IPC-9262

组装⾏业应⽤之AOI设备的特
性描述与鉴定
Specification for Characterization
and Verification of Assembly
Level Automatic Optical
Inspection Equipment

这份双语的IPC国际标准是由自动光学检测设备的特性描
述与鉴定小组委员会(7-32C)以母语中文开发并翻译成英
语，经由同行审查后出版。如中文和英语之间有冲突，以
中文优先。
This dual-language IPC international standard was developed
by the Automatic Optical Inspection Characterization and Veri-
fication Subcommittee (7-32C) in its native language and was
translated to English for peer review and publication. In the
event of conflict between Mandarin and English, Mandarin will
take precedence.

鼓励本标准的使用者参加未来修订版的开发。
Users of this standard are encouraged to participate in the
development of future revisions.

联系方式:
Contact：

IPC IPC 中国
2016年12月 IPC-9262

⽬录
Table of Contents
1 范围 (SCOPE) .......................................................... 1 3.1.27 光学字符识别
1.1 目的 (Purpose) ................................................ 1 (Optical Character Recognition (OCR) ........ 5
3.1.28 光学字符校验
2 适⽤⽂件 (APPLICABLE DOCUMENTS) ............ 1 (Optical Character Verifying (OCV) .............. 5
2.1 IPC .................................................................... 1 3.1.29 离线编程 (编辑)
(Offline Programming (Editor)) ...................... 5
3 要求 (REQUIREMENTS) ........................................ 2 3.1.30 在线编程 (编辑)
3.1 术语及定义 (Terms and Definitions) ............. 2 (Online Programming (Editor)) ...................... 5
3.1.1 算法 (Algorithm) .............................................. 2 3.1.31 组件库 (Parts Library) .................................... 5
3.1.2 条码系统 (Barcode System) .......................... 2 3.1.32 像素 (像元) (Pixel) ......................................... 5

3.1.3 板弯补偿方式 (Bending Offset Type) ........... 2 3.1.33 像素 (像元) 数量 (Pixel Number) ................. 5
3.1.34 像素 (像元) 尺寸 (Pixel Size) ....................... 6
3.1.4 元器件高度限制
(Component Stature Limit) ............................. 2 3.1.35 维修站 (Repair Station) .................................. 6
3.1.5 测试时间 (Cycle Time) ................................... 2 3.1.36 统计过程控制软件 (SPC Software) .............. 6
3.1.6 景深 (Depth of Field) ...................................... 2 3.1.37 远心镜头 (Telecentric Lens) .......................... 6
3.1.7 设备尺寸 (Equipment Size) ........................... 2 3.1.38 印制板固定方式 (Fixing Type of PCB) ......... 6
3.1.8 漏检 (Escapes) ................................................ 2 3.1.39 准确度 (Accuracy) ........................................... 6
3.1.9 误判 (False Alarm) .......................................... 3 3.1.40 精确度 (Precision) ........................................... 6
3.1.10 视野，面阵（FOV） 3.1.41 重复性 (Repeatability) .................................... 6
(Field of View (FOV)) ...................................... 3 3.1.42 再现性 (Reproducibility) ................................. 7
3.1.11 成像分辨率 (Image Resolution) .................... 3 3.1.43 Kappa (Kappa) ................................................. 7
3.1.12 检测分组 (Inspection Grouping) ................... 3 3.1.44 一致性 (Consistency) ..................................... 7
3.1.13 取像模式 (Inspection Type) ........................... 3 3.1.45 测试单元 (Units of Measurement) ................ 7
3.1.14 光源系统类型 (Lighting System Type) ......... 4 4 特性鉴定
(CHARACTERISTIC CERTIFICATION) .............. 7
3.1.15 线阵相机 (Line Images Camera) .................. 4
4.1 AOI准确度及精确度鉴定方法
3.1.16 进出板时间
(Identification Method of AOI Precision
(Loading and Unloading Time) ...................... 4
and AOI Accuracy) ........................................... 7
3.1.17 面阵相机 (Matrix-Images Camera) .............. 4
4.1.1 采用AVP板贴装Chip组件
3.1.18 允许最大印制板基板尺寸 (Mount Chip Components with Accuracy
(Maximum PCB Size) ...................................... 4 Verification Panel (AVP)) ............................. 8/9
3.1.19 可夹持印制板最大厚度 4.1.2 采用IPC-9850的AVP板测量定位点
(Maximum PCB Thickness) ........................... 4 Measure Setpoint on AVP Panel
3.1.20 最大板弯补偿能力 with IPC-9850) ........................................... 10/11
(Maximum Bending (Warp) Offset) ............... 4 4.2 Kappa鉴定方法
3.1.21 允许元器件与板边的最小距离 (Kappa Certification Method) ....................... 12
(Minimum Component Apart from Edge) ..... 4 4.2.1 测试样品的选择与制作
3.1.22 移动方式 (Motion Type of Table) .................. 4 (Selection and Fabrication of
Test Samples) ........................................... 12/13
3.1.23 相机数量 (Number of Cameras) ................... 5
4.2.2 标准样品测试
3.1.24 光源数量 (Number of Lighting) ..................... 5 (Standard Sample Test) ........................... 14/15
3.1.25 远程控制 (Remote Control) ........................... 5 4.2.3 标准样品编号
3.1.26 远程监视 (Remote Monitor) ........................... 5 (Standard Sample Number) ......................... 16

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IPC-9262 2016年12月

4.2.4 测试结果计算 图4-3 量测选择区域

(Testing Result Calculation) .................... 17/18 (Selection Range of the
4.3 最大板弯补偿能力测量方法 Test Sample) ............................................. 12/13
(Measuring Method of Maximum 图4-4 元器件与板边的最小距离测量治具
Bending (Warp) Offset) ................................. 19 (Measuring Gauge for Minimum
4.4 允许元器件与板边的最小距离测量方法 Components Apart from Edge) .................... 19
(Measuring Method of Minimum 图4-5 AOI景深计算示意图
Component Apart from Edge) ...................... 19 (Schematic Diagram of AOI Depth of
4.5 测试时间测量方法 Field Calculation) ...................................... 20/21
(Measuring Method of the Testing Time) ... 19 图4-6 AOI视野计算示意图
4.6 景深计算方法 (Schematic Diagram of AOI Field of
Measuring Method for Depth of Field) .. 20/21 View Calculation) ........................................... 22
4.7 视野计算方法 图A-1 Chip组件焊盘结构图
(Calculating Method of Field of View) ......... 22 (Chip Parts Bonding Pad
4.8 设备尺寸测量方法 Structure Chart) ............................................. 25
(Measuring Method of Equipment 图A-2 封装组件焊盘结构图
Dimension) ...................................................... 23 (Mounted Component Bonding Pad
4.9 允许最大印制板基板尺寸测量方法 Structure Chart) ............................................. 25
(Measuring Method of Maximum
PCB Size) ....................................................... 23 表格 (Tables)
4.10 可夹持印制板最大厚度测量方法 表4-1 AOI 特性鉴定纪录表
(Measuring Method of Maximum (AOI Characteristic Certification
PCB Thickness ............................................... 23 Record Sheet) ........................................... 14/15
4.11 可测产品最大重量测量方法 表4-2 5台AOI对n个样品重复u次检验设计表
(Measuring Method of Maximum (Design Table Showing Five Sets of AOI
PCB Weight) ................................................... 24 Repeats u Inspections in n Samples) ......... 16
4.12 特性分级标准 表4-3 AOI在缺件的检验与标准样品重复性
(Characteristic Grading Standard) .............. 24 (Inspection of Missing Parts and
附录A AOI Kappa测试载具的制作 Repeatability of Standard Samples) ...... 17/18
(Creating an AOI Kappa 表4-4 AOI准确度及精确度分级表
Testing Vehicle) .......................................... 26 (AOI Specification Limits Grading Table) ... 24
表4-5 Kappa值分级表
(Kappa Value Grading Table) ....................... 24
图⽚ (Figures) 表A-1 Chip零件焊盘尺寸
图4-1 组件贴装AVP板布局 (Chip Parts Bonding Pad Size) .............. 25/26
(Layout of Mounting Components to 表A-2 零件列表设计表
AVP Panel) .................................................... 8/9 (Part List Design Table) ........................... 27/28
图4-2 AVP板定位点布局 表A-3 零件贴装坐标
(AVP Panel Setpoint Layout) .................. 10/11 (Parts-Mounting Coordinates) ................ 29/30

vi
2016年12月 IPC-9262

组装⾏业应⽤之AOI设备的特性描述与鉴定
Specification for Characterization and Verification of
Assembly Level Automatic Optical Inspection Equipment

1 范围
本标准提供AOI (Automatic Optical Inspection) 设备 及其重要特性 与参数的相关定义, 鉴定方法和要求； 透过本标
准可以使AOI设备的生产厂商提供一致的设备特性描述；及提供AOI使用者验收及允收的参考依据。

1 SCOPE

This standard (specification) provides relevant definition, testing, certification and requirements of automatic optical inspection
(AOI) equipment and its significant characteristics and parameters. AOI equipment manufacturers can use this specification to
provide consistent equipment characteristic description, and AOI users can use it as a reference of certification and acceptance
for AOI.

1.1 本标准制定的目的在于建立AOI设备中对于其设备检测效能有重要影响的部件及整机之重要特性及参数
⽬的
进行文字定义及测试和鉴定方法; 另外对使用者提供应用量测系统分析对AOI设备的验收方法及允收标准。

1.1 Purpose This standard (specification) is formulated for establishing wording and definition and testing and certification
method of the key features and parameters of the components and complete machine, which has important influence on the
equipment testing efficiency in AOI equipment. It also provides users with measurement system analysis for acceptance meth-
ods and acceptability criteria of the AOI equipment.

2 适⽤⽂件
下列列出各机构所发行的文件, 规范或标准被引用及被应用于本规范中。

2 APPLICABLE DOCUMENTS

The following documents of the issue in effect at the time of the order form a part of this specification to the extent specified
herein.

2.1 IPC1

IPC-T-50 电子电路互连与封装名词术语及定义 (Terms and Definitions for Interconnecting and Packaging Electronic
Circuits)
IPC-OI-645 Standard for Visual Optical Inspection Aids

IPC-A-610F 电子组件的可接受性 (Acceptability of Electronic Assemblies)

IPC-9850 Surface Mount Placement Equipment Characterization

2.2 Automotive Industry Action Group (AIAG)2

TS16949 MSA测量系统分析手册 (Measurement System Analysis (MSA))

1. www.ipc.org
2. www.aiag.org