PCB Design Workshop

By
Chetan Naik J
Assistant Professor, CIT, Bangalore
 PCB Layout - Agenda

❑ INTRODUCTION
Introduction about PCB Design
Brief History
PCB Basics
Difference between PWB and PCB
Types of PCBs : Single sided and Multilayered
PCB Materials
PCB Layers
Electrical Layers
Mechanical Layers and component outlies
PCB materials

❑ PCB Design
PCB design flow: Schematic capture
Netlist
Layout design
DRC, DFM
Gerber generation
Making of PCB (printing, etching, drilling) & assembly of components
Footprint
2
Pad stacks
 PCB Design- Introduction

• PCB (PWB-Printed Wiring Board)

• PCB is Printed Circuit Board which mechanically supports and electrically connects
electronic components using conductive traces, pad and other features etched from copper
sheets laminated onto a non-conductive substrate.

• How PCB is made of

• A basic PCB starts with a copper-clad fiberglass material or thin copper sheets attached to
either side of the board. It consist of
❑ Copper Foil

❑ Copper Plating

❑ Solder Flow

❑ Solder Mask
❑ Trace

❑ Slots and Cut-out

3
EVOLUTION OF PCB
 What is PCB

• A PCB is a thin board made of fiberglass, composite epoxy, or other

laminate material.

• Conductive pathways are etched or "printed" onto board, connecting

different components on the PCB, such as transistors, resistors,
and integrated circuits.

• The tracks function as wires fixed in place, and are insulated from
each other by air and the board substrate material.

• FR-4 glass epoxy is the most common insulating substrate.

 History of PCB

introduction
• The printed circuit boards (PCBs) used in today’s electronics
equipment were first designed and developed in the 1930s.
• In 1936, Austrian inventor Paul Eisler developed the first PCB to
operate a radio system, based on a circuit design originally patented by
Charles Ducas.
 Difference Between PWB and PCB
PWB PCB
Definition and A PWB is an earlier form of circuitry that consists of In contrast, a PCB includes a more complex arrangement where
Structure: conductive paths (wires or traces) printed directly onto a multiple layers of conductive copper tracks are enclosed by
non-conductive substrate, providing basic connectivity insulating layers, allowing for intricate circuit designs and denser
for electronic components. configurations.
Complexity: PWBs, with their simpler structures, are generally better PCBs are typically more complex than PWBs, supporting higher
suited for less complex and lower-cost applications. densities of components and creating sophisticated circuit
layouts.
Manufacturing The manufacturing of PWBs is less intricate, involving PCBs undergo more advanced processes, including etching,
Process: straightforward techniques where conductive wires are drilling, and laminating, to achieve their multi-layered
printed onto the substrate. assemblies.

Performance: PWBs might still function effectively but are more prone PCBs tend to offer superior performance because their designs
to signal interference and have limitations in handling are optimized for high speed and frequency, along with better
high-frequency applications. signal integrity.
Historical The term PWB was commonly used during the early As technology advanced, the term PCB became more prevalent,
Context: development of circuit boards, when designs were limited especially in the latter half of the 20th century. Today, PCB has
to basic point-to-point connections. largely replaced PWB in common usage, though the latter is still
recognized, particularly in specific regions or in the context of
older technologies.
Overall, while both PWBs and PCBs serve the fundamental purpose of supporting and connecting electronic
components, PCBs represent a more advanced technology with broader capabilities and applications in modern
electronics
 Difference Between PWB and PCB

Characteristic PWB PCB

Often phenolic resin or FR-4 fiberglass most
Substrate
fiberglass common
Hand-routed or wire
Traces Pre-etched copper traces
point-to-point
Components Manually soldered Reflow or wave soldered
Design Simple, customized Complex, standardized
Volume Low, prototyping High, mass production
Higher setup but lower
Cost Lower
assembly
 Types of PCB’s
❑ Single Sided – Base material (rigid laminate with a woven glass epoxy base material) clad with copper on one side.

❑ Double Sided - The assembly encompasses a base material with copper on its both sides.

❑ Multi Layered – Encompasses several layers of substrates. Each layer is separated by an insulation.

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 MULTILAYER PCB
• MULTI-LAYER
2 Layer PCB design:
PCBTop layer and bottom layer
DESIGN

• 4 Layer PCB design: Top,Bottom, and two middle layers

Board Material

1. Prepreg
2. Core
3. Copper foil
Prepreg
• Sheet material (e.g., glass fabric) impregnated with a resin cured to an
intermediate stage.

• After treatment of glass fiber cloth, impregnated with resin glue solution, and
then heat treatment (pre-bake) to make the resin into the B stage and made of
sheet material called prepreg, which will soften under heat and pressure, will
react and solidify after cooling.

• It is used to stick the core layers together.

Cores
• Circuit boards cores are pre-pressed layers according to the pattern
copper foil – board material – copper foil.

Copper foils
• The copper for the outer layers of multilayer boards is applied in the form
of copper foil and pressed together with the prepregs / cores.
1.Signal Layers:
Electrical Layers
These layers are dedicated to carrying electrical signals between various components. In a standard dual-layer PCB, there
will typically be one top and one bottom signal layer. In more complex boards, additional inner layers can also be used for
signal routing, allowing for high-density interconnections.
2.Power and Ground Planes:
Power and ground planes are special layers that provide a low-resistance path for power distribution and help to reduce
electromagnetic interference (EMI). These layers are usually solid copper and are located between signal layers in
multi-layer boards. Having dedicated power and ground planes improves the performance and stability of the circuit.
3.Component Layer:
This is the top layer where electronic components are mounted. Components like resistors, capacitors, and ICs are placed
on this layer, and their connections are typically routed to the inner layers.
4.Inner Layers:
In multi-layer PCBs (more than two layers), there can be several inner layers dedicated to routing signals and power
distributions. Each inner layer may serve as a signal layer, power layer, or ground layer, depending on the design
requirements.
5.Via Layers:
Vias are small plated holes that allow connections between different layers of a PCB. They can be through-hole
(connecting all layers) or blind/buried (connecting only specific layers). The layers that contain vias facilitate the electrical
connection from one layer to another.

6.Solder Mask Layer:

While not an electrical layer, the solder mask protects the copper traces and prevents solder from bridging between
connections during assembly. It is typically green (but can be any color) and sits above the copper layers.
7.Silkscreen Layer:
Similar to the solder mask, the silkscreen layer is not electrical but contains text and symbols for indicating component
locations, values, and other important information on the PCB surface.
Electrical
Layers
 Mechanical layer
1.Mechanical Layer:
This layer outlines the dimensions and the physical boundaries of the PCB. It defines the overall shape, size, and
specific cutouts or features necessary for the PCB's assembly and integration into its final product. The
mechanical layer ensures that the PCB meets manufacturing specifications and fits into the intended enclosure.
2.Keep-Out Layer:
The keep-out layer delineates areas on the PCB where components, traces, or vias should not be placed. It
typically reserves space for mounting holes, connectors, or areas that require clearance for assembly processes.
This layer helps prevent design violations by ensuring that critical regions remain free of electronics.
3.Drill Layer:
This layer specifies the locations and sizes of holes that need to be drilled into the PCB for through-hole
components or vias. It is crucial for defining where mechanical fasteners or connectors will be installed.
4.Silkscreen Layer:
Although primarily informational, the silkscreen layer is used to print text, component designators, and other
markings on the PCB surface. This helps with identification, assembly, and troubleshooting by providing useful
visual references.
5.Outline Layer:
This layer shows the exact outline of the PCB, including the contour according to design requirements. It may also
include detailed specifications for milling or cutting the PCB during manufacturing.
6.Solder Mask Layer:
While typically considered an electrical layer, the solder mask layer acts as a mechanical barrier to protect
exposed copper traces from oxidation and accidental soldering. It also prevents solder bridging during assembly.
Mechanical
layer
Units
• Imperial
• Metric

• Mil / thou stand for 1/1000th of an inch.

• 1 inch = 25.4 mm

Most of the times the PCB will be dimensioned

in metric.
 Key Elements of PCB

• Pads are where the components are soldered to the PCB.

• Traces are the copper tracks that connect pads together

• Via are small holes through the board that link a bottom
And top trace together electrically. Traces on the same layer cannot cross, so
often, when you are laying out a PCB, you need to jump from one layer to
another
 Key Elements of PCB

• Silk-screen refers to any lettering that will appear on the final

board.

• Solder-mask is a layer of insulating lacquer that covers both sides

of the board except where there are pads.
Parts of the
PCB
1. Components
2. Pads
3. Traces
4. Vias
5. Layers
Actual devices used in the circuit Includes input &
output connection Includes power supply
connection.
Types of Components
1. Leaded components

2. Surface mount components

 Why do we need surface mount?
• Self-inductance and mutual inductance both are proportional to the
area of the circuit.
• The size of SMT parts is much smaller than the size of leaded parts.
• The area of the SMT circuitory is therefore smaller.
• The SMT circuit can handle higher frequencies than a traditional circuit
can.
5. Layers

1. Top Silk layer

2. Top Mask layer
3. Top Metal layer (Non wafer layer)
4. Internal layer (Signal, Power and
Ground)
5. Bottom layer
6. Bottom Mask layer
7. Bottom silk layer
Silk screen Layer

1. Printing on the solder mask to

designate component locations

2. Readable information about

component part numbers and
placement.

3. Helpful in assembling, testing and

servicing the circuit board
Solder Mask layer

1. Protect copper traces on outer layers from

corrosion

2. Areas that aren't soldered may be covered

with polymer resist solder mask coating.

3. Designed to keep solder only in certain areas

Prevents solder form binding between
conductors and thereby creating short circuits
 Through-Hole
• Components with leads that are inserted
through holes in the circuit board
 Surface Mount
Components with leads that are mounted
directly onto lands on the surface of the board
Surface Mount Lead
Styles
• Gull Wing
• J-Lead
• Lead Pitch -Distance from center of one pin
to center of adjacent pin
• L-Lead
Standard: 20 -100 mils
Fine: 12 -20 mils
Ultrafine: <12 mils
• Flat Lead
• Ball
Gull
Wing
J
Lead
L
Lead
Grid
Array
 PCB - Styles
The most common board styles are:
❑ Rigid – Solid construction
❑ Flex – Flexible circuits
❑ Rigid-flex – Rigid –Flex mixed
❑ Aluminum MCORE – Very small circuit. Can be integrated as part of a larger circuit

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 Terminologies in PCB
❑ PADS: Location where components connect/solder to.

❑ Traces: Connect pads together.

❑ VIA: Responsible for making electrical connection between the layers of

❑ Types of VIAs:
1. Through Hole Via : Padstack between all layers.
2. Blind Via: Padstack between the surface and internal layers.
3. Buried Via: Padstack between the internal layers.

❑ Paste Mask: A coating applied over the pins of SMD components for assembly
purpose. Through hole component doesn't required Paste mask.

❑ Solder Mask: A coating applied over selected areas of a circuit board thereby
permitting soldering only of the exposed (uncoated) areas, usually only the pads.

❑ Silkscreen: A legend printing of Epoxy Ink, used for identification of Components.

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 PCB Manufacturing Steps

• Following are the steps involved in PCB fabrication.

1) Base Material Preparation – Clean the laminate, containing copper foil.

2) Cutting the Base Material – Post the cleaning process, cut the laminate to required
specifications.
3) Apply Adhesive on the Laminate - Choose between epoxy or acrylic adhesives to get the
job done.
4) Generate Circuit Pattern –Desired circuit patterns can be generated by screen printing or
photo imaging.
5) Etch the Circuit Pattern – Etch the copper laminate containing the circuit pattern.
6) Drilling – Drill holes, pads, and vias by using high speed drilling tools.
7) Through-Hole Plating – Deposit the holes with copper and must be chemically plated.
8) Apply Cover lay – Protect the top and bottom side of the board by applying suitable cover
lay.
9) Cutting Flex - Cut individual flex from the production panel.

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 PCB Layout Flow Process

Importing Net
Placement Fanout
list

Length Matching Routing Power Plane

Silkscreen
DRC Validation Gerber Release
& Pre Gerber

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 Required inputs for PCB Layout

• Required Inputs:

❑ Schematics Design (*.dsn file)

❑ Netlist ( net properties )

❑ Mechanical inputs (*.dxf format )

❑ Layer Stackup

❑ Layout Guidelines (*.xls format)

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PCB Design
Flow
ECAD Tool Vendors and their PCB layout
tools
Logical Vs Physical design at system
level
Main roles and tasks involved in the PCB
design process
 Design flow: schematic, layout, actual
board
• Software has to manage the consistency between the schematic and the
layout.

• Photo plotter CAM files are used to manufacture the physical board.

Schematic PCB Actual board

Capture Layout
Schematic
• A diagram which shows, by means of graphic symbols, the electrical connections,
components and functions of an electrical system.
• The components are represented by agreed-upon symbols, and the conductors
connecting them by lines.
• If two lines cross each other, a large dot represents a junction, whereas no dot
represents no connection
• Before you even begin to layout your PCB, you MUST have a complete and
accurate schematic diagram.
• Good practice will have signals flowing from inputs at the left to outputs on the right.
• Your schematic really should be drawn with the PCB design in mind.
 Schematic symbols are the building
blocks
• Physical parts are represented by “schematic symbols”, which
have properties.

• Visible properties: value (e.g., 5 kohms), schematic reference

(e.g., R11).

• Invisible properties: footprint (1206, 0805, etc), distributor

number (P24.9CCT-ND).

• Invisible properties are essential

both for Layout and for the
procurement.

• Schematic symbols can be picked

from libraries
 The net list concept
• The net list is an ASCII file which describes the logical connections
between component pins. It also carries the physical footprint
information of the corresponding logical symbol.

• Generated from schematic capture systems for transferring logical

connections to layout systems. connections to layout systems.

• Other net-list are generated from CAD/CAM system for board test and
in-circuit test purposes.
 Capture provides many schematic
symbols
• Schematic symbols can be picked from libraries.

List of available Symbols already placed on a schematic

libraries page
 Working with Grids
• To layout your board on a fixed grid called snap grid

• It’s important because it will keep your components neat and symmetrical;
aesthetically pleasing if you may.

• It makes easy on future editing, dragging, movement and alignment of your

tracks, components and blocks of components easier as your layout grows in
size and complexity.
 Where to find actual parts and their
“properties”?
• Datasheet / Catalog released by the manufacturer

A page from the DigiKey

catalog
 Often Capture does not provide the symbol that you
need…
• For example, Analog Devices opamp type AD830 is not there.

• Need to make the symbol for it.

Symbol which was provided:

AD829

Here I am constructing
a new symbol
AD829_0,
which I will later
rename
to AD830 which I need.
Component Libraries of
DesignSpark
Symbols + Connections = Schematic
• In addition to properties, symbols also have pins.
• Pins are connected with wires in order to form a netlist.
• The netlist turns a loose collection of parts into the schematic.
• The netlist can be written to disk. Layout will read it from there.
• The PCB layout program will turn connections into copper traces.

Individual symbols Schematic

 Connections do not have to be drawn
explicitly

• Connection is either explicit (drawing a

wire) or implied (two wires with the same
names are assumed to be connected).

• As you can see, many wires are not

drawn, but rather implied by name. For
example, all the memory wires labeled in
red red are implicitly connected to the
“off page port” with the same name.

Wires are
connected to this
port

Other off-page
“ports”
 Before you start layout

Look at the PCB manufacturer’s website, learn their specs.

• What is the min/max size of holes?

• Minimum PCB trace width and separation?
• Minimum clearances?
• Maximum board size?
• Limitations concerning the board shape?
• Required file format? (Most likely GERBER, but check.)
• Etc.

Prepare your “board template” according to the specs.

The physical design flow
(PCB)
• ENV setup: Here we do the initial setup in layout
like board outline setup, layer stack up, some
DRC rules setting etc.

• Netlist input: Through the net list the layout tool

gets the net information, Footprint information
and the embedded constraints in formations.

• Placement: Component placement

manual/automatic.

• Routing: Plane creation and trace routing.

• Post process: Gerber setting, silk and assembly

text arrangement and Fabrication note.

• Gerber / CAM Review: Here we do the review of

the output files generated from layout tool
(Gerber). This will help to avoid the errors in output
files which directly goes for manufacturing.
 Layout step 1: prepare the
footprints
• Choose footprints from one of many Layout libraries.

• Some footprints need to be custom made.

Standard footprint Nonstandard footprint

1206-size LEMO socket
component
Component Libraries
 Layout step 2: Netlist + Board template = Ratsnest

• Layout will take an empty board template and the

netlist from Capture.
• You will see a somewhat depressing picture showed
below. Ratsnes
t

Component
“Ratsnest” footprints
of unrouted
connections

Board
outline
 Layout step 3: Placing the
components
• Green: top side
• Red: bottom side of the board
A few routed
connections
Board
outline
 Layout step 4: Ground and Power
distribution
• Blue: ground plane, violet: power plane (in negative)
• Yellow: connections to the planes with “thermal reliefs”
Dark is copper
light is etched
+3.3 V digital +1.8 V +3.3 V analog

-5 V
+5 V
 Ground and power distribution cont.

• The number of plane layers must be even. The planes have to be symmetric.
Otherwise the board will warp. Example: one GND and one PWR plane.
Signal
GND
PWR
Signal

• The PWR plane can be partitioned if there is more than one power source.
Example: +/- 5V, 1.8V and 3.3V digital, and 3.3V analog are all on the same
plane.

• GND plane can be partitioned between the analog and the digital grounds.
Ground and power distribution cont.

∙ By definition, SMT components imply no holes. The connections to the GND

and PWR planes need to be established. It can be done either automatically or
manually. This step is called “fanout”
 Layout step 5: Routing the
connections
• Routing connections “by hand” can yield good boards, but it is tedious.

Top
side

Bottom side
 Placing the components
• It is best to place the components on the top side

• Make sure that the grids are turned

• Components such as LED, connector, mounting holes, heat sink etc must be
in peripheral to the board

• Give careful thought while placing the components to minimise the trace
length

• Arrange the ICs in only one or two directions

• Polarised parts (diode, electrolytic capacitor ) with positive leads all having in
same orientation

• Digital and Analog circuits should be separated to isolate the digital switching
from analog circuits.

• High frequency should be separated from low frequency and keeping former to
the connector
Placing the components
Placing the components
 Placing the components
• Use continuous supply layers whenever possible.

• Keep connection to supply layer short.

• Use SMD components where ever possible

• Place bypass capacitor as close to the supply pin of transient load

• Do not create ground loop. Ground loops typically have very small
impedances. Current coupled into ground loops can be very large. They
cause problems like ground bounce, signal distortion.
 Placing the components
Capacitor connection:

• Capacitors should be connected to planes with minimum loop area

 Placing power and ground trace
• After the component placement, the next step is to lay the power and ground traces

• Solid ground plane is best, provides continuous, low-impedance path for return
current

• Absolutely necessary for large amounts of high speed devices (edge rates < 5ns)

• May not be feasible due to budget constraints (Usually requires at least a 4 layer
board)
 DFx (DFM, DFA & DFT)
Design For Manufacturing ( DFM / DFA)

❑ Clearance for Board Edge to Any Components

Longer [Conveyer] edges should have 200 mils
Other two edges should be 80 mils minimum.
❑ Clearance for Board Edge to Any Copper/Trace 40mils Minimum.
❑ All ICs are placed in 25 mil Grid.
❑ All Discrete’s are placed in 5mil Grid.
❑ All components accessible for an easy replacement.
❑ Tooling and Rework holes are provided as per requirement.
❑ Global and local fiducial’s are provided as per DFA rules
❑ Board Origin must be in left bottom corner of outline.

Design For Testing (DFT) :

❑ Test Point Size should be followed as per the customer requirements.

❑ Distance between the centers of two TPs should be at least 75 mils Minimum.
❑ Test Point -to- Component Outline/Copper/Via, Clearance should be followed as
per the customer requirements.

74
 Placement Guidelines
Placement have to be done based on below criteria
❑ Connectors/Socket/IC placement as per Mechanical Specification.
❑ Mounting hole placement as per Mechanical Specification.
❑ Component Keep out Area with Height restrictions.
❑ Trace/Via - Keep out Area as per Mechanical Specification.
❑ Placement with respect to Bus signal routing.
❑ Placement with respect to Critical signal routing.
❑ Placement with respect to Power plane cut.
❑ Decaps Placement - Closer to the power pin.
❑ Decaps Placement - Uniform Sharing
❑ Placement for Power routing and Topology
❑ Crystal and Oscillator placement - Along with Discrete's
❑ Bulk Cap Placement
❑ Placement as per Layout Guidelines
❑ Placement instructions as given in the Schematics
❑ Any Special Layout guideline from Vendors

Guideline
❑ Component Placement is the most important aspect in laying out a design.
❑ In PCB design 90% is Placement and 10% is routing.
❑ Good component placement makes layout job easier and give the best electrical
performance.

75
 Constraints
There are two levels of detail for Design rules

❑ Standard Rules (Default )

❑ Extended Rules.

❑ Standard Rules (Default ):

By default all nets in the database belong to Default rule set, which we define
using the standard values command.

76
 Constraints

❑ Extended Rules:
As the design becomes more complex , you need to be more specific about which
nets require special consideration and differentiate their requirements from the
default rules.

77
 Routing
ROUTING:
The Routing Process turns those various net connections into copper traces
which connects parts in physical prototype with current carrying connections.

Before starting the routing, make sure the following guidelines

❑ Decaps & Bulk dropping (Use Power via of size 24 mil drill & 40 mil pad)
❑ Fanout of SMD Pins (Use Micro via of size 12mil drill & 24 mil pad)
❑ Make sure All Ferrite beads have at least 2 Power via attached to it.
❑ Series Termination are placed at right place & can be routed within 500
mils length
❑ Differential Pair Placement is such that, the traces can be routed
together till the end of traces.
❑ Power Sections are placed properly & adequate copper shape & stitching
vias are provided wrt to the current rating.
❑ Power plane are cut properly, validate the trunck width & no placement
changes are required
❑ Constraints are set properly

VVDN/ TI
Confidentia
78 l
 Silkscreen

❑ Silkscreen is the arrangement of Reference designators of all

components.

❑ Silkscreen should be done after completion of routing & DRC cleanup to

avoid re-work.

❑ Use Text block sizes as mentioned in the Layout Checklist. Use 5 mils
grid preferably.

❑ Enable the following class/Subclass while arranging the silkscreen

VVDN/ TI
Confidentia
80 l
 Silkscreen
Orientation of Arrangement:
If Ref des can’t place near to component,
• Group it and place in the free area.
• Then we can mention marking and drawing rectangle

VVDN/ TI
Confidentia
81 l
82
DRC (Design Rule Check)
Definition: DRC is a process in the design of printed circuit boards (PCBs) or semiconductor layouts where automated tools verify that the design adheres to the specific manufacturing rules and
guidelines.

Purpose:

Ensure Manufacturability: It ensures that the layout design can be manufactured reliably.
Catch Errors Early: Identifies violations of spacing, layer usage, width, and other layout rules before production.
Prevent Costly Redesigns: Helps avoid manufacturing defects that could result in production delays or increased costs.
Typical Checks in DRC:

Minimum spacing between traces.

Minimum trace width.
Clearance between pads, vias, or other components.
Overlap of design elements with designated boundaries.
DFM (Design for Manufacturability)
Definition: DFM is the practice of designing products in such a way that they are easy to manufacture with high yield and low cost.

Purpose:
Thank
Optimize Production: Ensures the design is compatible with the capabilities and limitations of the manufacturing process.
Improve Yield: Reduces manufacturing defects and increases production success rates.
Lower Costs: Reduces waste, simplifies the manufacturing process, and avoids unnecessary complexity.
Typical DFM Considerations:

Component placement: Avoiding conflicts or misalignment.

Solder mask design: Ensuring correct application and spacing.
Trace routing: Minimizing complexity for fabrication.
You
Material selection: Ensuring compatibility with manufacturing processes.
Layer stackup: Optimizing the number and arrangement of layers for cost and performance.
Why Are These Tests Done?
Prevent Errors: DRC and DFM identify potential problems before manufacturing begins.
Save Time and Money: Early error detection avoids costly rework, delays, or product recalls.
Ensure Quality: These processes ensure that the final product meets functional and reliability standards.
Compliance with Standards: Helps meet industry or company-specific manufacturing guidelines.
Improve Efficiency: Streamlines communication between the design team and manufacturers.

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