POWER ELECTRONICS - Lecture 1
POWER ELECTRONICS - Lecture 1
• The term power electronics has been used since the 1960s, after the
introduction of the silicon controlled rectifier (SCR).
• Power electronics has shown rapid growth in recent years with the
development of power semiconductor devices that can switch large currents
efficiently at high voltages.
• The systems and machines of our world depend on power electronics for the
ability to run efficiently and sustainably.
• Power electronics is the application of solid-state electronics for the control
and conversion of electric power.
• It applies to both the systems and products involved in converting and
controlling the flow of electrical energy, allowing the electricity needed for
everyday products to be delivered with maximum efficiency in the smallest
and lightest package.
• Not only are power electronics used to deliver and control power in the electric grid, but they are also
used in numerous everyday devices. Everything from power steering in your car, battery chargers, cell
phones, and microwaves utilize power electronics. The use of this technology can increase productivity
and decrease costs for the manufacturer and the consumer.
Electrical Energy
• About 40% of the world’s power needs are met by electrical energy. That number is quickly rising as the
trend towards renewable energy sources increases. Without power electronics, this energy cannot be
harnessed and delivered efficiently and energy from renewable sources, such as solar and wind, could
not be fed into the electricity grid.
▪ Power electronics is a technology that deals with the conversion and control of
electrical power with high efficiency switching mode electronic devices.
• The power semiconductor devices that are generally used in converters can be
grouped as follows:
▪ Diode rectifiers,
▪ Power transistors and
▪ Thyristors
Semiconductor devices having high voltage and current ratings are known as Power
Semiconductor Devices.
A) Based on Turn ON and Turn OFF Capability:
1) Uncontrollable power semiconductor devices
• Ex: Diode: The ON and OFF state are not depend on the control signal. They depend
on the power source.
2) Partially controllable power semiconductor devices
• Ex: SCR, TRIAC, and DIAC -They are turned ON by applying gate signal. But these
devices cannot be turned OFF with the help of gate signals. They are turned off by
load or by commutation.
3) Fully controllable power semiconductor devices
• Ex: Power BJT, MOSFET, IGBT, GTO. These devices can be both turned ON and turned
OFF by applying gate signals
• The V-I characteristics of a power diode which is almost similar to that of a signal
diode.
• In signal diodes for forward biased region the current increases exponentially.
• In power diodes high forward current leads to high ohmic drop which
dominates the exponential growth and the curve increases almost linearly.
• The maximum reverse voltage that the diode can withstand is depicted by
VRRM, i.e. peak reverse repetitive voltage.
• Above this voltage the reverse current becomes very high abruptly and as
the diode is not designed to dissipate such high amount of heat, it may get
destroyed.
• This voltage may also be called as peak inverse voltage (PIV).
3) Schottky diodes:
• In Schottky diodes, the pn junction is eliminated. A metal is placed directly on the
semiconductor as shown in figure.
• Aluminum is deposited on n-type semiconductor.
• The metal is anode and semiconductor is cathode
• Since there is no PN junction, the storage time is absent.
• Hence turn-off time is very small.
• So Schottky diodes have high switching frequencies.
• Schottky diodes are used in low voltage converters as feedback and freewheeling
diodes.
3) Give the structure of Power diode, and what is the name of the N- layer.
4) What are the two similarities and two differences between Normal diode and Power
diode
• Power transistor have controlled turn- ON and turn- OFF characteristics and are used
as switching elements
Here are different types of transistors:
➢Power BJT
➢Power MOSFET
➢IGBT
• The transistor is turned on by supplying sufficient base current, and this base drive has
to be maintained throughout its conduction period.
• It is turned off by removing the base drive and making the base voltage slightly
negative.
• Power Transistor Symbol: The symbol of the Power BJT is same as signal level
transistor.
• A power transistor requires a large blocking voltage in the off state and a high
current capability in the on state.
• A vertically oriented four layers structure is preferable because it maximizes the
cross-sectional area through which the current flows, enhancing the on-state
resistance and power dissipation in the device.
• In power switches NPN transistors are most widely used than PNP transistors because
electrons move faster than holes, and therefore, npn transistors have considerable
faster commutation times.
• The characteristics of the device is determined by the doping level in each of the layers
and the thickness of the layers.
• The thickness of the drift region determines the breakdown voltage of the Power
transistor.
• It shows how IB varies with changes in VBE when VCE is held constant at a particular
value.
• To begin, voltage VCE is maintained constant at a convenient value and then VBE is
increased in steps. Corresponding values of IB are noted at each step.
• The procedure is then repeated for a different but constant value of VCE.
• It indicates the way in which IC varies with changes in VCE when IB is held constant.
• For obtaining this characteristic, first IB is set to a convenient value and maintained
constant and then VCE is increased from zero in steps, IC being noted at each step.
• Next, VCE is reduced to zero and IB increased to another convenient value and the
whole procedure repeated.
• It is seen that as VCE increases from zero, IC rapidly increases to a near saturation level
for a fixed value of IB.
• As shown, a small amount of collector current flows even when IB = 0. It is called ICEO
Since main collector current is zero, the transistor is said to be cut-off.
• It indicates how IC varies with changes in IB when VCE is held constant at a given value.
• From Fig (b), it is seen that a small collector current flows even when IB = 0.
• It is the common-emitter leakage current ICEO
• Like ICO, it is also due to the flow of minority
carriers across the reverse-biased C/B junction.
• The MOSFET (metal oxide semiconductor field effect transistor) is a very fast switching
transistor that has shown great promise for applications involving high frequency (up
to 1 MHz) and low power (up to a few kilowatts).
• There are other trade names for this device, such as HEXFET (International Rectifier),
SIMMOS (Siemens), and TIMOS (Motorola).
• The three terminals are called drain (D), source (S), and gate (G).
• The current can flow in both directions, and therefore MOSFET is a bidirectional
device.
• The device has no reverse-voltage blocking capability, and it always comes with an
integrated reverse diode,
• The switching characteristics of the MOSFET are similar to those of the BJT.
• However, MOSFETs switch on and off very fast, in less than 50 nanoseconds.
• MOSFETs switch very fast, and they have very low switching losses, which allow them to
operate at very high switching frequencies, as high as 5 MHz
• In the ON state they operate as a constant resistance and not a constant voltage drop (as in a
diode), so their conduction losses are proportional to the drain current squared.
• In low voltage applications, below approximately 50 V, the on-state resistance can be below
10mΩ , so conduction losses can be very low.
• As operating temperature increases, the ON resistance also increases.
• MOSFETs are still not available in high power ratings.
• MOSFETs with ratings of 1000 V, 4 A, or 12 V, 60 A are available. These devices can be used in
parallel for higher current ratings.
1) Transfer Characteristics
• It is shown in Figure that ID flows only when VGS exceeds threshold voltage VGS(th).
2) Output characteristic
• There are 3 regions of operation:
i) cut-off region
ii) Saturation region
iii) Linear region
• The advantage gained by the IGBT over a BJT or MOSFET is that it offers
greater power gain than the standard bipolar type transistor combined
with the higher voltage operation and lower input losses of the MOSFET.
• It has the best combination quality of BJT and MOSFET
• It has high input impedance like MOSFET
• It has low ON state power loss as in BJT
1) Output characteristics
• In the image, I-V characteristics are shown depending on the different gate voltage
Vge. The X axis denotes collector emitter voltage or Vce and the Y axis denotes the
collector current.
• During the off state the current flowing through
the collector and the gate voltage is zero.
• When we change the Vge or the gate voltage
the device goes in to the active region.
b) Transfer Characteristics
• In the image, the Transfer characteristic of IGBT is shown.
• It is almost identical with PMOSFET.
• The IGBT will go to the “ON” state after Vge is greater than a threshold value
depending on the IGBT specification.
Disadvantages of IGBT
• IGBTs have stable charge problems
• IGBTs are costlier than BJTs and MOSFETs
• Excessive power dissipation can take place at the time of turn- OFF
• For the common base circuit shown below, determine IC and VCB . Assume
the transistor to be of silicon.
• Determine VCB in the transistor circuit shown below (i). The transistor is of
silicon and has β = 150.