Building Material Thermal Conductivity
Building Material Thermal Conductivity
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6 Worksheets for participants.
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6.3 Recording the coefficient of thennr"rd corCI$rily
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6.3.1 Aim . .
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6.3.2 Experimentalmethod
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Unit description
Equipment layout
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Pressing spindle kdril
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Hot plate - Errilr
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Heater control lamp - Cttf-ilfrl&
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6 Heater ON/OFF
7 Cold plate
8 Heat flow sensor
I Cooler
10 Chamber for specimens
2 Unit description
lF Construction of cooling plate
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2 Unit description
Commissioning
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2 Unit description
Place a specimen in the specimen chamber
(9). To do this, loosen the pressing spindle
(1) and raise the heating plate. Now place the
specimen to be examined onto the cooling
plate through the opening on the unit (g) and
lowerthe heating plate again. Tightening the
pressing spindle presses the specimen onto
the heating and cooling plate with a defined
pressure. This ensures a reproducible heat
contact. The conectpressing force has been
reached when the green lamp (B) on the front
of the unit lights up.
Once the lamp is lit, the pressing spindle
should be tightened by a further half turn.
I Close the over (attacfr with 4 nuts)
I Ensure that the trose for the outgoing water
ends in the ouUet, then tum up the water
supply for cooling.
10 Manually open the vafue in the sottware
Set the optimum cooling water flow of
approx. 1 .2-21lmin by gauging the capacity.
11 Now tum on the heater (6) on the front of the
unit.
12 Set the se$ltrts br the cold and hot plates
(see seclim 5.32).
2 Unit description
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2 Unit description
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When Windows is stafted, the card is auto-
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To install the software, open WINDOWS
EXPLORER and select the CD-ROM drive.
2 Unit description
Start window
Controller
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2 Unit description
Hazards to life and limb
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use gloves
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3.2 Hazards for equipment and
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3 Safety instructions
4 Theoretical principles
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Fig.4.1 Heat transfer through a wall
4 Theoretical principtes
The heat flor,r0 due to thermal conduction is
described by the following equation:
O = -1,'A'qq
dx
(4.1)
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O= (4.3)
d = l',t,-$,) (4.4)
O = -l .A-t -d$
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(4.5)
o = r 1($,-$r) (4.6)
14 4 Theoretical principles
+.2.1 Thermal conduction through flat rall witft multiple tayers
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The heatflow is the same for each layer of a wail.
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nttlayec O = !.o.(n,
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(4.7)
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lnsulators: l" large
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Fig.4.2 Temperature curve for
6 a typical wall construction cfrange4 s$grilying thd frre thermal resistance of
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a flat waf does not change if the layers are
intercfiarged-
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4 Theoretical principles
4.3 Thermal resistance
Temperatu re Difference
Thermal Resistance =
Heat Flow
H = l^tl . K
-ln o. w
(4.8)
R.' = t'-t'= 6
(4.e)
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For walls with multiple layers, the procedure is the
same as for thermal conduction. The thermal
resistance through multiple layerwalls can thus be
derived as follows:
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R,n", =
*. *, i (4.10)
16 4 Theoretical principles
Didactic remarks
18 5 Experiments / lnstructor
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The *n d lr ryeilrf b to determine and
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cornpflB te trnrnd stdttctivity l"of various
CJ materials (irculators) and plastics used in
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5 Experiments / lnstructor 19
Preparations for experiment
5 Experiments / lnstructor
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Recording the coefficient of thermal conductivity
Aim
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Measured values
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T1 50 oc
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Evaluation
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Preparations for experiment
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at Pressing spindle Rear of unit
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2- Hot plate - Mains supply
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Pressing pressure control lamp - PC interface
4- Heater control lamp - Cooling water inlet and outlet
5- Mains switch ON/OFF
6- Heater ON/OFF
7- Cold plate
8- Heat flow sensor
o- Cooler
10- Chamber for specimens
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Aim
Material:
T1 oc
T2 oc
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m.K
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m.K
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Evaluation
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Specimen st rhr 300 x 300 mm
.o Area of Transnissin A = 0,046 m2
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d) Height: max. 50 mm
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Silicon heating nt*
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Tem peratu re npasurqnent
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Sensor plate:
Temperature range: -20 - 95 "c
Calibration factot: 1 mV = approx. 3 Wm2
Heat flow: min. 20 Wm2
max.500 Wm2
Cooling:
Water temperature: 10-15'C
Water volume: 1,2 !/min
Water pressure: 1 -6 bar
7 Appendix 33
Specimens:
Material: \ Armaflex
Coefficient of thermal conductivity I:
0.036 - 0.O40Y*K
Dimensions: 300x300 mm
Thickness 6: 19 mm
Material: Chipboard
Coetficient of thermal conductivity l.:
0.17Y^K
Dimensions: 300x300 mm
Thickness 6: 13 mm
Material: \ PMMA
Coefficient of thermal conductivity l.:
0.19Y^K
Dimensions: 300x300 mm
Thickness 6: 20 mm
Material: \ Styrofoam
Coefficient of thermal conductivity l.:
0.030 - o.040Y^r
Dimensions: 300x300 mm
Thickness 6: 5mm
Material: pS
Coefficient of thermal conductivity l.: ductivity
0.15 - O.4*/^* fterials
Dimensions: 300x300 mm
Thickness 6: 10 mm
7 Appendix
Material: \ POM
Matedal: \ Cork
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o Coeffident of thernal conductivity l":
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c6 Dirnensions: 300x300 mm
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Material: Plaster
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Optional altematives, see rating plate
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Fuse: 6.3 A
Water connection
Outlet or floor drain
7 Appendix
References
7 Appendix
lndex
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Appendir ...33-37
Area. .....14
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Commissitxitg ...5
Conducilirxt ......1
Convectirn .......1
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ExperimenB .17 -25
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o Handling ...5
o Hazardstolifeandlrb ......11
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I(! Heatflow ..14
d) Heatflowderxfty ......14
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l) Heattransfer..-- ...1,13
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lsothermicarea. ......14
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Technicaldata. ..33
Temperaturedifference... ...'t3
Temperaturegradient.... ...14
Theoretical principles ....13-16
Thermal conductivity ...14
Totaltemperaturedifference ..15
Unitdescription. .....3-9
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Worksafety .....11
7 Appendix 37