)

B Optional frame type

When the universal stencil holder (option) is used, the following stencil frame is available.

・Horizontally placed M frame 650 x 550 mm frame (PCB size 330 x 250 mm)
・Horizontally placed M frame 650 x 550 mm frame (PCB size 350 x 300 mm)
・Vertically placed M frame 550 x 650 mm frame (PCB size 330 x 250 mm)
・Horizontally placed M frame 550 x 650 mm frame (PCB size 350 x 300 mm)
・Horizontally placed M frame 600 x 550 mm frame (PCB size 330 x 250 mm)
・Horizontally placed M frame 600 x 550 mm frame (PCB size 350 x 300 mm)

SPD 4-1-4-2 N7201A455E02

 Operating procedure
Production Stencil recognition data
4-1-5 data
editing
edit

1 2
Select recognition method.
1 ● Data cannot input for batch
teach

2
Input recognition coordinates of
the PCB side.
●In case of [1 pair] recognition, input
second recognition coordinate.

Select recognition
3 method for the next
3 5 4 block.

4
Input recognition coordinates of
PCB side.
●In case of [1 pair] recognition, input
second recognition coordinate.

5
(The coordinates of PCB side are
copied to stencil side.)

6 Confirm message.

7
(Returns to [Home menu] screen.

6 7

SPD 4-1-5-1 N7201A455E02

 Edit point

■Block
Each block No
● When the distance between the block 1 and 2
is defined as far as away possible on the
diagonal, the accuracy of recognition
correction is increased.
■Recognition method (1 point/1 pair)
Select [1 point recognition] or [1 pair recognition]
for each block.
●When multiple patterns exist in one

Data editing
component, [1 pair recognition] is
recommended.
■1 point or 1 pair: for first point
Input coordinates of each recognition point from
PCB origin.
■1 pair: for second point
In case of [1 pair recognition], input coordinate
of the other point.

A
A

B
point

A
A
B
point

1 point 1 point 1 pair 1 pair

Notice
●The above setting is not necessary when PCB
recognition marks exist on the bottom side of the
stencil and stencil correction (batch teaching) is
carried out with the marks.

SPD 4-1-5-2 N7201A455E02

 Operating procedure
Production
Batch teaching data edit
4-1-6 data
editing

■[Batch teaching data setting] screen

3 1 2

1 Select [Use].

Select [ON] or [OFF] for PCB

2 search / Stencil search

3 Input recognition position.

■To copy the coordinates of
PCB recognition points,
①
②Confirm message.
5 6 4 7

When setting the shape of

4 stencil recognition mark,

5 Input recognition parameter.

6 Select [Use]

After completion.
7
(Returns to [Home menu] screen.

SPD 4-1-6-1 N7201A455E02

 Edit point

C A B

Batch teach
A Select whether to use batch teaching
data for stencil recognition.
●PCB recognition data shall be used
for PCB recognition.

Data editing
PCB search・Stencil search.
B Select whether to carry out search. In
this function, the camera moves up and
down, side to side and diagonally for
recognition.

Recognition position
C ●PCB recognition data copy
Copies coordinates of PCB
E D recognition point.
●Shape specification
Sets up the shape of stencil
recognition mark.

Data change
D Select whether to change PCB
recognition data based on batch
teaching data.
●When CAD data is used, select
[Unused].
●When selecting [Unused],the
coordinate data is not changed even
if the recognition mark is found in a
different coordinate as the result of
batch recognition.

Recognition parameter
E Input the lamp value for PCB
recognition / stencil recognition.
Lamp 1: Coaxial incident lighting
Lamp 2 to 4: Side lighting

SPD 4-1-6-2 N7201A455E02

 Operating procedure
Production
Print position data edit
4-1-7 data
editing

Normally the print position data is not edited here.

(Because the numerical values obtained from production data teaching are applied.)

How to see screen

Print position data

A The distance of XY table movement to
adjust the position of stencil and PCB.
●Automatically updated when the
results of stencil recognition or stencil
recognition teaching are saved.

Print position offset

B ●Input numerical value to correct the
shift due to the difference of print
direction or subtle difference due to
the extended stencil which can not be
compensated even by the stencil
recognition.
B ●Normally select [0].

SPD 4-1-7 N7201A455E02

 Operating procedure
Production Print process parameter
4-1-8 data
editing edit 1

How to go to each screen

■[Condition data input] screen ■[PCB type selection] screen

Data editing
■[Cleaning data] screen
(1 round mode) ■[Cleaning data] screen (2 round mode)

■[Print condition details] setting

screen ■[Print speed switch mode] screen

■[Squeegee selection] screen

■[Printing pressure teach data] screen

SPD 4-1-8-1 N7201A455E02

 Operating procedure
Production Print process parameter
4-1-8 data
editing edit 2

According to the requirement, edit each item.

Edit in [Cond. Data input] screen

A B A Print conditions

Select [single] (one way print) or

[double] (round trip print).
●Print speed
Input squeegee speed.
●Printing pressure
Input squeegee load on the stencil. To
change units (→P.5-3-6-3)
●Descent speed
Input snap off speed to obtain stable
transcription of solder paste.

B Cleaning data
1 round

C Select [ON] or [OFF] for 1 round

cleaning, or select [Alternate].

2 round
Select [ON] or [OFF] for 2 rounds
cleaning.
・ON :
After printing the specified sheets,
cleaning starts.
(1 round or 2 rounds).
・OFF :
No cleaning.
・Alternate :
After printing the specified sheets,
carries out outward cleaning. After
printing the specified sheets again,
carries out return cleaning.
●Interval
Input number of printing between
cleanings.

Through hole
C (Print speed switch mode)

Select [Use] or [Unused].

Set up the data regarding through hole.

*Through hole: Through hole in PCB.
*This setting is available only when the
[Use] is selected for [Speed change].

SPD 4-1-8-2 N7201A455E02

 Edit in [Cleaning data] screen
D E

D 1 round, 2 rounds
As same as B

Cleaning for wait process

E During operation, select cleaning mode
while waiting for the next process.

Data editing
Select [1 round] or [2 rounds] or
[Unused].
●Waiting time
Input the time from the start of waiting
F status to the start of cleaning.

Detailed setting
F
Select [1 round] or [2 rounds].
●Speed
Input motion speed.
(Setting range: 10 to 200 mm/s)
●Method
Select [dry] or [wet].
●Vacuum
Select [ON] or [OFF] for vacuum
motion during cleaning.
●Motion
Select [ON] or [OFF] for outward
and return cleaning motion.

[ON]: For using the motion

[OFF]: For not using the motion

SPD 4-1-8-3 N7201A455E02

 Operating procedure
Production Print process parameter
4-1-8 data
editing edit 3

According to the requirement, edit each item.

Edit in [PCB kind select] screen

G H

PCB kind
G ●Use PCB kind as a guide only for the
initial setting when the new conditions
are set for the first time.
●When print speed, printing pressure,
descent speed or cleaning data is
changed on [Condition data input]
screen or [Cleaning data] screen, the
conditions on this screen are also
changed. (refer to the table below.)

Tact/Paste quantity
H adjustment for PCB kind
Select product tact time and solder
Adjustment button amount with adjustment buttons.

① ③
●According to the selection of G and H , print speed and
Upper ②Up Upper
left right printing pressure are set as per the table below.

⑤
④Left ⑥Right
Middle
⑦ ⑨
Lower ⑧Down Lower
left right

Upper:print speed(mm/s)
■Table A Lower:printing pressure(x10-2 N/mm)
Adjustment① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨
button
Upper Up Upper Left Middle Right Lower Down Lower
PCB type
left right left right
25 50 75 25 50 75 25 50 75
Not specified
25 35 40 20 30 35 15 25 30
40 60 80 40 60 80 40 60 80
Phone/Camera
30 35 40 25 30 35 20 25 30
Personal computer 50 100 130 50 100 130 50 100 130
Peripherals 35 45 50 30 40 45 25 35 40
TV/Home 25 50 75 25 50 75 25 50 75
appliances 25 35 40 20 30 35 15 25 30
25 50 75 25 50 75 25 50 75
Car electronics
25 35 40 20 30 35 15 25 30

SPD 4-1-8-4 N7201A455E02

 Data editing

SPD 4-1-8-5 N7201A455E02

 Operating procedure
Production Print process parameter
4-1-8 data
editing edit 4

Edit in [Print condition detail config] screen

I

I Squeegee
●Operation mode
Select [single] (one way print) or
[double] (round print).
●Priority after print
Select the order of lifter and squeegee
motion after print.
・Lifter:
Squeegee stays on the stencil and
after snap off the squeegee rises.
・Simultaneous:
Lift and squeegee starts
simultaneously.
・PCB support:
J Snap off is carried out only by
PCB support descend while the
lifter stays at the print position and
stencil is clamped. Vacuum block
(option) is necessary.
・Squeegee :
After rising squeegee,snap off
starts.
●Print speed
Input squeegee transfer speed
●Printing pressure
Input the load of squeegee on stencil.
●Print range
・Input print range when only a part of
PCB is printed. As the print area is
limited, print tact time can be short.
・To print from edge to edge, input [0.00].
・When setting plus value, print range
becomes narrow.
・Offset F: Offset of F→R print
Offset R: Offset of R→F print

SPD 4-1-8-6 N7201A455E02

 J Lift
●Clearance
Input space between stencil and PCB.
・Normally input [-0.3] to [-0.1] for
better contact.
●Descent speed
Input snap off speed for good
transcription of solder paste.
●Descent stroke

Data editing
Input snap off distance for good
transcription of solder paste.
・Normally select around [2.50]
considering warping of stencil or
extending of solder paste during snap
off.
●Changing snap off speed
Select descent speed.
・High multi-speed (recommended):
Accelerated to the descent speed,
then eventually becomes descent
speed.(Obtains both good
transcription and faster tact time.)
・Constant speed: Descend down
stroke distance at a constant speed.
・Multi-step: Set an arbitrary speed pattern.

High multi-speed Constant speed

Descent Descent
speed speed

Descentstroke Descentstroke

Descent speed or descent stroke on the

screen shows the position "● "in the above
figure.

SPD 4-1-8-7 N7201A455E02

 Operating procedure
Production
Print process parameter
4-1-8 data
editing
edit 5

According to the requirement, edit each item.

Edit in [Printing speed change mode] screen

Edit when print speed varies depending on PCB area.

K L M
Zone
K Select whether to print each zone (zone
1 to 3).
(Zones to be printed are highlighted in
blue.)
*Zone…… separated print range.

Position
L Input the range of each zone.
●Input by setting the edge of PCB front
side as 0 mm.
●Setting range: 0 mm to PCB width
●Data check error occurs in the cases
below.
1) A zone includes a 2) A zone overlaps with
N O different zone. a different zone.

Zone 2
Zone 2
Overlapped range
Zone 1
Zone 1

●When [Print range] is specified in the

[Print condition detail setting]screen,
the setting range becomes narrower.

Speed
M Input print speed of each zone.
●Setting range:5.0 to 400.0 mm/s
●Printing speed out of the zones
defaults to the speed specified in the
[Condition data input]screen or [Print
condition details setting]screen.

Production data PCB width

N PCB width specified in the PCB data for
data modification.
●This data can not be changed.

Speed out of zones

O Print speed specified on [Condition data
input] screen or [Print condition details
setting] screen. (F→R, R→F).
●This data can not be changed.

SPD 4-1-8-8 N7201A455E02

 Edit in [Squeegee select] screen
P R S

P
Select [Metal], [Urethane] or [Plastic].

Q
Select [Flat] or [Advanced].
● Select [Flat] only for SPD

Data editing
Squeegee length
R Input squeegee length.

Q Squeegee angle
S Input squeegee angle.

SPD 4-1-8-9 N7201A455E02

 Operating procedure
Production Print process parameter
4-1-8 data
editing edit 6

Edit in [Pressure teach data] screen

T U V

Date
T Date when printing pressure teaching is
carried out.

Comment / Sqg. material

U Comments to distinguish squeegees of
different material and squeegee material.

Sqg length / Sqg. Type

V Squeegee length and type.
●Squeegees with the same length and type
but different material can be registered
individually.

W W
Delete printing pressure teaching data
of the same row.
1 2
■To modify comments

Select squeegee No.

1

3 Input comments

■To register

4
■To cancel

5
5 3 4

SPD 4-1-8-10 N7201A455E02

 Operating procedure
Production
Print counter edit 1
4-1-9 data
editing

2
Set solder paste supply.
1
When selecting [Counter]or [Combined],
2 input [Set count] of paste count.

Data editing
(Returns to [Home menu] screen.

1 3

SPD 4-1-9-1 N7201A455E02

 Operating procedure
Production
Print counter edit 2
4-1-9 data
editing

Edit point

B
Solder supply
A
●Solder exhaustion confirmation.
Select how to confirm residual solder
amount.
・Counter(option)
Displays residual solder quantity.
(Machine stops when zero.)
Or automatic solder supply starts.
(When using the soft switch.
(→P.4-1-10)
*Be sure to specify the counter
when printing without automatic
solder supply.
・Sensor (option)
When R→F printing is performed,
A C the machine confirms residual
solder quantity. When the solder
amount is short, automatic
solder supply starts. (Set with soft
switch (→P.4-1-10).
・Combined
The machine prioritizes the
automatic solder supply action
when solder counter becomes zero
or when the sensor detects solder
paste shortage.

Set count
B Input print count before the automatic
solder supply (option) starts.

Supply Time
C Input discharge time of solder paste
when [Automatic solder supply] (option)
is [ON].

SPD 4-1-9-2 N7201A455E02

 Data editing

SPD 4-1-9-3 N7201A455E02

 Operating procedure
Production
Function switch edit
4-1-10 data
editing

1 Select titles.
Select [ON] of the titles to be carried out.

2
(Returns to [Home menu screen].)

2
Edit point
A
A Software switch

●Pass mode
Only PCB transfer is performed automatically.
PCB positioning, recognition and printing are
not performed.
●PCB recognition
Carries out PCB recognition and prints based on
recognition correction.
●Preprint wait
Printing starts after receiving the request from
the post-process.
●Automatic solder supply (option)
Supplies solder paste automatically according to
the condition specified in [Print counter]screen.
●Automatic stencil cleaning
Carries out stencil cleaning automatically
according to the condition specified in [Cleaning
data] screen.
●Stencil recognition
Carries out stencil recognition in the beginning
of automatic run and adjusts the position of PCB
and the stencil.
●PCB extend check
At the PCB recognition, calculate the distance
between point A and point B.In the event that
the distance differs
0.5 mm or over from the registered value, the
machine stops due to error.

SPD 4-1-10 N7201A455E02

 Operating procedure
Production
Data check
4-1-11 data
editing

A
Check results
A (If errors exist ,contents of the first error
found are displayed and check stops.)

■When normal,
(Return to the
procedure.)

■If there are errors,

Data editing
Modify the data.

How to modify data (If there is an error)

1 4

1 Note the error.

2
(Displays the next error.)

Repeat procedure 1 and 2

3 until all data are displayed.

4 Correct all errors.

5 2 6
5

6 When [Normal],

(Returns to the procedure.)

SPD 4-1-11 N7201A455E02

 Operating procedure
Production Before starting teaching
4-2-1 data
teaching operations

Teaching means to correct the production data (PCB data) by recognizing PCB, stencil or similar, using
recognition units.

Recognition system
■LED lighting
PCB recognition is carried out using reflected light from two LED system ( coaxial incident + side).
Lens

Camera(CC Mirror
D)

Recognition unit
(PRU image processing) LED (coaxial
incident ) light
(Lamp 1)
LED (side) light
(Lamp 2 to 4)
Recognition mark

PCB

● Coaxial incident lighting ●Side lighting(Lamp 2 to 4)

(Lamp 1)

Used for gold plated surface or other smooth

patterns.
Used for copper plated surface or other rough
patterns.
■Recognition view
This machine's field of view is about 768 x 768 pixels.
Pixel rate Recognition PCB Stencil
area recognition recognition
10 μm 7.68 mm Available Available

SPD 4-2-1-1 N7201A455E02

 Recognition method
On this machine, recognition is performed using mark shapes registered with reference numbers for
recognition units.

1. Shape specification recognition (PCB recognition, stencil recognition)

Recognizes marks specifying shape, size and color (white / black). (teaching is not necessary)

Data editing
●Setting of lamp value (brightness of lamp).
・Reference No.125 : automatic setting
・Reference No.126 : manual setting
(Use when the contrast of the mark and the background is not clear, such as paper phenol PCB or
similar.)
*In the event of batch teaching, use the lamp value specified in the batch teaching data.(for manual
teaching)
2. One point pattern matching recognition
Carries out the teaching of the master image in advance, then recognizes the shifts from the master
image (X,Y coordinates).

Mark
●Features Camera view
・Recognition is possible even if the recognition mark is complex and has an indistinct outline or is too
large to fit into recognition view.
(Recognition is possible with only part of a mark.)
・Recognition is possible using PCB patterns for PCBs without a recognition mark.
(Accuracy of recognition depends on the surface processing of the patterns.)

3.Outline recognition
By getting the boundary of the recognition target and the background (outline information), the machine
calculates the shift amount (X,Y coordinates) or shape condition using the outline information.
●If there is a recognition error, the error factor can be analyzed using error codes.

SPD 4-2-1-2 N7201A455E02

 Operating procedure
Production Recognition target
4-2-2 data
teaching
condition data 1

The input data for recognition targets is shown here.

Refer to when designing recognition marks or editing recognition data.

How to see the table

A B C D E

Recognition target
A Main components of the target.

Recognition method
B
Applicable version
C Applicable software version.

Shape and input data /

D Recognition method and
results / Criteria
Required data for outline
recognition , and brief
explanation about recognition.

Available shape for

E recognition

G F

F Remarks
Available shape for recognition
differs from equipment type.
Please note.

Remarks
G Notes for outline recognition.
Please read carefully.

SPD 4-2-2-1 N7201A455E02

 PCB recognition mark/mount point recognition mark
Recognition target (by type) Recognition method Applicable version.

PCB recognition mark Shape specification recognition V1.00 or higher

Mount point recognition mark

Shape and input data Recognition method and results

Data editing
Shape number : 1 to 10 XY coordinate:center coordinates
Color : Black , White When correlation diagram of ANS matching is good,
size : a, b, c, d returns 100.

Criteria

1)Correlation value: Specify larger value than mating rate

entered threshold.

Available shapes for recognition (Only the shapes below are available. <with some exceptions> )

Shape 1 2 3 4 5 6 7 8 9 10
number

Shape

Recogniti
on results
(XYcoordi
nate)

Remarks Recognition results show the answer as the center of a and b of the mark. (center coordinates for circles)

Remarks

1)In shape specification PCB recognition, target image is created from the data below, and matching recognition is
carried out.
·Shape number
·Color
·Size

2)In [Shape specification (automatic)], the recognition unit sets lamp values automatically.
However when unstable, specify [Shape specifion (manual)] and set lamp value.

SPD 4-2-2-2 N7201A455E02

 Operating procedure
Production Recognition target
4-2-2 data
teaching
condition data 2

Stencil recognition(batch teaching)

Recognition target (by type) Recognition method Applicable version.

Stencil recognition Shape specification recognition V1.00 or higher

(Batch teaching)

Shape and input data Recognition method and results

Shape number : 1 to 10
Color : Black , White XY coordinate:center coordinates
size : a, b, c, d When correlation diagram of ANS
matching is good, returns 100.

Criteria
1)Correlation value:Specify larger value than mating rate entered threshold.

Available shapes for recognition (Only the shapes below are available. <with some exceptions> )

Shape
1 2 3 4 5 6 7
number

Shape

Recognitio
n results
(XYcoordi
nate)
Recognition results show the answer as the center of a and b of the mark. (center coordinates for circles)
Remarks

Remarks
1) In shape specification PCB recognition, target image is created from the data below, and matching recognition is
carried out.
·Shape number
·Color
·Size

2) For batch teaching, setting of lamp values is required. Set lamp values in [batch teaching data setting]screen. (→P.4-
1-6-1)

SPD 4-2-2-3 N7201A455E02

 Stencil recognition(production data teaching)
Recognition target (by type) Recognition method Applicable version

Stencil recognition Outline recognition V1.00 or higher

(Production data teaching)

Shape and input data Recognition method and results

Metal stencil Black resin stencil

Binary Mark: Black Mark: White Following table

color image (XY coordinates: center of gravity of the shape)

Data editing
Criteria
1) Area: Setting of criteria for comparison with teaching
data is done on the machine.
(XY coordinates: center of gravity of the shape)

Available shapes for recognition (Only the shapes below are available. <with some exceptions> )
1 2 3 4 5 6 7 8 9
Right & Left & Left & Left &
Alone Upward Downward Rightward Leftward
downward downward upward downward

Row of
apertures

Recognitio Center of Bottom of Top of Left of Right of Left top of Left bottom Right Right top of
n results screen screen screen screen screen screen of screen bottom of screen
(Position of screen
mark・)

Remarks

Remarks
1) Move the teaching mark on crosshair of the recognition screen.

The mark for recognition shall be on crosshair.

2: Upward row 3 : Downward row

Figure 1. Examples of teaching position.
●For black resin stencil, clogging recognition (for solder paste recognition) is not carried out.

2)During teaching, automatic setting of lamp value is possible.

SPD 4-2-2-4 N7201A455E02

 Operating procedure
Production
Batch teaching
4-2-3 data
teaching

Carry out PCB recognition teaching and stencil recognition teaching at the same time.
Preparation: ● Set [Batch teaching] (→P.4-1-6-1) to [Use].
● Install a stencil.

1 2 3
After loading a PCB,
ENABLING SERVO
OFF

Confirm print
6 SERVO
5 4 position visually.

ON

■When no shifts
7
+

(PCB recognition data, stencil recognition data

and print position data are saved and returns
to [Pproduction data teaching] screen.)
■When shifts,
(Or when the already registered data are used.)

(Returns to [Batch teaching] screen.) 7

SPD 4-2-3-1 N7201A455E02

 Data editing

SPD 4-2-3-2 N7201A455E02

 Operating procedure
Production
PCB recognition teach 1
4-2-4 data
teaching

Shape specification recognition(automatic)

Preparation: ● Set [Batch teaching] (→P.4-1-6-1) to [Unused].
● Load a PCB.

■[Production data teaching] screen

1

1 +

2 +

●If PCB is not loaded, load a PCB.

(After loading the PCB, recognition
starts automatically.)

3
4 When recognition mark is not
3 displayed on the crosshair, move
the mark
by using the buttons.

4
5
Recognition teaching (the first
point) is completed.
●When a teaching error occurs, confirm
position, shape or color of the
Recognition mark
recognition mark.
5

SPD 4-2-4-1 N7201A455E02

 6

6 +

(Moves to the next recognition mark,

YYYY.MM.DD HH:MM:SS
and starts recognition.)
XXXXXXXXX

7
Recognition teaching (the second
point) is completed.
●In the event of multi-point recognition,

Data editing
repeat 6 to 7 for all points.

Confirm message.
8 +
10 9 7 8

9 +

Confirm whether the recognition

is performed normally.

Note X and Y values of A point

10 and B point.

12 11 11
Modify PCB recognition data.
12 ・Input the noted values in step 10.
YYYY.MM.DD HH:MM:SS
XXXXXXXXX

13 Press two times.

(Modification is completed.)

Confirm message.
14
+
(Unloads the PCB.)
13 14

SPD 4-2-4-2 N7201A455E02

 Operating procedure
Production
PCB recognition teach 2
4-2-4 data
teaching

When using pattern matching, set [REF selection] of PCB recognition data to [One point block].

Pattern matching recognition 1

Preparation:● Set [Batch teaching] (→P.4-1-6-1) to [Unused].

1 +

2 +

●If PCB is not loaded, load a PCB.

(After loading the PCB, recognition
starts automatically.)

3
Set lamp values of the lamp 1,
3 by using the [▲][▼] buttons.
●Adjust so that mark becomes white
( Black) and the background becomes
black (white).
●Repeat procedure for lamps 2 to 4.

SPD 4-2-4-3 N7201A455E02

 5 6

By using the
5 +

move recognition mark to the center of

screen.
(A small square mark appears in the
center of the screen.)

Data editing
Recognition mark 7

7 By using the

buttons, move outer frame of the

square mark.
●Adjust so that recognition mark fits
into
the square mark.

8 9
By using the
8
buttons, change the size of the
outer frame.
●Match to the outline of the recognition
mark.

9
(The center of the pattern matches to
the center of the recognition mark.)

SPD 4-2-4-4 N7201A455E02

 Operating procedure
Production
PCB recognition teach 3
4-2-4 data
teaching

When using pattern matching, set [REF selection] of PCB recognition data to [One point block].

Pattern matching recognition 2

11 10
10
By using the
11
buttons, move shape image
registration setting image area.
●Move to surround the recognition
mark.

Shape registration image setting area

12
14 13 12

13
Move inner frame by
14
Expand or reduce by

●Set the range of shape registration.

Inner frame 17 16 15 15
16
Set a searching area by

17
●Set the range to match with the shape
specified in step 11.

18
Searching area 18

SPD 4-2-4-5 N7201A455E02

 20 19
19
Set a skip by
20
●The skip value refers to the pitch to
search the image with similar shape.
With smaller skip sizes, accuracy of
the recognition increases but
searching time becomes longer.
(Default [4] is recommended.)

Data editing
23 22 21 21
22 +

24 (Recognizes image.)

23
(Saves the data and finishes the teaching
for this mark.)

24
25
26 25

26 +
●When two or more recognition points
exist, repeat steps 3 to 25
27 28

27 +

28
●Repeat push twice to return to
[production data teaching]screen.

29 Carry out steps

4-2-4-2 .
9 to 13 in

SPD 4-2-4-6 N7201A455E02

 Operating procedure
Production
Stencil recognition teach 1
4-2-5 data
teaching

Preparation: ●Set [Batch teaching] (→P.4-1-6-1) to [Unused].

1 +

2 3

2 +
(Processes steps from PCB loading to
recognition.)

3 +
(Processes stencil recognition.)

4
Select the arrangement of
apertures to be recognized

5
Select automatic or manual for
lamp brightness setting.

■For automatic setting

Go to step 7.
4 5 ■For manual setting
Go to step
6.

SPD 4-2-5-1 N7201A455E02

 For manual setting only,
6 Adjust the lamp brightness.

● Adjust ▲ ▼ so that the image

of stencil apertures become clear.
●Lamp 1(center of mark):
straight lighting
Lamp 2 to 4 (peripheral of mark):
ring lighting

■In the event that apertures do

not exist in the center of screen,
+
To finely adjust so that the part of

Data editing
6 recognition mark overlaps with the
cross.

7
(Saves data.)

8 +

For multiple recognition marks,

9 repeat steps 4 to 8 .

8 7

10 +

( The normal / error state of recognition

point and recognition motion can be
confirmed.)

11 +

For multiple recognition marks,

12 repeat steps 5 to 9 .

11 10

SPD 4-2-5-2 N7201A455E02

 Operating procedure
Production
Stencil recognition teach 2
4-2-5 data
teaching

13
(Saves the data.)

13

14 +
(The normal / error state of recognition
point or recognition motion can be
confirmed.)

15 +
●Confirm whether the position of PCB
matches with stencil position.
(→P.4-2-6)

15 14

16

16

SPD 4-2-5-3 N7201A455E02

 17 Confirms message.

18
(Saves teaching data.)
■When the data is not saved,

18 +

Data editing
17 19
19
(Returns to [Production data teach]
screen.)

SPD 4-2-5-4 N7201A455E02

 Operating procedure
Production
Print positioning teach
4-2-6 data
teaching

1 +

Confirm if there
2 3 4 are any pattern
shifts between
SERVO PCB and stencil.
OFF
●Check visually
from above the
position of the
squeegee.

6 5
SERVO

ON

SPD 4-2-6-1 N7201A455E02

 8
■If there are nay pattern shifts,

Modify print position data with

7
+

■To edit the data

Data editing
7
10
Confirm message.
9 Returns to [Print position
teaching] screen.)

■When the data is not saved,

10 +

9 11 11
(Returns to [Production data teaching] screen.)

Confirm message.
12 +
12

SPD 4-2-6-2 N7201A455E02

 Operating procedure
Production
Print pressure teach 1
4-2-7 data
teaching

■When you change the squeegee to use, be sure to perform printing pressure teach.
Once the result of the data for the squeegee performing printing pressure teach is saved as the printing
pressure date, you do not need to perform teach again.

2 +

Starts printing pressure teach.

■If not performing printing

pressure teach

SPD 4-2-7-1 N7201A455E02

 3 +

Starts to mount the squeegee

■To finish printing pressure teach

Data editing
3

4 +

Starts to set the stencil

Push the stencil until it hits to the

5 stopper.

5
Stencil

SPD 4-2-7-2 N7201A455E02

 Operating procedure
Production
Printing pressure teach 2
4-2-7 data
teaching

6 +

Starts own teach.

■To end printing pressure teach

6
The result of own teach
7 (squeegee head weight (F and R
sides)) is displayed.

■When you continue to perform

printing pressure teach

■When printing pressure teach is

not performed

+
7
■Screen during printing pressure teach

Message area appeared during

A printing pressure teach

SPD 4-2-7-3 N7201A455E02

 8
Newly saves the printing
pressure teach result.
To step 9

■To overwrite the printing

pressure teach result

To step 10

Data editing
C 8

■When the printing pressure teach result

is newly saved

9 Input the name

B Software keyboard (for input name)

C Input name is shown here

B 9

10
Sets the printing pressure teach
result to be available in
production.

■When the result is not saved

and not used for production.

10

SPD 4-2-7-4 N7201A455E02

 Operating procedure
Production
Height detection
4-2-8 data
teaching

Measuring the PCB thickness

The PCB thickness is measure with the laser and reflected to the PCB dimension T
(thickness).

1 +

2 1

2
The PCB is loaded

3 4

3
The PCB thickness is measured
with the laser.

4
The PCB is unloaded.

A
The PCB is positioned by using
A the measured thickness.
You can check whether to set the
PCB thickness properly.

SPD 4-2-8-1 N7201A455E02

 Measuring the stencil gap
The stencil gap is measured with the laser and reflected to the print process parameter
clearance.
Preparation: Perform the step 1 to 2 in P4-2-8-1

3
The stencil gap is measured with
the laser.

Data editing
3

B
The lifter axis is moved up by
using the measured data.
You can check whether to set the
clearance properly.

SPD 4-2-8-2 N7201A455E02

SPD 4-2-8-3 N7201A455E02
 Operation
-1
System
5
Machine adjustment
-1-1 To[machine adjustment menu] screen
-1-2 Origin return/conveyor width
administ- -1-3
adjustment
Transfer motion/PCB recognition

ration -1-4
-1-5
Confirmation of print motion
Confirmation of stencil cleaning motion
-1-6 Confirmation of stencil
recognition/solder supply motion
-1-7 Confirmation of input/output
-1-8 Confirmation of axis information
-2 Machine setting
-2-1 Setting of adjustment switch/time
setting
-2-2 Gathering of recognition results/setting
of back light
-2-3 Operator level customization
-2-4 Printing accuracy
-3 Machine parameter
-3-1 To[machine parameter] screen
-3-2 Origin offset
-3-3 Error tolerance value/camera
-3-4 Other offset/signal tower
-3-5 Setting of motion parameter
-3-6 Option setting
-3-7 Data check
-3-8 Teaching menu
-3-9 Network configuration (with LNB
(Option) enabled)
 Operating procedure
Machine To [Machine adjustment
5-1-1 adjustment
menu] screen

Carries out motion confirmation of the machine and correction of recognition data.

How to enter [Machine adjustment menu] screen

■[Machine adjustment menu] screen

●Select item to adjust.

(→ P.5-1-2 to 5-1-8)

SPD 5-1-1 N7201A455E02

 Operating procedure
Machine Origin return/
5-1-2 adjustment
conveyor width adjustment

Origin return
Carry out origin return of the all axes.
Preparation:
●Confirm that no PCB is loaded on conveyors.
●Confirm that servo switch is turned [ON] .

1 +

(Carries out origin return)

Adjustment of conveyor width

Adjust PCB transfer conveyor width to fit the width of production PCB or any PCB.

administration
Preparation:

System
● Confirm that no PCB is loaded on conveyors.
● When narrowing conveyor width,remove PCB support plate.
(If adjusted without removing, PCB width setting error occurs in the machine.)

1 +

2 3
Perform adjustment.
2 ■To fit the width of production
data.

■To fit any PCB width, input

numerical values.

3 +

SPD 5-1-2 N7201A455E02

 Operating procedure
Machine Transfer motion
5-1-3 adjustment
/PCB recognition

Transfer motion
Confirms the conveyor on which PCBs are loaded and transfers PCBs to the given position.

1 +

Display to show each

conveyor

PCB position
●Waiting for loading:
blinking green
●With PCB: illuminated
green

■To remove PCB

■To return PCB support to origin. ■To adjust conveyor rotation.

●To switch rotating direction.
+
/
■To release PCB clamp. ●To rotate transfer conveyor.

+
+
●To stop transfer conveyor.
■To perform PCB positioning motion only . +

SPD 5-1-3-1 N7201A455E02

 ■When confirming series of operation from loading to unloading
Preparation:
●Confirm that no PCB is loaded on conveyors.
●Confirm that the servo switch is turned [ON] .

2 3 4 5
2 +
(PCB loading.)

3 +
(PCB transferring to the PCB holder.)

4 +
(PCB transferring to the exit conveyor.)

5 +

administration
(PCB unloading.)

System
●When PCB transfer error occurs by
carrying out the same operation twice,
push the emergency stop switch and
remove the PCB.
6
6 After completion.

PCB recognition
Carry out PCB recognition to correct recognition point coordinates.
Preparation:
●Set function switch [PCB recognition] (→ P.4-1-10) to [ON] .

Carry out origin return

1 (→ P.5-1-2)

Transfer PCB to PCB holder.

2 (→ Above procedure 2 to 3 )

From machine adjustment screen.

3
+

(Correction values of recognition point

3 A A coordinates are displayed.)

SPD 5-1-3-2 N7201A455E02

 Operating procedure
Machine Confirmation of print
5-1-4 adjustment
motion

Confirmation of print process motion such as rise / descent of lift and squeegee.
Preparation: ●Install the stencil.

1 +

B A

Lift up/down
A
+

or

Squeegee down
B
+

or

●R: rear, F: front

C
Squeegee up
C
+

or

●Middle: to middle height.

Upper limit: to upper limit

SPD 5-1-4-1 N7201A455E02

 F D E

Squeegee movement to front /

D rear.

or

●↓; R to F: to front side

↑; F to R: to rear side

Squeegee step movement

E

administration
+

System
G H Displays the current
states of the squeegee
and the lift. Print 1 cycle
F (Lift rise to descent) continuous
motion

●Lift rise Squeegee descent

Squeegee move Squeegee
rise Lift descent

Squeegee movement to origin

G
+

Change of print start position

H
+

●Changes the memorized squeegee

position to the opposite side.
Notice
●Each motion can be confirmed even if the PCB is not loaded on the center conveyor (on PCB holder) .
However, when solder paste is supplied on the stencil, carry out each motion after confirming the
existence of PCB.

SPD 5-1-4-2 N7201A455E02

 Operating procedure
Machine Confirmation of stencil
5-1-5 adjustment
cleaning motion

Confirmation of stencil cleaning motion process.

Preparation: ●Set [Automaticmask cleaning] (→ P.4-1-10) to [ON] .

1 +

(Carries out origin return)

Cleaning of stencil back side

A A
+

or

●Cleaning 1 cycle:
Cleaning unit moves 1 round.
Cleaning 2 cycle:
Cleaning unit moves 2 rounds.
●cleaning time:
After cleaning, cleaning time is
displayed.

B
Carry out cleaning after every
B printing.

●10 steps per cycle

SPD 5-1-5-1 N7201A455E02

 D

C Modification of cleaning data.

(→ P.4-1-8-3)

D Feeding of cleaning paper.

administration
●Pressing the button once again stops

System
feeding motion.

C E F

Purging air from pipes for solvent

E pipes.
(When operating after a long period of idleness.)

or

(Bleeding of air from pipes to send cleaning solvent.)

●When solvent does not come out by one operation, push several times until solvent comes
out.
●Select [Send out air of solvent] in the event that solvent is not present in tube.
●Selecting [Initial solvent air omission], results in the pump operating longer than selecting
[ Send out air of solvent] .
(To prevent leaking of solvent into the machine, operate this process while on firming the
application states of solvent.)

F Cleaning paper exchange

(The brake of cleaning paper winding up side (front side) is released.)

SPD 5-1-5-2 N7201A455E02

 Operating procedure Confirmation of stencil
Machine

5-1-6 adjustment recognition/solder supply

motion

Stencil recognition
Carry out stencil recognition to correct recognition point coordinates of stencil.

1 +

SPD 5-1-6-1 N7201A455E02

 Solder supply
Confirmation of the motion of solder automatic supply unit.(Use also for cartridge exchange.)
Preparation: ●Set software switch of [solder automatic supply] (→ P.4-1-10) to [ON] .

1 +

administration
System
A B C
Squeegee head moves to solder
B supply position

C Squeegee head moves to front side

Discharge of solder paste

D
E D +

●Pressing the button once again stops

discharge motion.
Squeegee head moves to back side
A E Automatic supply of solder paste

+ +

● Set the supply motion count with

or buttons.

SPD 5-1-6-2 N7201A455E02

 Operating procedure
Machine Confirmation of
5-1-7 adjustment
input/output

Input confirmation
Carries out sampling of all used input address at one second intervals, and displays the state.

■Screen transition between [Detail display] and [All display]

●Displays the states of output address with names of

every bits.
●[Names] of bits in ON (1) are highlighted.

SPD 5-1-7-1 N7201A455E02

 Output confirmation
Confirms the states of frequently used valves and allows user to operate those independently to confirm the
motion.

administration
System
●Displays the states of output address with
names of every bits.
●[Names] of bits in ON (1) are highlighted.

SPD 5-1-7-2 N7201A455E02

 Operating procedure
Machine Confirmation of axis
5-1-8 adjustment
information

Confirms current positions or states of all axes controlled by the machine.

A B C D E F G
Current position counter
A Current position of each axis in units of
mm or pulse.

Status 1
B Sensor information of each axis and
communication ready state with the
servo drivers.

Status 2
C Interlock and driver communication error
information of each axis.

Status 3
D Error information detected by servo
amplifiers.

Status 4
E Error information in the event that setting
of driver parameter is out of range.

Status 5
F Warning information detected by servo
drivers.

Status 6
G Servostate etc.
● When the last digit is [1], the servo is
in OFF free state.

SPD 5-1-8-1 N7201A455E02

 For details (→ [Troubleshooting] P.2-3-11)

■Status 1
1 For table θ, width adjustment (pulse axis) . 2 For other servo axes .

Bit number States shown by[1] Bit number States shown by[1]
0 During error Communication available with
0 servo driver
2 Origin return completed
7 Servo ON(I)
8 During emergency stop
8 Origin position
10 Origin return error
10 +limit
13 +limit
11 -limit
14 -limit

■Status 2, 3
(→ [Troubleshooting] P.2-3-11)

administration
■Status 4

System
Display Contents
0×0 Normal

Display Contents Display Contents

0** Servo driver parameter No. 001 Setting out of range error
038 Communication time-out

■status 5
display contents display contents
0×0 Normal Continuous communication error
0×053 warning
0×00D Main power supply OFF warning
Cumulative communication error
0×010 Overload warning 0×054 warning
0×012 Regeneration warning 0×056 Update counter warning
0×028 Battery warning 0×058 Fan lock warning
0×059 External scale warning

■Status 6 Display Contents

0×0 Normal

Display Contents Display Contents

080 Position range correcting position 001 I/O servo free input state

SPD 5-1-8-2 N7201A455E02

 Operating procedure
Machine Setting of adjustment
5-2-1 setting switch/time setting

Switch for adjustment

For adjustment, changes production motion conditions temporally.
●Normally set [Print operation] only to ON.
●When restarting the machine, the setting returns to normal setting.

A C
A Simulate mode
Set ON / OFF for repeated operation of
printing mode.

PCB ststus check

B Set ON / OFF for PCB sampling check
motion.
(Printed PCB remains in the print
position.)

C Print operation
Set ON /Off for print process motion.

Time setting
Adjust the time on the machine.

1 2
Use ▲▼ to select year, month,
1 day and time.

2
(Year, month, date and current time are
displayed)

SPD 5-2-1 N7201A455E02

 Operating procedure
Machine Gathering of recognition
5-2-2 setting results/setting of back light

Gathering of recognition results

Displays the last 100 PCB recognition results.

B A

A Recognition result data

All data deletion

B Deletes all data of the past 100 times.

administration
System
Setting of back light
When the screen is not touched within the time set, the back light turns off automatically.

1
Select the time for the back light
1 to turn off.
●If you do not use this function, select
[None] .
■Touch screen to turn on the back light.

Notice
●The setting is enabled when you exit this screen. (Selecting time alone does not enable the setting.)

SPD 5-2-2 N7201A455E02

 Operating procedure
Machine Operator level
5-2-3 setting customization 1

A D C E

A Current mode
Selects a mode to set

B Authority selection switch

Sets an operation authority in the
selected mode

C Password change
Sets the password in the selected mode

Default
B G F
D Sets all menu in the selected mode to
[Unused]

Detail config
E Sets operation authority below the first
level

Save
F Saves operator customized settings to
the SD card (parameter disk)

●The password and the operator

customized settings are overwritten.
●If the key disk is inserted, the
message of 'Disk is full' appears and
you cannot save the data.

Load
G Loads operator customized settings on
the SD card (parameter disk) into the
machine.

SPD 5-2-3-1 N7201A455E02

 Setting to allow the following functions in the operator mode.
①Data modification ②Production data teaching ③File operation ④Machine adjustment
⑤Machine parameter ⑥Machine setting ⑦Maintenance
●Setting of 3 types of operator mode settings (A, B, C) are available.

1 2 3 Select a mode to set.

1
Set the desired menu used in
2 the operator mode.
or

3
Insert the key disk.
4

administration
(→P.1-9-1-2)

System
5
6 8 7 9
Input the password.
6 ● Length: one to ten characters
(Symbols allowed)
● We recommend to input more than 4
characters for security

7
8 Input the password again

9
Remove the key disk and insert
5 10 the parameter disk.

11
The password and the operator
customized settings are overwritten.

Confirm the message,

11 12
12

SPD 5-2-3-2 N7201A455E02

 Operating procedure
Machine Operator level
5-2-3 setting customization 2

Setting of functions below the first level

1
Select a mode to set.
2
Select the desired menu used in
2 3 1 3 the operator mode.

or
Detail
A Set menu of sub level.
●Example) When you set PCB data
menu in data correction menu to
[Use] , push this button to set PCB
data menu to [Use] .
Data edit menu PCB data menu

(Change to ) ( Change to )

A B
B
●All become [Unused] .

[Operator mode] screen after setting

Current setting mode

Icons of functions set to [Use] .

Notice
●Operator customize setting is not available in operator mode.

SPD 5-2-3-3 N7201A455E02

 Operating procedure
Machine
Printing accuracy
5-2-4 setting

Preparation: When printing accuracy is measured, the parameters should be set the
followings.
●Data edit/Function switch ···[PCB recognition]: ON (→ P.4-1-10)
●Machine setting/Adjustment switch ···[Printing]: ON (→ P.5-2-1)
●Data edit/Batch teach data setting ···[Batch teach]: Use (→ P.4-1-6)
■Set when printing accuracy (*1) is measured
Printing accuracy after printing is measured by production and Cp /Cpk values are
calculated.
(*1) Printing accuracy means positioning accuracy between stencil
and PCB.

B A

A
Once production is started,
printing accuracy starts

administration
measuring.

System
B
The detailed data of measured
printing accuracy is displayed

C
All measured printing accuracy
data is deleted.

SPD 5-2-4 N7201A455E02

 Operating procedure
Machine To [Machine parameter]
5-3-1 parameter
screen

Machine parameters are the individually adjusted offset

values for each equipment obtained by calibration and ●Relocating of equipment.
mechanical alignments. ●Exchanging of units.
Machine parameter teaching is the adjustment and ●Change of floor level.
calibration work to set each machine parameters.
Carry out in the situations indicated on the right.
●Significant change in temperature

●As data change is carried out by teaching basically, do not change data manually, except [Signal tower],
[Tolerance for badness], [Motion parameter] or [Option setting].

How to enter [Machine parameter] screen

●Select a item to adjust. ●To select other items

(→ P.5-3-2 to 5-3-8)

SPD 5-3-1 N7201A455E02

 Operating procedure
Machine
Origin offset
5-3-2 parameter

Origin offset 1
Displays origin offset values for X, Y, θ, lift, support, squeegee and camera axis.

administration
System
Origin offset 2

SPD 5-3-2 N7201A455E02

 Operating procedure
Machine Error tolerance
5-3-3 parameter
value/camera

Tolerance for error

Displays the reference value to judge PCB recognition error.
(When the recognition result is less than the reference value, the result is regarded as an error.)
Preparation: ●Set [PCB extension check] (→ P.4-1-10) to[ON] .

B A

Recognition(PCB)
A Input tolerance for error.
●Input range: 0 to 100 %
●Reference value: 90 %

PCB extend (only for PCB

B recognition)
Input tolerance to judge error on PCB
extension after PCB recognition.
●When the measured distance between
recognition point A and B is greater
than the registered coordinates beyond
the tolerance value, it is regarded as an
error.
●Input range: 0.05 to 0.50 mm

Camera
Displays rotation origin offset of θ axis, magnification of camera and so on.

C D E

θ axis rotation origin

C Input the distance from XY table origin
to rotating center of XY table. (teaching)

PCB Recog. Pix. Setting

D Input PCB camera magnification by
distance per pixel.
(teaching)

Mask Recog. Pix.Setting

E Input stencil camera magnification.
●Be sure to input 0.01 mm.

SPD 5-3-3 N7201A455E02

 Operating procedure
Machine
Other offset/signal tower
5-3-4 parameter

Other offset
Displays offset values for clearance, PCB thickness, stopper and PCB loading (unloading) position.

A B C

Clearance
A Input offset value for clearance before
printing.
●By increasing the value, the PCB
support moves downward.

PCB thickness
B Input offset value for PCB support axis
to compensate for PCB thickness
during PCB positioning.
●By increasing the value, the support

administration
moves upward.

System
PCB stopper offset
C Input offset value for shift in X direction
during PCB positioning.

Signal tower

D E
Indicator
D Set each item of signal tower.
●Switches in the order of
Off illuminated blinking

E
Returns all settings to initial value.

Buzzer
F Set each item of buzzer.
●Switches in the order of
Continuous intermittent silent

G F
G
Input item No. to display at the top of
the table.

SPD 5-3-4 N7201A455E02

 Operating procedure
Machine Setting of motion
5-3-5 parameter
parameter 1

1
PCB vacuum release time[ms]

[Master change] switches as [Standard] [Special] [Standard]

by each press of the button.

If the [Master change] is [Standard], the set values are cancelled and returns to the default values after
turning off the power and restarting the machine. When the [Master change] is [Special], the set values
are kept after turning off the power and restarting the machine.

1.PCB transfer forced time(ms) 3.PCB out interval(s)

Input the time to allow the middle conveyor to Input time to keep the conveyor running after
push the PCB against the PCB stopper. the PCB request signal from the post process is
●Initial value: 200(ms) turned OFF.
●Initial value: 0(s)

2.PCB vacuum release time(ms) 4.Paper feed counter

Input time while stopping the PCB support at Input cleaning paper winding amount during
the transfer height and waiting for releasing the cleaning.
adsorption pressure reminder, during ●Normally input [3] .
descending PCB support.
●Available when [3.vacuum OFF waiting]
(→ P.5-3-6-1) of option setting is [ON] .
●Initial value: 0(ms)

5.Squeegee stop time out (min)

When the squeegee idle time exceeds the
input time, a warning is displayed before the
printing motion commences.
●Effective in preventing dry and/or
deteriorated solder paste printing.
●Disabled when parameter is [0.00] .

SPD 5-3-5-1 N7201A455E02

 (To scroll down)

11.Paper empty notice. (m)

Input length of cleaning paper.
Length is subtracted for each cleaning motion.
4
When the remaining paper length becomes
[0] , a paper empty notice is displayed.
2
●Since the calculation of paper consumption
is an approximate expression obtained from
experiment, the amount may not be
consistent with the actual roll-up amount
depending on such as thickness and
expansion of the paper used.
●Recommended value: 13 m for 15 m paper,
8 m for 10 m paper.
●Initial value: 0(m)
● Disabled when setting value is [0] .

administration
System
8.Cleaning solvent supply count 12.Stop time before leave (×10 ms)
(Rep) Input time from the end of squeegee transfer to
Input solvent discharge amount for wet cleaning. the beginning of snap off.
●Normally set to [4] . ●Initial value: 0 (ms)

9.PCB eject wait time (Ready Off) (s) 13.Supply end pos. offset (mm)
Input PCB unload waiting time before and error Input the position to finish solder supply when
is displayed. using automatic solder supply unit (option) .
●Initial value: 10 seconds ●Initial value: 0 (mm)

10.PCB carry in check time (ms) 14.Production end notice warning

Input the time to prevent the PCBs being time(min)
transferred from the upstream machine from Input time to indicate that production is nearing
stopping along the way if, during production, completion by blinking the progress bar or
the STOP button or the cycle stop button is utilizing the signal tower / buzzer.
pressed while the machine is sending the PCB ●Disabled when setting value is [0] .
request signal to the upstream machine
●Rotates conveyor by input time and switches
to single stop (or cycle stop) screen after
completing PCB loading.
●Initial value: 2000 (ms)

SPD 5-3-5-2 N7201A455E02

 Operating procedure
Machine Setting of motion
5-3-5 parameter
parameter 2

(To scroll down)

15.Slowdown Start Distance for 19.Deceleration Distance Conv. F

PCB Positioning (mm) (mm)
Input distance from the stopper to switch to Input distance from the stopper to switch to
low conveyor speed . low conveyor speed during transferring the
(Length from PCB stopper on middle PCB of the front conveyor. (Length from the
conveyor. ) PCB detection sensor of the front conveyor
●Initial value: 120 mm entrance)
●Initial value: 250 mm

20.Decelaration Distance Conv. R

(mm)
Input distance from the stopper to switch to
low conveyor speed during transferring the
PCB of the rear conveyor. (Length from the
PCB detection sensor of the rear conveyor
entrance)
●Initial value: 250 mm

21. Stopping distance exceeds

Conv. F (mm)
Input distance to change the transfer speed to
the stopping speed during transferring the
PCB of the front conveyor. (Length from the
PCB detection sensor of the front conveyor
exit)
●Initial value: 10 mm

SPD 5-3-5-3 N7201A455E02

 (To scroll down)

25.Solder supply pos offset (mm)

(option)
Input the offset value of discharge position (Y-
direction) of the automatic solder discharge
unit.
●Initial value: 0 mm

administration
System
22. Stopping distance exceeds 26. Rising speed after printing (mm/ s)
Conv. R (mm) Input the speed to rise the squeegee after
Input distance to change the transfer speed to printing.
the stopping speed during transferring the ●Initial value: 10mm/s
PCB of the rear conveyor. (Length from the
PCB detection sensor of the rear conveyor
exit)
●Initial value: 6 mm

23.Solder supply round count 27.Alarm paste count (piece)

(production prep) (times) (option) Input the number to notice solder exhaust
Input the number of syringe round trip for When the remaining solder becomes less
automatic solder discharge during production than the set value, notice is displayed.
preparation. ●Initial value: 0 piece
●Initial value: 5 times ●Disabled when parameter is [0] .

24.Solder supply round count(during 28.Solder adhesion&up judge value

production) (times) (option) (N)
Input the number of syringe round trip for Input the judgment value to display warning
automatic solder discharge during production when the solder lifting up is checked during
preparation. printing.
●Initial value: 5 times ●Initial value: 3 N

SPD 5-3-5-4 N7201A455E02

 Operating procedure
Machine Setting of motion
5-3-5 parameter
parameter 3

(To scroll down)

29.Printing pressure acquisition 31.Printing tolerance (negative) (N)

cycle (ms) Input the value (negative) to judge changes
Input the sampling cycle of the squeegee against the setting value of the squeegee
printing pressure with the printing pressure printing pressure with the printing pressure
monitor function. monitor function.
●Initial value: 2ms ●Initial value: -5 N
Ex.) Setting printing pressure: 50N
When the printing pressure monitor
judgment value: 5 N
If the squeegee printing pressure during
printing becomes 45 N or less, it
judges printing pressure error

30.Printing pressure tolerance

(positive) (N)
Input the value (positive) to judge changes
against the setting value of the squeegee
printing pressure with the printing pressure
monitor function.
●Initial value: 5 N
Ex.) Setting printing pressure: 50N
When the printing pressure monitor
judgment value: 5 N
If the squeegee printing pressure
during printing becomes 55 N or over,
it judges printing pressure error

SPD 5-3-5-5 N7201A455E02

 administration
System

SPD 5-3-5-6 N7201A455E02

 Operating procedure
Machine
Option setting 1
5-3-6 parameter

The following explains the setting to improve process quality. Please use as needed.
Please note however, that the cycle time becomes longer by using this setting.

Push to select.

1.Another connect 4.Double print after process wait

Choose whether to connect with non-Panasonic clng.
machines. Select whether to carry out round trip print for
●When set to [Use], as soon as conveyor the next wait cleaning process when idle.
entrance sensor detects PCB, the demand ●Select [Yes] when solder filling becomes
signal to the pre-process turns off. difficult due to cleaning.

2.Double print after wet cleaning 5.Pressure teach cancel

Select whether to carry out round trip print for ●Select to check whether the squeegee being
the next wet cleaning motion. used has gone through the pressure
teaching process
●The initial value is [None]

3.Vacuum OFF waiting (option) 7.External inspection machine NG

When using vacuum-holding, select whether to cleaning (option)
stop descent of PCB support once to prevent Select whether to continue printing after
PCB bounce. cleaning when the machine receives an NG
(Due to vacuum reminder, PCB may bounce on signal from an external inspection machine
the transfer surface and may drop out.)
●Set waiting time in [Release time of
adsorption pressure reminder]
(→ P.5-3-5-1) .

SPD 5-3-6-1 N7201A455E02

 (To scroll down)

11.Process wait signal tower

Select whether to switch the state of the
signal tower when process waiting state
continues for 60 seconds. (PCB clogging on
the pre-process stocker or transfer conveyor
becomes more evident by using this function.)
●How to switch
Set in [Signal tower] (→ P.5-3-4) , in No.71
[pre-process waiting time-out] or in
No.72[post process waiting time-out] .

administration
System
12.Screen SD save
Select whether to save screen images on an
SD card when the printer button is pressed .
Push to select ●Saved in bitmap format.

8.External inspection machine NG 13.Wait for pre process eject ready

cycle stop (option) Select the timing to transmit the request
signal when the machine is ready to receive a
Select whether to cycle stop the printing
PCB.
process when the machine receives NG signal
●Yes: Does not transmit the signal until
from an external inspection machine.
receiving an unload signal (BA) from
pre-process.
None: Transmits the request signal
immediately.
9.Air conditioner error detection
(option)
Select whether to cycle stop the printing 14.PCB carry out signal
process when receives NG signal from an air
Select the timing to transmit the PCB unload
conditioner.
signal (BA) .
●Yes: Transmit signal while unloading the
PCB
None: Transmit signal when the machine
10.Post process production end is ready to unload the PCB (print
signal output completion) .
Select whether to output production end signal
to the post process.

SPD 5-3-6-2 N7201A455E02

 Operating procedure
Machine
Option setting 2
5-3-6 parameter

(To scroll down)

17.PCB recognition failure No recognition

operate
Select whether to enable the [Non-
recognition] button to proceed without
recognizing the PCB when PCB recognition
error occurs.
●Yes: All operation available
None: [Non-recognition] can not be selected.

18.Pressure unit
Select unit to display printing pressure.

Push to select

15.Heat calibrate 19.Small PCB transfer mode

Select whether to carry out thermal Select whether to move XY table in X
compensation. Direction for PCB transfer between conveyors.
● [Yes] : Carries out periodically with thermal ● [Yes] : Stable transfer motion can be
compensation recognition during achieved even for thin PCB etc.
operation.

16.Conveyor width save 20.Center conveyor simultaneous

After starting, select whether to save conveyor transportation mode
width at power off. Select whether to transfer PCBs on pre-,
●Yes: Leaves the conveyor width at power off middle and post-conveyor simultaneously for
after starting. faster tact time.
(Risk of slight conveyor width change )
None: Adjusts conveyor width during at origin
return after starting.

21.PCB width cleaning

Select whether to clean the PCB back surface
only.
●[Yes] : Clean the PCB back surface only.
(Available for PCB width of 120 mm or
less.)

SPD 5-3-6-3 N7201A455E02

 (To scroll down)

administration
System
Push to select

24.Mask Suction (option) 25.Mask recog after cleaning

Select whether to suction the stencil by the Select whether to carry out stencil recognition
clamper in order to prevent the stencil after cleaning.
misalignment during printing.

SPD 5-3-6-4 N7201A455E02

 Operating procedure
Machine
Option setting 3
5-3-6 parameter

(To scroll down)

Push to select

29.Squeegee set check 32.Printing Pressure monitor

Select enable or disable the function to check Select enable or disable the function to check
whether the squeegee is attached before whether the squeegee printing pressure is out
printing. of set area during printing.

30.Check PCB around conveyor 34.Counter reset with mask

Select whether to check PCB presence on exchange
the front and rear conveyors. Select whether to reset the printing counter
when the stencil is exchanged.

31.Double print after dry cleaning 35.PCB fall prevention plate off
Select whether to print round trip or not during Select whether to activate the PCB fall
printing right after cleaned during production. prevention plate or not during PCB positioning.

SPD 5-3-6-5 N7201A455E02

 (To scroll down)

administration
System
Push to select

36.PCB thickness measure (option) 38. Middle conveyor high-speed

Select whether to enable the PCB thickness simultaneous transfer
measurement during production data teach. Select whether to load PCBs to the middle
conveyor at high-speed for improving tact
time when the middle conveyor simultaneous
transfer mode is enabled.

37.Solder lift check

Select whether to check the solder lifting up
when the squeegee is raised during printing.

SPD 5-3-6-6 N7201A455E02

 Operating procedure
Machine
Data check
5-3-7 parameter

Checks whether the machine parameter values are correct for production.

A B

Check results
A When a error is detected, the first error
is displayed and stops.

B
Pressing this button after the result of
the error is confirmed, check continues.

How to modify data (when error exists)

1 Note the error details.

2 (Displays the next error.)

Repeat procedure 1 and 2

3 until all the data name have been
displayed.

Correct all errors.

4
5 1 2 6
5
When [Normal]
6
(Returns to the procedure.)

SPD 5-3-7 N7201A455E02

 Operating procedure
Machine
Teaching menu
5-3-8 parameter

Carry out machine parameter teaching.

administration
System
Attention
●Due to the importance of this setting for machine operation, it is recommended that customers receive
formal training from Panasonic before performing this procedure.

SPD 5-3-8-1 N7201A455E02

 Operating procedure
Machine Network configuration
5-3-9 parameter
(with LNB (Option) enabled)

Configure network settings in a condition where LNB is enabled.

A C B

A Local
● The host name must be the same as
C Others
●All value are fixed values.
the machine host name of the LNB
(→[LNB operating manual] Page 4-4)
● The line number and machine
number must be the same as the one
in the LNB.
● IP address, net mask, port number
and gateway are fixed value.

B Remote
●The host name must be the same as
the machine host name of the LNB
(→[LNB operating manual] Page 4-4)
● IP address, host number and line
number are fixed value.

SPD 5-3-9 N7201A455E02

 Operation
6
Option -1 Options
-1-1 Mounting of solder leak prevention
plate
-1-2 Mounting of PCB support
-1-3 PCB vacuum box
-1-4 Automatic solder paste supply unit
-1-5 Setting of PCB hold down
motion/PCB transfer test
 Operating procedure
Mounting of solder leak
6-1-1 Options
prevention plate

Mount solder leak

Adjust plate position vertically.
1 prevention plates 2
onto the
squeegee holder.
Screw

Attachment
screw

Plate for solder leak prevention

Squeegee
holder
Protruded Printing
length pressure Adjustment range of plate position
Plate for solder leak (mm) (×10-2 N/mm)
prevention
30 or Used in the bottom position.
lower (1.8 mm from squeegee edge.)
Used in the middle position.
13 30 to 70
(3.5 mm from squeegee edge.)
Used in the top position.
70 or higher
(4.5 mm from squeegee edge.)

● If it is used at the wrong position, it may interfere with the

stencil, resulting in stencil damage.

(4 attachment screws)

SPD 6-1-1-1 N7201A455E02

 Options

SPD 6-1-1-2 N7201A455E02

 Operating procedure

6-1-2 Options Mounting of PCB support

Six types of PCB support are available. Select the appropriate support type for your PCB.

■PCB support block Supports PCB using block. Used for single-sided printing.
■PCB vacuum support block Supports PCB using a block with vacuum-holding function.
■PCB vacuum box Supports PCBs by vacuum-holding. Used for bottom side printing or
for PCBs with a large amount of warp.

■PCB support pin Supports PCBs with pins. Used for PCBs with components already
mounted in a previous process.
■Magnet support Supports PCBs using pins. Magnets are attached to the pins allowing
pins to be placed in any position.
Supports PCBs using magnet support pins with vacuum-holding
■PCB vacuum support pin
function.

PCB support block / PCB vacuum support block

PCB (vacuum) support block Bolt
Mount required number to fit
Tube 1 PCB size.
●Two types of block widths are
available.
Joint One is 21 mm and the other is 42 mm.
●Magnets are attached for
supplemental use. Be sure to affix
with bolts to avoid shifting during
operation.
●When using PCB support block,
connect all the tubes from the block to
the joint on the right side of the table.
●Place the plug to the unused joint.
●Insert the PCB support to carry the
whole PCBs.

Tube

Joint

PCB vacuum box

PCB vacuum plate
Mount the special box for PCB
PCB vacuum box
Tube
1 type being used.
(→ P.6-1-3-1)
● Connect all tubes from the block to
Joint
the joint on the right side of the table.
●When using a vacuum-holding
(option) , up to three tubes can be
connected.
●Place the plug to the unused joint and
the box hole.

SPD 6-1-2-1 N7201A455E02

 PCB support pin

Mount the required number

1 of matrix plates. 2 Mount pins on the matrix plates.
Matrix plate Fix bolts (M3) Matrix plate
PCB support pin

●Width of one plate ● If there are mounted components on the

40 mm width (length 324 mm·six) bottom, mount pins accordingly to avoid
35 mm width (length 324 mm·one) interference with the existing components.

(Attachment bolt: 2 bolts/plate)

Options
PCB vacuum support pin / Magnet support pin

Tube Place PCB vacuum support pins

1 and magnet support pins.
●Connect tubes from vacuum support
pins to the joint on the right side of the
table. (Max. 5 pieces)
●Use of magnet support pins only is
available.
Diameter of magnet support pins.
· 4 mm dia. 10 pieces
· 10 mm dia. 10 pieces
· 20 mm dia. 4 pieces

Magnet support pin

PCB pickup support pin

SPD 6-1-2-2 N7201A455E02

 Operating procedure

6-1-3 Options PCB vacuum box 1

Mount direction
You can choose the PCB flow direction on the front and rear sides either of the face-to-face direction or the
same direction
■For face-to-face direction ■For same direction
Positioning processing
Rear Side Positioning processing is
is required only for required for both sides.
worker side.

Positioning processing part

A
A

A A
PCB vacuum box
Front Side

How to mount
Attachment
bolt Name Model
Joint KQ2H06-01S(SMC)
Upper
plate Tube TU0604B(SMC)
Plug KQ2P06(SMC)
Box ● Plugs are used to the joint parts with no tube
connected.
● An included tube adapter (N510059956AA) is
Tube(φ6) available to use a pickup box (Tube: φ8) used for
an original machine (SP18,SP60P,SP80V).
Joint

Tube(φ8)

Tube adapter

(2 attachment bolts)

SPD 6-1-3-1 N7201A455E02

 Basic dimensions (for face-to-face direction)
Box length ≦330 (Unit: mm)

Mounting pitch
●Apply the target PCB width to
the[PCB width] in the drawing.

●When using with SP28P-D or older

Box width (PCB width-10)

Mounting pitch (around 100)

machines, a sensor recess is
required. Please consult Panasonic.

PCB width

Transfer reference Upper plate

Box

Options
Example of the upper plate design (for face-to-face direction)
(Unit: mm)

φ6.5 counter boring depth 6

Material : Aluminum plate (A2017) ■Design conditions

Processing : not necessary PCB size : (L) 350 x (W) 300 mm

Transfer reference

SPD 6-1-3-2 N7201A455E02

 Operating procedure

6-1-3 Options PCB vacuum box 2

Example of the box design (for face-to-face direction)

(Unit: mm)

■Design conditions
PCB size :
Material : Aluminum plate (A2017)
(L) 350 x (W) 300 mm
Processing : not necessary

290(PCB width -10)

270(PCBwidth-30)

2xφ3±0.005Depth 5

For relief
For box positioning

SPD 6-1-3-3 N7201A455E02

 Basic dimensions (for same direction)
(Unit: mm)
Box length ≦330
Transfer reference
Mounting pitch(around100)
●Apply the target PCB width to the
[PCB width] in the drawing.
●Attach vacuum box using M3 bolts.
Box width (PCB width - 10)

(through M4 holes)

Mounting pitch ( around 100)

●Block unused holes for fixing by M4
bolts.
● When using with SP28P-D or older

PCB width
machines, a sensor recess is
required. Please consult Panasonic.

Transfer reference Upper plate

Box

Options
Example of the upper plate design (for same direction)
(Unit: mm)
Transfer reference
■Design conditions
PCB size:
(L) 350 mm x (W) 300 mm
Φ6.5
counter boring Material: Aluminum plate(A2017)
depth 6 Processing: not necessary

Φ9
counter boring
depth 6

Transfer reference

SPD 6-1-3-4 N7201A455E02

 Operating procedure

6-1-3 Options PCB vacuum box 3

Example of the box design (for same direction)

(Unit: mm)

(290PCB width - 10)

Material : Aluminum plate
270(PCB width - 30)

Processing : not necessary

2xφ3±0.005Depth : 5

(φ3.3Through hole)

For relief
For box positioning

■Design conditions
PCB size:
(L) 350 x (W) 300 mm

SPD 6-1-3-5 N7201A455E02

 Dimensions to mount the box
Movable side PCB clamp claw (unit: mm)

Vacuum piping
connection
(option)

Fixed side PCB clamp claw

Options
Support plate
Support plate
Support mount surface
Fixed side PCB clamp claw Movable side PCB clamp claw
Support

Support plate
Support plate

Fixed side PCB clamp claw Support mount surface Movable side PCB clamp claw
Support

SPD 6-1-3-6 N7201A455E02

 Operating procedure
Automatic solder paste
6-1-4 Options
supply unit

Preparation: Set [Solder automatic supply] (→ P.4-1-10) to [ON].

1 2 3 SERVO

SUPPORT ENABLING OFF

Solder Change

(The squeegee rises and the

squeegee head moves
toward you.)

11 10
SERVO

ENABLING ON

●Pressing the [Interrupt]

closes the window.

SPD 6-1-4-1 N7201A455E02

 Remove the
4 5 Unlock 6 syringe

Lock

8 Unlock 7 Replace it with

9 new one.

Options
● The new syringe should be
Lock at the room temperature.

SPD 6-1-4-2 N7201A455E02

 Operating procedure
Setting of PCB hold down
6-1-5 Options
motion/PCB transfer test 1

Setting of PCB hold down motion

The PCB flattening motion using the PCB stopper is employed when the PCB is thin or warped. (The PCB
stopper is lowered to push the center of PCB.)
When a PCB warpage correction unit is installed (option), the PCB stopper pushes down on the entire PCB.

1 Set to [ON]

2
(Returns to [Home menu] screen.)

1 2

SPD 6-1-5-1 N7201A455E02

 Options

SPD 6-1-5-2 N7201A455E02

 Operating procedure
Setting of PCB hold down
6-1-5 Options
motion/PCB transfer test 2

PCB transfer test (adjustment of PCB clamp force)

Carry out PCB transfer test after conveyor width have been adjusted and support pins have been installed.
●In[data modification]screen(P.4-1-1-1), selection of PCB transfer speed for each PCB is possible.

1 Turn servo on

2 +

3 +

(PCB is transferred from pre-process to

transfer conveyor.)
●When stopping transfer motion

4 Turn servo off.

5 Open the safety cover.

SPD 6-1-5-3 N7201A455E02

 Confirm PCB clamp state and
Regulator knob
6 adjust clamp force to fit the PCB
shape and material.
● Pull out regulator knob, turn to adjust
and push in.
●Clamp force: Force to hold the PCB.
●When PCB warp is detected due to
excessive clamp force, decrease air
pressure.
●When adjusting air pressure,
decrease below the desirable
pressure setting, then adjust the
pressure setting accordingly.
●Air pressure setting range:
0.20 to 0.40 MPa
(If air pressure is set at 0.20 MPa or
less, clamping may not work reliably.)
●Correlation between air pressure and
clamp force.
Air pressure PCB clamp force
(MPa) (N)
0.20 23.6
0.30 35.4
9 10

Options
0.40 47.2

7 Close the safety cover.

8 Turn servo on

9 +

(The PCB transfers to the right

conveyor)

10 +

11 (PCB is transferred from transfer

conveyor to post-process.)

11
(Returns to [Machine adjustment
menu] screen.)

SPD 6-1-5-4 N7201A455E02

SPD 6-1-5-5 N7201A455E02
 Operation
-1
7
Specifications
When -1-1 Equipment specifications/outline
dimensions
required -1-2 Applicable PCB specifications
/stencil specifications
 Operating procedure
Specifi- Equipment specifications /
7-1-1 cations
outline dimensions

Equipment specifications
Items Specifications
Control system Microcomputer system
Data is managed using the SD card.
External memory
Requires around 300 KB for one data. (up to 2 GB available)
Min. 50 ×50 mm to Max. 350 ×300 mm
Applicable PCB dimensions
Thickness 0.3 to 8.0 mm
736 ×736mm ,
Stencil frame
Option : 650 ×550 mm,600 ×550 mm, 550 ×650 mm
Squeegee type Metallic squeegee
Squeegee length 370 mm
Squeegee speed 5 mm to 400 mm/s
Input range 5×10-2 to 54×10-2 N/mm
(For squeegee of 370mm length)
Printing pressure ●Actual available printing pressure differs from squeegee type or length.
●Stable printing may not be achieved under the printing pressure of
10×10-2 N/mm or less.
Single squeegee (one way printing) and double squeegee (round
Squeegee motion
printing) are exchangeable.
PCB positioning reference Center
PCB fixing method Mechanical clamp (standard) or PCB vacuum-holding (option) method
Offset of stencil positioning ±5 mm in the X and Y directions, ±1.2˚ in the rotation direction
Clearance between stencil and
-1.0 to +3 .0mm
PCB
Stencil back side cleaning
Dry type and wet type. (Selection and combination are available.)
function
Cleaning paper dimensions Length 15 m, Width 370 mm, Paper tube inner diameter 20 mm
W 1,220 × D 2,530 × H 1,444 mm
Dimensions
(Excluding a signal tower and a touch screen)
Main body:2,250kg (Standard structure, excluding options)
Mass
Vacuum pump:28 kg / unit (option)
Rated voltage : Single-phase, AC 200 V / 220 V / 230 V / 240 V ±10 V
Electric source Frequency:50 / 60 Hz
Rated capacity:1.5 kVA
Supply air pressure 0.5 to 0.8 MPa (Working air pressure 0.5 to 0.55 MPa)
Supply air amount 60 L/min (A.N.R.)
Temperature:10 to 35 ˚C
Environment for operation
Humidity:25 to 75 %RH (No condensation)
Environment for transporting Temperature:-20 to 60 ˚C
and storing Humidity:75 %RH or lower (No condensation)
Altitude Up to 1,000 m above sea level
Noise Below 70 dB (A)
LED class Class 1

SPD 7-1-1-1 N7201A455E02

 SPD
Outline dimensions

1220
Solvent tank
1300(Width including Touch screen)
1429(Touch screen)

1429(When Signal tower not standing)

1429(When Signal tower standing)

7-1-1-2
Power cable connection
Outline dimensions and Working area
Working area

(Minimum set distance(SPD 2 line specification)Stencils are changed alternately

N7201A455E02
When required
 Operating procedure
Specifi- Applicable PCB specifications /
7-1-2 cations stencil specifications

Applicable PCB specifications

Items Specifications
●PCB dimensions
L size Min.:50 (L)×50 (W) mm
Max.:350 (L)×300 (W) mm
PCB size (mm)
PCB thickness :0.3 ≤ T ≤ 8.0mm
PCB mass:1.5 kg or less
(including the carrier weight)

Within ±1.0 mm

Allowable PCB
●For a PCB with thickness of 8.0 mm,
warpage
the upper limit of warpage is 0.5 mm.

●If a cutout is located on PCB, it is

possible to change the stopper
position to an arbitrarly position in
PCB cutout range XY direction.

PCB

Max.8.5mm
From belt surface

Dead space ●Dead space may differ

depending on line
Open space for transfer
configuration.

●Mark shape examples

PCB recognition correction is based on the positional relationship between the
marks and the circuit pattern. Certain contrast is required between recognition mark
and PCB base.
●"3"on the left: Equilateral triangle
Line width of"4"on the left: 0.3 mm or
more.

PCB recognition ●Mark dimension and background

mark The background of a mark requires the non-interference area outside the mark.

●Not all the marks are black.

SPD 7-1-2-1 N7201A455E02

 Stencil specifications
Stencils available in standard specifications (standard specification: Left to right flow, Front reference.)
(Unit:mm)

Plate-making
Max. size of
Type Size reference
applicable PCB
(Ydirection)
Panasonic
Center
L size STD stencil
Standard 736 × 736 350 × 300
DEK type stencil Center
(MAX:508 × 508) Front
Panasonic 650 × 550
M size STD stencil (M size lateral stencil) Center
330 × 250
Front
Panasonic 600 × 550
Option
M size STD stencil (M size lateral stencil)
Panasonic 550 × 650 350 × 300 Center
M size STD stencil (M size lateral stencil)

■[Stencil data edit](→ P.4-1-4)

When required
●Since stencil recognition is carried out from the stencil underside, a recognition mark needs to be
located on the underside or in the form of through-hole.
●If there is no recognition mark on the stencil underside, the stencil aperture is used as a reference for
positioning.
●For any screen stencil size, the applicable minimum PCB size is 50× 50 mm.
●For SPD, only the front reference is available. (Rear-reference type is not available).
●If using the screen stencils and plate-making references that are not listed above, please consult us.
●To change the screen-stencil frame dimensions, the stencil data and the stencil holder width needs to
be changed.
●The stencil intended for pasting the stencil in Y direction shall be pasted on the outside of the "PCB size
+ One side 75 mm" area. (If there is convex area within 75 mm, the print quality will be affected
because of no PCB adhesion with the stencil.)
●Only the front printing stage can be used for the front reference stencil of the DEK frame and MPM
frame.
Notice
To change the stencil size, [stencil type] of stencil data (→P.4-1-4) and mounting or removing of spacer
needs to be changed.

SPD 7-1-2-2 N7201A455E02

SPD 7-1-2-3 N7201A455E02
 Notice

The contents of this document are subject to change without prior notification.
Some of our products fall under the export control items (or technologies) established in
the Foreign Exchange and Foreign Trade Act. When exporting (or providing technologies
overseas), please check its legal restrictions and be sure to take necessary procedures
such as to obtain the export permission.

When reselling or moving this equipment, please make sure to contact us, our sales subsidiaries or agents.

1375, Kamisukiawara, Showa-cho, Nakakoma-gun, Yamanashi, Japan

Phone number: +81-55-275-6223
Fax number: +81-55-243-4972

© Panasonic Factory Solutions Co., Ltd. 2012

Unauthorized copying and distribution is a violation of the law.