Unit 2.0 Creep Test - Q & A
Unit 2.0 Creep Test - Q & A
MATERIAL TESTING
PART – A
1. Define creep
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Creep is defined as the time-dependent plastic deformation at constant stress which is below the
yield stress of material and at temperatures in excess of Tm/3. (Tm is the melting point of
material in Kelvin).
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The temperature at which the grain is as strong as the grain boundary is called the equicohesive
temperature.
3. During creep test which one between stress and time is kept constant
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Equicohesive temperature
PART – B
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This mechanism involves dislocations moving along slip planes and overcoming barriers
by thermal activation.
This mechanism occurs at high stress, σ/G>10-2.
The creep rate is established by the ease with which dislocations are impeded by
obstacles such as precipitates, solute atoms, and other dislocations
3. Describe the specifications of standard test specimen for creep test
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Creep Mechanism by Grain boundary sliding:
This mechanism involves the sliding of grains past each other and the creep rate is very
high ultimately leading to failure.
This mechanism takes place at relatively high temperature close to melting points
At such temperatures the grain boundary becomes very week compared to grain
PART – C
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A constant stress (load) is applied to a tensile specimen held at a constant temperature. The strain
(extension) produced is measured as a function of time and these values are plotted. An ideal
creep curve is illustrated in the following Fig.
The slope of this curve is called the 'creep rate'. When the load is applied to the specimen,
there occurs an almost instantaneous elongation.
This is denoted by є0.
The creep rate decreases with time during this period and is known as the primary creep.
The creep rate later becomes approximately constant in the second stage.
The third stage is marked by a rapid increase in the creep rate, which continues until the
fracture occurs.
In actual experiment, the third stage is not attained.
That is the creep curve consists of essentially three regions they are
o Primary creep – decreasing creep rate as dislocation microstructure develops to
reduce strain rate
o Secondary creep - equilibrium is established between deformation and recovery
mechanisms to maintain a steady state strain rate.
o Tertiary creep – increasing creep rate as the effective cross section reduces
leading to failure.
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It involves the flow of vacancies and interstitials through a crystal under the influence of
applied stress. Occurs for σ/G<10-4.
This category includes Nabarro-Herring and Coble creep.
Deformation occurs by the movement of atoms between differently oriented grain boundaries
under the influence of an imposed stress to produce a macroscopic shape change. Creep occurs
by this mechanism at low stresses and at relatively high temperatures where the diffusion is fast
enough to produce a measurable creep rate.
Grains s undergoing diffusion creep under tensile stress – the material within the dotted
boundaries has come from the predominantly vertical boundaries. The arrows represent the flux
of atoms.
Coble Creep:
As diffusion is very sensitive to temperature, at lower temperatures the main diffusion path is
along the grain boundaries since the activation energy for grain boundary diffusion is
considerably less than that for bulk diffusion. This mechanism of creep at low temperatures is
called coble creep.
3. Explain the procedure of creep test
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