Power Components
Power Components
Among all the static switching devices used in power electronics, the power diode is
perhaps the simplest. Its circuit symbol shown in Figure 1.3 (a), is a two-terminal
device involves the anode terminal (A) and the cathode terminal (K).
Both forward voltage drop and leakage current are ignored in an ideal diode. In power
electronic applications, a diode is usually considered to be an ideal static switch
(Figure 1.3 (c).
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(a)
(b) (c)
When the applied voltage across the DIAC increases above the avalanche breakdown
voltage, only then it can conduct. However, when the voltage across DIAC decreases
below its avalanche breakdown voltage it will be turned OFF.
The DIAC symbol is a combination of two diodes in parallel with each other but
connected in opposite directions. DIACs have no gate terminal, unlike some other
thyristors that they are commonly used to trigger, such as TRIACs.
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Thyristors are capable of handling large blocking voltages and large currents for use
in high-power applications, but their frequency capabilities are not very high, being
lowerthan 10 kHz.
If positive voltage is applied without gate current, the thyristor constitutes the state of
forward blocking. A low-power pulse of gate current switches the thyristor to the ON
state. The output characteristic of a conducting thyristor in the forward bias is similar
to the characteristic of the diode with a small leakage current. Thus, the thyristor
assumes very low resistance in the forward direction. Once turned on.
The thyristor remains in this state after the end of the gate pulse if its current is higher
than the latching value. If the current drops below the holding value, the device
switches back to the non-conducting region. Switching off by gate pulse is impossible.
Therefore, using the samearguments as for diodes, the thyristor can be represented by
the idealized switch.
The output characteristic of SCR in the reverse bias is similar to the characteristic of
the diode with a small leakage current. With negative voltage between anode and
cathode, this corresponds to the reverse blocking state. If the maximum reverse
voltage exceeds the permissible value, the leakage current rises rapidly, as with
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diodes, leading to breakdown and thermal destruction of the thyristor. Figure 1.4 (a)
and (b) illustrate the SCR symbol and its practical characteristics, respectively.
TRIACs differ from SCRs in that they allow current flow in both directions, whereas
an SCR can only conduct current in a single direction. Most TRIACs can be triggered
by applying either a positive or negative voltage to the gate (an SCR requires a
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positive voltage).
As the TRIAC can conduct in both the directions, the terms “anode” and “cathode”
arenot used for TRIACs. The three terminals are marked as MT1 (Main Terminal 1),
MT2 (Main Terminal 2) and G (Gate Terminal). Figure 1.5 (a) shows the TRIAC
symbol.
The conduction of a TRIAC is initiated by injecting a current pulse into the gate
terminal. The TRIAC turns off only when the current through the main terminals
become zero.
To understand how TRIACs work, consider the triggering in each of the four
quadrants.The four quadrants are illustrated in Figure 1.5 (b). They are depending on
the gate andMT2 voltages with respect to MT1, as given below.
• Quadrant 1 operation occurs when the gate and MT2 are positive with
respect to MT1.
• Quadrant 2 operation occurs when the gate is negative and MT2 is positive
with respect to MT1.
• Quadrant 3 operation occurs when the gate and MT2 are negative with
respect to MT1.
• Quadrant 4 operation occurs when the gate is positive and MT2 is negative
with respect to MT1.
In almost all applications, both gate and MT2 positive or negative against MT1, so
quadrants 1 and 3 are the only operating modes. Figure 1.5 (c) illustrates the TRIAC
charecterstics.
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Figure 1.5: (a) TRIAC symbol, (b) Quadrant diagram, and (c) Practical characteristics.
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GTO is a special type of thyristor, which provides more control. As opposed to normal
thyristors, GTOs are fully controllable switches which can be turned ON and OFF by
switching the polarity of the gate signal.
The GTO thyristor turns ON similarly to the SCR thyristor, i.e. after a current pulse
is applied to the gate terminal. To turn it OFF, a powerful negative current control
pulse must be applied to the gate terminal.
Figure 1.6 (a) and (b) illustrate the GTO symbol and its practical characteristics,
respectively.
The MCT has many of the properties of a GTO thyristor, including a low voltage drop
at high current. Nevertheless, it is a voltage-controlled device. Here, turning ON is
controlled by applying a positive voltage signal to the gate, and turning OFF by a
negative voltage. Therefore, the MCT has two principle advantages over the GTO,
including much simpler drive requirements (voltage instead of current) and faster
switching speeds (few microseconds).
The power BJT has three terminals, Collector (C), Emitter (E) and Base (B), as shown
in Figure 1.7 (a). BJT is a current-controlled device. The Base (B) is connected to the
control signal, while the power terminals are the Collector (C) and the Emitter (E).
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three regions as shown in
Figure 1.7 (b). However, the only two regionsthat are used in power electronics are,
the on-state region where VCE is less than VCE(Sat) and the off-state region where
IB= 0. Neglecting the middle region, the idealized device characteristics as a switch
Figure 1.7: (a) BJT symbol, (b) practical characteristics of BJT, and (c) idealized
characteristics of BJT.
MOSFET is a voltage-controlled device which has three terminals. The Gate (G) is
connected to the control signal, while the power terminals are the Drain (D) and
Source(S), as shown in Figure 1.8 (a).
Similar to BJT, the MOSFET has three regions as shown in Figure 1.8 (b). The device
is controlled by supplying a voltage (VGS) between the gate and the source. To
maintain the MOSFET in the off-state, VGS must be less than a threshold voltage
known as VT. However, VGS must be high enough (depending on its specifications)
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MOSFET in on-state.
Neglecting the middle region, the idealized device characteristics as a switch are
shown in Figure 1.8 (c).
Figure 1.8: (a) MOSFET symbol, (b) practical characteristics of MOSFET, and (c)
idealized characteristics of MOSFET.
The IGBT Transistor takes the best parts of BJT and MOSFET, the high input
impedance and high switching speeds of a MOSFET with the low saturation voltage
As shown in Figure 1.9 (a), the Gate (G) is connected to the control signal, while the
power terminals are the collector (C) and emitter (E). The device is controlled by
applying a voltage (VGE) between the gate and the emitter. Figure 1.9 (b) and (c)
illustrate the practical and idealized characteristics of the IGBT, respectively.
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Figure 1.9: (a) IGBT symbol, (b) practical characteristics of IGBT, and
(c) idealized characteristics of IGBT.