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Met402 Mod 02 Mems Sensors

The document covers Micro Electro Mechanical Systems (MEMS) and their applications, focusing on MEMS-based sensors such as accelerometers, gyroscopes, and pressure sensors. It details the fabrication methods, principles, and working mechanisms of these sensors, including piezoresistive and capacitive technologies. Key applications in various industries, including automotive and aerospace, are also highlighted.

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9 views11 pages

Met402 Mod 02 Mems Sensors

The document covers Micro Electro Mechanical Systems (MEMS) and their applications, focusing on MEMS-based sensors such as accelerometers, gyroscopes, and pressure sensors. It details the fabrication methods, principles, and working mechanisms of these sensors, including piezoresistive and capacitive technologies. Key applications in various industries, including automotive and aerospace, are also highlighted.

Uploaded by

vickian.19
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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MET402 MECHATRONICS

MODULE 02 PART 02

MEMS – MEMS BASED SENSORS

[email protected] (M8/2023) 1
MODULE 03

Micro Electro Mechanical Systems (MEMS):


Fabrication: Deposition, Lithography, Micromachining methods for MEMS,

Deep Reactive Ion Etching (DRIE) and


LIGA processes.

**Principle, fabrication and working of MEMS based


pressure sensor,
accelerometer and
gyroscope.

[email protected] (M8/2023) 2
MEMS - INERTIAL SENSORS

⮚ Inertial force 🡪 force produced by the reaction of a body to an accelerating force


⮚ Accelerometers are used for linear motion
⮚ Gyro sensors (gyroscopes) for rotary motion
⮚ Major application areas of inertial sensors
✔ automobiles, aerospace, missile technology and robotics
⮚ In automobiles 🡪
✔ crash sensing, air bag deployment, active stable suspension system, yaw rate sensor for skid
control in anti-lock braking applications
⮚ used in camcorders for active picture stabilization, head mounted virtual reality displays, 3D
mouse, mobile phones and electronic toys to support video games

[email protected] (M8/2023) 3
MEMS - ACCELEROMETER

⮚ second largest volume of sensors used by industries


⮚ MEMS accelerometers follow spring-mass-damper design
⮚ The displacement of the proof mass (seismic mass) under inertial force is sensed by interface
electronic circuit, to measure linear displacement, velocity and acceleration
⮚ Proof mass movement 🡪 Piezoresistive, capacitive, piezoelectric, optical

[email protected] (M8/2023) 4
MEMS - Piezoresistive Accelerometer

⮚ a bulk-micromachined silicon wafer that forms the proof mass, substrate and a cantilever as its
suspension system
⮚ Piezoresistors are embedded to the cantilever beam
⮚ Silicon wafer is bonded to a Pyrex glass wafer base
⮚ bulk-micromachined silicon wafer is cladded between two glass wafers into which cavities are
etched
⮚ Changes their stress profile 🡪 resistivity change of the embedded piezoresistors

[email protected] (M8/2023) 5
MEMS -Capacitive Accelerometer

⮚ a proof mass held to the basic structure (substrate) with two flexures (springs)
⮚ Enclosed in a Pyrex glass wafer casing.
⮚ electrodes (conductive surfaces) embedded on the outer surface of the proof mass and inner
surface of the Pyrex glass casing

[email protected] (M8/2023) 6
MEMS -Comb Type Differential Capacitive Accelerometer

⮚ More preferred design due to its simplicity and easiness to fabricate by surface micromachining
technique
⮚ Proof mass held to substrate with flexures (spring)
⮚ Springs are attached to the base structure
⮚ Different capacitances are developed between the conductive electrodes S1 & S3 and S2 & S3
⮚ Enables to accurately sense even slight change in velocity

[email protected] (M8/2023) 7
MEMS -PRESSURE SENSORS

⮚ Highest selling MEMS based sensors


⮚ Used in automobiles
▪ for measuring manifold air pressure (MAP)
▪ fuel rail monitoring
▪ Fuel tank and engine oil monitoring
⮚ Converting pressure to deflection of a diaphragm and then transducing it into an electrical
quantity
⮚ Deflection sensed by using strain gauges, capacitive technology, piezoresistive technology

[email protected] (M8/2023) 8
MEMS -Piezoresistive Pressure Sensor

⮚ three main parts –


▪ a top glass cap
▪ a bottom glass base
▪ a sensing element in between
⮚ Sensing element 🡪 single crystal silicon ring attached to which is a polysilicon diaphragm
⮚ Four piezoresistive elements are embedded on the top of the diaphragm forms Wheatstone
bridge

[email protected] (M8/2023) 9
MEMS - Capacitive Pressure Sensor
⮚ three layers of micromachined structures packed together
⮚ top cap layer and the bottom base layer are fabricated in Pyrex glassm wafer
⮚ middle layer is a silicon membrane (diaphragm)
⮚ Four capacitors are used
▪ embedded on top surface of the diaphragm and the bottom surface of the top Pyrex cap
⮚ Two reference capacitors are placed towards the rigid edges of the diaphragm, for which
capacitance is a constant during functioning of the device
⮚ Important 🡪 electronic circuit must be integrated or placed closer to the sensing device to
avoid errors due to interference

[email protected] (M8/2023) 10
MEMS - GYROSCOPE
⮚ SELF STUDY

[email protected] (M8/2023) 11

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