LMX9838 DS
LMX9838 DS
DESCRIPTION
The Texas Instruments LMX9838 Bluetooth Serial Port module is a fully integrated Bluetooth 2.0 baseband
controller, 2.4 GHz radio, crystal, antenna, LDO and discreets; combined to form a complete small form factor
(10 mm x 17 mm x 2.0 mm) Bluetooth node.
All hardware and firmware is included to provide a complete solution from antenna through the complete lower
and upper layers of the Bluetooth stack, up to the application including the Generic Access Profile (GAP), the
Service Discovery Application Profile (SDAP), and the Serial Port Profile (SPP). The module includes a
configurable service database to fulfil service requests for additional profiles on the host. Moreover, the LMX9838
is qualified as a Bluetooth endproduct, ready to be used in the end application without additional testing and
license cost.
Based on TI’s CompactRISC™ 16-bit processor architecture and Digital Smart Radio technology, the
LMX9838 is optimized to handle the data and link management processing requirements of a Bluetooth node.
The firmware supplied in the on-chip ROM memory offers a complete Bluetooth (v2.0) stack including profiles
and command interface. This firmware features point-to-point and point-to-multipoint link management supporting
data rates up to the theoretical maximum over RFComm of 704 kbps. The internal memory supports up to 7
active Bluetooth data links and one active SCO link.
The on-chip Patch RAM provided for lowest cost and risk, allows the flexibility of firmware upgrade.
The module is lead free and RoHS (Restriction of Hazardous Substances) compliant.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 CompactRISC is a trademark of Texas Instruments.
3 Bluetooth is a registered trademark of Bluetooth SIG, Inc. and is used under license by Texas Instruments.
4 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMX9838
SNOSAZ9C – JULY 2007 – REVISED FEBRUARY 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PG6
GPIO
PG7
Link UART
Antenna
Manager Transport
TXD
RXD
UART RTS#
CTS#
POR RESET#
32k+
LFO
TM 32 kHz
2.4 GHz BLUEtooth Compact RISC
Radio Core Processor 32k-
Config OP3
Options OP4/PG4
OP5
Combined SCLK
Voltage ROM CVSD Audio SF
XTAL System and
Regulator EPROM Codecs Port STD
Patch RAM
SRD
Applications
• Telemedicine/Medical, Industrial and Scientific
• Personal Digital Assistants
• POS Terminals
• Data Logging Systems
• Audio Gateway applications
Device Details
HARDWARE
• Baseband and Link Management processors based on TI’s CompactRISC Core
• Embedded ROM and Patch RAM memory
• Auxiliary Host Interface Ports:
– Link Status
– Transceiver Status (Tx or Rx)
• Advanced Power Management (APM) features
• Supports low-power mode with optional 32.768 kHz oscillator
• Full Radio path integrated including antenna
• On-chip reference crystal for Bluetooth operation
• Single supply voltage
FIRMWARE
• Additional Profile support on Host. e.g:
– Dial Up Networking (DUN)
– Facsimile Profile (FAX)
– File Transfer Protocol (FTP)
COMPLIANCE
• FCC compliance: The device complies with Part 15 of FCC Rules. Operation is subject to the following two
conditions:
– This device may not cause harmful interference
– This device must accept any interference received, including interference that may cause undesired
operation
PACKAGE
• Complete system interface provided in Lead Grid Array on underside for surface mount assembly
Connection Diagram
Pad Description
(1) Treat As No Connect If RTS is not used. Pad required for mechanical stability.
(2) Connect to GND if CTS is not use.
Application Diagrams
The following diagrams show two application examples for LMX9838 implementations.
Figure 1 illustrates a cable replacement application, requiring the physical UART interface to a data device like a
sensor. The LMX9838 just waits for an incoming link and forwards data between the data device and the
bluetooth link. PG6 acts as active link indicator and is used to enable the data transfer from the sensor. A
32.768khz crystal may be is used to reduce power consumption while waiting for the incoming link.
Figure 2 shows an example for the connection to a host controller, which can include a simple application to
control the LMX9838. The figure also includes the connection to a PCM codec, in case the host controller
application includes an audio profile. Reset, OP4 and OP5 are controlled by the host for full control of the
LMX9838 status.
Please refer to Application Notes for more detailed descriptions for LMX9838 designs.
330:
1 k: 1 k:
CTS RTS
RTS CTS Data device
RXD TXD with Sensor
TXD RXD
LMX9838
PG6 EN
RESET#
22 pF 22 pF
330: 330:
1 k:
CTS RTS
RTS CTS
RXD TXD
TXD RXD
LMX9838 Host
RESET# GPIO1
Controller
OP5 GPIO2
OP4 GPIO3
SCLK SFS STD SRD
Audio Codec
Figure 2. Example For Host Controller Based Application With Audio Support
General Specifications
Absolute Maximum Ratings (see Table 6 ) indicate limits beyond which damage to the device may occur.
Operating Ratings (see Table 7) indicate conditions for which the device is intended to be functional.
This device is a high performance RF integrated circuit and is ESD sensitive. Handling and assembly of this
device should be performed at ESD free workstations.
The following conditions are true unless otherwise stated in the tables below:
• TA = -40°C to +85°C
• VCC = 3.3V
• RF system performance specifications are guaranteed on Texas Instruments FlagStaff board rev 2.1
evaluation platform.
(1) (2)
Table 8. Power Supply Requirements
Typ
Symbol Parameter Min (3) Max Unit
DC CHARACTERISTICS
RF PERFORMANCE CHARACTERISTICS
In the performance characteristics tables the following applies:
• All tests performed are based on Bluetooth Test Specification revision 2.0
• All tests are measured at antenna port unless otherwise specified
• TA = -40°C to +85°C
• VDD_RF = 2.8V unless otherwise specified
RF system performance specifications are guaranteed on Texas Instruments Flagstaff board rev 2.1
evaluation platform.
RXsense Receive Sensitivity BER < 0.001 2.402 GHz -80 -76 dBm
2.441 GHz -80 -76 dBm
2.480 GHz -80 -76 dBm
PinRF Maximum Input Level -10 0 dBm
IMP Intermodulation Performance F1= + 3 MHz, -38 -36 dBm
(2)
F2= + 6 MHz,
PinRF = -64 dBm
RSSI RSSI Dynamic Range at LNA -72 -52 dBm
Input
OOB Out Of Band Blocking PinRF = -10 dBm, -10 dBm
(3)
Performance 30 MHz < FCWI < 2 GHz,
BER < 0.001
PinRF = -27 dBm, -27 dBm
2000 MHz < FCWI < 2399 MHz,
BER < 0.001
PinRF = -27 dBm, -27 dBm
2498 MHz < FCWI < 3000 MHz,
BER < 0.001
PinRF = -10 dBm, -10 dBm
3000 MHz < FCWI < 12.75 GHz,
BER < 0.001
(1) Typical operating conditions are at 2.75V operating voltage and 25°C ambient temperature.
(2) The f0 = -64 dBm Bluetooth modulated signal, f1 = -39dbm sine wave, f2 = -39 dBm Bluetooth modulated signal, f0 = 2f1 - f2, and |f2 - f1|
= n * 1MHz, where n is 3, 4, or 5. For the typical case, n = 3.
(3) The f0 = -64 dBm Bluetooth modulated signal, f1 = -39dbm sine wave, f2 = -39 dBm Bluetooth modulated signal, f0 = 2f1 - f2, and |f2 - f1|
= n * 1MHz, where n is 3, 4, or 5. For the typical case, n = 3.
(1) Typical operating conditions are at 2.75V operating voltage and 25°C ambient temperature.
(2) ΔF2max ≥ 115 kHz for at least 99.9% of all Δf2max.
(3) Modulation index set between 0.28 and 0.35.
(4) Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel.
(5) Not tested in production.
(1) Frequency accuracy is dependent on crystal oscillator chosen. The crystal must have a cumulative accuracy of < +/-20ppm to meet
Bluetooth specifications.
NOTE
All RF parameters are tested prior to the antenna.
Functional Description
Profile Support
The on-chip application of the LMX9838 allows full stand-alone operation, without any Bluetooth protocol layer
necessary outside the module. It supports the Generic Access Profile (GAP), the Service Discovery Application
Profile (SDAP), and the Serial Port Profile (SPP).
The on-chip profiles can be used as interfaces to additional profiles executed on the host. The LMX9838 includes
a configurable service database to answer requests with the profiles supported.
Memory
The LMX9838 introduces 16 kB of combined system and Patch RAM memory that can be used for data and/or
code upgrades of the ROM based firmware. Due to the flexible startup used for the LMX9838 operating
parameters like the Bluetooth Device Address (BD_ADDR) are defined during boot time. This allows reading out
the parameters of an internal EEPROM or programming them directly over UART.
AUDIO PORT
(1) In PCM slave mode, parameters are stored in NVS. Bit clock and frame clock must be generated by the host interface.
PCM slave configuration example: PCM slave uses the slot 0, 1 slot per frame, 16 bit linear mode, long frame
sync, normal frame sync. In this case, 0x03E0 should be stored in NVS. See “LMX9838 Software Users Guide”
for more details.
AUXILIARY PORTS
RESET#
The RESET# is active low and will put radio and baseband into reset.
Power Up
The LMX9838 contains an internal EEPROM initialized during power up or hardware reset. During this
initialization phase it is recommended not to:
• Send a command to the LMX9838: The command will be ignored.
• Issue a Hardware Reset: The EEPROM initialization phase will be interrupted and the EEPROM will not be
recognized which leaves the device in a lockup situation.
Once the initialization phase is completed the module sends the “SimplyBlue Ready Event” (refer to the
LMX9838 Software User's Guide, AN-1699) to declare its fully functional state.
It is therefore recommended to wait for the “SimplyBlue Ready Event” message before starting using the
LM9838 by sending a command or issuing a Reset or Power On cycle.
FUNCTIONAL DESCRIPTION
The integrated Digital Smart Radio utilizes a heterodyne receiver architecture with a low intermediate frequency
(2 MHz) such that the intermediate frequency filters can be integrated on chip. The receiver consists of a low-
noise amplifier (LNA) followed by two mixers. The intermediate frequency signal processing blocks consist of a
poly-phase bandpass filter (BPF), two hard-limiters (LIM), a frequency discriminator (DET), and a post-detection
filter (PDF). The received signal level is detected by a received signal strength indicator (RSSI).
The received frequency equals the local oscillator frequency (fLO) plus the intermediate frequency (fIF):
fRF = fLO + fIF (supradyne).
The radio includes a synthesizer consisting of a phase detector, a charge pump, an (off-chip) loop-filter, an RF-
frequency divider, and a voltage controlled oscillator (VCO).
The transmitter utilizes IQ-modulation with bit-stream data that is gaussian filtered. Other blocks included in the
transmitter are a VCO buffer and a power amplifier (PA).
RECEIVER FRONT-END
The receiver front-end consists of a low-noise amplifier (LNA) followed by two mixers and two low-pass filters for
the I- and Q-channels.
The intermediate frequency (IF) part of the receiver front-end consists of two IF amplifiers that receive input
signals from the mixers, delivering balanced I- and Q-signals to the poly-phase bandpass filter. The poly-phase
bandpass filter is directly followed by two hard-limiters that together generate an AD-converted RSSI signal.
RECEIVER BACK-END
The hard-limiters are followed by a two frequency discriminators. The I-frequency discriminator uses the 90×
phase-shifted signal from the Q-path, while the Q-discriminator uses the 90× phase-shifted signal from the I-path.
A poly-phase bandpass filter performs the required phase shifting. The output signals of the I- and Q-
discriminator are substracted and filtered by a low-pass filter. An equalizer is added to improve the eye-pattern
for 101010 patterns.
After equalization, a dynamic AFC (automatic frequency offset compensation) circuit and slicer extract the
RX_DATA from the analog data pattern. It is expected that the Eb/No of the demodulator is approximately 17 dB.
Frequency Discriminator
The frequency discriminator gets its input signals from the limiter. A defined signal level (independent of the
power supply voltage) is needed to obtain the input signal. Both inputs of the frequency discriminator have
limiting circuits to optimize performance. The bandpass filter in the frequency discriminator is tuned by the
autotuning circuitry.
AUTOTUNING CIRCUITRY
The autotuning circuitry is used for tuning the bandpass filter, the detector, the post-detection filter, the equalizer,
and the transmit filters for process and temperature variations. The circuit also includes an offset compensation
for the FM detector.
SYNTHESIZER
The synthesizer consists of a phase-frequency detector, a charge pump, a low-pass loop filter, a programmable
frequency divider, a voltage-controlled oscillator (VCO), a delta-sigma modulator, and a lookup table.
The frequency divider consists of a divide-by-2 circuit (divides the 5 GHz signal from the VCO down to 2.5 GHz),
a divide-by-8-or-9 divider, and a digital modulus control. The delta-sigma modulator controls the division ratio and
also generates an input channel value to the lookup table.
Phase-Frequency Detector
The phase-frequency detector is a 5-state phase-detector. It responds only to transitions, hence phase-error is
independent of input waveform duty cycle or amplitude variations. Loop lockup occurs when all the negative
transitions on the inputs, F_REF and F_MOD, coincide. Both outputs (i.e., Up and Down) then remain high. This
is equal to the zero error mode. The phase-frequency detector input frequency range operates at 12 MHz.
TRANSMITTER CIRCUITRY
The transmitter consists of ROM tables, two Digital to Analog (DA) converters, two low-pass filters, IQ mixers,
and a power amplifier (PA).
The ROM tables generate a digital IQ signal based on the transmit data. The output of the ROM tables is
inserted into IQ-DA converters and filtered through two low-pass filters. The two signal components are mixed up
to 2.5 GHz by the TX mixers and added together before being inserted into the transmit PA.
32 kHz Oscillator
An oscillator is provided (see Figure 4) that is tuned to provide optimum performance and low-power
consumption while operating with a 32.768 kHz crystal. An external crystal clock network is required between the
32k+ clock input (pad 27) and the 32k- clock output (pad 28) signals.The oscillator is built in a Pierce
configuration and uses two external capacitors. Table 17 provides the oscillator’s specifications.
In case the 32kHz is not used, it is recommended to leave 32k- open and connect 32k+ to GND.
Integrated Firmware
The LMX9838 includes the full Bluetooth stack up to RFComm to support the following profiles:
• GAP (Generic Access Profile)
• SDAP (Service Discovery Application Profile)
• SPP (Serial Port Profile)
Figure 5 shows the Bluetooth protocol stack with command interpreter interface. The command interpreter offers
a number of different commands to support the functionality given by the different profiles. Execution and
interface timing is handled by the control application.
14 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated
The chip has an internal data area in RAM that includes the parameters shown in Table 18.
FEATURES
Operation Modes
On boot-up, the application configures the module following the parameters in the data area.
Automatic Operation
No Default Connections Stored:
In Automatic Operation the module is connectable and discoverable and automatically answers to service
requests. The command interpreter listens to commands and links can be set up. The full command list is
supported.
If connected by another device, the module sends an event back to the host, where the RFComm port has been
connected, and switches to transparent mode.
Default Connections Stored:
If default connections were stored on a previous session, once the LMX9838 is reset, it will attempt to connect
each device stored within the data RAM three times. The host will be notified about the success of the link setup
via a link status event.
Non-Automatic Operation
In Non-Automatic Operation, the LMX9838 does not check the default connections section within the Data RAM.
If connected by another device, it will NOT switch to transparent mode and continue to interpret data sent on the
UART.
Transparent Mode
The LMX9838 supports transparent data communication from the UART interface to a bluetooth link.
If activated, the module does not interpret the commands on the UART which normally are used to configure and
control the module. The packages don’t need to be formatted as described in Table 20. Instead all data are
directly passed through the firmware to the active bluetooth link and the remote device.
Transparent mode can only be supported on a point-to-point connection. To leave Transparent mode, the host
must send a UART_BREAK signal to the module.
Force Master Mode
In Force Master mode tries to act like an access point for multiple connections. For this it will only accept the link
if a Master/slave role switch is accepted by the connecting device. After successful link establishment the
LMX9838 will be Master and available for additional incoming links. On the first incoming link the LMX9838 will
switch to transparent depending on the setting for automatic or command mode. Additional links will only be
possible if the device is not in transparent mode.
Default Connections
The LMX9838 supports the storage of up to 3 devices within its NVS. Those connections can either be
connected after reset or on demand using a specific command.
Event Filter
The LMX9838 uses events or indicators to notify the host about successful commands or changes at the
bluetooth interface. Depending on the application the LMX9838 can be configured. The following levels are
defined:
• No Events:
– – The LMX9838 is not reporting any events. Optimized for passive cable replacement solutions.
• Standard LMX9838 events:
– – Only necessary events will be reported.
• All events:
– – Additional to the standard all changes at the physical layer will be reported.
Audio Support
The LMX9838 offers commands to establish and release synchronous connections (SCO) to support Headset or
Handsfree applications. The firmware supports one active link with all available package types (HV1, HV2, HV3),
routing the audio data between the bluetooth link and the advanced audio interface. In order to provide the
analog data interface, an external audio codec is required. The LMX9838 includes a list of codecs which can be
used.
POWER MODES
The following LMX9838 power modes, which depend on the activity level of the UART transport layer and the
radio activity are defined:
The radio activity level mainly depends on application requirements and is defined by standard bluetooth
operations like inquiry/page scanning or an active link.
A remote device establishing or disconnecting a link may also indirectly change the radio activity level.
The UART transport layer by default is enabled on device power up. In order to disable the transport layer the
command “Disable Transport Layer” is used. Thus only the Host side command interface can disable the
transport layer. Enabling the transport layer is controlled by the HW Wakeup signalling. This can be done from
either the Host or the LMX9838. See also “LMX9838 Software User’s Guide” for detailed information on timing
and implementation requirements.
Command Interface
The LMX9838 offers Bluetooth functionality in either a self contained slave functionality or over a simple
command interface. The interface is listening on the UART interface.
The following sections describe the protocol transported on the UART interface between the LMX9838 and the
host in command mode (see Figure 8). In Transparent mode, no data framing is necessary and the device does
not listen for commands.
FRAMING
The connection is considered “Error free”. But for packet recognition and synchronization, some framing is used.
All packets sent in both directions are constructed per the model shown in Table 20.
Packet Type ID
This byte identifies the type of packet. See Table 21 for details.
Opcode
The opcode identifies the command to execute. The opcode values can be found within the “LMX9838 Software
User’s Guide” included within the LMX9838 Evaluation Board.
Data Length
Number of bytes in the Packet Data field. The maximum size is defined with 333 data bytes per packet.
Checksum:
This is a simple Block Check Character (BCC) checksum of the bytes “Packet type”, “Opcode” and “Data
Length”. The BCC checksum is calculated as low byte of the sum of all bytes (e.g., if the sum of all bytes is
0x3724, the checksum is 0x24).
NOTE
For standard Bluetooth operation only commands from Table 22 through Table 24 will be
used. Most of the remaining commands are for configuration purposes only.
Application Notes
The different possibilities to power supply the LMX9838 depend on the IO interface logic level.
Figure 9 represents an example of system functional schematic for the LMX9838 using a 3.0V to 3.3V IO
interface.
Figure 10 represents an example of system functional schematic for the LMX9838 using a 2.5V to 3.0V IO
interface.
Figure 11 represents an example of system functional schematic for the LMX9838 using a 1.8V to 2.5V IO
interface.
Figure 12 represents an example of system functional schematic for the LMX9838 using a 1.8V IO interface.
NC 100 nF
2.2 PF 100 nF 2.2 PF 100 nF
2.2 PF
10 9 11 6
VCC VCC_CORE VCC_IO MVCC
Optional 32 kHz
27 12
If not used 32k+ RXD
-32k+ = GND Y1 13
TXD UART System Bus
-32k- = NC 28
32k- 14
RTS Connected to Host
32.768 kHz 15
C2 C1 CTS
LMX9838 RESET#
2
Reset line connected to host
23
SRD
Advanced Audio Interface 22
STD VCC_IO
Connect to PCM codec 21
or leave open SFS
20 1k 1k 1k
SCLK
16 Frequency Baud
All Common OP3 Rate selector
GROUND 26 Settings shown for
OP4
For No Connects Reference 25 921600 BPS
Reference Table 5 Table 5 OP5
For other baudrates
reference Table 7
NC
Notes:
Capacitor values C1 and C2 may vary depending on design and crystal manufacturer specification.
NC 100 nF
2.2 PF 100 nF 2.2 PF 100 nF
2.2 PF
10 9 11 6
VCC VCC_CORE VCC_IO MVCC
Optional 32 kHz
27 12
If not used 32k+ RXD
-32k+ = GND Y1 13 UART System Bus
TXD
-32k- = NC 28 Connected to Host
32k- 14
RTS
32.768 kHz 15
C2 C1 CTS
2
LMX9838 RESET# Reset line connected to host
23
SRD
22
Advanced Audio Interface STD VCC_IO
Connect to PCM codec 21
SFS
or leave open 20 1k 1k 1k
SCLK
16 Frequency Baud
All Common OP3
Rate selector
GROUND 26 Settings shown for
OP4
For No Connects Reference
25 921600 BPS
Reference Table 5 Table 5 OP5
For other baudrates
reference Table 7
NC
Notes:
Capacitor values C1 and C2 may vary depending on design and crystal manufacturer specification.
MVCC can be connected to 3.0V and above in this configuration. Please see Table 7.
1.8V
1.8V ~ 2.5V 3.0V+
2.2 PF 100 nF
100 nF
2.2 PF 100 nF
2.2 PF
10 9 11 6
VCC VCC_CORE VCC_IO MVCC
Optional 32 kHz
27 12
If not used 32k+ RXD
-32k+ = GND Y1 13
TXD UART System Bus
-32k- = NC 28
32k- 14 Connected to Host
RTS
32.768 kHz 15
C2 C1 CTS
2
LMX9838 RESET# Reset line connected to host
23
SRD
Advanced Audio Interface 22
STD VCC_IO
Connect to PCM codec 21
or leave open SFS
20 1k 1k 1k
SCLK
16 Frequency Baud
All Common OP3 Rate selector
GROUND 26 Settings shown for
OP4
For No Connects Reference 921600 BPS
25
Reference Table 5 Table 5 OP5
For other baudrates
reference Table 7
NC
Notes:
Capacitor values C1 and C2 may vary depending on design and crystal manufacturer specification.
MVCC can be connected to 3.0V and above in this configuration. Please see Table 7.
1.8V
1.8V 3.0V+
2.2 PF 100 nF
100 nF
2.2 PF 100 nF
2.2 PF
10 9 11 6
VCC VCC_CORE VCC_IO MVCC
Optional 32 kHz
27 12
If not used 32k+ RXD
-32k+ = GND Y1 13
TXD UART System Bus
-32k- = NC 28
32k- 14 Connected to Host
RTS
32.768 kHz 15
C2 C1 CTS
LMX9838 RESET#
2
Reset line connected to host
23
SRD
Advanced Audio Interface 22
STD VCC_IO
Connect to PCM codec 21
or leave open SFS
20 1k 1k 1k
SCLK
16 Frequency Baud
All Common OP3 Rate selector
GROUND 26 Settings shown for
OP4
For No Connects Reference 921600 BPS
25
Reference Table 5 Table 5 OP5
For other baudrates
reference Table 7
NC
Notes:
Capacitor values C1 and C2 may vary depending on design and crystal manufacturer specification.
MVCC can be connected to 3.0V and above in this configuration. Please see Table 7.
Evaluation Design
J7
BATTHOLDER
TP7 TP6
VCC VCC VCC VCC VCC GND VCC U3 VIN + -
LP3965-3.3V
5 1 1
VOUT VIN J6
R1 R2 R3 R4 R5 4 3 DC-015PBT
1k 1k 1k BYPASS 5V MAX
330R 330R + C12 C9 + C11 C9
2 3 2
1 PF 100 nF GND VEN 1 PF 100 pF
J1 J2 D1 D2
1 1 1 J3 RED BLUE
2 2 2 1 2 1 2
OP3 OP4 OP5 PG6 PG7
U1
LMX9838
45 19
NC PG7 PG7
46 7
NC PG6 PG6
47 25
NC OP5 OP5
48 26
NC OP4/PG4 OP4 VCC C15
49 16 C5 1 PF R15
NC OP3 OP3 22 pF NM
50 44
NC NC C14 C13 U2
51 43 1 PF MAX3225 R13 TP5 TP4 TP3 TP2 TP1
NC NC 1 PF OR
Y1 2 19
52 28 32.768 kHz C6 C1+ VCC
NC 32k- 22 pF 4 17
53 27 C1- T_OUT R16 5
NC 32k+ 5 C2+ 16 NM 9 J8
54 42 R_IN 4 DB9 MALE
NC NC VCC 6 9 8
55 41 C2- R_IN 3
NC NC 13 T_IN
56 40 1 J4 T_OUT 8 7
2
NC NC 12 3 R17 6
23 AUDIO T_IN V+ OR
57 SCLK 2 1
NC SRD 15 7
58 22 STD 3 R_OUT V-
NC STD 10 R_OUT 11
59 21 SFS 4 INVALD
NC SFS 14 1
60 20 SRD 5 FORCEON READY
NC SCLK 20 18
61 39 6 FORCEOFF GND
NC NC
62 38 R6 R7 R8 R9 R10 R11 R12 C17 C16 R14 R18
NC NC OR OR OR OR NM 10k 10k 1 PF 1PF OR NM
63 37
NC NC
64 15
NC CTS#
65 14
NC RTS#
66 13
NC TXD
67 12 VCC
NC RXD
68 36 VCC C4
NC NC 2.2 PF 1 J5
69 35 BAUD RATE SETTINGS
NC NC 2 UART
70 10 C3 JUMPER 921K 115K NVS
NC VCC 100 nF 3
32 11 J1 SHORT SHORT SHORT
GND VCC_IO TXD 4
31 6 C7
GND MVCC VCC_CORE CTS# 5 J2 SHORT SHORT OPEN
2.2 PF
30 34 C2
GND NC 2.2 PF RXD 6
33 J3 SHORT OPEN OPEN
29 C8
GND NC 100 nF RTS# 7
24 8 C1
GND XOSCEN 100 nF TP8 VCC_CORE_IN 8
18 9 RESET
GND VCC_CORE 9
17 5
GND NC
4 2
GND RESET# C18
1 1 J9 S1
3 NM VCC_CORE
GND NC 2 SMA FEMALE SKQTLCE010 J10
3 3 4 1
C19
4 1 PF 1 2 2
5
Soldering
The LMX9838 bumps are designed to melt as part of the Surface Mount Assembly (SMA) process. In order to
ensure reflow of all solder bumps and maximum solder joint reliability while minimizing damage to the package,
recommended reflow profiles should be used.
It is also extremely important to observe MSL level and bake the part before soldering if needed.
Table 35, Table 36 and Figure 13 provide the soldering details required to properly solder the LMX9838 to
standard PCBs. The illustration serves only as a guide and TI is not liable if a selected profile does not
work.
See IPC/JEDEC J-STD-020C, July 2004 for more information.
(1) (2)
Table 36. Classification Reflow Profiles ,
Profile Feature NOPB Assembly
Average Ramp-Up Rate (TsMAX to Tp) 3°C/second maximum
Preheat:
Temperature Min (TsMIN) 150°C
Temperature Max (TsMAX) 200°C
Time (tsMIN to tsMAX) 60 – 180 seconds
Time maintained above:
Temperature (TL) 217°C
Time (tL) 60 – 150 seconds
Peak/Classification Temperature (Tp) 250 + 0°C
Time within 5°C of actual Peak Temperature (tp) 20 – 40 seconds
Ramp-Down Rate 6°C/second maximum
Time 25 °C to Peak Temperature 8 minutes maximum
Reflow Profiles See Figure 13
Regulatory Compliance
The LMX9838 has been tested and approved to be compliant to the following regulatory standards:
CE Compliance:
• EN 300 328 v1.7.1
• EN 301 489-17 v1.2.1
IC Compliance:
• RSS-GEN Issue 1
• RSS-210 Issue 7 Annex 8 and RSS-GEN issue 2
FCC Compliance:
• FCC Part 15 Subpart C
FCC INSTRUCTIONS
(2) l’ utilisateur du dispositif doit étre pret a accepter toute interference radioélectrique reçu, meme si celle-ci est
susceptible de compromettre le fonctionnement du dispositif.
Caution: Exposure to Radio Frequency Radiation.
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit
RF field in excess of Health Canada limits for the general population; consult Safety Code 6, obtainable from
Health Canada’s website www.hc-sc.gc.ca/rpb.
www.ti.com 17-Nov-2012
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Qty Eco Plan Lead/Ball Finish MSL Peak Temp Samples
(1) Drawing (2) (3) (Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Nov-2012
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Nov-2012
Pack Materials-Page 2
MECHANICAL DATA
NAW0070A
SB70A (Rev B)
www.ti.com
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