A Beginners Guide To EMC
A Beginners Guide To EMC
Basic standards
Examples
EN 61000-3-XX
EN 61000-4-XX
The problems of EMC
Emissions: Immunity:
– conducted RF on – conducted RF on
mains cable mains cable and
– conducted RF on other ports
other ports
– radiated RF – radiated RF
– LF power – supply voltage dips
disturbances and interruptions
– magnetic fields
– electrostatic
discharge
– fast transients
– surges
EMC Directive 2004/108/EC
ANNEX V CE Marking
Transposed Harmonised Standards
BS EN [reference number]
V, kHz - GHz
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Typical type of transmitter For 3V/m For 10V/m
or radiator Domestic, commercial and Industrial generic,
light industrial generic, and and medical life
most medical equipment support equipment
Cellphone in strong
1.7 metres 0.5 metres
signal area, ‘intrinsically
safe’ walkie-talkie (5½ feet) (1½ feet)
RF power = 0.8 Watts
Cellphone in weak signal
2.5 metres 0.76 metres
area and standby mode
RF power = 2 Watts (8 feet) (2½ feet)
Walkie-talkie handset
3.7 metres 1.1 metres
RF power = 4 watts
(emergency services can be 10W) (12 feet) (3½ feet)
Vehicle mobile (e.g.
18 metres 5.5 metres
taxicab), Electro-Surgery
RF power = 100 Watts (59 feet) (18 feet)
(some ES are 400W or more)
EUT
EUT
Incoming disturbance fields
pass through gaps in shield
to induce unwanted currents
in the circuit structure
Electrical Fast Transients: sources
contact breakdown
characteristic
neighbouring
unsuppressed V C conductors
VC
suppressed VC IL
time
L
V
IL
Cstr ay RL
Lightning surge: generation
H-field
cloud to cloud
direct strike
to primary supply
direct strike ground strike
to LV supply
(esp. rural areas)
IG
substation
load
fault clearance
Electrostatic discharge: sources
+ +
kV kV
- -
UT
0.4 x UT
UT
EUT
Induction
coil
Three
orthogonal
orientations
Coupling mechanisms
far-field radiated
conducted
• A major manufacturer of
automotive parts
commissioned a
series of robotic
paint booths
– to save cost, it was
agreed that the cabling
would be installed by
contractors
Robotic paint booth installation continued...
primary tertiary
secondary
Tertiary: screening
Example of ‘layered’ EM mitigation (using shielding and filtering)
Printed
~
~
circuit ~ ~
board ~
~
~
~ Cable filtering
~
Example: Cutting holes in enclosures
ESD
Shielding Enclosure
Stray capacitance
Signal Circuit
Mains
Managing
unwanted currents
Ground Managing wanted
currents
Capacitance
V
I
V Current and
voltage are
Dielectric
displacement 90°out
current of phase
Inductance L N2
V = - L di/dt
• can be concentrated further by including a magnetically
Z = j 2p FL permeable material in the path of the field
Inductance L µr
Bonding conductors
Single-point vs. multi-point grounds
IDM
external ground
E
IDM
N L
PSU
ICM
external ground
N L
PSU
ICM
ICM VDM
VN
Skin depth d
There must be no common mode
potential between cable and Interference currents stay on the outside
chassis developed at the interface
Cross-section
through screen
Signal currents stay on the inside
+
Differential choke
circuit
Differential
Differential capacitor mode filter
–
Common-mode choke
+
Common-mode
circuit
Common
capacitors
mode filter
–
GND
Parasitic reactances
Self-resonance
-20
Network
attenuation dB
-40
Frequency
Ferrites
Snap on Ferrite
Power Line Filter
Bulkhead
Filters
Shielding theory: reflection
incident field
E
i
Er
Z Transmission line
W
equivalent
ZB
Shielding theory: absorption
current current
density density
8.6dB
through through
barrier reflection
one skin depth d
barrier
from far wall
Limitations on theory
d d d
h
SE(dB) = 100 - 20log [d(mm) · F(MHz)] + 20log [1 + ln(d/h)] (for d < l/2, >> thickness)
100
80
d = 4cm d = 0.25mm
effectiveness dB
h = 2mm
Shieldingeffectiveness
60 0.25cm
40
2.5cm
Shielding
20
d = 25cm
0
10kHz 100kHz 1MHz 10MHz 100MHz 1GHz 10GHz
Shielding
Copper Tape
The EMC margin
dB µV/m V/m
140 10
Equipment
130 Immunity 3
120 1
EMC
74 5mV/m
66 2mV/m
Equipment
47 Emissions 224µV/m
30 32µV/m
V/m
NB dB µV/m = 20log
1µV/m
Andy Lawson
Technical Supervisor, Industry EMC, TÜV SÜD Product Service