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VLSI DESIGN May 2024

The document outlines the examination structure for VLSI Design for III B. Tech II Semester students, detailing various units and questions related to CMOS fabrication, inverter characteristics, and amplifier stages. Each unit contains multiple questions that students must answer, focusing on theoretical concepts and practical applications in electronics and communication engineering. The examination is set for May/June 2024, with a maximum score of 70 marks.

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Eswar
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0% found this document useful (0 votes)
57 views7 pages

VLSI DESIGN May 2024

The document outlines the examination structure for VLSI Design for III B. Tech II Semester students, detailing various units and questions related to CMOS fabrication, inverter characteristics, and amplifier stages. Each unit contains multiple questions that students must answer, focusing on theoretical concepts and practical applications in electronics and communication engineering. The examination is set for May/June 2024, with a maximum score of 70 marks.

Uploaded by

Eswar
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 7

Code No: R2032042 R20 SET -1

III B. Tech II Semester Regular/Supplementary Examinations, May/June -2024


VLSI DESIGN
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Answer any FIVE Questions ONE Question from Each unit
All Questions Carry Equal Marks
*****
UNIT-I
1. a) Derive the CMOS inverter DC characteristics and obtain the relationship for [7M]
output voltage at different region in the transfer characteristics.
b) For a CMOS inverter calculates the shift in transfer characteristic curve when [7M]
βn/βp ratio is varied from 1/1 to 10/1.
(OR)
2. a) Derive the equations for Ids of an n-channel enhancement MOSFET operating [7M]
in Non-saturated region and saturated region?
b) Draw the circuit for nMOS inverter and explain the transfer characteristic using [7M]
necessary equations, and the different regions in the characteristics.
UNIT-II
3. a) List out the scaling factors for the different device parameters in terms of [7M]
different scaling models?
b) Calculate the ON resistance from VDD to GND for the nMOS and CMOS [7M]
inverter circuits.
(OR)
4. a) Explain the model for derivation of time delay? [7M]
b) Discuss the limits of scaling. Why scaling is necessary for VLSI circuits? [7M]
UNIT-III
5. a) Draw and explain the circuit diagram for common source amplifier and also [7M]
construct input-output characteristics for the same?
b) How do we maximize the voltage gain of a common-source stage? Explain [7M]
(OR)
6. a) Draw the small-signal equivalent circuit of diode connected MOSFET and [7M]
measure the equivalent resistance?
b) Calculate the output resistance of a simple current mirror. [7M]
UNIT-IV
7. a) Explain the different approaches used to reduce delays in large fan-in circuits? [7M]
b) Draw the basic structure of a dynamic CMOS gate and explain the same? [7M]
(OR)
8. a) Explain about pass transistor logic. [7M]
b) Draw and explain about SR Master slave register. [7M]
UNIT-V
9. a) Write down the step by step approach of FPGA design process on XILINX [7M]
environment?
b) Draw and explain the basic architecture of FPGA? [7M]
(OR)
10. a) Write about Drain Induced Barrier Lowering effect in nMOS transistor? [7M]
Explain with neat sketch.
b) List out the advantages and disadvantages of metal gate technology? [7M]
1 of 1

|'''|'|'|''||'''||||
Code No: R203105O
R2031011
R2031351
R203135A
R203147A
R203147C
P2031051
R2032042 R20 SET
SET
RA--22

III B. Tech II Semester Regular/Supplementary Examinations, May/June -2024


VLSI DESIGN
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Answer any FIVE Questions ONE Question from Each unit
All Questions Carry Equal Marks
*****
UNIT-I
1. a) Explain in detail the p-well process for CMOS fabrication indicating the masks [7M]
used.
b) Tabulate the comparisons between n-well and p-well CMOS fabrication [7M]
processes?
(OR)
2. a) What is a stick diagram? Draw the stick diagram and layout for a CMOS [7M]
inverter?
b) Explain the different types of design rules and give some examples. [7M]
UNIT-II
3. a) What is sheet resistance? Derive the Expression for RS? [7M]
b) Two nMOS inverters are cascaded to drive a capacitive load CL = 16 Cg. [7M]
Calculate the pair delay in turns of τ for the inverter indicated in the figure
below. What are the ratios of each inverter?

Inverter 1 Inverter 2

LPU = 16 λ LPU = 2 λ
WPU = 2 λ WPU = 2 λ
LPd = 2 λ LPd = 2 λ
WPd = 2 λ WPd = 8 λ
(OR)
4. a) What is the problem of driving large capacitive loads? Explain a method to [7M]
drive such load.
b) Briefly discuss about the scaling limits on logic levels and supply voltage due [7M]
to noise?
UNIT-III
5. a) Draw the small-signal model for the MOS transistor. Briefly explain each [7M]
component in that?
b) Choose values of VGS = 1,2,3,4 and 5V, assume that the channel modulation [7M]
parameter is zero. Sketch to scale the output characteristics of an enhancement
n-channel device if VT = 0.7V and ID = 500µA when VGS = 5 Vin saturation.
(OR)
6. a) Derive the voltage gain equation for common source amplifier at high [7M]
frequencies.
b) Write short notes on current sinks and sources? [7M]
1 of 2
|'''|'|'|''||'''||||
Code No: R2032042
R2031011
R2031351
R203135A
R203147A
R203147C
R203105O
P2031051 R20 SET
SET
RA--22

UNIT-IV
7. a) Draw the basic one-transistor storage cell with cross-coupled latch sense [7M]
amplifier and explain the operation with suitable timing diagrams?
b) With EX-OR gate as an example explain about static and dynamic logics. [7M]
(OR)
8. a) Implement 4-input NAND gate using CPL and also construct the layout [7M]
diagram for the same?
b) With suitable diagrams explain how switch logic can be implemented using [7M]
Pass Transistors and transmission gates?
UNIT-V
9. a) Give the steps in FPGA design flow with flow diagram and briefly discuss [7M]
about each step.
b) List out the various FPGA Boards and software tools required for digital [7M]
system design?
(OR)
10. a) How does surface scattering affect the mobility of electrons in MOSFET? [7M]
Explain with neat diagram.
b) What is tunneling field effect transistor (TFET)? What are the advantages of [7M]
using a TFET transistor?

2 of 2

|'''|'|'|''||'''||||
Code No: R203105O
R2031351
R203135A
R203147A
R203147C
P2031051
R2032042
R2031011 R20 SET
SET
RA--32

III B. Tech II Semester Regular/Supplementary Examinations, May/June -2024


VLSI DESIGN
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Answer any FIVE Questions ONE Question from Each unit
All Questions Carry Equal Marks
*****

UNIT-I
1. a) Explain the steps in twin-tub process of CMOS fabrication with suitable sketch. [7M]
b) Tabulate the encoding scheme for a simple single metal nMOS process with [7M]
respect to various MOS layers.
(OR)
2. a) Give the design rules for the following cases with neat sketches [7M]
i) Polysilicon – polysilicon ii) n-type diffusion – n-type diffusion
iii) n-type diffusion – p-type diffusion iv) metal 1 – metal 2.
b) Show that the switching speed of an enhancement MOSFET varies inversely as [7M]
the square of the channel length?
UNIT-II
3. a) What is inverter delay? How delay is calculated for multiple stages. [7M]
b) How does depletion regions around source and drain are affected due to scaling [7M]
down of device dimensions? Explain
(OR)
4. a) Explain about the constraints in choice of layers. [7M]
b) Derive the expression for propagation delay in the case of cascaded pass [7M]
transistors?
UNIT-III
5. a) With the help of neat circuit diagrams explain about CS stage with source [7M]
degeneration?
b) Derive an expression for transconductance and small-signal voltage gain for [7M]
degenerated CS stage with the help of small-signal equivalent circuit?
(OR)
6. a) What is the need of source follower? Draw and explain the input-output [7M]
characteristics of source follower?
b) List out the comparisons between CS, CG and CD amplifier stages? [7M]
UNIT-IV
7. a) In gate logic compare the geometry aspects between two input nMOS NAND gate [7M]
and CMOS NAND gate?
b) Draw the positive latch using transmission gates and explain the operation? [7M]
(OR)
8. a) Explain about Domino CMOS logic. Draw the Domino structure for AND and OR [7M]
gates?
b) Draw the schematic circuit of a SR flip flop with negative edge triggering using [7M]
NAND gates. Give its truth table and explain its operation?

1 of 2

|'''|'|'|''||'''||||
Code No: R2032042
R2031011
R2031351
R203135A
R203147A
R203147C
R203105O
P2031051 R20 SET
SET
RA--32

UNIT-V
9. a) What are FPGAs? Explain about the principle and operation of FPGAs. What are its [7M]
applications?
b) List out the important features of Altera Flex 8000FPGA? [7M]
(OR)
10. a) With the help of neat diagram explain about impact ionization? [7M]
b) What is giga-scale integration (GSI)? How does the gate delay scale down with [7M]
improvement of semiconductor technology?

2 of 2

|'''|'|'|''||'''||||
Code No: R2031011
R2031351
R203135A
R203147A
R203147C
R203105O
P2031051
R2032042 R20 SET
SET
RA--42

III B. Tech II Semester Regular/Supplementary Examinations, May/June -2024


VLSI DESIGN
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 70
Answer any FIVE Questions ONE Question from Each unit
All Questions Carry Equal Marks
*****

UNIT-I
1. a) With neat circuit diagram and transfer characteristics explain the operation of [7M]
CMOS inverter?
b) Draw the schematic, layout and stick diagram for two input nMOS NAND [7M]
gates?
(OR)
2. a) Discuss the alternative forms of pull-up for an inverter circuit. Compare the [7M]
relative merits of three different forms of pull-ups?
b) Draw the nMOS inverter circuit and determine the pull-up to pull-down ratio of [7M]
an nMOS inverter driven by another nMOS inverter?
UNIT-II
3. a) Why scaling is required? Write the scaling factors for different types of device [7M]
parameters?
b) Write notes on sheet resistance concept and its applications. [7M]
(OR)
4. a) Explain the issues involved in driving large capacitor loads in VLSI circuit [7M]
regions?
b) Derive the expressions for rise time and fall time in the case of CMOS inverter. [7M]
UNIT-III
5. a) Explain the small signal model for common source stage and sketch the drain [7M]
current and trans conductance of transistor as a function of the input voltage?
b) Explain briefly about body bias effect with neat diagrams? [7M]
(OR)
6. a) Briefly discuss about CS stage with diode connected load and also draw the [7M]
input-output characteristics?
b) List out the applications of CS, CG and CD amplifier stages? [7M]
UNIT-IV
7. a) What is level restoration? Explain the level restoring circuit with the help of [7M]
neat sketch?
b) What are the advantages and disadvantages of dynamic logic? Explain. [7M]
(OR)
8. a) Draw the Master-slave positive edge-triggered register using multiplexers and [7M]
explain the operation?
b) What is pipelining? Explain the operation of two-phase pipelined circuit using [7M]
dynamic registers?

1 of 2

|'''|'|'|''||'''||||
Code No: R2032042
R2031011
R2031351
R203135A
R203147A
R203147C
R203105O
P2031051 R20 SET
SET
RA--42

UNIT-V
9. a) Explain the following terms: [7M]
i) LUT ii) CLB iii) IOB iv) Switch matrix
b) List out the different FPGA families. Explain how they are differing. [7M]
(OR)
10. a) Briefly discuss about velocity saturation effects in a Short Channel Si- [7M]
MOSFET?
b) What is a FinFET? What are the differences between FinFET and a multi-gate [7M]
transistor?

2 of 2

|'''|'|'|''||'''||||

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