正修科技大學 113 學年度第 1 學期

封裝設備保修實務(一)

Instructor: 王納富

Student : 91103I12 - 吉麥琳

Submitted: 01/06/2024
1. What are the main benefits of surface mount assembly compared to through-hole
technology?
Surface mount technology (SMT) and through-hole technology (THT)
each have their own advantages, but SMT has become more popular in
modern electronics manufacturing due to its benefits. Here are the
main advantages of SMT compared to THT:

Size and Weight Reduction: SMT components are typically smaller

and lighter than THT components. This allows for more compact and
lightweight electronic devices, which is especially important in
consumer electronics like smartphones and laptops.

Higher Component Density: Because SMT components are smaller

and can be placed on both sides of the printed circuit board (PCB), SMT
allows for a higher component density. This means more functionality
can be packed into a smaller space.

Improved Performance: The shorter leads of SMT components result

in lower parasitic capacitance and inductance, leading to better
electrical performance at high frequencies.

Automated Assembly: SMT is highly compatible with automated

assembly processes, which can increase production speed and
consistency while reducing labor costs. Automated placement
machines can place thousands of components per hour with high
accuracy.

Cost Efficiency: The use of smaller components and automated

assembly can reduce material and manufacturing costs. Additionally,
the overall cost per unit can be lower due to the increased efficiency
and reduced need for manual labor.

Reliability: SMT components are generally more reliable in terms of

mechanical and thermal stress. They are less prone to issues like lead
fatigue and can perform better in harsh environments.
Of course, THT still has its place, especially in applications where
mechanical strength is crucial or where components need to withstand
significant stress. But for most modern electronic devices, SMT offers
numerous advantages that make it the preferred choice.
 2. What are the main benefits of through-hole technology compared to surface mount
assembly?

Through-hole technology and surface mount assembly are both

methods used to mount components onto printed circuit boards
(PCBs). Each has its own advantages, but here are some of the main
benefits of through-hole technology:

1. Mechanical Strength: Through-hole components are anchored

securely by leads that pass through the PCB and are soldered on the
opposite side. This provides strong mechanical bonds, making them
ideal for components that will experience physical stress, like
connectors, switches, and heavy transformers.
2. Reliability: Because through-hole components are mounted securely,
they are more resistant to environmental stress and vibrations. This
makes them suitable for high-reliability products used in aerospace,
military, and industrial applications.
3. Ease of Repair: Through-hole components can be easier to replace
and rework because they are larger and more accessible. This is
beneficial for prototyping, testing, and maintenance.
4. Power Handling: Through-hole components can handle higher power
levels and larger currents due to their larger size and strong
connections. This makes them suitable for power supplies and high-
power applications.

Surface mount technology (SMT) has its own benefits, like allowing for more
compact and high-density PCB designs, but through-hole technology
remains valuable for specific applications where its strengths are needed.

3. Describe the assembly and soldering process for a mixed assembly.

The assembly and soldering process for a mixed assembly, which

typically involves both surface-mount technology (SMT) and through-
hole components, is a bit of a balancing act, but it's a fascinating one.
Here’s a breakdown of the process:

1. Preparation:

 Design Review: Ensure the PCB design supports both SMT and
through-hole components, checking the layout and clearances.
  Stencil Preparation: For SMT components, prepare a stencil for
solder paste application.

2. Solder Paste Application:

 Stencil Printing: Apply solder paste onto the PCB using a stencil
printer. This is for the SMT components.
 Inspection: Check the solder paste application for consistency and
accuracy.

3. Placement of SMT Components:

 Pick-and-Place: Use a pick-and-place machine to accurately place

SMT components onto the PCB. This is typically done at high speed and
with great precision.

4. Reflow Soldering:

 Reflow Oven: Pass the PCB through a reflow oven to melt the solder
paste and securely attach the SMT components. The temperature
profile of the oven is critical to ensure proper soldering without
damaging components.

5. Placement of Through-Hole Components:

 Manual or Automated Insertion: Insert through-hole components

into their respective slots on the PCB. This can be done manually or
using automated insertion machines.

6. Wave Soldering (or Selective Soldering):

 Wave Soldering: For boards with many through-hole components,

the PCB is passed over a wave of molten solder. This method is quick
and efficient.
 Selective Soldering: If the PCB has mixed technology and you need
to avoid disturbing SMT components, selective soldering is used to
apply solder only to specific through-hole joints.

7. Inspection and Testing:

 Visual Inspection: Check for any visible defects like solder bridges or
misaligned components.
 Automated Optical Inspection (AOI): Use AOI systems to check for
defects in the soldering of SMT components.
  X-Ray Inspection: For complex assemblies, X-ray inspection can be
used to check hidden solder joints, especially for BGAs (Ball Grid
Arrays).

8. Final Assembly and Functional Testing:

 Functional Testing: Conduct functional tests to ensure that the

assembled PCB works as intended.
 Final Assembly: Attach any remaining components, such as
connectors or heat sinks, and prepare the PCB for integration into the
final product.

9. Quality Assurance:

 In-Circuit Testing (ICT): Perform ICT to check electrical connections,

component values, and functionality.
 Final Quality Checks: Conduct a thorough quality check to ensure
the assembly meets all specifications and standards.

10. Packaging and Delivery:

 Cleaning: Clean the assembled PCBs to remove any flux residues or

contaminants.
 Packaging: Properly package the finished PCBs for delivery to ensure
they are protected during transportation.

This combination of steps ensures that the PCB assembly is robust, reliable,
and ready for use in its final application. It's a meticulous process that
balances speed and precision.

4. Draw and describe a typical reflow profile, the critical times, temperatures and the
different purposes of the zones.
Each zone plays a crucial role in the reflow process:

 Preheat Zone: Ensures gradual heating to prevent damage.

 Soak Zone: Achieves uniform temperature across the PCB.
 Reflow Zone: Melts the solder to form connections.
 Cooling Zone: Solidifies the solder joints, ensuring strength and reliability.

Reflow soldering is a critical process in electronics manufacturing,

ensuring that surface mount components are properly attached to
printed circuit boards (PCBs). A typical reflow profile consists of several
distinct zones, each with specific temperature ranges and purposes:

1. Preheat Zone: This zone gradually raises the temperature of the PCB
and components to avoid thermal shock. The temperature typically
starts at around room temperature and gradually rises to
approximately 150°C to 180°C. This phase usually lasts between 60 to
120 seconds.
2. Soak Zone: Also known as the thermal soak zone, this stage aims to
eliminate any temperature differences across the PCB and
components. The temperature is held steady between 150°C to 200°C
for about 60 to 120 seconds. This zone ensures that all parts of the
PCB reach a uniform temperature.
3. Reflow Zone: This is the peak temperature zone where the solder
paste reaches its melting point. The temperature typically rises to
between 220°C to 250°C, depending on the solder paste used. The PCB
remains in this zone for around 30 to 90 seconds, allowing the solder
to liquefy and form reliable joints.
4. Cooling Zone: This zone rapidly cools the PCB and solder joints to
solidify the connections. The cooling rate is controlled to prevent
thermal shock and ensure the integrity of the solder joints. The
temperature drops back down to room temperature, ideally at a rate of 3°C
to 5°C per second.
5. What are the advantages and disadvantages of using nitrogen?

Nitrogen has several advantages and disadvantages for assembly and

soldering, including:

 Advantages
 Reduces defects: Nitrogen is an inert gas that protects the
board and solder from oxidation, which can reduce soldering
defects.
 Improves solder quality: Nitrogen improves the wetting of the
solder, which can lead to higher quality solder joints.
 Reduces flux consumption: Nitrogen can reduce the amount of
flux needed by up to 40%.
 Increases productivity: Nitrogen can reduce the need for
rework, which can increase productivity.
 Reduces costs: Nitrogen can reduce the amount of energy
needed to heat the oven and the time needed to reflow the solder
paste.

 Disadvantages
 High temperatures can damage components: High
temperatures during soldering can cause components and PCBs
to crack or deform.
 Some components may fail: Some components may not be
heat-resistant and may fail or be damaged.
 High-precision soldering may be difficult: High-precision
soldering may be difficult and may result in cold solder joints or
false soldering.

6. Why is the particular alloy of 63% tin and 37% lead advantageous to use?

The alloy of 63% tin and 37% lead is commonly known as "eutectic
solder" and it's widely used in electronics for a number of reasons:

1. Low Melting Point: It has a melting point of 183°C (361°F), which is

significantly lower than that of either pure tin or lead. This means it
can be used to solder components without damaging sensitive
electronics.
2. Excellent Wetting Properties: The eutectic composition provides
excellent wetting properties, meaning it flows easily over surfaces to
 form a strong bond, which is crucial for creating reliable electrical
connections.
3. Ease of Use: The alloy transitions directly from solid to liquid state at
its melting point, without passing through a plastic or mushy phase.
This makes it easier to work with and results in cleaner, more reliable
joints.
4. Durability: It offers good mechanical and thermal fatigue properties,
meaning it can withstand thermal cycling and mechanical stress
without failing.

Overall, these properties make the 63/37 tin-lead solder an industry

favorite for creating strong, reliable, and easy-to-work-with joints in
electronic assemblies. Although 63/37 is widely used in electronics for
both manual and automatic soft soldering applications, it is also used
in general purpose applications where fast alloy flow is desired. This
alloy offers good corrosion resistance properties, has the highest
strength of the tin/lead series and generally is used where low soft
soldering temperature requirements are required.

This alloy offers good corrosion resistance properties, has the highest
strength of the tin/lead series and generally is used where low soft
soldering temperature requirements are required.

7. Why should we consider environmental issues?

Environmental issues in assembly and soldering should be considered

because they can have a negative impact on the environment and
human health:
 Toxic emissions
Soldering and other assembly processes can release harmful
substances into the air, such as lead, volatile organic compounds
(VOCs), and other pollutants. These emissions can be toxic and
contribute to air pollution.
 Waste generation
The assembly process can generate a significant amount of
waste, including defective PCBs, obsolete components, and off-
cuts. This waste can contain hazardous materials that should be
properly disposed of.
 Lead contamination
Lead is a toxic substance that can contaminate soil, water, and
air. It can also harm wildlife and impair their reproductive ability.
  Chemical usage
The use of chemicals in assembly, such as fluxes and cleaning
agents, can have environmental implications. Some of these
chemicals may be hazardous if improperly handled and disposed
of.
To address these environmental issues, you can:
 Use lead-free solder and more environmentally friendly fluxes
 Use proper ventilation and emissions control equipment
 Recycle PCBs and electronic components to recover valuable materials
 Properly dispose of electronic waste
 Minimize the use of solvents

8. What are the benefits of area array packages? The resonance frequency for this
arrangement? Is the impedance or admittance peaking?

Area array packages are a type of surface-mount technology (SMT)

used for high-density interconnection and miniaturization in modern
electronics. They feature a grid or array of pins (pads) arranged in a
matrix pattern, as opposed to traditional package designs that use a
single row or peripheral pins. These packages are often seen in
applications like advanced microprocessors, system-on-chip (SoC)
devices, memory chips, and high-speed ICs.
Benefits of Area Array Packages:
1. Higher Pin Density:
o The arrangement of pins in a grid allows for more pins in the
same or smaller package footprint, which is particularly useful for
devices with a large number of I/O (input/output) connections.
o This results in more compact designs and better use of available
board space.
2. Improved Thermal Performance:
o The even distribution of pins across the package aids in more
efficient heat dissipation, which is crucial for high-power or high-
performance devices.
o The thermal management is enhanced because the heat can be
spread more evenly across the package, reducing hot spots.
3. Reduced Inductance and Resistance:
o With the shorter traces between the package pins and the PCB,
there are lower parasitic inductances and resistances, leading to
better signal integrity, particularly at high frequencies.
4. Improved Electrical Performance:
 oThe direct connection of many I/O pins to the PCB without long,
winding leads improves the signal quality, reducing the risk of
cross-talk and other interferences.
5. Better Mechanical Robustness:
o Area array packages, such as ball grid array (BGA), offer better
mechanical stability during assembly and operation, especially for
devices subjected to thermal cycling and mechanical stress.
6. Reduced Package Size:
o By arranging the pins in a grid, the package can be made more
compact, allowing for more functionality to be integrated into a
smaller form factor.

Resonance Frequency for Area Array Packages:

The resonance frequency of an area array package can be influenced by
several factors, including the electrical characteristics of the interconnects
between the package and the PCB, the package size, the layout of the vias,
and the substrate material.
 Inductance and Capacitance Effects:
o In high-speed applications, resonance can occur due to the
inductive and capacitive effects between the package pins (or
solder balls) and the PCB traces. When these interconnects form a
circuit with parasitic inductance and capacitance, they can result
in resonant frequencies, especially at higher speeds.
 Package and PCB Design:
o The resonance frequency depends heavily on the trace layout on
both the package and the PCB. At high frequencies, impedance
mismatches can cause reflections and standing waves, leading to
resonance effects.
In general, the resonance frequency of the area array package is
expected to be in the GHz range depending on the specific
design, but this varies greatly based on the physical dimensions,
trace lengths, and other electrical parameters of the design.

Impedance or Admittance Peaking?

In the context of high-frequency or high-speed signal transmission, both
impedance and admittance characteristics can influence the performance of
an area array package.
 1. Impedance Peaking:
o Impedance peaking typically occurs when there is a mismatch in
impedance between the package, PCB traces, and the
components at high frequencies. This can lead to reflections,
signal integrity issues, and power loss.
o When the impedance of the interconnects (between the PCB and
package) changes rapidly due to parasitic inductances or
capacitances, it can cause peaking in the frequency response,
especially in the return loss curve.
2. Admittance Peaking:
o Similarly, admittance peaking can occur if the capacitive or
inductive reactance between the pins of the area array package
and the PCB leads to a resonance condition.
o At the resonant frequency, the admittance can show a peak,
which would affect the overall signal integrity and could lead to
undesirable electrical behavior.
In summary, impedance peaking is more commonly discussed
in the context of high-speed interconnects due to the effects of
parasitic inductance and capacitance, which can lead to
reflections and signal degradation at specific resonant
frequencies. Admittance peaking can also happen under similar
conditions, but it’s more related to how the system responds to
changes in voltage and current at those resonant points.
Conclusion:
 Area array packages offer several benefits, including high pin
density, better thermal dissipation, improved electrical performance,
and reduced parasitic effects.
 Resonance frequency concerns are typically related to the parasitic
inductances and capacitances that arise from the package’s electrical
interconnects.
 Impedance peaking is a more common concern in high-frequency
design, as it can directly affect signal integrity and cause reflections,
while admittance peaking may also occur in resonant circuits
involving capacitive and inductive effects.