SEMICONDUCTOR TECHNICAL DATA

     
   
  " !# #

The MC10H350 is a member of Motorola’s 10H family of high performance

ECL logic. It consists of 4 translators with differential inputs and TTL outputs. L SUFFIX
The 3–state outputs can be disabled by applying a HIGH TTL logic level on the CERAMIC PACKAGE
common OE input. CASE 620–10
The MC10H350 is designed to be used primarily in systems incorporating
both ECL and TTL logic operating off a common power supply. The separate P SUFFIX
VCC power pins are not connected internally and thus isolate the noisy TTL VCC PLASTIC PACKAGE
CASE 648–08
runs from the relatively quiet ECL VCC runs on the printed circuit board. The
differential inputs allow the H350 to be used as an inverting or noninverting FN SUFFIX
translator, or a differential line receiver. The H350 can also drive CMOS with the PLCC
CASE 775–02
addition of a pullup resistor.
• Propagation Delay, 3.5 ns Typical • MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit LOGIC DIAGRAM
Power Supply (VEE = Gnd) VCC 7.0 Vdc 9
Operating Temperature Range TA 0 to +75 °C
Storage Temperature Range — Plastic Tstg –55 to +150 °C
3
— Ceramic –55 to +165 °C 2
4
ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ±5%) (See Note 1)
TA = 0°C to 75°C 5
7
Characteristic Symbol Min Max Unit 6
Power Supply Current TTL ICC — 20 mA
ECL — 12 11
10
Input Current High Pin 9 IIH — 20 µA 12
Others IINH — 50
Input Current Low Pin 9 IIL — –0.6 mA 13
Others IINL — 50 µA 15
14
Input Voltage High Pin 9 VIH 2.0 — Vdc
VCC (+5.0 VDC) = PINS 1 AND 16
Input Voltage Low Pin 9 VIL — 0.8 Vdc
GND = PIN 8
Differential Input Voltage (1) VDIFF 350 — mV
Pins 3–6, 11–14 (1)
Voltage Common Mode VCM 2.8 VCC Vdc DIP
Pins 3–6, 11–14
PIN ASSIGNMENT
Output Voltage High VOH 2.7 — Vdc
IOH = 3.0 mA
Output Voltage Low VOL — 0.5 Vdc ECL VCC 1 16 TTL VCC
IOL = 20 mA
AOUT 2 15 COUT
Short Circuit Current IOS –60 –150 mA
VOUT = 0 V CIN
AIN 3 14
Output Disable Current High IOZH — 50 µA
VOUT = 2.7 V AIN 4 13 CIN
Output Disable Current Low IOZL — –50 µA
BIN 5 12 DIN
VOUT = 0.5 V
(1) Common mode input voltage to pins 3–4, 5–6, 11–12, 13–14 must be between the values of 2.8 BIN 6 11 DIN
V and 5.0 V. This common mode input voltage range includes the differential input swing.
(2) For single ended use, apply 3.75 V (VBB) to either input depending on output polarity required. BOUT DOUT
Signal level range to other input is 3.3 V to 4.2 V.
7 10
(3) Any unused gates should have the inverting inputs tied to VCC and the non–inverting inputs tied
to ground to prevent output glitching. GND 8 9 OE
(4) 1.0 V to 2.0 V w/50 pF into 500 ohms.
*Positive Emitter Coupled Logic
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).

9/96

 Motorola, Inc. 1996 2–57 REV 6

MC10H350

ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ±5%) (See Notes 1 & 4)

TA = 0°C to 75°C
Characteristic Symbol Min Max Unit

AC PARAMETERS (CL = 50 pF) (VCC = 5.0 ± 5%) (TA = 0°C to 75°C)

Propagation Delay tpd 1.5 5.0 ns
Data
Rise Time tr 0.3 1.6 ns
Fall Time tf 0.3 1.6 ns
Output Disable Time tpdLZ 2.0 6.0 ns
tpdHZ 2.0 6.0
Output Enable Time tpdZL 2.0 8.0 ns
tpdZH 2.0 8.0

3–STATE SWITCHING WAVEFORMS

3–STATE OUTPUT LOW ENABLE AND 3–STATE OUTPUT HIGH ENABLE AND
DISABLE TIMES DISABLE TIMES
OE OE

1.5 V 1.5 V 1.5 V 1.5 V

TPZL TPLZ TPZH TPHZ

VOUT 1.5 V
Q VOH ≈ 3.5 V
1.5 V
VOUT
VOL
0.3 V

0.3 V

TEST LOAD

+7.0 V OPEN

TPZL, TPLZ, O, C, ALL OTHER

500 Ω
D.U.T
.

50 PF 500 Ω

*INCLUDES JIG AND PROBE CAPACITANCE

Application Note: Pin 9 is an OE and the 10H350 is disabled when OE is at VIH or higher.

MOTOROLA 2–58 MECL Data

DL122 — Rev 6
 MC10H350

OUTLINE DIMENSIONS

FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C

B 0.007 (0.180) M T L–M S N S

–N– Y BRK 0.007 (0.180) M T L–M S N S

U
D
–L– –M– Z

D
20 1
X G1 0.010 (0.250) S T L–M S N S

V VIEW D–D

A 0.007 (0.180) M T L–M S N S

Z
R 0.007 (0.180) M T L–M S N S
H 0.007 (0.180) M T L–M S N S

C
E K1

0.004 (0.100) K
G J –T– SEATING
PLANE F 0.007 (0.180) M T L–M S N S
VIEW S
G1 VIEW S
0.010 (0.250) S T L–M S N S

NOTES:
INCHES MILLIMETERS
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC DIM MIN MAX MIN MAX
BODY AT MOLD PARTING LINE. A 0.385 0.395 9.78 10.03
2. DIMENSION G1, TRUE POSITION TO BE B 0.385 0.395 9.78 10.03
MEASURED AT DATUM –T–, SEATING PLANE. C 0.165 0.180 4.20 4.57
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD E 0.090 0.110 2.29 2.79
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) F 0.013 0.019 0.33 0.48
PER SIDE. G 0.050 BSC 1.27 BSC
4. DIMENSIONING AND TOLERANCING PER ANSI H 0.026 0.032 0.66 0.81
Y14.5M, 1982. J 0.020 ––– 0.51 –––
5. CONTROLLING DIMENSION: INCH. K 0.025 ––– 0.64 –––
6. THE PACKAGE TOP MAY BE SMALLER THAN THE R 0.350 0.356 8.89 9.04
PACKAGE BOTTOM BY UP TO 0.012 (0.300). U 0.350 0.356 8.89 9.04
DIMENSIONS R AND U ARE DETERMINED AT THE
V 0.042 0.048 1.07 1.21
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, W 0.042 0.048 1.07 1.21
GATE BURRS AND INTERLEAD FLASH, BUT X 0.042 0.056 1.07 1.42
INCLUDING ANY MISMATCH BETWEEN THE TOP Y ––– 0.020 ––– 0.50
AND BOTTOM OF THE PLASTIC BODY. Z 2_ 10 _ 2_ 10 _
7. DIMENSION H DOES NOT INCLUDE DAMBAR G1 0.310 0.330 7.88 8.38
PROTRUSION OR INTRUSION. THE DAMBAR K1 0.040 ––– 1.02 –––
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

MECL Data 2–59 MOTOROLA

DL122 — Rev 6
MC10H350

OUTLINE DIMENSIONS

L SUFFIX
CERAMIC DIP PACKAGE
–A– CASE 620–10
NOTES:
ISSUE V 1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
16 9
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
–B– FORMED PARALLEL.
1 8 4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
C L BODY.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
–T– C ––– 0.200 ––– 5.08
N K D 0.015 0.020 0.39 0.50
SEATING
PLANE E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
E M H 0.008 0.015 0.21 0.38
F K 0.125 0.170 3.18 4.31
G J 16 PL
L 0.300 BSC 7.62 BSC
D 16 PL 0.25 (0.010) M T B S M 0_ 15 _ 0_ 15 _
N 0.020 0.040 0.51 1.01
0.25 (0.010) M T A S

P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R NOTES:
–A– 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F C L A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.70 1.02 1.77
–T– PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
H K M J 0.008 0.015 0.21 0.38
J K 0.110 0.130 2.80 3.30
G L 0.295 0.305 7.50 7.74
D 16 PL
M 0_ 10 _ 0_ 10 _
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01

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*MC10H350/D*
◊ MC10H350/D
MOTOROLA 2–60 MECL Data
DL122 — Rev 6