EDA Question
EDA Question
c. In recent router cum modem all are integrated in a single package. Is it ASIC or ASSP?
m. What is LVS?
n. In SPICE model what is the priority level among electrical and physical parameter?
b. Develop a VHDL code of a 4 to 1 MUX that selects among four unsigned 6 bit integer.
Or
Q.2 B 3+3+8=14
Q.3 A 2+6+6=14
a. What is resolution function? Write the code for resolution function and its output process for
multiple signal driver assignment
b. Write a VHDL model for a 12 bit register that stores an unsigned integer value.
Or
Q.3 B 3+3+6+2=14
a. Write a Test bench of 2 input Xor gate. Also write the main programme of the Xor gate.
Q.4 A 5+5+4=14
a. Explain the basic differences between full custom and semi custom IC designs.
c. Draw and explain the logic synthesis steps from RTL level to physical design. What is
component library?
Or
Q.4 B 4+6+4=14
Q.5 A 4+4+4+2=14
c. What is partitioning technique? How signal integrity is taken care in partitioning process.
Or
Q.5 B 4+1+4+1+4=14
a. Explain the level 1 model of a MOS transistor with equivalent circuit. What are parasitic
parameters?
d. Deduce the drain current in linear and saturation level, gate capacitance, intrinsic gate delay
and power density for constant voltage scaling.
Q.6 A 3+2+3+3+3=14
a. What is the difference between parametric failure and catastrophic failure? Is there any
correlation among them?
c. Explain designable and noise component on typical CMOS based circuit parameters.
d. The dependence of the mobility on temperature is determined empirically as. Derive the
expression for ∆µ/µ in terms of ∆T/T
300
= .
300
Or
Q.6 B 1+3+2+3 +1+4=14
a. What is Stuck at Zero fault model. In the function F = AB+BC+A/C, what can be the
redundancy removal circuit and function?
b. Write three processing type faults? Is it possible to have a combinational circuit with some
signal line S and a test vector T such that T detects both S/0 and S/1 faults
c. What is defined as Response surface model? A CMOS chip with three signal input terminals,
one output terminal, one power supply terminal, and one ground terminal is presented to you.
The input signal voltages can vary from 0 to 5 V, the power supply voltage can vary from 4.5 V
to 5.5 V, and the device operating temperature can range from 0 to 85 0C. We want to design an
experiment so that the DC response of the chip can be described by a quadratic response surface
model for three inputs, power supply voltage, and temperature.