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STB5NK50Z/-1 - STD5NK50Z/-1

STP5NK50Z - STP5NK50ZFP
N-CHANNEL 500V - 1.22Ω - 4.4A TO-220/FP-D/IPAK-D2/I2PAK
Zener-Protected SuperMESH™MOSFET

Table 1: General Features Figure 1: Package


TYPE VDSS RDS(on) ID Pw
STB5NK50Z 500 V < 1.5 Ω 4.4 A 70 W
STB5NK50Z-1 500 V < 1.5 Ω 4.4 A 70 W
STD5NK50Z 500 V < 1.5 Ω 4.4 A 70 W
STD5NK50Z-1 500 V < 1.5 Ω 4.4 A 70 W 3
STP5K50Z 500 V < 1.5 Ω 4.4 A 70 W 12
2
3

STP5K50ZFP 500 V < 1.5 Ω 4.4 A 25 W 1

TO-220 I2PAK TO-220FP


■ TYPICAL RDS(on) = 1.22 Ω
■ EXTREMELY HIGH dv/dt CAPABILITY
■ IMPROVED ESD CAPABILITY
■ 100% AVALANCHE RATED
3 3 3
■ GATE CHARGE MINIMIZED 1 2
1 1
■ VERY LOW INTRINSIC CAPACITANCES IPAK
DPAK D2PAK
■ VERY GOOD MANUFACTURING
REPEATIBILITY
Figure 2: Internal Schematic Diagram
DESCRIPTION
The SuperMESH™ series is obtained through an
extreme optimization of ST’s well established
stripbased PowerMESH™ layout. In addition to
pushing on-resistance significantly down, special
care is taken to ensure a very good dv/dt capability
for the most demanding applications. Such series
complements ST full range of high voltage MOS-
FETs including revolutionary MDmesh™ products.

APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING

■ IDEAL FOR OFF-LINE POWER SUPPLIES,

ADAPTORS AND PFC


■ LIGHTING

Table 2: Order Codes


SALES TYPE MARKING PACKAGE PACKAGING

STB5NK50ZT4 B5NK50Z D2PAK TAPE & REEL

STB5NK50Z-1 B5NK50Z I2PAK TUBE

STD5NK50ZT4 D5NK50Z DPAK TAPE & REEL


STD5NK50Z-1 D5NK50Z IPAK TUBE
STP5NK50Z P5NK50Z TO-220 TUBE
STP5NK50ZFP P5NK50ZFP TO-220FP TUBE

Rev. 2
September 2005 1/17
STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

Table 3: Absolute Maximum ratings


Symbol Parameter Value Unit
STP5NK50Z STD5NK50Z
STP5NK50ZFP
STB5NK50Z/-1 STD5NK50Z-1
VDS Drain-source Voltage (VGS = 0) 500 V
VDGR Drain-gate Voltage (RGS = 20 kΩ) 500 V
VGS Gate- source Voltage ± 30 V
ID Drain Current (continuous) at TC = 25°C 4.4 4.4 (*) 4.4 A
ID Drain Current (continuous) at TC = 100°C 2.7 2.7 (*) 2.7 A
IDM () Drain Current (pulsed) 17.6 17.6 (*) 17.6 A
PTOT Total Dissipation at TC = 25°C 70 25 70 W
Derating Factor 0.56 0.2 0.56 W/°C
VESD(G-S) Gate source ESD(HBM-C=100pF, R=1.5KΩ) 3000 V
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
VISO Insulation Withstand Voltage (DC) - 2500 - V
Tj Operating Junction Temperature -55 to 150 °C
Tstg Storage Temperature -55 to 150 °C
( ) Pulse width limited by safe operating area
(1) ISD ≤4.4A, di/dt ≤200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX.
(*) Limited only by maximum temperature allowed
Table 4: Thermal Data
TO-220
TO-220FP DPAK
I2PAK/D2PAK
Rthj-case Thermal Resistance Junction-case Max 1.78 5 1.78 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
Tl Maximum Lead Temperature For Soldering Purpose 300 °C

Table 5: Avalanche Characteristics


Symbol Parameter Max Value Unit
IAR Avalanche Current, Repetitive or Not-Repetitive 4.4 A
(pulse width limited by Tj max)
EAS Single Pulse Avalanche Energy 130 mJ
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)

Table 6: Gate-Source Zener Diode


Symbol Parameter Test Conditions Min. Typ. Max. Unit
BVGSO Gate-Source Breakdown Igs=± 1mA (Open Drain) 30 V
Voltage

PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES


The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED)


Table 7: On /Off
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V(BR)DSS Drain-source Breakdown ID = 1 mA, VGS = 0 500 V
Voltage
IDSS Zero Gate Voltage VDS = Max Rating 1 µA
Drain Current (VGS = 0) VDS = Max Rating, TC = 125°C 50 µA
IGSS Gate-body Leakage VGS = ± 20 V ± 10 µA
Current (VDS = 0)
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 50 µA 3 3.75 4.5 V
RDS(on Static Drain-source On VGS = 10 V, ID = 2.2 A 1.22 1.5 Ω
Resistance

Table 8: Dynamic
Symbol Parameter Test Conditions Min. Typ. Max. Unit
gfs (1) Forward Transconductance VDS = 15 V , ID = 2.2 A 3.1 S
Ciss Input Capacitance VDS = 25 V, f = 1 MHz, VGS = 0 535 pF
Coss Output Capacitance 75 pF
Crss Reverse Transfer 17 pF
Capacitance
COSS eq (3). Equivalent Output VGS = 0 V, VDS = 0 to 400 V 45 pF
Capacitance
td(on) Turn-on Delay Time VDD = 250 V, ID = 2.2 A, 15 ns
tr Rise Time RG = 4.7 Ω, VGS = 10 V 10 ns
td(off) Turn-off-Delay Time (see Figure 19) 32 ns
tf Fall Time 15 ns
Qg Total Gate Charge VDD = 400 V, ID = 4.4 A, 20 28 nC
Qgs Gate-Source Charge VGS = 10 V 4 nC
Qgd Gate-Drain Charge (see Figure 22) 10 nC

Table 9: Source Drain Diode


Symbol Parameter Test Conditions Min. Typ. Max. Unit
ISD Source-drain Current 4.4 A
ISDM (2) Source-drain Current (pulsed) 17.6 A
VSD (1) Forward On Voltage ISD = 4.4 A, VGS = 0 1.6 V
trr Reverse Recovery Time ISD = 4.4 A, di/dt = 100 A/µs 310 ns
Qrr Reverse Recovery Charge VDD = 30V, Tj = 150°C 1425 nC
IRRM Reverse Recovery Current (see Figure 20) 9.2 A
(1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
(2) Pulse width limited by safe operating area.
(3) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS.

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

Figure 3: Safe Operating Area For DPAK/IPAK/ Figure 6: Safe Operating Area For TO-220FP
D2PAK/I2PAK/TO-220

Figure 4: Thermal Impedance For DPAK/IPAK/ Figure 7: Thermal Impedance For TO-220FP
D2PAK/I2PAK/TO-220

Figure 5: Output Characteristics Figure 8: Transfer Characteristics

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

Figure 9: Transconductance Figure 12: Static Drain-Source On Resistance

Figure 10: Gate Charge vs Gate-source Voltage Figure 13: Capacitance Variations

Figure 11: Normalized Gate Threshold Voltage Figure 14: Normalized On Resistance vs Tem-
vs Temperature perature

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

Figure 15: Source-Drain Forward Characteris- Figure 17: Normalized BVDSS vs Temperature
tics

Figure 16: Maximum Avalanche Energy vs


Temperature

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

Figure 18: Unclamped Inductive Load Test Cir- Figure 21: Unclamped Inductive Wafeform
cuit

Figure 19: Switching Times Test Circuit For Figure 22: Gate Charge Test Circuit
Resistive Load

Figure 20: Test Circuit For Inductive Load


Switching and Diode Recovery Times

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

TO-220FP MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
E
A

D
B

L3
L6
L7
F1

G1

G
H

F2

1 2 3
L5
L2 L4

9/17
STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

TO-220 MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

TO-251 (IPAK) MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031
B2 5.2 5.4 0.204 0.212
B3 0.85 0.033
B5 0.3 0.012
B6 0.95 0.037
C 0.45 0.6 0.017 0.023
C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047
L2 0.8 1 0.031 0.039

H
C
A

A3
C2

A1

L2 D L
B3

B6

B5
B
3
=

=
B2

G
E

2
=

=
1

L1
0068771-E

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

TO-262 (I2PAK) MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.

A 4.40 4.60 0.173 0.181

A1 2.40 2.72 0.094 0.107

b 0.61 0.88 0.024 0.034

b1 1.14 1.70 0.044 0.066

c 0.49 0.70 0.019 0.027

c2 1.23 1.32 0.048 0.052

D 8.95 9.35 0.352 0.368

e 2.40 2.70 0.094 0.106

e1 4.95 5.15 0.194 0.202

E 10 10.40 0.393 0.410

L 13 14 0.511 0.551

L1 3.50 3.93 0.137 0.154

L2 1.27 1.40 0.050 0.055

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

DPAK FOOTPRINT

All dimensions are in millimeters

TAPE AND REEL SHIPMENT

REEL MECHANICAL DATA


mm inch
DIM.
MIN. MAX. MIN. MAX.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0.795
G 16.4 18.4 0.645 0.724
N 50 1.968
T 22.4 0.881

BASE QTY BULK QTY


TAPE MECHANICAL DATA
2500 2500
mm inch
DIM.
MIN. MAX. MIN. MAX.
A0 6.8 7 0.267 0.275
B0 10.4 10.6 0.409 0.417
B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299
K0 2.55 2.75 0.100 0.108
P0 3.9 4.1 0.153 0.161
P1 7.9 8.1 0.311 0.319
P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

D2PAK MECHANICAL DATA


TO-247 MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.

A 4.4 4.6 0.173 0.181

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.7 0.93 0.027 0.036

B2 1.14 1.7 0.044 0.067

C 0.45 0.6 0.017 0.023

C2 1.23 1.36 0.048 0.053

D 8.95 9.35 0.352 0.368

D1 8 0.315

E 10 10.4 0.393

E1 8.5 0.334

G 4.88 5.28 0.192 0.208

L 15 15.85 0.590 0.625

L2 1.27 1.4 0.050 0.055

L3 1.4 1.75 0.055 0.068

M 2.4 3.2 0.094 0.126

R 0.4 0.015

V2 0º 4º
3

14/17
STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

TO-252 (DPAK) MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.

A 2.20 2.40 0.087 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.213

C 0.45 0.60 0.018 0.024

C2 0.48 0.60 0.019 0.024


D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.252 0.260

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.398

L2 0.8 0.031

L4 0.60 1.00 0.024 0.039

V2 0o 8o 0o 0o

P032P_B

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

Table 10: Revision History

Date Revision Description of Changes


16-Jun-2004 1 2
D PAK Included. New Stylesheet.
06-Sep-2005 2 Inserted Ecopack indication

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STB5NK50Z/-1 - STD5NK50Z/-1 - STP5NK50Z - STP5NK50ZFP

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics


All other names are the property of their respective owners

© 2005 STMicroelectronics - All Rights Reserved

STMicroelectronics group of companies


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