PIC12C509

PIC12C5XX
8-Pin, 8-Bit CMOS Microcontrollers

Devices included in this Data Sheet: Peripheral Features:
• PIC12C508 • PIC12C508A • PIC12CE518 • 8-bit real time clock/counter (TMR0) with 8-bit
• PIC12C509 • PIC12C509A • PIC12CE519 programmable prescaler
• PIC12CR509A • Power-On Reset (POR)
Note: Throughout this data sheet PIC12C5XX • Device Reset Timer (DRT)
refers to the PIC12C508, PIC12C509, • Watchdog Timer (WDT) with its own on-chip RC
PIC12C508A, PIC12C509A, oscillator for reliable operation
PIC12CR509A, PIC12CE518 and • Programmable code-protection
PIC12CE519. PIC12CE5XX refers to • 1,000,000 erase/write cycle EEPROM data
PIC12CE518 and PIC12CE519. memory
High-Performance RISC CPU: • EEPROM data retention > 40 years
• Only 33 single word instructions to learn • Power saving SLEEP mode
• All instructions are single cycle (1 µs) except for • Wake-up from SLEEP on pin change
program branches which are two-cycle • Internal weak pull-ups on I/O pins
• Operating speed: DC - 4 MHz clock input • Internal pull-up on MCLR pin
DC - 1 µs instruction cycle • Selectable oscillator options:
Memory - INTRC: Internal 4 MHz RC oscillator
Device EPROM ROM RAM EEPROM - EXTRC: External low-cost RC oscillator
Program Program Data Data - XT: Standard crystal/resonator
PIC12C508 512 x 12 25 - LP: Power saving, low frequency crystal
PIC12C508A 512 x 12 25 CMOS Technology:
PIC12C509 1024 x 12 41
• Low power, high speed CMOS EPROM/ROM
PIC12C509A 1024 x 12 41
technology
PIC12CE518 512 x 12 25 16
• Fully static design
PIC12CE519 1024 x 12 41 16
• Wide operating voltage range
PIC12CR509A 1024 x 12 41
• Wide temperature range:
• 12-bit wide instructions
- Commercial: 0°C to +70°C
• 8-bit wide data path - Industrial: -40°C to +85°C
• Seven special function hardware registers - Extended: -40°C to +125°C
• Two-level deep hardware stack • Low power consumption
• Direct, indirect and relative addressing modes for - < 2 mA @ 5V, 4 MHz
data and instructions - 15 µA typical @ 3V, 32 KHz
• Internal 4 MHz RC oscillator with programmable - < 1 µA typical standby current
calibration
• In-circuit serial programming
 1999 Microchip Technology Inc. DS40139E-page 1

PIC12C5XX
Pin Diagram - PIC12C508/509
PDIP, 208 mil SOIC, Windowed Ceramic Side Brazed
VDD VSS
PIC12C509
PIC12C508
1 8
GP5/OSC1/CLKIN 2 7 GP0
GP4/OSC2 3 6 GP1
GP3/MCLR/VPP 4 5 GP2/T0CKI
Pin Diagram - PIC12C508A/509A,

PIC12CE518/519
PDIP, 150 & 208 mil SOIC, Windowed CERDIP
VDD 1 8 VSS
PIC12C509A
PIC12CE519
PIC12CE518
PIC12C508A
GP4/OSC2 3 6 GP1
Pin Diagram - PIC12CR509A

PDIP, 150 & 208 mil SOIC
VDD VSS
PIC12CR509A
1 8
GP4/OSC2 3 6 GP1
Device Differences
Oscillator Process
Voltage
Device
Range
Oscillator Calibration2 Technology
(Bits) (Microns)
PIC12C508A 3.0-5.5 See Note 1 6 0.7

PIC12LC508A 2.5-5.5 See Note 1 6 0.7
PIC12C508 2.5-5.5 See Note 1 4 0.9
PIC12C509A 3.0-5.5 See Note 1 6 0.7
PIC12LC509A 2.5-5.5 See Note 1 6 0.7
PIC12C509 2.5-5.5 See Note 1 4 0.9
PIC12CR509A 2.5-5.5 See Note 1 6 0.7
PIC12CE518 3.0-5.5 - 6 0.7
PIC12LCE518 2.5-5.5 - 6 0.7
PIC12CE519 3.0-5.5 - 6 0.7
PIC12LCE519 2.5-5.5 - 6 0.7
Note 1: If you change from the PIC12C50X to the PIC12C50XA or to the PIC12CR50XA, please verify
oscillator characteristics in your application.
Note 2: See Section 7.2.5 for OSCCAL implementation differences.
DS40139E-page 2  1999 Microchip Technology Inc.

PIC12C5XX
TABLE OF CONTENTS
1.0 General Description............................................................................................................................................... 4
2.0 PIC12C5XX Device Varieties ................................................................................................................................ 7
3.0 Architectural Overview........................................................................................................................................... 9
4.0 Memory Organization .......................................................................................................................................... 13
5.0 I/O Port ................................................................................................................................................................ 21
6.0 Timer0 Module and TMR0 Register .................................................................................................................... 25
7.0 EEPROM Peripheral Operation........................................................................................................................... 29
8.0 Special Features of the CPU ............................................................................................................................... 35
9.0 Instruction Set Summary ..................................................................................................................................... 47
10.0 Development Support.......................................................................................................................................... 59
11.0 Electrical Characteristics - PIC12C508/PIC12C509............................................................................................ 65
12.0 DC and AC Characteristics - PIC12C508/PIC12C509 ........................................................................................ 75
13.0 Electrical Characteristics PIC12C508A/PIC12C509A/PIC12LC508A/PIC12LC509A/PIC12CR509A/
PIC12CE518/PIC12CE519/
PIC12LCE518/PIC12LCE519/PIC12LCR509A ................................................................................................... 79
14.0 DC and AC Characteristics
PIC12C508A/PIC12C509A/PIC12LC508A/PIC12LC509A/PIC12CE518/PIC12CE519/PIC12CR509A/
PIC12LCE518/PIC12LCE519/ PIC12LCR509A .................................................................................................. 93
15.0 Packaging Information......................................................................................................................................... 99
Index ........................................................................................................................................................................... 105
PIC12C5XX Product Identification System ................................................................................................................ 109
Sales and Support: ..................................................................................................................................................... 109
To Our Valued Customers

Most Current Data Sheet
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PIC12C5XX
1.0 GENERAL DESCRIPTION 1.1 Applications
The PIC12C5XX from Microchip Technology is a fam- The PIC12C5XX series fits perfectly in applications
ily of low-cost, high performance, 8-bit, fully static, ranging from personal care appliances and security
EEPROM/EPROM/ROM-based CMOS microcontrol- systems to low-power remote transmitters/receivers.
lers. It employs a RISC architecture with only 33 sin- The EPROM technology makes customizing applica-
gle word/single cycle instructions. All instructions are tion programs (transmitter codes, appliance settings,
single cycle (1 µs) except for program branches receiver frequencies, etc.) extremely fast and conve-
which take two cycles. The PIC12C5XX delivers per- nient, while the EEPROM data memory technology
formance an order of magnitude higher than its com- allows for the changing of calibration factors and secu-
petitors in the same price category. The 12-bit wide rity codes. The small footprint packages, for through
instructions are highly symmetrical resulting in 2:1 hole or surface mounting, make this microcontroller
code compression over other 8-bit microcontrollers in series perfect for applications with space limitations.
its class. The easy to use and easy to remember Low-cost, low-power, high performance, ease of use
instruction set reduces development time signifi- and I/O flexibility make the PIC12C5XX series very ver-
cantly. satile even in areas where no microcontroller use has
The PIC12C5XX products are equipped with special been considered before (e.g., timer functions, replace-
features that reduce system cost and power requirement of “glue” logic and PLD’s in larger systems, copro-
ments. The Power-On Reset (POR) and Device Reset cessor applications).
Timer (DRT) eliminate the need for external reset cir-
cuitry. There are four oscillator configurations to choose
from, including INTRC internal oscillator mode and the
power-saving LP (Low Power) oscillator mode. Power
saving SLEEP mode, Watchdog Timer and code
protection features also improve system cost, power
and reliability.
The PIC12C5XX are available in the cost-effective
One-Time-Programmable (OTP) versions which are
suitable for production in any volume. The customer
can take full advantage of Microchip’s price leadership
in OTP microcontrollers while benefiting from the OTP’s
flexibility.
The PIC12C5XX products are supported by a full-fea-
tured macro assembler, a software simulator, an in-cir-
cuit emulator, a ‘C’ compiler, fuzzy logic support tools,
a low-cost development programmer, and a full fea-
tured programmer. All the tools are supported on IBM
PC and compatible machines.

PIC12C5XX
TABLE 1-1: PIC12CXXX & PIC12CEXXX FAMILY OF DEVICES
PIC12C508(A) PIC12C509(A) PIC12CR509A PIC12CE518 PIC12CE519 PIC12C671 PIC12C672 PIC12CE673 PIC12CE674
Maximum 4 4 4 4 4 10 10 10 10
Frequency
Clock
of Operation
(MHz)
EPROM 512 x 12 1024 x 12 1024 x 12 512 x 12 1024 x 12 1024 x 14 2048 x 14 1024 x 14 2048 x 14
Program (ROM)
Memory
Memory
RAM Data 25 41 41 25 41 128 128 128 128
Memory
(bytes)
EEPROM — — — 16 16 — — 16 16
Data Memory
(bytes)
Timer TMR0 TMR0 TMR0 TMR0 TMR0 TMR0 TMR0 TMR0 TMR0
Peripherals
Module(s)
A/D Con- — — — — — 4 4 4 4
verter (8-bit)
Channels
Wake-up Yes Yes Yes Yes Yes Yes Yes Yes Yes
from SLEEP
on pin
change
Interrupt — — — 4 4 4 4
Sources
Features I/O Pins 5 5 5 5 5 5 5 5 5

Input Pins 1 1 1 1 1 1 1 1 1
Internal Yes Yes Yes Yes Yes Yes Yes Yes Yes
Pull-ups
In-Circuit Yes Yes — Yes Yes Yes Yes Yes Yes
Serial
Programming
Number of 33 33 33 33 33 35 35 35 35
Instructions
Packages 8-pin DIP, 8-pin DIP, 8-pin DIP, 8-pin DIP, 8-pin DIP, 8-pin DIP, 8-pin DIP, 8-pin DIP, 8-pin DIP,
JW, SOIC JW, SOIC SOIC JW, SOIC JW, SOIC JW, SOIC JW, SOIC JW JW
All PIC12CXXX & PIC12CEXXX devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O
current capability.
All PIC12CXXX & PIC12CEXXX devices use serial programming with data pin GP0 and clock pin GP1.

PIC12C5XX
NOTES:

PIC12C5XX
2.0 PIC12C5XX DEVICE VARIETIES 2.3 Quick-Turnaround-Production (QTP)
Devices
A variety of packaging options are available.
Depending on application and production Microchip offers a QTP Programming Service for
requirements, the proper device option can be factory production orders. This service is made
selected using the information in this section. When available for users who choose not to program a
placing orders, please use the PIC12C5XX Product medium to high quantity of units and whose code
Identification System at the back of this data sheet to patterns have stabilized. The devices are identical to
specify the correct part number. the OTP devices but with all EPROM locations and fuse
options already programmed by the factory. Certain
2.1 UV Erasable Devices
code and prototype verification procedures do apply
The UV erasable version, offered in ceramic side before production shipments are available. Please con-
brazed package, is optimal for prototype development tact your local Microchip Technology sales office for
and pilot programs. more details.
The UV erasable version can be erased and 2.4 Serialized Quick-Turnaround

reprogrammed to any of the configuration modes. Production (SQTPSM) Devices
Note: Please note that erasing the device will
Microchip offers a unique programming service where
also erase the pre-programmed internal
a few user-defined locations in each device are
calibration value for the internal oscillator.
programmed with different serial numbers. The serial
The calibration value must be saved prior
numbers may be random, pseudo-random or
to erasing the part.
sequential.
Microchip’s PICSTART PLUS and PRO MATE pro-
Serial programming allows each device to have a
grammers all support programming of the PIC12C5XX.
unique number which can serve as an entry-code,
Third party programmers also are available; refer to the
password or ID number.
Microchip Third Party Guide for a list of sources.
2.5 Read Only Memory (ROM) Device
2.2 One-Time-Programmable (OTP)
Devices Microchip offers masked ROM to give the customer a
low cost option for high volume, mature products.
The availability of OTP devices is especially useful for
customers who need the flexibility for frequent code
updates or small volume applications.
The OTP devices, packaged in plastic packages permit
the user to program them once. In addition to the
program memory, the configuration bits must also be
programmed.

PIC12C5XX
NOTES:

PIC12C5XX
3.0 ARCHITECTURAL OVERVIEW The PIC12C5XX device contains an 8-bit ALU and
working register. The ALU is a general purpose
The high performance of the PIC12C5XX family can arithmetic unit. It performs arithmetic and Boolean
be attributed to a number of architectural features functions between data in the working register and any
commonly found in RISC microprocessors. To begin register file.
with, the PIC12C5XX uses a Harvard architecture in
which program and data are accessed on separate The ALU is 8-bits wide and capable of addition,
buses. This improves bandwidth over traditional von subtraction, shift and logical operations. Unless
Neumann architecture where program and data are otherwise mentioned, arithmetic operations are two's
fetched on the same bus. Separating program and complement in nature. In two-operand instructions,
data memory further allows instructions to be sized typically one operand is the W (working) register. The
differently than the 8-bit wide data word. Instruction other operand is either a file register or an immediate
opcodes are 12-bits wide making it possible to have all constant. In single operand instructions, the operand is
single word instructions. A 12-bit wide program either the W register or a file register.
memory access bus fetches a 12-bit instruction in a The W register is an 8-bit working register used for
single cycle. A two-stage pipeline overlaps fetch and ALU operations. It is not an addressable register.
execution of instructions. Consequently, all instructions
Depending on the instruction executed, the ALU may
(33) execute in a single cycle (1µs @ 4MHz) except for
affect the values of the Carry (C), Digit Carry (DC),
program branches.
and Zero (Z) bits in the STATUS register. The C and
The table below lists program memory (EPROM), data DC bits operate as a borrow and digit borrow out bit,
memory (RAM), ROM memory, and non-volatile respectively, in subtraction. See the SUBWF and ADDWF
(EEPROM) for each device. instructions for examples.
A simplified block diagram is shown in Figure 3-1, with
Memory the corresponding device pins described in Table 3-1.
Device EPROM ROM RAM EEPROM
Program Program Data Data
PIC12C508 512 x 12 25
PIC12C509 1024 x 12 41
PIC12C508A 512 x 12 25
PIC12C509A 1024 x 12 41
PIC12CR509A 1024 x 12 41
PIC12CE518 512 x 12 25 x 8 16 x 8
PIC12CE519 1024 x 12 41 x 8 16 x 8
The PIC12C5XX can directly or indirectly address its
register files and data memory. All special function
registers including the program counter are mapped in
the data memory. The PIC12C5XX has a highly
orthogonal (symmetrical) instruction set that makes it
possible to carry out any operation on any register
using any addressing mode. This symmetrical nature
and lack of ‘special optimal situations’ make
programming with the PIC12C5XX simple yet efficient.
In addition, the learning curve is reduced significantly.

PIC12C5XX
FIGURE 3-1: PIC12C5XX BLOCK DIAGRAM
12 8 GPIO
Data Bus
ROM/EPROM Program Counter
512 x 12 or GP0
1024 x 12 GP1
RAM GP2/T0CKI
Program STACK1 25 x 8 or
Memory GP3/MCLR/VPP
41 x 8 GP4/OSC2
STACK2 File
Registers GP5/OSC1/CLKIN
Program 12
Bus RAM Addr 9
SDA
SCL
Addr MUX
Instruction reg
Direct Addr 5 Indirect 16 X 8
5-7 Addr EEPROM
Data
FSR reg
Memory
PIC12CE5XX
STATUS reg Only
8
3 MUX
Device Reset
Timer
Instruction
Decode & ALU
Control Power-on
Reset
8
OSC1/CLKIN Timing Watchdog
Generation Timer W reg
OSC2
Internal RC
OSC Timer0
MCLR
VDD, VSS

PIC12C5XX
TABLE 3-1: PIC12C5XX PINOUT DESCRIPTION
DIP SOIC I/O/P Buffer

Name Description
Pin # Pin # Type Type
GP0 7 7 I/O TTL/ST Bi-directional I/O port/ serial programming data. Can
be software programmed for internal weak pull-up and
wake-up from SLEEP on pin change. This buffer is a
Schmitt Trigger input when used in serial programming
mode.
GP1 6 6 I/O TTL/ST Bi-directional I/O port/ serial programming clock. Can
be software programmed for internal weak pull-up and
wake-up from SLEEP on pin change. This buffer is a
Schmitt Trigger input when used in serial programming
mode.
GP2/T0CKI 5 5 I/O ST Bi-directional I/O port. Can be configured as T0CKI.
GP3/MCLR/VPP 4 4 I TTL/ST Input port/master clear (reset) input/programming volt-
age input. When configured as MCLR, this pin is an
active low reset to the device. Voltage on MCLR/VPP
must not exceed VDD during normal device operation
or the device will enter programming mode. Can be
software programmed for internal weak pull-up and
wake-up from SLEEP on pin change. Weak pull-up
always on if configured as MCLR. ST when in MCLR
mode.
GP4/OSC2 3 3 I/O TTL Bi-directional I/O port/oscillator crystal output. Con-
nections to crystal or resonator in crystal oscillator
mode (XT and LP modes only, GPIO in other modes).
GP5/OSC1/CLKIN 2 2 I/O TTL/ST Bidirectional IO port/oscillator crystal input/external
clock source input (GPIO in Internal RC mode only,
OSC1 in all other oscillator modes). TTL input when
GPIO, ST input in external RC oscillator mode.
VDD 1 1 P — Positive supply for logic and I/O pins
VSS 8 8 P — Ground reference for logic and I/O pins
Legend: I = input, O = output, I/O = input/output, P = power, — = not used, TTL = TTL input,
ST = Schmitt Trigger input

PIC12C5XX
3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining
The clock input (OSC1/CLKIN pin) is internally divided An Instruction Cycle consists of four Q cycles (Q1, Q2,
by four to generate four non-overlapping quadrature Q3 and Q4). The instruction fetch and execute are
clocks namely Q1, Q2, Q3 and Q4. Internally, the pipelined such that fetch takes one instruction cycle
program counter is incremented every Q1, and the while decode and execute takes another instruction
instruction is fetched from program memory and cycle. However, due to the pipelining, each instruction
latched into instruction register in Q4. It is decoded effectively executes in one cycle. If an instruction
and executed during the following Q1 through Q4. The causes the program counter to change (e.g., GOTO)
clocks and instruction execution flow is shown in then two cycles are required to complete the
Figure 3-2 and Example 3-1. instruction (Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is
latched into the Instruction Register (IR) in cycle Q1.
This instruction is then decoded and executed during
the Q2, Q3, and Q4 cycles. Data memory is read
during Q2 (operand read) and written during Q4
(destination write).
FIGURE 3-2: CLOCK/INSTRUCTION CYCLE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Q1
Q2 Internal
phase
Q3 clock
Q4
PC PC PC+1 PC+2
Fetch INST (PC)

Execute INST (PC-1) Fetch INST (PC+1)
Execute INST (PC) Fetch INST (PC+2)
Execute INST (PC+1)
EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW
1. MOVLW 03H Fetch 1 Execute 1

2. MOVWF GPIO Fetch 2 Execute 2
3. CALL SUB_1 Fetch 3 Execute 3
4. BSF GPIO, BIT1 Fetch 4 Flush
Fetch SUB_1 Execute SUB_1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.

PIC12C5XX
4.0 MEMORY ORGANIZATION FIGURE 4-1: PROGRAM MEMORY MAP
AND STACK
PIC12C5XX memory is organized into program mem-
ory and data memory. For devices with more than 512 PC<11:0>
bytes of program memory, a paging scheme is used. CALL, RETLW 12
Program memory pages are accessed using one STA-
TUS register bit. For the PIC12C509, PIC12C509A, Stack Level 1
PICCR509A and PIC12CE519 with a data memory Stack Level 2
register file of more than 32 registers, a banking
scheme is used. Data memory banks are accessed
using the File Select Register (FSR). Reset Vector (note 1) 0000h
4.1 Program Memory Organization

On-chip Program
The PIC12C5XX devices have a 12-bit Program Memory
User Memory
Counter (PC) capable of addressing a 2K x 12
program memory space.
Space
512 Word 01FFh
Only the first 512 x 12 (0000h-01FFh) for the
0200h
PIC12C508, PIC12C508A and PIC12CE518 and 1K x
12 (0000h-03FFh) for the PIC12C509, PIC12C509A, On-chip Program
PIC12CR509A, and PIC12CE519 are physically Memory
implemented. Refer to Figure 4-1. Accessing a
location above these boundaries will cause a wrap-
around within the first 512 x 12 space (PIC12C508, 1024 Word 03FFh
PIC12C508A and PIC12CE518) or 1K x 12 space 0400h
(PIC12C509, PIC12C509A, PIC12CR509A and
PIC12CE519). The effective reset vector is at 000h,
(see Figure 4-1). Location 01FFh (PIC12C508,
PIC12C508A and PIC12CE518) or location 03FFh
7FFh
(PIC12C509, PIC12C509A, PIC12CR509A and
PIC12CE519) contains the internal clock oscillator
calibration value. This value should never be Note 1: Address 0000h becomes the
overwritten. effective reset vector. Location
01FFh (PIC12C508, PIC12C508A,
PIC12CE518) or location 03FFh
(PIC12C509, PIC12C509A,
PIC12CR509A, PIC12CE519) con-
tains the MOVLW XX INTERNAL RC
oscillator calibration value.

PIC12C5XX
4.2 Data Memory Organization FIGURE 4-2: PIC12C508, PIC12C508A AND
PIC12CE518 REGISTER FILE
Data memory is composed of registers, or bytes of
MAP
RAM. Therefore, data memory for a device is specified
by its register file. The register file is divided into two File Address
functional groups: special function registers and
general purpose registers. 00h INDF (1)
The special function registers include the TMR0 01h TMR0

register, the Program Counter (PC), the Status 02h PCL
Register, the I/O registers (ports), and the File Select STATUS
03h
Register (FSR). In addition, special purpose registers
are used to control the I/O port configuration and 04h FSR
prescaler options. 05h OSCCAL
The general purpose registers are used for data and 06h GPIO
control information under command of the instructions.
07h
For the PIC12C508, PIC12C508A and PIC12CE518,
the register file is composed of 7 special function
registers and 25 general purpose registers (Figure 4-
General
2). Purpose
Registers
For the PIC12C509, PIC12C509A, PIC12CR509A,
and PIC12CE519 the register file is composed of 7
special function registers, 25 general purpose
registers, and 16 general purpose registers that may 1Fh
be addressed using a banking scheme (Figure 4-3).
Note 1: Not a physical register. See Section 4.8
4.2.1 GENERAL PURPOSE REGISTER FILE
The general purpose register file is accessed either

directly or indirectly through the file select register FSR
(Section 4.8).
FIGURE 4-3: PIC12C509, PIC12C509A, PIC12CR509A AND PIC12CE519 REGISTER FILE MAP
FSR<6:5> 00 01
File Address
00h INDF(1) 20h
01h TMR0
02h PCL
STATUS Addresses map
03h
back to
04h FSR addresses
05h OSCCAL in Bank 0.
06h GPIO
07h
General
Purpose
Registers
0Fh 2Fh
10h 30h
General General
Purpose Purpose
Registers Registers
1Fh 3Fh
Bank 0 Bank 1
Note 1: Not a physical register. See Section 4.8

PIC12C5XX
4.2.2 SPECIAL FUNCTION REGISTERS The special registers can be classified into two sets.
The special function registers associated with the
The Special Function Registers (SFRs) are registers “core” functions are described in this section. Those
used by the CPU and peripheral functions to control related to the operation of the peripheral features are
the operation of the device (Table 4-1). described in the section for each peripheral feature.
TABLE 4-1: SPECIAL FUNCTION REGISTER (SFR) SUMMARY
Value on Value on
Power-On All Other
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Resets(2)
N/A TRIS — — --11 1111 --11 1111

Contains control bits to configure Timer0, Timer0/WDT
N/A OPTION prescaler, wake-up on change, and weak pull-ups 1111 1111 1111 1111
00h INDF Uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu
01h TMR0 8-bit real-time clock/counter xxxx xxxx uuuu uuuu
02h(1) PCL Low order 8 bits of PC 1111 1111 1111 1111

03h STATUS GPWUF — PA0 TO PD Z DC C 0001 1xxx q00q quuu(3)
FSR
(PIC12C508/
PIC12C508A/
04h PIC12C518) Indirect data memory address pointer 111x xxxx 111u uuuu
FSR
(PIC12C509/
PIC12C509A/
PIC12CR509A/
04h PIC12CE519) Indirect data memory address pointer 110x xxxx 11uu uuuu
OSCCAL
(PIC12C508/
05h PIC12C509) CAL3 CAL2 CAL1 CAL0 — — — — 0111 ---- uuuu ----
OSCCAL
(PIC12C508A/
PIC12C509A/
PIC12CE518/
PIC12CE519/
05h PIC12CR509A) CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — — 1000 00-- uuuu uu--
GPIO
(PIC12C508/
PIC12C509/
PIC12C508A/
PIC12C509A/
06h PIC12CR509A) — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu
GPIO
(PIC12CE518/
06h PIC12CE519) SCL SDA GP5 GP4 GP3 GP2 GP1 GP0 11xx xxxx 11uu uuuu
Legend: Shaded boxes = unimplemented or unused, — = unimplemented, read as ’0’ (if applicable)
x = unknown, u = unchanged, q = see the tables in Section 8.7 for possible values.
Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.6
for an explanation of how to access these bits.
2: Other (non power-up) resets include external reset through MCLR, watchdog timer and wake-up on pin change reset.
3: If reset was due to wake-up on pin change then bit 7 = 1. All other resets will cause bit 7 = 0.

PIC12C5XX
4.3 STATUS Register For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
This register contains the arithmetic status of the ALU, as 000u u1uu (where u = unchanged).
the RESET status, and the page preselect bit for
It is recommended, therefore, that only BCF, BSF and
program memories larger than 512 words.
MOVWF instructions be used to alter the STATUS
The STATUS register can be the destination for any register because these instructions do not affect the Z,
instruction, as with any other register. If the STATUS DC or C bits from the STATUS register. For other
register is the destination for an instruction that affects instructions, which do affect STATUS bits, see
the Z, DC or C bits, then the write to these three bits is Instruction Set Summary.
disabled. These bits are set or cleared according to
the device logic. Furthermore, the TO and PD bits are
not writable. Therefore, the result of an instruction with
the STATUS register as destination may be different
than intended.
FIGURE 4-4: STATUS REGISTER (ADDRESS:03h)
R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x

GPWUF — PA0 TO PD Z DC C R = Readable bit
bit7 6 5 4 3 2 1 bit0 W = Writable bit
- n = Value at POR reset
bit 7: GPWUF: GPIO reset bit
1 = Reset due to wake-up from SLEEP on pin change
0 = After power up or other reset
bit 6: Unimplemented
bit 5: PA0: Program page preselect bits
1 = Page 1 (200h - 3FFh) - PIC12C509, PIC12C509A, PIC12CR509A and PIC12CE519
0 = Page 0 (000h - 1FFh) - PIC12C5XX
Each page is 512 bytes.
Using the PA0 bit as a general purpose read/write bit in devices which do not use it for program
page preselect is not recommended since this may affect upward compatibility with future products.
bit 4: TO: Time-out bit
1 = After power-up, CLRWDT instruction, or SLEEP instruction
0 = A WDT time-out occurred
bit 3: PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2: Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1: DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions)
ADDWF
1 = A carry from the 4th low order bit of the result occurred
0 = A carry from the 4th low order bit of the result did not occur
SUBWF
1 = A borrow from the 4th low order bit of the result did not occur
0 = A borrow from the 4th low order bit of the result occurred
bit 0: C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions)
ADDWF SUBWF RRF or RLF
1 = A carry occurred 1 = A borrow did not occur Load bit with LSB or MSB, respectively
0 = A carry did not occur 0 = A borrow occurred

PIC12C5XX
4.4 OPTION Register Note: If TRIS bit is set to ‘0’, the wake-up on
The OPTION register is a 8-bit wide, write-only change and pull-up functions are disabled
register which contains various control bits to for that pin; i.e., note that TRIS overrides
configure the Timer0/WDT prescaler and Timer0. OPTION control of GPPU and GPWU.
By executing the OPTION instruction, the contents of Note: If the T0CS bit is set to ‘1’, GP2 is forced to
the W register will be transferred to the OPTION be an input even if TRIS GP2 = ‘0’.
register. A RESET sets the OPTION<7:0> bits.
FIGURE 4-5: OPTION REGISTER
W-1 W-1 W-1 W-1 W-1 W-1 W-1 W-1

GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 W = Writable bit
bit7 6 5 4 3 2 1 bit0 U = Unimplemented bit
Reference Table 4-1 for
other resets.
bit 7: GPWU: Enable wake-up on pin change (GP0, GP1, GP3)
1 = Disabled
0 = Enabled
bit 6: GPPU: Enable weak pull-ups (GP0, GP1, GP3)
1 = Disabled
0 = Enabled
bit 5: T0CS: Timer0 clock source select bit
1 = Transition on T0CKI pin
0 = Transition on internal instruction cycle clock, Fosc/4
bit 4: T0SE: Timer0 source edge select bit
1 = Increment on high to low transition on the T0CKI pin
0 = Increment on low to high transition on the T0CKI pin
bit 3: PSA: Prescaler assignment bit
1 = Prescaler assigned to the WDT
0 = Prescaler assigned to Timer0
bit 2-0: PS2:PS0: Prescaler rate select bits
Bit Value Timer0 Rate WDT Rate
000 1:2 1:1

001 1:4 1:2
010 1:8 1:4
011 1 : 16 1:8
100 1 : 32 1 : 16
101 1 : 64 1 : 32
110 1 : 128 1 : 64
111 1 : 256 1 : 128

PIC12C5XX
4.5 OSCCAL Register
The Oscillator Calibration (OSCCAL) register is used to
calibrate the internal 4 MHz oscillator. It contains four to
six bits for calibration. Increasing the cal value
increases the frequency. See Section 7.2.5 for more
information on the internal oscillator.
FIGURE 4-6: OSCCAL REGISTER (ADDRESS 05h) FOR PIC12C508 AND PIC12C509
R/W-0 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 U-0 U-0

CAL3 CAL2 CAL1 CAL0 — — — — R = Readable bit
bit7 bit0 W = Writable bit
U = Unimplemented bit,
read as ‘0’
bit 7-4: CAL<3:0>: Calibration
bit 3-0: Unimplemented: Read as ’0’
FIGURE 4-7: OSCCAL REGISTER (ADDRESS 05h) FOR PIC12C508A/C509A/CR509A/12CE518/

12CE519
R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0

CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — — R = Readable bit
bit7 bit0 W = Writable bit
U = Unimplemented bit,
read as ‘0’
bit 7-2: CAL<5:0>: Calibration
bit 1-0: Unimplemented: Read as ’0’

PIC12C5XX
4.6 Program Counter 4.6.1 EFFECTS OF RESET
As a program instruction is executed, the Program The Program Counter is set upon a RESET, which
Counter (PC) will contain the address of the next means that the PC addresses the last location in the
program instruction to be executed. The PC value is last page i.e., the oscillator calibration instruction. After
increased by one every instruction cycle, unless an executing MOVLW XX, the PC will roll over to location
instruction changes the PC. 00h, and begin executing user code.
For a GOTO instruction, bits 8:0 of the PC are provided The STATUS register page preselect bits are cleared
by the GOTO instruction word. The PC Latch (PCL) is upon a RESET, which means that page 0 is pre-
mapped to PC<7:0>. Bit 5 of the STATUS register selected.
provides page information to bit 9 of the PC (Figure 4- Therefore, upon a RESET, a GOTO instruction will
8). automatically cause the program to jump to page 0
For a CALL instruction, or any instruction where the until the value of the page bits is altered.
PCL is the destination, bits 7:0 of the PC again are
provided by the instruction word. However, PC<8> 4.7 Stack
does not come from the instruction word, but is always
PIC12C5XX devices have a 12-bit wide L.I.F.O.
cleared (Figure 4-8).
hardware push/pop stack.
Instructions where the PCL is the destination, or
A CALL instruction will push the current value of stack
Modify PCL instructions, include MOVWF PC, ADDWF
1 into stack 2 and then push the current program
PC, and BSF PC,5.
counter value, incremented by one, into stack level 1. If
Note: Because PC<8> is cleared in the CALL more than two sequential CALL’s are executed, only
instruction, or any Modify PCL instruction, the most recent two return addresses are stored.
all subroutine calls or computed jumps are A RETLW instruction will pop the contents of stack level
limited to the first 256 locations of any pro- 1 into the program counter and then copy stack level 2
gram memory page (512 words long). contents into level 1. If more than two sequential
FIGURE 4-8: LOADING OF PC RETLW’s are executed, the stack will be filled with the
address previously stored in level 2. Note that the
BRANCH INSTRUCTIONS -
W register will be loaded with the literal value specified
PIC12C5XX
in the instruction. This is particularly useful for the
GOTO Instruction implementation of data look-up tables within the
program memory.
11 10 9 8 7 0
PC PCL Upon any reset, the contents of the stack remain
unchanged, however the program counter (PCL) will
also be reset to 0.
Instruction Word
Note 1: There are no STATUS bits to indicate
PA0
7 0
stack overflows or stack underflow condi-
tions.
STATUS
Note 2: There are no instructions mnemonics
called PUSH or POP. These are actions
that occur from the execution of the CALL
CALL or Modify PCL Instruction and RETLW instructions.
11 10 9 8 7 0
PC PCL
Instruction Word
Reset to ‘0’
PA0
7 0
STATUS

PIC12C5XX
4.8 Indirect Data Addressing; INDF and EXAMPLE 4-2: HOW TO CLEAR RAM
FSR Registers USING INDIRECT
ADDRESSING
The INDF register is not a physical register. movlw 0x10 ;initialize pointer
Addressing INDF actually addresses the register movwf FSR ; to RAM
whose address is contained in the FSR register (FSR NEXT clrf INDF ;clear INDF register
is a pointer). This is indirect addressing. incf FSR,F ;inc pointer
btfsc FSR,4 ;all done?
EXAMPLE 4-1: INDIRECT ADDRESSING goto NEXT ;NO, clear next
CONTINUE
• Register file 07 contains the value 10h
: ;YES, continue
• Register file 08 contains the value 0Ah
• Load the value 07 into the FSR register The FSR is a 5-bit wide register. It is used in
• A read of the INDF register will return the value conjunction with the INDF register to indirectly address
of 10h the data memory area.
• Increment the value of the FSR register by one The FSR<4:0> bits are used to select data memory
(FSR = 08) addresses 00h to 1Fh.
• A read of the INDR register now will return the
PIC12C508/PIC12C508A/PIC12CE518: Does not
value of 0Ah.
use banking. FSR<7:5> are unimplemented and read
Reading INDF itself indirectly (FSR = 0) will produce as '1's.
00h. Writing to the INDF register indirectly results in a
PIC12C509/PIC12C509A/PIC12CR509A/
no-operation (although STATUS bits may be affected).
PIC12CE519: Uses FSR<5>. Selects between bank 0
A simple program to clear RAM locations 10h-1Fh and bank 1. FSR<7:6> is unimplemented, read as '1’ .
using indirect addressing is shown in Example 4-2.
FIGURE 4-9: DIRECT/INDIRECT ADDRESSING

Direct Addressing Indirect Addressing
(FSR)
6 5 4 (opcode) 0 6 5 4 (FSR) 0
bank select location select bank location select

00 01
00h
Addresses
map back to
addresses
in Bank 0.
Data 0Fh
Memory(1) 10h
1Fh 3Fh
Bank 0 Bank 1(2)
Note 1: For register map detail see Section 4.2.

Note 2: PIC12C509, PIC12C509A, PIC12CR509A, PIC12CE519.

PIC12C5XX
5.0 I/O PORT 5.3 I/O Interfacing
As with any other register, the I/O register can be The equivalent circuit for an I/O port pin is shown in
written and read under program control. However, read Figure 5-1. All port pins, except GP3 which is input
instructions (e.g., MOVF GPIO,W) always read the I/O only, may be used for both input and output operations.
pins independent of the pin’s input/output modes. On For input operations these ports are non-latching. Any
RESET, all I/O ports are defined as input (inputs are at input must be present until read by an input instruction
hi-impedance) since the I/O control registers are all (e.g., MOVF GPIO,W). The outputs are latched and
set. See Section 7.0 for SCL and SDA description for remain unchanged until the output latch is rewritten. To
PIC12CE5XX. use a port pin as output, the corresponding direction
control bit in TRIS must be cleared (= 0). For use as an
5.1 GPIO input, the corresponding TRIS bit must be set. Any I/O
GPIO is an 8-bit I/O register. Only the low order 6 bits pin (except GP3) can be programmed individually as
are used (GP5:GP0). Bits 7 and 6 are unimplemented input or output.
and read as '0's. Please note that GP3 is an input only FIGURE 5-1: EQUIVALENT CIRCUIT
pin. The configuration word can set several I/O’s to FOR A SINGLE I/O PIN
alternate functions. When acting as alternate functions
the pins will read as ‘0’ during port read. Pins GP0, Data
Bus
GP1, and GP3 can be configured with weak pull-ups D Q
and also with wake-up on change. The wake-up on Data
VDD
change and weak pull-up functions are not pin WR Latch
Port
selectable. If pin 4 is configured as MCLR, weak pull- CK Q
P
up is always on and wake-up on change for this pin is
not enabled.
W N I/O
5.2 TRIS Register Reg pin(1,3)
D Q
The output driver control register is loaded with the TRIS
VSS
contents of the W register by executing the TRIS f Latch
instruction. A '1' from a TRIS register bit puts the TRIS ‘f’
CK Q
corresponding output driver in a hi-impedance mode.
A '0' puts the contents of the output data latch on the
selected pins, enabling the output buffer. The Reset
(2)
exceptions are GP3 which is input only and GP2 which
may be controlled by the option register, see Figure 4-
5.
Note: A read of the ports reads the pins, not the

RD Port
output data latches. That is, if an output
driver on a pin is enabled and driven high, Note 1: I/O pins have protection diodes to VDD
but the external system is holding it low, a and VSS.
read of the port will indicate that the pin is Note 2: See Table 3-1 for buffer type.
low.
Note 3: See Section 7.0 for SCL and SDA
The TRIS registers are “write-only” and are set (output description for PIC12CE5XX
drivers disabled) upon RESET.

PIC12C5XX
TABLE 5-1: SUMMARY OF PORT REGISTERS
Value on
Power-On Value on
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset All Other Resets
N/A TRIS — — --11 1111 --11 1111
N/A OPTION GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
03H STATUS GPWUF — PAO TO PD Z DC C 0001 1xxx q00q quuu(1)
GPIO
(PIC12C508/
PIC12C509/
PIC12C508A/
PIC12C509A/
06h PIC12CR509A) — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu
GPIO
(PIC12CE518/
06h PIC12CE519) SCL SDA GP5 GP4 GP3 GP2 GP1 GP0 11xx xxxx 11uu uuuu
Legend: Shaded cells not used by Port Registers, read as ‘0’, — = unimplemented, read as '0', x = unknown, u = unchanged,
q = see tables in Section 8.7 for possible values.
Note 1: If reset was due to wake-up on change, then bit 7 = 1. All other resets will cause bit 7 = 0.
5.4 I/O Programming Considerations EXAMPLE 5-1: READ-MODIFY-WRITE

INSTRUCTIONS ON AN
5.4.1 BI-DIRECTIONAL I/O PORTS
I/O PORT
Some instructions operate internally as read followed ;Initial GPIO Settings
; GPIO<5:3> Inputs
by write operations. The BCF and BSF instructions, for
; GPIO<2:0> Outputs
example, read the entire port into the CPU, execute ;
the bit operation and re-write the result. Caution must ; GPIO latch GPIO pins
be used when these instructions are applied to a port ; ---------- ----------
where one or more pins are used as input/outputs. For BCF GPIO, 5 ;--01 -ppp --11 pppp
example, a BSF operation on bit5 of GPIO will cause BCF GPIO, 4 ;--10 -ppp --11 pppp
all eight bits of GPIO to be read into the CPU, bit5 to MOVLW 007h ;
be set and the GPIO value to be written to the output TRIS GPIO ;--10 -ppp --11 pppp
latches. If another bit of GPIO is used as a bi- ;
directional I/O pin (say bit0) and it is defined as an ;Note that the user may have expected the pin
;values to be --00 pppp. The 2nd BCF caused
input at this time, the input signal present on the pin
;GP5 to be latched as the pin value (High).
itself would be read into the CPU and rewritten to the
data latch of this particular pin, overwriting the 5.4.2 SUCCESSIVE OPERATIONS ON I/O
previous content. As long as the pin stays in the input PORTS
mode, no problem occurs. However, if bit0 is switched
into output mode later on, the content of the data latch The actual write to an I/O port happens at the end of
may now be unknown. an instruction cycle, whereas for reading, the data
must be valid at the beginning of the instruction cycle
Example 5-1 shows the effect of two sequential read-
(Figure 5-2). Therefore, care must be exercised if a
modify-write instructions (e.g., BCF, BSF, etc.) on an
write followed by a read operation is carried out on the
I/O port.
same I/O port. The sequence of instructions should
A pin actively outputting a high or a low should not be allow the pin voltage to stabilize (load dependent)
driven from external devices at the same time in order before the next instruction, which causes that file to be
to change the level on this pin (“wired-or”, “wired- read into the CPU, is executed. Otherwise, the
and”). The resulting high output currents may damage previous state of that pin may be read into the CPU
the chip. rather than the new state. When in doubt, it is better to
separate these instructions with a NOP or another
instruction not accessing this I/O port.

PIC12C5XX
FIGURE 5-2: SUCCESSIVE I/O OPERATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC PC + 1 PC + 2 PC + 3 This example shows a write to GPIO followed

Instruction by a read from GPIO.
fetched MOVWF GPIO MOVF GPIO,W NOP NOP
Data setup time = (0.25 TCY – TPD)
where: TCY = instruction cycle.
GP5:GP0
TPD = propagation delay
Port pin Port pin Therefore, at higher clock frequencies, a
written here sampled here write followed by a read may be problematic.
Instruction
executed MOVWF GPIO MOVF GPIO,W NOP
(Write to (Read
GPIO) GPIO)

PIC12C5XX
NOTES:

PIC12C5XX
6.0 TIMER0 MODULE AND Counter mode is selected by setting the T0CS bit
(OPTION<5>). In this mode, Timer0 will increment
TMR0 REGISTER either on every rising or falling edge of pin T0CKI. The
The Timer0 module has the following features: T0SE bit (OPTION<4>) determines the source edge.
• 8-bit timer/counter register, TMR0 Clearing the T0SE bit selects the rising edge.
Restrictions on the external clock input are discussed
- Readable and writable
in detail in Section 6.1.
• 8-bit software programmable prescaler
The prescaler may be used by either the Timer0
• Internal or external clock select
module or the Watchdog Timer, but not both. The
- Edge select for external clock prescaler assignment is controlled in software by the
Figure 6-1 is a simplified block diagram of the Timer0 control bit PSA (OPTION<3>). Clearing the PSA bit
module. will assign the prescaler to Timer0. The prescaler is
Timer mode is selected by clearing the T0CS bit not readable or writable. When the prescaler is
(OPTION<5>). In timer mode, the Timer0 module will assigned to the Timer0 module, prescale values of 1:2,
increment every instruction cycle (without prescaler). If 1:4,..., 1:256 are selectable. Section 6.2 details the
TMR0 register is written, the increment is inhibited for operation of the prescaler.
the following two instruction cycles (Figure 6-2 and A summary of registers associated with the Timer0
Figure 6-3). The user can work around this by writing module is found in Table 6-1.
an adjusted value to the TMR0 register.
FIGURE 6-1: TIMER0 BLOCK DIAGRAM
Data bus
GP2/T0CKI FOSC/4 0
Pin PSout 8
1
Sync with
1 Internal TMR0 reg
Clocks
Programmable 0 PSout
Prescaler(2)
T0SE (2 TCY delay) Sync
3
PS2, PS1, PS0(1) PSA(1)
T0CS(1)
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register.
2: The prescaler is shared with the Watchdog Timer (Figure 6-5).

PIC12C5XX
FIGURE 6-2: TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE
PC Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
(Program
Counter) PC-1 PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
Instruction MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Fetch
Timer0 T0 T0+1 T0+2 NT0 NT0+1 NT0+2
Instruction
Executed
Write TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0
executed reads NT0 reads NT0 reads NT0 reads NT0 + 1 reads NT0 + 2
FIGURE 6-3: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
PC Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
(Program
Counter) PC-1 PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
Instruction MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Fetch
Timer0 T0 T0+1 NT0 NT0+1 T0
Instruction
Execute Write TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0
executed reads NT0 reads NT0 reads NT0 reads NT0 reads NT0 + 1
TABLE 6-1: REGISTERS ASSOCIATED WITH TIMER0
Value on Value on
Power-On All Other
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Resets
01h TMR0 Timer0 - 8-bit real-time clock/counter xxxx xxxx uuuu uuuu
N/A TRIS — — GP5 GP4 GP3 GP2 GP1 GP0 --11 1111 --11 1111
Legend: Shaded cells not used by Timer0, - = unimplemented, x = unknown, u = unchanged,

PIC12C5XX
6.1 Using Timer0 with an External Clock When a prescaler is used, the external clock input is
divided by the asynchronous ripple counter-type
When an external clock input is used for Timer0, it prescaler so that the prescaler output is symmetrical.
must meet certain requirements. The external clock For the external clock to meet the sampling
requirement is due to internal phase clock (TOSC) requirement, the ripple counter must be taken into
synchronization. Also, there is a delay in the actual account. Therefore, it is necessary for T0CKI to have a
incrementing of Timer0 after synchronization. period of at least 4TOSC (and a small RC delay of
40 ns) divided by the prescaler value. The only
6.1.1 EXTERNAL CLOCK SYNCHRONIZATION
requirement on T0CKI high and low time is that they
When no prescaler is used, the external clock input is do not violate the minimum pulse width requirement of
the same as the prescaler output. The synchronization 10 ns. Refer to parameters 40, 41 and 42 in the
of T0CKI with the internal phase clocks is electrical specification of the desired device.
accomplished by sampling the prescaler output on the
6.1.2 TIMER0 INCREMENT DELAY
Q2 and Q4 cycles of the internal phase clocks
(Figure 6-4). Therefore, it is necessary for T0CKI to be Since the prescaler output is synchronized with the
high for at least 2TOSC (and a small RC delay of 20 ns) internal clocks, there is a small delay from the time the
and low for at least 2TOSC (and a small RC delay of external clock edge occurs to the time the Timer0
20 ns). Refer to the electrical specification of the module is actually incremented. Figure 6-4 shows the
desired device. delay from the external clock edge to the timer
incrementing.
6.1.3 OPTION REGISTER EFFECT ON GP2 TRIS
If the option register is set to read TIMER0 from the pin,

the port is forced to an input regardless of the TRIS reg-
ister setting.
FIGURE 6-4: TIMER0 TIMING WITH EXTERNAL CLOCK
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
External Clock Input or Small pulse
Prescaler Output (2) misses sampling
(1)
External Clock/Prescaler (3)
Output After Sampling
Increment Timer0 (Q4)
Timer0 T0 T0 + 1 T0 + 2
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc).
Therefore, the error in measuring the interval between two edges on Timer0 input = ± 4Tosc max.
2: External clock if no prescaler selected, Prescaler output otherwise.
3: The arrows indicate the points in time where sampling occurs.

PIC12C5XX
6.2 Prescaler EXAMPLE 6-1: CHANGING PRESCALER
(TIMER0→WDT)
An 8-bit counter is available as a prescaler for the 1.CLRWDT ;Clear WDT
Timer0 module, or as a postscaler for the Watchdog 2.CLRF TMR0 ;Clear TMR0 & Prescaler
Timer (WDT), respectively (Section 8.6). For simplicity, 3.MOVLW '00xx1111’b ;These 3 lines (5, 6, 7)
this counter is being referred to as “prescaler” 4.OPTION ; are required only if
throughout this data sheet. Note that the prescaler ; desired
may be used by either the Timer0 module or the WDT, 5.CLRWDT ;PS<2:0> are 000 or 001
but not both. Thus, a prescaler assignment for the 6.MOVLW '00xx1xxx’b ;Set Postscaler to
Timer0 module means that there is no prescaler for 7.OPTION ; desired WDT rate
the WDT, and vice-versa. To change prescaler from the WDT to the Timer0
The PSA and PS2:PS0 bits (OPTION<3:0>) module, use the sequence shown in Example 6-2. This
determine prescaler assignment and prescale ratio. sequence must be used even if the WDT is disabled. A
CLRWDT instruction should be executed before
When assigned to the Timer0 module, all instructions switching the prescaler.
writing to the TMR0 register (e.g., CLRF 1,
MOVWF 1, BSF 1,x, etc.) will clear the prescaler.
EXAMPLE 6-2: CHANGING PRESCALER
When assigned to WDT, a CLRWDT instruction will
(WDT→TIMER0)
clear the prescaler along with the WDT. The prescaler
CLRWDT ;Clear WDT and
is neither readable nor writable. On a RESET, the ;prescaler
prescaler contains all '0's. MOVLW 'xxxx0xxx' ;Select TMR0, new
;prescale value and
6.2.1 SWITCHING PRESCALER ASSIGNMENT ;clock source
OPTION
The prescaler assignment is fully under software control
(i.e., it can be changed “on the fly” during program
execution). To avoid an unintended device RESET, the
following instruction sequence (Example 6-1) must be
executed when changing the prescaler assignment from
Timer0 to the WDT.
FIGURE 6-5: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER

TCY ( = Fosc/4)
Data Bus
0 8
GP2/T0CKI M
Pin 1
U M
1 X Sync
U 2 TMR0 reg
0 X Cycles
T0SE T0CS
PSA
0
8-bit Prescaler
M
U
1 X
Watchdog 8
Timer
8 - to - 1MUX PS2:PS0
PSA
0 1
WDT Enable bit
MUX PSA
WDT
Time-Out
Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register.

PIC12C5XX
7.0 EEPROM PERIPHERAL Namely, to avoid code overhead in modifying the TRIS
register, both SDA and SCL are always outputs. To
OPERATION read data from the EEPROM peripheral requires out-
This section applies to PIC12CE518 and putting a ‘1’ on SDA placing it in high-Z state, where
PIC12CE519 only. only the internal 100K pull-up is active on the SDA line.
The PIC12CE518 and PIC12CE519 each have 16 SDA:
bytes of EEPROM data memory. The EEPROM mem- Built-in 100K (typical) pull-up to VDD
ory has an endurance of 1,000,000 erase/write cycles Open-drain (pull-down only)
and a data retention of greater than 40 years. The Always an output
EEPROM data memory supports a bi-directional 2-wire Outputs a ‘1’ on reset
bus and data transmission protocol. These two-wires SCL:
are serial data (SDA) and serial clock (SCL), that are Full CMOS output
mapped to bit6 and bit7, respectively, of the GPIO reg- Always an output
ister (SFR 06h). Unlike the GP0-GP5 that are con- Outputs a ‘1’ on reset
nected to the I/O pins, SDA and SCL are only
The following example requires:
connected to the internal EEPROM peripheral. For
most applications, all that is required is calls to the fol- • Code Space: 77 words
lowing functions: • RAM Space: 5 bytes (4 are overlayable)
; Byte_Write: Byte write routine • Stack Levels:1 (The call to the function itself. The
; Inputs: EEPROM Address EEADDR functions do not call any lower level functions.)
; EEPROM Data EEDATA • Timing:
; Outputs: Return 01 in W if OK, else
return 00 in W
- WRITE_BYTE takes 328 cycles
; - READ_CURRENT takes 212 cycles
; Read_Current: Read EEPROM at address - READ_RANDOM takes 416 cycles.
currently held by EE device.
• IO Pins: 0 (No external IO pins are used)
; Inputs: NONE
; Outputs: EEPROM Data EEDATA
; Return 01 in W if OK, else
This code must reside in the lower half of a page. The
return 00 in W
;
code achieves it’s small size without additional calls
; Read_Random: Read EEPROM byte at supplied through the use of a sequencing table. The table is a
address list of procedures that must be called in order. The
; Inputs: EEPROM Address EEADDR table uses an ADDWF PCL,F instruction, effectively a
; Outputs: EEPROM Data EEDATA computed goto, to sequence to the next procedure.
; Return 01 in W if OK, However the ADDWF PCL,F instruction yields an 8 bit
else return 00 in W address, forcing the code to reside in the first 256
The code for these functions is available on our website addresses of a page.
www.microchip.com. The code will be accessed by
either including the source code FL51XINC.ASM or by
linking FLASH5IX.ASM.
It is very important to check the return codes when
using these calls, and retry the operation if unsuccess-
ful. Unsuccessful return codes occur when the EE data
memory is busy with the previous write, which can take
up to 4 mS.
7.0.1 SERIAL DATA
SDA is a bi-directional pin used to transfer addresses

and data into and data out of the device.
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the START and STOP condi-
tions.
The EEPROM interface is a 2-wire bus protocol con-
sisting of data (SDA) and a clock (SCL). Although
these lines are mapped into the GPIO register, they are
not accessible as external pins; only to the internal
EEPROM peripheral. SDA and SCL operation is also
slightly different than GPO-GP5 as listed below.

PIC12C5XX
Figure 7-1: Block diagram of GPIO6 (SDA line)
VDD
reset
To 24L00 SDA
Pad
D
EN
write ck Q
databus GPIO
Output Latch
Q D
EN
ck
Schmitt Trigger
Input Latch
Read ltchpin
GPIO
Figure 7-2: Block diagram of GPIO7 (SCL line)
VDD
D
To 24LC00 SCL
Pad
EN
write ck Q
databus GPIO
Q D
EN
ck Schmitt Trigger
Read ltchpin
GPIO

PIC12C5XX
7.0.2 SERIAL CLOCK 7.1.4 DATA VALID (D)
This SCL input is used to synchronize the data transfer The state of the data line represents valid data when,
from and to the device. after a START condition, the data line is stable for the
duration of the HIGH period of the clock signal.
7.1 BUS CHARACTERISTICS
The data on the line must be changed during the LOW
The following bus protocol is to be used with the period of the clock signal. There is one bit of data per
EEPROM data memory. clock pulse.
• Data transfer may be initiated only when the bus Each data transfer is initiated with a START condition
is not busy. and terminated with a STOP condition. The number of
the data bytes transferred between the START and
During data transfer, the data line must remain stable
STOP conditions is determined by the master device
whenever the clock line is HIGH. Changes in the data
and is theoretically unlimited.
line while the clock line is HIGH will be interpreted as a
START or STOP condition. 7.1.5 ACKNOWLEDGE
Accordingly, the following bus conditions have been
Each receiving device, when addressed, is obliged to
defined (Figure 7-3).
generate an acknowledge after the reception of each
7.1.1 BUS NOT BUSY (A) byte. The master device must generate an extra clock
pulse which is associated with this acknowledge bit.
Both data and clock lines remain HIGH.
Note: Acknowledge bits are not generated if an
7.1.2 START DATA TRANSFER (B) internal programming cycle is in progress.
The device that acknowledges has to pull down the
A HIGH to LOW transition of the SDA line while the
SDA line during the acknowledge clock pulse in such a
clock (SCL) is HIGH determines a START condition. All
way that the SDA line is stable LOW during the HIGH
commands must be preceded by a START condition.
period of the acknowledge related clock pulse. Of
7.1.3 STOP DATA TRANSFER (C) course, setup and hold times must be taken into
account. A master must signal an end of data to the
A LOW to HIGH transition of the SDA line while the slave by not generating an acknowledge bit on the last
clock (SCL) is HIGH determines a STOP condition. All byte that has been clocked out of the slave. In this case,
operations must be ended with a STOP condition. the slave must leave the data line HIGH to enable the
master to generate the STOP condition (Figure 7-4).

PIC12C5XX
FIGURE 7-3: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A) (B) (C) (D) (C) (A)

SCL
SDA
START ADDRESS OR DATA STOP

CONDITION ACKNOWLEDGE ALLOWED CONDITION
VALID TO CHANGE
FIGURE 7-4: ACKNOWLEDGE TIMING

Acknowledge
Bit
SCL 1 2 3 4 5 6 7 8 9 1 2 3
SDA Data from transmitter Data from transmitter
Transmitter must release the SDA line at this point Receiver must release the SDA line at this point
allowing the Receiver to pull the SDA line low to so the Transmitter can continue sending data.
acknowledge the previous eight bits of data.
7.2 Device Addressing FIGURE 7-5: CONTROL BYTE FORMAT

After generating a START condition, the bus master Read/Write Bit
transmits a control byte consisting of a slave address
and a Read/Write bit that indicates what type of opera- Device Select Don’t Care
tion is to be performed. The slave address consists of Bits Bits
a 4-bit device code (1010) followed by three don’t care
bits. S 1 0 1 0 X X X R/W ACK
The last bit of the control byte determines the operation
to be performed. When set to a one a read operation is Slave Address
selected, and when set to a zero a write operation is
selected. (Figure 7-5). The bus is monitored for its cor- Start Bit Acknowledge Bit
responding slave address all the time. It generates an
acknowledge bit if the slave address was true and it is
not in a programming mode.

PIC12C5XX
7.3 WRITE OPERATIONS 7.4 ACKNOWLEDGE POLLING
7.3.1 BYTE WRITE Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
Following the start signal from the master, the device complete (this feature can be used to maximize bus
code (4 bits), the don’t care bits (3 bits), and the R/W throughput). Once the stop condition for a write com-
bit (which is a logic low) are placed onto the bus by the mand has been issued from the master, the device ini-
master transmitter. This indicates to the addressed tiates the internally timed write cycle. ACK polling can
slave receiver that a byte with a word address will follow be initiated immediately. This involves the master send-
after it has generated an acknowledge bit during the ing a start condition followed by the control byte for a
ninth clock cycle. Therefore, the next byte transmitted write command (R/W = 0). If the device is still busy with
by the master is the word address and will be written the write cycle, then no ACK will be returned. If no ACK
into the address pointer. Only the lower four address is returned, then the start bit and control byte must be
bits are used by the device, and the upper four bits are re-sent. If the cycle is complete, then the device will
don’t cares. The address byte is acknowledgeable and return the ACK and the master can then proceed with
the master device will then transmit the data word to be the next read or write command. See Figure 7-6 for
written into the addressed memory location. The mem- flow diagram.
ory acknowledges again and the master generates a
stop condition. This initiates the internal write cycle, FIGURE 7-6: ACKNOWLEDGE POLLING
and during this time will not generate acknowledge sig- FLOW
nals (Figure 7-7). After a byte write command, the inter-
nal address counter will not be incremented and will Send
point to the same address location that was just written. Write Command
If a stop bit is transmitted to the device at any point in
the write command sequence before the entire
sequence is complete, then the command will abort
Send Stop
and no data will be written. If more than 8 data bits are
Condition to
transmitted before the stop bit is sent, then the device Initiate Write Cycle
will clear the previously loaded byte and begin loading
the data buffer again. If more than one data byte is
transmitted to the device and a stop bit is sent before a
full eight data bits have been transmitted, then the write Send Start
command will abort and no data will be written. The
EEPROM memory employs a VCC threshold detector
circuit which disables the internal erase/write logic if the
VCC is below minimum VDD. Send Control Byte
with R/W = 0
Byte write operations must be preceded and immedi-
ately followed by a bus not busy bus cycle where both
SDA and SCL are held high.
Did Device NO
Acknowledge
(ACK = 0)?
YES
Next
Operation
FIGURE 7-7: BYTE WRITE

S
S
T
BUS ACTIVITY CONTROL WORD T
A DATA
MASTER BYTE ADDRESS O
R
P
T
SDA LINE S 1 0 1 0 X X X X X X X P
0
A A A
BUS ACTIVITY C C C
K K K
X = Don’t Care Bit

PIC12C5XX
7.5 READ OPERATIONS device as part of a write operation. After the word
address is sent, the master generates a start condition
Read operations are initiated in the same way as write following the acknowledge. This terminates the write
operations with the exception that the R/W bit of the operation, but not before the internal address pointer is
slave address is set to one. There are three basic types set. Then the master issues the control byte again but
of read operations: current address read, random read, with the R/W bit set to a one. It will then issue an
and sequential read. acknowledge and transmits the eight bit data word. The
master will not acknowledge the transfer but does gen-
7.5.1 CURRENT ADDRESS READ
erate a stop condition and the device discontinues
It contains an address counter that maintains the transmission (Figure 7-9). After this command, the
address of the last word accessed, internally incre- internal address counter will point to the address loca-
mented by one. Therefore, if the previous read access tion following the one that was just read.
was to address n, the next current address read opera-
7.5.3 SEQUENTIAL READ
tion would access data from address n + 1. Upon
receipt of the slave address with the R/W bit set to one, Sequential reads are initiated in the same way as a ran-
the device issues an acknowledge and transmits the dom read except that after the device transmits the first
eight bit data word. The master will not acknowledge data byte, the master issues an acknowledge as
the transfer but does generate a stop condition and the opposed to a stop condition in a random read. This
device discontinues transmission (Figure 7-8). directs the device to transmit the next sequentially
addressed 8-bit word (Figure 7-10).
7.5.2 RANDOM READ
To provide sequential reads, it contains an internal
Random read operations allow the master to access address pointer which is incremented by one at the
any memory location in a random manner. To perform completion of each read operation. This address
this type of read operation, first the word address must pointer allows the entire memory contents to be serially
be set. This is done by sending the word address to the read during one operation.
FIGURE 7-8: CURRENT ADDRESS READ

S
T S
BUS ACTIVITY A CONTROL T
MASTER R BYTE O
T P
SDA LINE S 1 0 1 0 X XX 1 P
A N
BUS ACTIVITY C DATA O
K
A
C
X = Don’t Care Bit K
FIGURE 7-9: RANDOM READ

S S
T T S
BUS ACTIVITY A CONTROL WORD A CONTROL T
MASTER R BYTE ADDRESS (n) R BYTE O
T T P
S 1 0 1 0 X X X 0 X X X X S 1 0 1 0 X X X 1 P
SDA LINE
A A A N
C C C DATA (n) O
K K K
BUS ACTIVITY A
C
X = Don’t Care Bit K
FIGURE 7-10: SEQUENTIAL READ

S
BUS ACTIVITY CONTROL T
MASTER BYTE DATA n DATA n + 1 DATA n + 2 DATA n + X O
P
SDA LINE P
A A A A N
BUS ACTIVITY C C C C O
K K K K
A
C
K

PIC12C5XX
8.0 SPECIAL FEATURES OF THE The PIC12C5XX has a Watchdog Timer which can be
shut off only through configuration bit WDTE. It runs
CPU off of its own RC oscillator for added reliability. If using
What sets a microcontroller apart from other XT or LP selectable oscillator options, there is always
processors are special circuits to deal with the needs an 18 ms (nominal) delay provided by the Device
of real-time applications. The PIC12C5XX family of Reset Timer (DRT), intended to keep the chip in reset
microcontrollers has a host of such features intended until the crystal oscillator is stable. If using INTRC or
to maximize system reliability, minimize cost through EXTRC there is an 18 ms delay only on VDD power-up.
elimination of external components, provide power With this timer on-chip, most applications need no
saving operating modes and offer code protection. external reset circuitry.
These features are:
The SLEEP mode is designed to offer a very low
• Oscillator selection current power-down mode. The user can wake-up
• Reset from SLEEP through a change on input pins or
- Power-On Reset (POR) through a Watchdog Timer time-out. Several oscillator
options are also made available to allow the part to fit
- Device Reset Timer (DRT)
the application, including an internal 4 MHz oscillator.
- Wake-up from SLEEP on pin change The EXTRC oscillator option saves system cost while
• Watchdog Timer (WDT) the LP crystal option saves power. A set of
• SLEEP configuration bits are used to select various options.
• Code protection
8.1 Configuration Bits
• ID locations
• In-circuit Serial Programming The PIC12C5XX configuration word consists of 12
bits. Configuration bits can be programmed to select
various device configurations. Two bits are for the
selection of the oscillator type, one bit is the Watchdog
Timer enable bit, and one bit is the MCLR enable bit.
FIGURE 8-1: CONFIGURATION WORD FOR PIC12C5XX
— — — — — — — MCLRE CP WDTE FOSC1 FOSC0 Register: CONFIG

bit11 10 9 8 7 6 5 4 3 2 1 bit0 Address(1): FFFh
bit 11-5: Unimplemented
bit 4: MCLRE: MCLR enable bit.
1 = MCLR pin enabled
0 = MCLR tied to VDD, (Internally)
bit 3: CP: Code protection bit.
1 = Code protection off
0 = Code protection on
bit 2: WDTE: Watchdog timer enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator selection bits
11 = EXTRC - external RC oscillator
10 = INTRC - internal RC oscillator
01 = XT oscillator
00 = LP oscillator
Note 1: Refer to the PIC12C5XX Programming Specifications to determine how to access the
configuration word. This register is not user addressable during device operation.

PIC12C5XX
8.2 Oscillator Configurations TABLE 8-1: CAPACITOR SELECTION
FOR CERAMIC RESONATORS
8.2.1 OSCILLATOR TYPES
- PIC12C5XX
The PIC12C5XX can be operated in four different Osc Resonator Cap. Range Cap. Range
oscillator modes. The user can program two Type Freq C1 C2
configuration bits (FOSC1:FOSC0) to select one of
XT 4.0 MHz 30 pF 30 pF
these four modes:
These values are for design guidance only. Since
• LP: Low Power Crystal each resonator has its own characteristics, the user
• XT: Crystal/Resonator should consult the resonator manufacturer for
appropriate values of external components.
• INTRC: Internal 4 MHz Oscillator
• EXTRC: External Resistor/Capacitor TABLE 8-2: CAPACITOR SELECTION
FOR CRYSTAL OSCILLATOR -
8.2.2 CRYSTAL OSCILLATOR / CERAMIC PIC12C5XX
RESONATORS
Osc Resonator Cap.Range Cap. Range
In XT or LP modes, a crystal or ceramic resonator is Type Freq C1 C2
connected to the GP5/OSC1/CLKIN and GP4/OSC2
LP 32 kHz(1) 15 pF 15 pF
pins to establish oscillation (Figure 8-2). The
XT 200 kHz 47-68 pF 47-68 pF
PIC12C5XX oscillator design requires the use of a
1 MHz 15 pF 15 pF
parallel cut crystal. Use of a series cut crystal may give
4 MHz 15 pF 15 pF
a frequency out of the crystal manufacturers
specifications. When in XT or LP modes, the device Note 1: For VDD > 4.5V, C1 = C2 ≈ 30 pF is
can have an external clock source drive the GP5/ recommended.
OSC1/CLKIN pin (Figure 8-3). These values are for design guidance only. Rs may
be required to avoid overdriving crystals with low
FIGURE 8-2: CRYSTAL OPERATION (OR drive level specification. Since each crystal has its
CERAMIC RESONATOR) (XT own characteristics, the user should consult the crys-
OR LP OSC tal manufacturer for appropriate values of external
CONFIGURATION) components.
C1(1) OSC1 PIC12C5XX
SLEEP
XTAL RF(3)
To internal
logic
OSC2
(2)
RS
C2(1)
Note 1: See Capacitor Selection tables for

recommended values of C1 and C2.
2: A series resistor (RS) may be required for
AT strip cut crystals.
3: RF approximate value = 10 MΩ.
FIGURE 8-3: EXTERNAL CLOCK INPUT

OPERATION (XT OR LP OSC
CONFIGURATION)
Clock from OSC1

ext. system PIC12C5XX
Open OSC2

PIC12C5XX
8.2.3 EXTERNAL CRYSTAL OSCILLATOR 8.2.4 EXTERNAL RC OSCILLATOR
CIRCUIT
For timing insensitive applications, the RC device
Either a prepackaged oscillator or a simple oscillator option offers additional cost savings. The RC oscillator
circuit with TTL gates can be used as an external frequency is a function of the supply voltage, the
crystal oscillator circuit. Prepackaged oscillators resistor (Rext) and capacitor (Cext) values, and the
provide a wide operating range and better stability. A operating temperature. In addition to this, the oscillator
well-designed crystal oscillator will provide good frequency will vary from unit to unit due to normal
performance with TTL gates. Two types of crystal process parameter variation. Furthermore, the
oscillator circuits can be used: one with parallel difference in lead frame capacitance between package
resonance, or one with series resonance. types will also affect the oscillation frequency,
Figure 8-4 shows implementation of a parallel especially for low Cext values. The user also needs to
resonant oscillator circuit. The circuit is designed to take into account variation due to tolerance of external
use the fundamental frequency of the crystal. The R and C components used.
74AS04 inverter performs the 180-degree phase shift Figure 8-6 shows how the R/C combination is
that a parallel oscillator requires. The 4.7 kΩ resistor connected to the PIC12C5XX. For Rext values below
provides the negative feedback for stability. The 10 kΩ 2.2 kΩ, the oscillator operation may become unstable,
potentiometers bias the 74AS04 in the linear region. or stop completely. For very high Rext values
This circuit could be used for external oscillator (e.g., 1 MΩ) the oscillator becomes sensitive to noise,
designs. humidity and leakage. Thus, we recommend keeping
Rext between 3 kΩ and 100 kΩ.
FIGURE 8-4: EXTERNAL PARALLEL
RESONANT CRYSTAL Although the oscillator will operate with no external
capacitor (Cext = 0 pF), we recommend using values
OSCILLATOR CIRCUIT
above 20 pF for noise and stability reasons. With no or
+5V small external capacitance, the oscillation frequency
To Other can vary dramatically due to changes in external
Devices
10k capacitances, such as PCB trace capacitance or
4.7k 74AS04 PIC12C5XX package lead frame capacitance.
74AS04 CLKIN The Electrical Specifications sections show RC
frequency variation from part to part due to normal
process variation. The variation is larger for larger R
10k (since leakage current variation will affect RC
XTAL frequency more for large R) and for smaller C (since
variation of input capacitance will affect RC frequency
10k more).
Also, see the Electrical Specifications sections for
20 pF 20 pF
variation of oscillator frequency due to VDD for given
Rext/Cext values as well as frequency variation due to
Figure 8-5 shows a series resonant oscillator circuit. operating temperature for given R, C, and VDD values.
This circuit is also designed to use the fundamental
frequency of the crystal. The inverter performs a 180- FIGURE 8-6: EXTERNAL RC OSCILLATOR
degree phase shift in a series resonant oscillator MODE
circuit. The 330 Ω resistors provide the negative VDD
feedback to bias the inverters in their linear region.
Rext
FIGURE 8-5: EXTERNAL SERIES Internal
OSC1 clock
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
To Other
N
Cext PIC12C5XX
330 330 Devices
PIC12C5XX
VSS
74AS04 74AS04 74AS04
CLKIN
0.1 µF
XTAL

PIC12C5XX
8.2.5 INTERNAL 4 MHz RC OSCILLATOR Some registers are not reset in any way; they are
unknown on POR and unchanged in any other reset.
The internal RC oscillator provides a fixed 4 MHz (nom- Most other registers are reset to “reset state” on power-
inal) system clock at VDD = 5V and 25°C, see “Electri- on reset (POR), MCLR, WDT or wake-up on pin
cal Specifications” section for information on variation change reset during normal operation. They are not
over voltage and temperature. affected by a WDT reset during SLEEP or MCLR reset
In addition, a calibration instruction is programmed into during SLEEP, since these resets are viewed as
the top of memory which contains the calibration value resumption of normal operation. The exceptions to this
for the internal RC oscillator. This location is never code are TO, PD, and GPWUF bits. They are set or cleared
protected regardless of the code protect settings. This differently in different reset situations. These bits are
value is programmed as a MOVLW XX instruction where used in software to determine the nature of reset. See
XX is the calibration value, and is placed at the reset Table 8-3 for a full description of reset states of all
vector. This will load the W register with the calibration registers.
value upon reset and the PC will then roll over to the
users program at address 0x000. The user then has the
option of writing the value to the OSCCAL Register
(05h) or ignoring it.
OSCCAL, when written to with the calibration value, will
“trim” the internal oscillator to remove process variation
from the oscillator frequency. .
Note: Please note that erasing the device will
also erase the pre-programmed internal
calibration value for the internal oscillator.
The calibration value must be read prior to
erasing the part. so it can be repro-
grammed correctly later.
For the PIC12C508A, PIC12C509A, PIC12CE518,
PIC12CE519, and PIC12CR509A, bits <7:2>, CAL5-
CAL0 are used for calibration. Adjusting CAL5-0 from
000000 to 111111 yields a higher clock speed. Note
that bits 1 and 0 of OSCCAL are unimplemented and
should be written as 0 when modifying OSCCAL for
compatibility with future devices.
For the PIC12C508 and PIC12C509, the upper 4 bits of
the register are used. Writing a larger value in this loca-
tion yields a higher clock speed.
8.3 RESET
The device differentiates between various kinds of
reset:
a) Power on reset (POR)
b) MCLR reset during normal operation
c) MCLR reset during SLEEP
d) WDT time-out reset during normal operation
e) WDT time-out reset during SLEEP
f) Wake-up from SLEEP on pin change

PIC12C5XX
TABLE 8-3: RESET CONDITIONS FOR REGISTERS
MCLR Reset
Register Address Power-on Reset WDT time-out
Wake-up on Pin Change
W (PIC12C508/509) — qqqq xxxx (1) qqqq uuuu (1)
W (PIC12C508A/509A/ — qqqq qqxx (1) qqqq qquu (1)
PIC12CE518/519/
PIC12CE509A)
INDF 00h xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu
PC 02h 1111 1111 1111 1111
STATUS 03h 0001 1xxx q00q quuu (2,3)
FSR (PIC12C508/ 04h 111x xxxx 111u uuuu
PIC12C508A/
PIC12CE518)
FSR (PIC12C509/ 04h 110x xxxx 11uu uuuu
PIC12C509A/
PIC12CE519/
PIC12CR509A)
OSCCAL 05h 0111 ---- uuuu ----
(PIC12C508/509)
OSCCAL 05h 1000 00-- uuuu uu--
(PIC12C508A/509A/
PIC12CE518/512/
PIC12CR509A)
GPIO 06h --xx xxxx --uu uuuu
(PIC12C508/PIC12C509/
PIC12C508A/
PIC12C509A/
PIC12CR509A)
GPIO 06h
(PIC12CE518/
PIC12CE519) 11xx xxxx 11uu uuuu
OPTION — 1111 1111 1111 1111
TRIS — --11 1111 --11 1111
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Note 1: Bits <7:2> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory.
Note 2: See Table 8-7 for reset value for specific conditions
Note 3: If reset was due to wake-up on pin change, then bit 7 = 1. All other resets will cause bit 7 = 0.
TABLE 8-4: RESET CONDITION FOR SPECIAL REGISTERS
STATUS Addr: 03h PCL Addr: 02h
Power on reset 0001 1xxx 1111 1111

MCLR reset during normal operation 000u uuuu 1111 1111
MCLR reset during SLEEP 0001 0uuu 1111 1111
WDT reset during SLEEP 0000 0uuu 1111 1111
WDT reset normal operation 0000 uuuu 1111 1111
Wake-up from SLEEP on pin change 1001 0uuu 1111 1111
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’.

PIC12C5XX
8.3.1 MCLR ENABLE The Power-On Reset circuit and the Device Reset
Timer (Section 8.5) circuit are closely related. On
This configuration bit when unprogrammed (left in the power-up, the reset latch is set and the DRT is reset.
‘1’ state) enables the external MCLR function. When The DRT timer begins counting once it detects MCLR
programmed, the MCLR function is tied to the internal to be high. After the time-out period, which is typically
VDD, and the pin is assigned to be a GPIO. See 18 ms, it will reset the reset latch and thus end the on-
Figure 8-7. When pin GP3/MCLR/VPP is configured as chip reset signal.
MCLR, the internal pull-up is always on.
A power-up example where MCLR is held low is
FIGURE 8-7: MCLR SELECT shown in Figure 8-9. VDD is allowed to rise and
stabilize before bringing MCLR high. The chip will
actually come out of reset TDRT msec after MCLR
goes high.
MCLRE
In Figure 8-10, the on-chip Power-On Reset feature is
WEAK being used (MCLR and VDD are tied together or the
PULL-UP pin is programmed to be GP3.). The VDD is stable
INTERNAL MCLR before the start-up timer times out and there is no
GP3/MCLR/V PP
problem in getting a proper reset. However, Figure 8-
11 depicts a problem situation where VDD rises too
slowly. The time between when the DRT senses that
MCLR is high and when MCLR (and VDD) actually
8.4 Power-On Reset (POR) reach their full value, is too long. In this situation, when
the start-up timer times out, VDD has not reached the
The PIC12C5XX family incorporates on-chip Power- VDD (min) value and the chip is, therefore, not
On Reset (POR) circuitry which provides an internal guaranteed to function correctly. For such situations,
chip reset for most power-up situations. we recommend that external RC circuits be used to
achieve longer POR delay times (Figure 8-10).
The on-chip POR circuit holds the chip in reset until
VDD has reached a high enough level for proper opera- Note: When the device starts normal operation
tion. To take advantage of the internal POR, program (exits the reset condition), device operating
the GP3/MCLR/VPP pin as MCLR and tie through a parameters (voltage, frequency, tempera-
resistor to VDD or program the pin as GP3. An internal ture, etc.) must be meet to ensure opera-
weak pull-up resistor is implemented using a transistor. tion. If these conditions are not met, the
Refer to Table 11-1 for the pull-up resistor ranges. This device must be held in reset until the oper-
will eliminate external RC components usually needed ating conditions are met.
to create a Power-on Reset. A maximum rise time for
For additional information refer to Application Notes
VDD is specified. See Electrical Specifications for
“Power-Up Considerations” - AN522 and “Power-up
details.
Trouble Shooting” - AN607.
When the device starts normal operation (exits the
reset condition), device operating parameters (voltage,
frequency, temperature, ...) must be met to ensure
operation. If these conditions are not met, the device
must be held in reset until the operating parameters are
met.
A simplified block diagram of the on-chip Power-On
Reset circuit is shown in Figure 8-8.

PIC12C5XX
FIGURE 8-8: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Power-Up
Detect
POR (Power-On Reset) Pin Change
VDD Wake-up on
pin change
SLEEP
GP3/MCLR/VPP
WDT Time-out
MCLRE
RESET
8-bit Asynch S Q
On-Chip Ripple Counter
DRT OSC (Start-Up Timer)
R Q
CHIP RESET
FIGURE 8-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW)
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 8-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET

PIC12C5XX
FIGURE 8-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME
V1
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In
this example, the chip will reset properly if, and only if, V1 ≥ VDD min.
8.5 Device Reset Timer (DRT) 8.6 Watchdog Timer (WDT)

In the PIC12C5XX, DRT runs from RESET and varies The Watchdog Timer (WDT) is a free running on-chip
based on oscillator selection (see Table 8-5.) RC oscillator which does not require any external
The DRT operates on an internal RC oscillator. The components. This RC oscillator is separate from the
processor is kept in RESET as long as the DRT is external RC oscillator of the GP5/OSC1/CLKIN pin
active. The DRT delay allows VDD to rise above VDD and the internal 4 MHz oscillator. That means that the
min., and for the oscillator to stabilize. WDT will run even if the main processor clock has
been stopped, for example, by execution of a SLEEP
Oscillator circuits based on crystals or ceramic instruction. During normal operation or SLEEP, a WDT
resonators require a certain time after power-up to reset or wake-up reset generates a device RESET.
establish a stable oscillation. The on-chip DRT keeps
the device in a RESET condition for approximately 18 The TO bit (STATUS<4>) will be cleared upon a
ms after MCLR has reached a logic high (VIHMCLR) Watchdog Timer reset.
level. Thus, programming GP3/MCLR/VPP as MCLR The WDT can be permanently disabled by
and using an external RC network connected to the programming the configuration bit WDTE as a ’0’
MCLR input is not required in most cases, allowing for (Section 8.1). Refer to the PIC12C5XX Programming
savings in cost-sensitive and/or space restricted Specifications to determine how to access the
applications, as well as allowing the use of the GP3/ configuration word.
MCLR/VPP pin as a general purpose input.
TABLE 8-5: DRT (DEVICE RESET TIMER
The Device Reset time delay will vary from chip to chip PERIOD)
due to VDD, temperature, and process variation. See
AC parameters for details. Oscillator Subsequent
POR Reset
The DRT will also be triggered upon a Watchdog Configuration Resets
Timer time-out. This is particularly important for IntRC & 18 ms (typical) 300 µs (typical)
applications using the WDT to wake from SLEEP ExtRC
mode automatically.
XT & LP 18 ms (typical) 18 ms (typical)

PIC12C5XX
8.6.1 WDT PERIOD 8.6.2 WDT PROGRAMMING CONSIDERATIONS
The WDT has a nominal time-out period of 18 ms, The CLRWDT instruction clears the WDT and the
(with no prescaler). If a longer time-out period is postscaler, if assigned to the WDT, and prevents it
desired, a prescaler with a division ratio of up to 1:128 from timing out and generating a device RESET.
can be assigned to the WDT (under software control) The SLEEP instruction resets the WDT and the
by writing to the OPTION register. Thus, a time-out postscaler, if assigned to the WDT. This gives the
period of a nominal 2.3 seconds can be realized. maximum SLEEP time before a WDT wake-up reset.
These periods vary with temperature, VDD and part-to-
part process variations (see DC specs).
Under worst case conditions (VDD = Min., Temperature
= Max., max. WDT prescaler), it may take several
seconds before a WDT time-out occurs.
FIGURE 8-12: WATCHDOG TIMER BLOCK DIAGRAM

From Timer0 Clock Source
(Figure 8-5)
0
M Postscaler
Watchdog 1 Postscaler
U
Timer
X
8 - to - 1 MUX PS2:PS0
WDT Enable PSA

Configuration Bit
To Timer0 (Figure 8-4)
0 1
MUX PSA
Note: T0CS, T0SE, PSA, PS2:PS0
are bits in the OPTION register.
WDT
Time-out
TABLE 8-6: SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER
Value on Value on
Power-On All Other
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Resets
Legend: Shaded boxes = Not used by Watchdog Timer, — = unimplemented, read as ’0’, u = unchanged

PIC12C5XX
8.7 Time-Out Sequence, Power Down, FIGURE 8-14: BROWN-OUT PROTECTION
and Wake-up from SLEEP Status Bits CIRCUIT 2
(TO/PD/GPWUF) VDD
The TO, PD, and GPWUF bits in the STATUS register VDD
can be tested to determine if a RESET condition has VDD
been caused by a power-up condition, a MCLR or R1
Watchdog Timer (WDT) reset. Q1
MCLR
TABLE 8-7: TO/PD/GPWUF STATUS R2 40k* PIC12C5XX
AFTER RESET
GPWUF TO PD RESET caused by
0 0 0
WDT wake-up from
SLEEP
0 0 u WDT time-out (not from
This brown-out circuit is less expensive, although
SLEEP)
less accurate. Transistor Q1 turns off when VDD
0 1 0 MCLR wake-up from is below a certain level such that:
SLEEP
R1
0 1 1 Power-up VDD • = 0.7V
R1 + R2
0 u u MCLR not during SLEEP
1 1 0 Wake-up from SLEEP on *Refer to Figure 8-7 and Table 11-1 for internal
pin change weak pull-up on MCLR.
Legend: u = unchanged
Note 1: The TO, PD, and GPWUF bits maintain FIGURE 8-15: BROWN-OUT PROTECTION
their status (u) until a reset occurs. A low- CIRCUIT 3
pulse on the MCLR input does not change
the TO, PD, and GPWUF status bits. VDD
8.8 Reset on Brown-Out MCP809 VDD

bypass
Vss capacitor
A brown-out is a condition where device power (VDD) VDD
dips below its minimum value, but not to zero, and then RST
recovers. The device should be reset in the event of a MCLR
brown-out.
PIC12C5XX
To reset PIC12C5XX devices when a brown-out
occurs, external brown-out protection circuits may be
built, as shown in Figure 8-13 , Figure 8-14 and This brown-out protection circuit employs
Figure 8-15 Microchip Technology’s MCP809 microcontroller
supervisor. The MCP8XX and MCP1XX family of
FIGURE 8-13: BROWN-OUT PROTECTION supervisors provide push-pull and open collector
CIRCUIT 1 outputs with both high and low active reset pins.
There are 7 different trip point selections to
VDD accomodate 5V and 3V systems.
VDD
VDD
33k
Q1
10k
MCLR
40k* PIC12C5XX
This circuit will activate reset when VDD goes below

Vz + 0.7V (where Vz = Zener voltage).
*Refer to Figure 8-7 and Table 11-1 for internal
weak pull-up on MCLR.

PIC12C5XX
8.9 Power-Down Mode (SLEEP) 8.10 Program Verification/Code Protection
A device may be powered down (SLEEP) and later If the code protection bit has not been programmed,
powered up (Wake-up from SLEEP). the on-chip program memory can be read out for
verification purposes.
8.9.1 SLEEP
The first 64 locations can be read by the PIC12C5XX
The Power-Down mode is entered by executing a regardless of the code protection bit setting.
SLEEP instruction. The last memory location cannot be read if code pro-
If enabled, the Watchdog Timer will be cleared but tection is enabled on the PIC12C508/509.
keeps running, the TO bit (STATUS<4>) is set, the PD The last memory location can be read regardless of the
bit (STATUS<3>) is cleared and the oscillator driver is code protection bit setting on the PIC12C508A/509A/
turned off. The I/O ports maintain the status they had CR509A/CE518/CE519.
before the SLEEP instruction was executed (driving
high, driving low, or hi-impedance). 8.11 ID Locations
It should be noted that a RESET generated by a WDT
Four memory locations are designated as ID locations
time-out does not drive the MCLR pin low.
where the user can store checksum or other code-
For lowest current consumption while powered down, identification numbers. These locations are not
the T0CKI input should be at VDD or VSS and the GP3/ accessible during normal execution but are readable
MCLR/VPP pin must be at a logic high level (VIHMC) if and writable during program/verify.
MCLR is enabled.
Use only the lower 4 bits of the ID locations and
8.9.2 WAKE-UP FROM SLEEP always program the upper 8 bits as ’0’s.
The device can wake-up from SLEEP through one of

the following events:
1. An external reset input on GP3/MCLR/VPP pin,
when configured as MCLR.
2. A Watchdog Timer time-out reset (if WDT was
enabled).
3. A change on input pin GP0, GP1, or GP3/
MCLR/VPP when wake-up on change is
enabled.
These events cause a device reset. The TO, PD, and
GPWUF bits can be used to determine the cause of
device reset. The TO bit is cleared if a WDT time-out
occurred (and caused wake-up). The PD bit, which is
set on power-up, is cleared when SLEEP is invoked.
The GPWUF bit indicates a change in state while in
SLEEP at pins GP0, GP1, or GP3 (since the last time
there was a file or bit operation on GP port).
Caution: Right before entering SLEEP, read the
input pins. When in SLEEP, wake up
occurs when the values at the pins change
from the state they were in at the last
reading. If a wake-up on change occurs
and the pins are not read before
reentering SLEEP, a wake up will occur
immediately even if no pins change while
in SLEEP mode.
The WDT is cleared when the device wakes from
sleep, regardless of the wake-up source.

PIC12C5XX
8.12 In-Circuit Serial Programming FIGURE 8-16: TYPICAL IN-CIRCUIT SERIAL
PROGRAMMING
The PIC12C5XX microcontrollers with EPROM pro-
CONNECTION
gram memory can be serially programmed while in the
end application circuit. This is simply done with two
lines for clock and data, and three other lines for power, To Normal
ground, and the programming voltage. This allows cus- Connections
External
tomers to manufacture boards with unprogrammed Connector PIC12C5XX
devices, and then program the microcontroller just Signals
before shipping the product. This also allows the most +5V VDD
recent firmware or a custom firmware to be pro- 0V VSS
grammed.
VPP MCLR/VPP
The device is placed into a program/verify mode by
holding the GP1 and GP0 pins low while raising the CLK GP1
MCLR (VPP) pin from VIL to VIHH (see programming
specification). GP1 becomes the programming clock Data I/O GP0
and GP0 becomes the programming data. Both GP1
and GP0 are Schmitt Trigger inputs in this mode. VDD
After reset, a 6-bit command is then supplied to the
device. Depending on the command, 14-bits of pro- To Normal
gram data are then supplied to or from the device, Connections
depending if the command was a load or a read. For
complete details of serial programming, please refer to
the PIC12C5XX Programming Specifications.
A typical in-circuit serial programming connection is
shown in Figure 8-16.

PIC12C5XX
9.0 INSTRUCTION SET SUMMARY All instructions are executed within a single instruction
cycle, unless a conditional test is true or the program
Each PIC12C5XX instruction is a 12-bit word divided counter is changed as a result of an instruction. In this
into an OPCODE, which specifies the instruction type, case, the execution takes two instruction cycles. One
and one or more operands which further specify the instruction cycle consists of four oscillator periods.
operation of the instruction. The PIC12C5XX Thus, for an oscillator frequency of 4 MHz, the normal
instruction set summary in Table 9-2 groups the instruction execution time is 1 µs. If a conditional test is
instructions into byte-oriented, bit-oriented, and literal true or the program counter is changed as a result of
and control operations. Table 9-1 shows the opcode an instruction, the instruction execution time is 2 µs.
field descriptions.
Figure 9-1 shows the three general formats that the
For byte-oriented instructions, ’f’ represents a file instructions can have. All examples in the figure use the
register designator and ’d’ represents a destination following format to represent a hexadecimal number:
designator. The file register designator is used to
specify which one of the 32 file registers is to be used 0xhhh
by the instruction. where ’h’ signifies a hexadecimal digit.
The destination designator specifies where the result FIGURE 9-1: GENERAL FORMAT FOR
of the operation is to be placed. If ’d’ is ’0’, the result is
INSTRUCTIONS
placed in the W register. If ’d’ is ’1’, the result is placed
in the file register specified in the instruction. Byte-oriented file register operations
For bit-oriented instructions, ’b’ represents a bit field 11 6 5 4 0

designator which selects the number of the bit affected OPCODE d f (FILE #)
by the operation, while ’f’ represents the number of the d = 0 for destination W
file in which the bit is located. d = 1 for destination f
f = 5-bit file register address
For literal and control operations, ’k’ represents an
8 or 9-bit constant or literal value. Bit-oriented file register operations
11 8 7 5 4 0
TABLE 9-1: OPCODE FIELD
OPCODE b (BIT #) f (FILE #)
DESCRIPTIONS
b = 3-bit bit address
Field Description f = 5-bit file register address
f Register file address (0x00 to 0x7F) Literal and control operations (except GOTO)
W Working register (accumulator) 11 8 7 0
b Bit address within an 8-bit file register OPCODE k (literal)
k Literal field, constant data or label
k = 8-bit immediate value
Don’t care location (= 0 or 1)
The assembler will generate code with x = 0. It is Literal and control operations - GOTO instruction
x
the recommended form of use for compatibility
with all Microchip software tools. 11 9 8 0
Destination select; OPCODE k (literal)
d = 0 (store result in W)
d k = 9-bit immediate value
d = 1 (store result in file register ’f’)
Default is d = 1
label Label name
TOS Top of Stack
PC Program Counter
WDT Watchdog Timer Counter
TO Time-Out bit
PD Power-Down bit
Destination, either the W register or the specified
dest register file location
[ ] Options
( ) Contents
→ Assigned to
<> Register bit field
∈ In the set of
italics User defined term (font is courier)

PIC12C5XX
TABLE 9-2: INSTRUCTION SET SUMMARY
12-Bit Opcode
Mnemonic, Status
Operands Description Cycles MSb LSb Affected Notes
ADDWF f,d Add W and f 1 0001 11df ffff C,DC,Z 1,2,4
ANDWF f,d AND W with f 1 0001 01df ffff Z 2,4
CLRF f Clear f 1 0000 011f ffff Z 4
CLRW – Clear W 1 0000 0100 0000 Z
COMF f, d Complement f 1 0010 01df ffff Z
DECF f, d Decrement f 1 0000 11df ffff Z 2,4
DECFSZ f, d Decrement f, Skip if 0 1(2) 0010 11df ffff None 2,4
INCF f, d Increment f 1 0010 10df ffff Z 2,4
INCFSZ f, d Increment f, Skip if 0 1(2) 0011 11df ffff None 2,4
IORWF f, d Inclusive OR W with f 1 0001 00df ffff Z 2,4
MOVF f, d Move f 1 0010 00df ffff Z 2,4
MOVWF f Move W to f 1 0000 001f ffff None 1,4
NOP – No Operation 1 0000 0000 0000 None
RLF f, d Rotate left f through Carry 1 0011 01df ffff C 2,4
RRF f, d Rotate right f through Carry 1 0011 00df ffff C 2,4
SUBWF f, d Subtract W from f 1 0000 10df ffff C,DC,Z 1,2,4
SWAPF f, d Swap f 1 0011 10df ffff None 2,4
XORWF f, d Exclusive OR W with f 1 0001 10df ffff Z 2,4
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF f, b Bit Clear f 1 0100 bbbf ffff None 2,4
BSF f, b Bit Set f 1 0101 bbbf ffff None 2,4
BTFSC f, b Bit Test f, Skip if Clear 1 (2) 0110 bbbf ffff None
BTFSS f, b Bit Test f, Skip if Set 1 (2) 0111 bbbf ffff None
LITERAL AND CONTROL OPERATIONS
ANDLW k AND literal with W 1 1110 kkkk kkkk Z
CALL k Call subroutine 2 1001 kkkk kkkk None 1
CLRWDT k Clear Watchdog Timer 1 0000 0000 0100 TO, PD
GOTO k Unconditional branch 2 101k kkkk kkkk None
IORLW k Inclusive OR Literal with W 1 1101 kkkk kkkk Z
MOVLW k Move Literal to W 1 1100 kkkk kkkk None
OPTION – Load OPTION register 1 0000 0000 0010 None
RETLW k Return, place Literal in W 2 1000 kkkk kkkk None
SLEEP – Go into standby mode 1 0000 0000 0011 TO, PD
TRIS f Load TRIS register 1 0000 0000 0fff None 3
XORLW k Exclusive OR Literal to W 1 1111 kkkk kkkk Z
Note 1: The 9th bit of the program counter will be forced to a ’0’ by any instruction that writes to the PC except for GOTO.
(Section 4.6)
2: When an I/O register is modified as a function of itself (e.g. MOVF GPIO, 1), the value used will be that value
present on the pins themselves. For example, if the data latch is ’1’ for a pin configured as input and is driven
low by an external device, the data will be written back with a ’0’.
3: The instruction TRIS f, where f = 6 causes the contents of the W register to be written to the tristate latches of
GPIO. A ’1’ forces the pin to a hi-impedance state and disables the output buffers.
4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared
(if assigned to TMR0).

PIC12C5XX
ADDWF Add W and f ANDWF AND W with f

Syntax: [ label ] ADDWF f,d Syntax: [ label ] ANDWF f,d
Operands: 0 ≤ f ≤ 31 Operands: 0 ≤ f ≤ 31
d ∈ [0,1] d ∈ [0,1]
Operation: (W) + (f) → (dest) Operation: (W) .AND. (f) → (dest)
Status Affected: C, DC, Z Status Affected: Z
Encoding: 0001 11df ffff Encoding: 0001 01df ffff
Description: Add the contents of the W register and Description: The contents of the W register are
register ’f’. If ’d’ is 0 the result is stored AND’ed with register 'f'. If 'd' is 0 the
in the W register. If ’d’ is ’1’ the result is result is stored in the W register. If 'd' is
stored back in register ’f’. '1' the result is stored back in register 'f'.
Words: 1 Words: 1
Cycles: 1 Cycles: 1
Example: ADDWF FSR, 0 Example: ANDWF FSR, 1
Before Instruction Before Instruction
W = 0x17 W = 0x17
FSR = 0xC2 FSR = 0xC2
After Instruction After Instruction
W = 0xD9 W = 0x17
FSR = 0xC2 FSR = 0x02
ANDLW And literal with W BCF Bit Clear f

Syntax: [ label ] ANDLW k Syntax: [ label ] BCF f,b
Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 31
Operation: (W).AND. (k) → (W) 0≤b≤7
Status Affected: Z Operation: 0 → (f<b>)
Encoding: 1110 kkkk kkkk Status Affected: None
Description: The contents of the W register are Encoding: 0100 bbbf ffff
AND’ed with the eight-bit literal 'k'. The Description: Bit 'b' in register 'f' is cleared.
result is placed in the W register.
Words: 1
Words: 1
Cycles: 1
Cycles: 1
Example: BCF FLAG_REG, 7
Example: ANDLW 0x5F
Before Instruction
Before Instruction FLAG_REG = 0xC7
W = 0xA3
After Instruction
After Instruction FLAG_REG = 0x47
W = 0x03

PIC12C5XX
BSF Bit Set f BTFSS Bit Test f, Skip if Set

Syntax: [ label ] BSF f,b Syntax: [ label ] BTFSS f,b
0≤b≤7 0≤b<7
Operation: 1 → (f<b>) Operation: skip if (f<b>) = 1
Status Affected: None Status Affected: None
Encoding: 0101 bbbf ffff Encoding: 0111 bbbf ffff
Description: Bit ’b’ in register ’f’ is set. Description: If bit ’b’ in register ’f’ is ’1’ then the next
instruction is skipped.
Words: 1
If bit ’b’ is ’1’, then the next instruction
Cycles: 1 fetched during the current instruction
Example: BSF FLAG_REG, 7 execution, is discarded and an NOP is
executed instead, making this a 2 cycle
Before Instruction instruction.
FLAG_REG = 0x0A
Words: 1
After Instruction
FLAG_REG = 0x8A
Cycles: 1(2)
Example: HERE BTFSS FLAG,1
FALSE GOTO PROCESS_CODE
TRUE •
BTFSC Bit Test f, Skip if Clear
•
Syntax: [ label ] BTFSC f,b •
Operands: 0 ≤ f ≤ 31 Before Instruction
0≤b≤7 PC = address (HERE)
Operation: skip if (f<b>) = 0 After Instruction
If FLAG<1> = 0,
Status Affected: None PC = address (FALSE);
Encoding: 0110 bbbf ffff if FLAG<1> = 1,
PC = address (TRUE)
Description: If bit ’b’ in register ’f’ is 0 then the next
instruction is skipped.
If bit ’b’ is 0 then the next instruction
fetched during the current instruction
execution is discarded, and an NOP is
executed instead, making this a 2 cycle
instruction.
Words: 1
Cycles: 1(2)
Example: HERE BTFSC FLAG,1
FALSE GOTO PROCESS_CODE
TRUE •
•
•
Before Instruction
PC = address (HERE)
After Instruction
if FLAG<1> = 0,
PC = address (TRUE);
if FLAG<1> = 1,
PC = address(FALSE)

PIC12C5XX
CALL Subroutine Call CLRW Clear W

Syntax: [ label ] CALL k Syntax: [ label ] CLRW
Operands: 0 ≤ k ≤ 255 Operands: None
Operation: (PC) + 1→ Top of Stack; Operation: 00h → (W);
k → PC<7:0>; 1→Z
(STATUS<6:5>) → PC<10:9>; Status Affected: Z
0 → PC<8>
Encoding: 0000 0100 0000
Status Affected: None
Description: The W register is cleared. Zero bit (Z)
Encoding: 1001 kkkk kkkk is set.
Description: Subroutine call. First, return address Words: 1
(PC+1) is pushed onto the stack. The
eight bit immediate address is loaded Cycles: 1
into PC bits <7:0>. The upper bits Example: CLRW
PC<10:9> are loaded from STA-
TUS<6:5>, PC<8> is cleared. CALL is Before Instruction
a two cycle instruction. W = 0x5A
Words: 1 After Instruction

W = 0x00
Cycles: 2 Z = 1
Example: HERE CALL THERE
Before Instruction
PC = address (HERE) CLRWDT Clear Watchdog Timer
After Instruction Syntax: [ label ] CLRWDT
PC = address (THERE) Operands: None
TOS = address (HERE + 1)
Operation: 00h → WDT;
0 → WDT prescaler (if assigned);
1 → TO;
CLRF Clear f
1 → PD
Syntax: [ label ] CLRF f
Status Affected: TO, PD
Operands: 0 ≤ f ≤ 31
Encoding: 0000 0000 0100
Operation: 00h → (f);
Description: The CLRWDT instruction resets the
1→Z WDT. It also resets the prescaler, if the
Status Affected: Z prescaler is assigned to the WDT and
not Timer0. Status bits TO and PD are
Encoding: 0000 011f ffff
set.
Description: The contents of register ’f’ are cleared
Words: 1
and the Z bit is set.
Cycles: 1
Words: 1
Example: CLRWDT
Cycles: 1
Before Instruction
Example: CLRF FLAG_REG
WDT counter = ?
Before Instruction
After Instruction
FLAG_REG = 0x5A
WDT counter = 0x00
After Instruction WDT prescale = 0
FLAG_REG = 0x00 TO = 1
Z = 1 PD = 1

PIC12C5XX
COMF Complement f DECFSZ Decrement f, Skip if 0

Syntax: [ label ] COMF f,d Syntax: [ label ] DECFSZ f,d
d ∈ [0,1] d ∈ [0,1]
Operation: (f) → (dest) Operation: (f) – 1 → d; skip if result = 0
Status Affected: Z Status Affected: None
Encoding: 0010 01df ffff Encoding: 0010 11df ffff
Description: The contents of register ’f’ are comple- Description: The contents of register ’f’ are decre-
mented. If ’d’ is 0 the result is stored in mented. If ’d’ is 0 the result is placed in
the W register. If ’d’ is 1 the result is the W register. If ’d’ is 1 the result is
stored back in register ’f’. placed back in register ’f’.
Words: 1 If the result is 0, the next instruction,
which is already fetched, is discarded
Cycles: 1 and an NOP is executed instead mak-
Example: COMF REG1,0 ing it a two cycle instruction.
Before Instruction Words: 1

REG1 = 0x13 Cycles: 1(2)
After Instruction Example: HERE DECFSZ CNT, 1
REG1 = 0x13 GOTO LOOP
W = 0xEC CONTINUE •
•
•
DECF Decrement f Before Instruction
Syntax: [ label ] DECF f,d PC = address (HERE)
Operands: 0 ≤ f ≤ 31 After Instruction

CNT = CNT - 1;
d ∈ [0,1]
if CNT = 0,
Operation: (f) – 1 → (dest) PC = address (CONTINUE);
if CNT ≠ 0,
Status Affected: Z
PC = address (HERE+1)
Encoding: 0000 11df ffff
Description: Decrement register ’f’. If ’d’ is 0 the
result is stored in the W register. If ’d’ is GOTO Unconditional Branch
1 the result is stored back in register ’f’.
Syntax: [ label ] GOTO k
Words: 1
Operands: 0 ≤ k ≤ 511
Cycles: 1
Operation: k → PC<8:0>;
Example: DECF CNT, 1 STATUS<6:5> → PC<10:9>
Before Instruction Status Affected: None
CNT = 0x01
Z = 0 Encoding: 101k kkkk kkkk
After Instruction Description: GOTO is an unconditional branch. The

CNT = 0x00 9-bit immediate value is loaded into PC
bits <8:0>. The upper bits of PC are
Z = 1
loaded from STATUS<6:5>. GOTO is a
two cycle instruction.
Words: 1
Cycles: 2
Example: GOTO THERE
After Instruction
PC = address (THERE)

PIC12C5XX
INCF Increment f IORLW Inclusive OR literal with W

Syntax: [ label ] INCF f,d Syntax: [ label ] IORLW k
Operands: 0 ≤ f ≤ 31 Operands: 0 ≤ k ≤ 255
d ∈ [0,1] Operation: (W) .OR. (k) → (W)
Operation: (f) + 1 → (dest) Status Affected: Z
Status Affected: Z Encoding: 1101 kkkk kkkk
Description: The contents of the W register are
Description: The contents of register ’f’ are incre- OR’ed with the eight bit literal 'k'. The
mented. If ’d’ is 0 the result is placed in result is placed in the W register.
the W register. If ’d’ is 1 the result is Words: 1
placed back in register ’f’.
Cycles: 1
Words: 1
Example: IORLW 0x35
Cycles: 1
Before Instruction
Example: INCF CNT, 1 W = 0x9A
Before Instruction After Instruction
CNT = 0xFF
W = 0xBF
Z = 0
Z = 0
After Instruction
CNT = 0x00
Z = 1 IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
INCFSZ Increment f, Skip if 0 Operands: 0 ≤ f ≤ 31
d ∈ [0,1]
Syntax: [ label ] INCFSZ f,d
Operation: (W).OR. (f) → (dest)
d ∈ [0,1] Status Affected: Z
Operation: (f) + 1 → (dest), skip if result = 0 Encoding: 0001 00df ffff
Status Affected: None Description: Inclusive OR the W register with regis-

ter 'f'. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
Description: The contents of register ’f’ are incre- placed back in register 'f'.
mented. If ’d’ is 0 the result is placed in Words: 1
the W register. If ’d’ is 1 the result is
placed back in register ’f’. Cycles: 1
If the result is 0, then the next instruc- Example: IORWF RESULT, 0
tion, which is already fetched, is dis-
carded and an NOP is executed Before Instruction
instead making it a two cycle instruc- RESULT = 0x13
tion. W = 0x91
Words: 1 After Instruction

RESULT = 0x13
Cycles: 1(2) W = 0x93
Example: HERE INCFSZ CNT, 1 Z = 0
GOTO LOOP
CONTINUE •
•
•
Before Instruction
PC = address (HERE)
After Instruction
CNT = CNT + 1;
if CNT = 0,
PC = address (CONTINUE);
if CNT ≠ 0,
PC = address (HERE +1)

PIC12C5XX
MOVF Move f MOVWF Move W to f

Syntax: [ label ] MOVF f,d Syntax: [ label ] MOVWF f
d ∈ [0,1] Operation: (W) → (f)
Operation: (f) → (dest) Status Affected: None
Status Affected: Z Encoding: 0000 001f ffff
Description: Move data from the W register to regis-
Description: The contents of register ’f’ is moved to ter 'f'.
destination ’d’. If ’d’ is 0, destination is
Words: 1
the W register. If ’d’ is 1, the destination
is file register ’f’. ’d’ is 1 is useful to test Cycles: 1
a file register since status flag Z is
Example: MOVWF TEMP_REG
affected.
Before Instruction
Words: 1
TEMP_REG = 0xFF
Cycles: 1 W = 0x4F
Example: MOVF FSR, 0 After Instruction
TEMP_REG = 0x4F
After Instruction
W = 0x4F
W = value in FSR register
NOP No Operation
MOVLW Move Literal to W Syntax: [ label ] NOP
Syntax: [ label ] MOVLW k Operands: None
Operands: 0 ≤ k ≤ 255 Operation: No operation
Operation: k → (W) Status Affected: None
Status Affected: None Encoding: 0000 0000 0000
Encoding: 1100 kkkk kkkk Description: No operation.
Description: The eight bit literal ’k’ is loaded into the Words: 1
W register. The don’t cares will assem-
ble as 0s.
Cycles: 1
Words: 1 Example: NOP
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W = 0x5A

PIC12C5XX
OPTION Load OPTION Register RLF Rotate Left f through Carry

Syntax: [ label ] OPTION Syntax: [ label ] RLF f,d
Operands: None Operands: 0 ≤ f ≤ 31
Operation: (W) → OPTION d ∈ [0,1]
Status Affected: None Operation: See description below
Encoding: 0000 0000 0010 Status Affected: C
Description: The content of the W register is loaded Encoding: 0011 01df ffff
into the OPTION register.
Description: The contents of register ’f’ are rotated
Words: 1 one bit to the left through the Carry
Cycles: 1 Flag. If ’d’ is 0 the result is placed in the
W register. If ’d’ is 1 the result is stored
Example OPTION
back in register ’f’.
Before Instruction
C register ’f’
W = 0x07
After Instruction Words: 1
OPTION = 0x07
Cycles: 1
Example: RLF REG1,0
RETLW Return with Literal in W
Before Instruction
Syntax: [ label ] RETLW k REG1 = 1110 0110
C = 0
Operands: 0 ≤ k ≤ 255
After Instruction
Operation: k → (W);
REG1 = 1110 0110
TOS → PC W = 1100 1100
Status Affected: None C = 1
Encoding: 1000 kkkk kkkk
Description: The W register is loaded with the eight
RRF Rotate Right f through Carry
bit literal ’k’. The program counter is
loaded from the top of the stack (the Syntax: [ label ] RRF f,d
return address). This is a two cycle
instruction.
d ∈ [0,1]
Words: 1
Operation: See description below
Cycles: 2
Status Affected: C
Example: CALL TABLE ;W contains
;table offset Encoding: 0011 00df ffff
;value. Description: The contents of register ’f’ are rotated
• ;W now has table one bit to the right through the Carry
• ;value. Flag. If ’d’ is 0 the result is placed in the
• W register. If ’d’ is 1 the result is placed
TABLE ADDWF PC ;W = offset back in register ’f’.
RETLW k1 ;Begin table
RETLW k2 ; C register ’f’
•
• Words: 1
•
Cycles: 1
RETLW kn ; End of table
Before Instruction Example: RRF REG1,0
W = 0x07 Before Instruction
REG1 = 1110 0110
After Instruction
C = 0
W = value of k8
After Instruction
REG1 = 1110 0110
W = 0111 0011
C = 0

PIC12C5XX
SLEEP Enter SLEEP Mode SUBWF Subtract W from f

Syntax: [label] SLEEP Syntax: [label] SUBWF f,d
Operands: None Operands: 0 ≤ f ≤ 31
d ∈ [0,1]
Operation: 00h → WDT;
0 → WDT prescaler; Operation: (f) – (W) → (dest)
1 → TO; Status Affected: C, DC, Z
0 → PD
Status Affected: TO, PD, GPWUF
Description: Subtract (2’s complement method) the
Encoding: 0000 0000 0011 W register from register 'f'. If 'd' is 0 the
Description: Time-out status bit (TO) is set. The result is stored in the W register. If 'd' is
power down status bit (PD) is cleared. 1 the result is stored back in register 'f'.
GPWUF is unaffected. Words: 1
The WDT and its prescaler are Cycles: 1
cleared.
The processor is put into SLEEP mode
Example 1: SUBWF REG1, 1
with the oscillator stopped. See sec- Before Instruction
tion on SLEEP for more details. REG1 = 3
Words: 1 W = 2
C = ?
Cycles: 1
After Instruction
Example: SLEEP REG1 = 1
W = 2
C = 1 ; result is positive
Example 2:
Before Instruction
REG1 = 2
W = 2
C = ?
After Instruction
REG1 = 0
W = 2
C = 1 ; result is zero
Example 3:
Before Instruction
REG1 = 1
W = 2
C = ?
After Instruction
REG1 = FF
W = 2
C = 0 ; result is negative

PIC12C5XX
SWAPF Swap Nibbles in f XORLW Exclusive OR literal with W

Syntax: [ label ] SWAPF f,d Syntax: [label] XORLW k
Operands: 0 ≤ f ≤ 31 Operands: 0 ≤ k ≤ 255
d ∈ [0,1]
Operation: (W) .XOR. k → (W)
Operation: (f<3:0>) → (dest<7:4>);
Status Affected: Z
(f<7:4>) → (dest<3:0>)
Encoding: 1111 kkkk kkkk
Description: The contents of the W register are
XOR’ed with the eight bit literal 'k'. The
Description: The upper and lower nibbles of register result is placed in the W register.
’f’ are exchanged. If ’d’ is 0 the result is
Words: 1
placed in W register. If ’d’ is 1 the result
is placed in register ’f’. Cycles: 1
Words: 1 Example: XORLW 0xAF
Cycles: 1 Before Instruction
W = 0xB5
Example SWAPF REG1, 0
After Instruction
Before Instruction
W = 0x1A
REG1 = 0xA5
After Instruction
REG1 = 0xA5
XORWF Exclusive OR W with f
W = 0X5A
Syntax: [ label ] XORWF f,d
TRIS Load TRIS Register d ∈ [0,1]
Syntax: [ label ] TRIS f Operation: (W) .XOR. (f) → (dest)
Operands: f=6 Status Affected: Z
Operation: (W) → TRIS register f Encoding: 0001 10df ffff
Description: Exclusive OR the contents of the W
Encoding: 0000 0000 0fff register with register 'f'. If 'd' is 0 the
Description: TRIS register ’f’ (f = 6) is loaded with the result is stored in the W register. If 'd' is
contents of the W register 1 the result is stored back in register 'f'.
Words: 1 Words: 1
Cycles: 1 Cycles: 1
Example TRIS GPIO Example XORWF REG,1
Before Instruction Before Instruction
W = 0XA5 REG = 0xAF
After Instruction W = 0xB5
TRIS = 0XA5 After Instruction
Note: f = 6 for PIC12C5XX only. REG = 0x1A
W = 0xB5

PIC12C5XX
NOTES:

PIC12C5XX
10.0 DEVELOPMENT SUPPORT 10.3 ICEPIC: Low-Cost PICmicro
In-Circuit Emulator
10.1 Development Tools
ICEPIC is a low-cost in-circuit emulator solution for the
The PICmicro microcontrollers are supported with a Microchip PIC12CXXX, PIC16C5X and PIC16CXXX
full range of hardware and software development tools: families of 8-bit OTP microcontrollers.
• MPLAB™-ICE Real-Time In-Circuit Emulator ICEPIC is designed to operate on PC-compatible
• ICEPIC Low-Cost PIC16C5X and PIC16CXXX machines ranging from 386 through Pentium based
In-Circuit Emulator machines under Windows 3.x, Windows 95, or Win-
• PRO MATE II Universal Programmer dows NT environment. ICEPIC features real time, non-
intrusive emulation.
• PICSTART Plus Entry-Level Prototype
Programmer 10.4 PRO MATE II: Universal Programmer
• SIMICE
• PICDEM-1 Low-Cost Demonstration Board The PRO MATE II Universal Programmer is a full-fea-
tured programmer capable of operating in stand-alone
• PICDEM-2 Low-Cost Demonstration Board
mode as well as PC-hosted mode. PRO MATE II is CE
• PICDEM-3 Low-Cost Demonstration Board compliant.
• MPASM Assembler
The PRO MATE II has programmable VDD and VPP
• MPLAB SIM Software Simulator supplies which allows it to verify programmed memory
• MPLAB-C17 (C Compiler) at VDD min and VDD max for maximum reliability. It has
• Fuzzy Logic Development System an LCD display for displaying error messages, keys to
(fuzzyTECH−MP) enter commands and a modular detachable socket
• KEELOQ® Evaluation Kits and Programmer assembly to support various package types. In stand-
alone mode the PRO MATE II can read, verify or pro-
10.2 MPLAB-ICE: High Performance gram PIC12CXXX, PIC14C000, PIC16C5X,
Universal In-Circuit Emulator with PIC16CXXX and PIC17CXX devices. It can also set
MPLAB IDE configuration and code-protect bits in this mode.
The MPLAB-ICE Universal In-Circuit Emulator is 10.5 PICSTART Plus Entry Level
intended to provide the product development engineer Development System
with a complete microcontroller design tool set for
PICmicro microcontrollers (MCUs). MPLAB-ICE is The PICSTART programmer is an easy-to-use, low-
supplied with the MPLAB Integrated Development cost prototype programmer. It connects to the PC via
Environment (IDE), which allows editing, “make” and one of the COM (RS-232) ports. MPLAB Integrated
download, and source debugging from a single envi- Development Environment software makes using the
ronment. programmer simple and efficient. PICSTART Plus is not
recommended for production programming.
Interchangeable processor modules allow the system
to be easily reconfigured for emulation of different pro- PICSTART Plus supports all PIC12CXXX, PIC14C000,
cessors. The universal architecture of the MPLAB-ICE PIC16C5X, PIC16CXXX and PIC17CXX devices with
allows expansion to support all new Microchip micro- up to 40 pins. Larger pin count devices such as the
controllers. PIC16C923, PIC16C924 and PIC17C756 may be sup-
ported with an adapter socket. PICSTART Plus is CE
The MPLAB-ICE Emulator System has been designed compliant.
as a real-time emulation system with advanced fea-
tures that are generally found on more expensive devel-
opment tools. The PC compatible 386 (and higher)
machine platform and Microsoft Windows 3.x or
Windows 95 environment were chosen to best make
these features available to you, the end user.
MPLAB-ICE is available in two versions.
MPLAB-ICE 1000 is a basic, low-cost emulator system
with simple trace capabilities. It shares processor mod-
ules with the MPLAB-ICE 2000. This is a full-featured
emulator system with enhanced trace, trigger, and data
monitoring features. Both systems will operate across
the entire operating speed range of the PICmicro
MCU.

PIC12C5XX
10.6 SIMICE Entry-Level Hardware 10.8 PICDEM-2 Low-Cost PIC16CXX
Simulator Demonstration Board
SIMICE is an entry-level hardware development sys- The PICDEM-2 is a simple demonstration board that
tem designed to operate in a PC-based environment supports the PIC16C62, PIC16C64, PIC16C65,
with Microchip’s simulator MPLAB™-SIM. Both SIM- PIC16C73 and PIC16C74 microcontrollers. All the
ICE and MPLAB-SIM run under Microchip Technol- necessary hardware and software is included to
ogy’s MPLAB Integrated Development Environment run the basic demonstration programs. The user
(IDE) software. Specifically, SIMICE provides hardware can program the sample microcontrollers provided
simulation for Microchip’s PIC12C5XX, PIC12CE5XX, with the PICDEM-2 board, on a PRO MATE II pro-
and PIC16C5X families of PICmicro 8-bit microcon- grammer or PICSTART-Plus, and easily test firmware.
trollers. SIMICE works in conjunction with MPLAB-SIM The MPLAB-ICE emulator may also be used with the
to provide non-real-time I/O port emulation. SIMICE PICDEM-2 board to test firmware. Additional prototype
enables a developer to run simulator code for driving area has been provided to the user for adding addi-
the target system. In addition, the target system can tional hardware and connecting it to the microcontroller
provide input to the simulator code. This capability socket(s). Some of the features include a RS-232 inter-
allows for simple and interactive debugging without face, push-button switches, a potentiometer for simu-
having to manually generate MPLAB-SIM stimulus lated analog input, a Serial EEPROM to demonstrate
files. SIMICE is a valuable debugging tool for entry- usage of the I2C bus and separate headers for connec-
level system development. tion to an LCD module and a keypad.
10.7 PICDEM-1 Low-Cost PICmicro 10.9 PICDEM-3 Low-Cost PIC16CXXX

Demonstration Board Demonstration Board
The PICDEM-1 is a simple board which demonstrates The PICDEM-3 is a simple demonstration board that
the capabilities of several of Microchip’s microcontrol- supports the PIC16C923 and PIC16C924 in the PLCC
lers. The microcontrollers supported are: PIC16C5X package. It will also support future 44-pin PLCC
(PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, microcontrollers with a LCD Module. All the neces-
PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and sary hardware and software is included to run the
PIC17C44. All necessary hardware and software is basic demonstration programs. The user can pro-
included to run basic demo programs. The users can gram the sample microcontrollers provided with
program the sample microcontrollers provided with the PICDEM-3 board, on a PRO MATE II program-
the PICDEM-1 board, on a PRO MATE II or mer or PICSTART Plus with an adapter socket, and
PICSTART-Plus programmer, and easily test firm- easily test firmware. The MPLAB-ICE emulator may
ware. The user can also connect the PICDEM-1 also be used with the PICDEM-3 board to test firm-
board to the MPLAB-ICE emulator and download the ware. Additional prototype area has been provided to
firmware to the emulator for testing. Additional proto- the user for adding hardware and connecting it to the
type area is available for the user to build some addi- microcontroller socket(s). Some of the features include
tional hardware and connect it to the microcontroller an RS-232 interface, push-button switches, a potenti-
socket(s). Some of the features include an RS-232 ometer for simulated analog input, a thermistor and
interface, a potentiometer for simulated analog input, separate headers for connection to an external LCD
push-button switches and eight LEDs connected to module and a keypad. Also provided on the PICDEM-3
PORTB. board is an LCD panel, with 4 commons and 12 seg-
ments, that is capable of displaying time, temperature
and day of the week. The PICDEM-3 provides an addi-
tional RS-232 interface and Windows 3.1 software for
showing the demultiplexed LCD signals on a PC. A sim-
ple serial interface allows the user to construct a hard-
ware demultiplexer for the LCD signals.

PIC12C5XX
10.10 MPLAB Integrated Development 10.12 Software Simulator (MPLAB-SIM)
Environment Software
The MPLAB-SIM Software Simulator allows code
The MPLAB IDE Software brings an ease of software development in a PC host environment. It allows the
development previously unseen in the 8-bit microcon- user to simulate the PICmicro series microcontrollers
troller market. MPLAB is a windows based application on an instruction level. On any given instruction, the
which contains: user may examine or modify any of the data areas or
provide external stimulus to any of the pins. The input/
• A full featured editor
output radix can be set by the user and the execution
• Three operating modes
can be performed in; single step, execute until break, or
- editor
in a trace mode.
- emulator
- simulator MPLAB-SIM fully supports symbolic debugging using
• A project manager MPLAB-C17 and MPASM. The Software Simulator
• Customizable tool bar and key mapping offers the low cost flexibility to develop and debug code
• A status bar with project information outside of the laboratory environment making it an
• Extensive on-line help excellent multi-project software development tool.
MPLAB allows you to: 10.13 MPLAB-C17 Compiler
• Edit your source files (either assembly or ‘C’)
• One touch assemble (or compile) and download The MPLAB-C17 Code Development System is a
to PICmicro tools (automatically updates all complete ANSI ‘C’ compiler and integrated develop-
project information) ment environment for Microchip’s PIC17CXXX family of
• Debug using: microcontrollers. The compiler provides powerful inte-
- source files gration capabilities and ease of use not found with
- absolute listing file other compilers.
The ability to use MPLAB with Microchip’s simulator For easier source level debugging, the compiler pro-
allows a consistent platform and the ability to easily vides symbol information that is compatible with the
switch from the low cost simulator to the full featured MPLAB IDE memory display.
emulator with minimal retraining due to development
10.14 Fuzzy Logic Development System
tools.
(fuzzyTECH-MP)
10.11 Assembler (MPASM)
fuzzyTECH-MP fuzzy logic development tool is avail-
The MPASM Universal Macro Assembler is a PC- able in two versions - a low cost introductory version,
hosted symbolic assembler. It supports all microcon- MP Explorer, for designers to gain a comprehensive
troller series including the PIC12C5XX, PIC14000, working knowledge of fuzzy logic system design; and a
PIC16C5X, PIC16CXXX, and PIC17CXX families. full-featured version, fuzzyTECH-MP, Edition for imple-
menting more complex systems.
MPASM offers full featured Macro capabilities, condi-
tional assembly, and several source and listing formats. Both versions include Microchip’s fuzzyLAB demon-
It generates various object code formats to support stration board for hands-on experience with fuzzy logic
Microchip's development tools as well as third party systems implementation.
programmers.
10.15 SEEVAL Evaluation and
MPASM allows full symbolic debugging from MPLAB- Programming System
ICE, Microchip’s Universal Emulator System.
MPASM has the following features to assist in develop- The SEEVAL SEEPROM Designer’s Kit supports all
ing software for specific use applications. Microchip 2-wire and 3-wire Serial EEPROMs. The kit
includes everything necessary to read, write, erase or
• Provides translation of Assembler source code to program special features of any Microchip SEEPROM
object code for all Microchip microcontrollers. product including Smart Serials and secure serials.
• Macro assembly capability. The Total Endurance Disk is included to aid in trade-
• Produces all the files (Object, Listing, Symbol, and off analysis and reliability calculations. The total kit can
special) required for symbolic debug with significantly reduce time-to-market and result in an
Microchip’s emulator systems. optimized system.
• Supports Hex (default), Decimal and Octal source
and listing formats.
MPASM provides a rich directive language to support
programming of the PICmicro. Directives are helpful
in making the development of your assemble source
code shorter and more maintainable.

PIC12C5XX
10.16 KEELOQ Evaluation and
Programming Tools
KEELOQ evaluation and programming tools support
Microchips HCS Secure Data Products. The HCS eval-
uation kit includes an LCD display to show changing
codes, a decoder to decode transmissions, and a pro-
gramming interface to program test transmitters.

24CXX HCS200
PIC12C5XX PIC14000 PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X PIC17C7XX 25CXX HCS300
93CXX HCS301
TABLE 10-1:
MPLAB™-ICE
á
á
á
á
á
á
á
á
á
á
ICEPIC Low-Cost
In-Circuit Emulator
á
á
á
á
á
á
Emulator Products
 1999 Microchip Technology Inc.

MPLAB
Integrated
Development
á
á
á
á
á
á
á
á
á
á
Environment
MPLAB C17*
Compiler
á
á
fuzzyTECH-MP
Explorer/Edition
Software Tools
Fuzzy Logic
á
á
á
á
á
á
á
á
á
Dev. Tool
Total Endurance
Software Model
á
PICSTARTPlus
Low-Cost
á
á
á
á
á
á
á
á
á
á
Universal Dev. Kit

DEVELOPMENT TOOLS FROM MICROCHIP
PRO MATE II
Universal
á
á
á
á
á
á
á
á
á
á
á
á
Programmer
Programmers
KEELOQ
Programmer
á
SEEVAL
Designers Kit
á
SIMICE
á
á
PICDEM-14A
á
PICDEM-1
á
á
á
á
PICDEM-2
á
á
PICDEM-3
á
Demo Boards
KEELOQ®
Evaluation Kit
á
KEELOQ
Transponder Kit
á
DS40139E-page 63
PIC12C5XX
PIC12C5XX
NOTES:

PIC12C5XX
11.0 ELECTRICAL CHARACTERISTICS - PIC12C508/PIC12C509
Absolute Maximum Ratings†
Ambient Temperature under bias ........................................................................................................... –40°C to +125°C
Storage Temperature ............................................................................................................................. –65°C to +150°C
Voltage on VDD with respect to VSS .................................................................................................................0 to +7.5 V
Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V
Voltage on all other pins with respect to VSS ............................................................................... –0.6 V to (VDD + 0.6 V)
Total Power Dissipation(1) ....................................................................................................................................700 mW
Max. Current out of VSS pin ..................................................................................................................................200 mA
Max. Current into VDD pin .....................................................................................................................................150 mA
Input Clamp Current, IIK (VI < 0 or VI > VDD).................................................................................................................... ±20 mA
Output Clamp Current, IOK (VO < 0 or VO > VDD)............................................................................................................. ±20 mA
Max. Output Current sunk by any I/O pin................................................................................................................25 mA
Max. Output Current sourced by any I/O pin...........................................................................................................25 mA
Max. Output Current sourced by I/O port (GPIO) .................................................................................................100 mA
Max. Output Current sunk by I/O port (GPIO )......................................................................................................100 mA
Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
†
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

PIC12C5XX
11.1 DC CHARACTERISTICS: PIC12C508/509 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise specified)

DC Characteristics Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)
Power Supply Pins –40°C ≤ TA ≤ +85°C (industrial)
–40°C ≤ TA ≤ +125°C (extended)
Parm
No.
Characteristic Sym Min Typ(1) Max Units Conditions
D001 Supply Voltage VDD 2.5 5.5 V FOSC = DC to 4 MHz (Commercial/

Industrial)
3.0 5.5 V FOSC = DC to 4 MHz (Extended)
D002 RAM Data Retention VDR 1.5* V Device in SLEEP mode
Voltage(2)
D003 VDD Start Voltage to VPOR VSS V See section on Power-on Reset for details
ensure Power-on Reset
D004 VDD Rise Rate to ensure SVDD 0.05 V/ms See section on Power-on Reset for details
Power-on Reset *
Supply Current(3)
D010 IDD — .78 2.4 mA XT and EXTRC options (4)
FOSC = 4 MHz, VDD = 5.5V
D010C — 1.1 2.4 mA INTRC Option
D010A — 10 27 µA LP OPTION, Commercial Temperature
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
— 14 35 µA LP OPTION, Industrial Temperature
— 14 35 µA LP OPTION, Extended Temperature
Power-Down Current (5)
D020 IPD — 0.25 4 µA VDD = 3.0V, Commercial WDT disabled
D021 — 0.25 5 µA VDD = 3.0V, Industrial WDT disabled
D021B — 2 18 µA VDD = 3.0V, Extended WDT disabled
D022 ∆IWDT — 3.75 8 µA VDD = 3.0V, Commercial
— 3.75 9 µA VDD = 3.0V, Industrial
— 3.75 14 µA VDD = 3.0V, Extended
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as
bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an
impact on the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that
the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the
formula: IR = VDD/2Rext (mA) with Rext in kOhm.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current
is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or
VSS.

PIC12C5XX
11.2 DC CHARACTERISTICS: PIC12C508/509 (Commercial, Industrial, Extended)
Operating temperature 0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
DC CHARACTERISTICS
Operating voltage VDD range as described in DC spec Section 11.1 and
Section 11.2.
Param Characteristic Sym Min Typ† Max Units Conditions
No.
Input Low Voltage
I/O ports VIL -
D030 with TTL buffer VSS - 0.8V V 4.5 < VDD ≤ 5.5V
- 0.15VDD V otherwise
D031 with Schmitt Trigger buffer VSS - 0.15VDD V
D032 MCLR, GP2/T0CKI (in EXTRC mode) VSS - 0.15VDD V
D033 OSC1 (EXTRC) (1) VSS - 0.15VDD
D033 OSC1 (in XT and LP) VSS - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer VSS 2.0V - VDD V 4.5 ≤ VDD ≤ 5.5V
D040A 0.25VDD + - VDD V otherwise
0.8V
D041 with Schmitt Trigger buffer 0.85VDD - VDD V For entire VDD range
D042 MCLR/GP2/T0CKI 0.85VDD - VDD V
D042A OSC1 (XT and LP) 0.7VDD - VDD V Note1
D043 OSC1 (in EXTRC mode) 0.85VDD - VDD V
D070 GPIO weak pull-up current IPUR 50 250 400 µA VDD = 5V, VPIN = VSS
Input Leakage Current (2, 3) For VDD ≤5.5V
D060 I/O ports IIL -1 0.5 +1 µA Vss ≤ VPIN ≤ VDD,
Pin at hi-impedance
D061 MCLR, GP2/T0CKI 20 130 250 µA VPIN = VSS + 0.25V(2)
0.5 +5 µA VPIN = VDD
D063 OSC1 -3 0.5 +3 µA Vss ≤ VPIN ≤ VDD,
XT and LP options
Output Low Voltage
D080 I/O ports/CLKOUT VOL - - 0.6 V IOL = 8.7 mA, VDD = 4.5V
Output High Voltage
D090 I/O ports/CLKOUT (3) VOH VDD - 0.7 - - V IOH = -5.4 mA, VDD = 4.5V
Capacitive Loading Specs on
Output Pins
D100 OSC2 pin COSC2 - - 15 pF In XT and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins CIO - - 50 pF
†Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that
the PIC12C5XX be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as coming out of the pin.

PIC12C5XX
TABLE 11-1: PULL-UP RESISTOR RANGES - PIC12C508/C509
VDD (Volts) Temperature (°C) Min Typ Max Units

GP0/GP1
2.5 –40 38K 42K 63K Ω
25 42K 48K 63K Ω
85 42K 49K 63K Ω
125 50K 55K 63K Ω
5.5 –40 15K 17K 20K Ω
25 18K 20K 23K Ω
85 19K 22K 25K Ω
125 22K 24K 28K Ω
GP3
2.5 –40 285K 346K 417K Ω
25 343K 414K 532K Ω
85 368K 457K 532K Ω
125 431K 504K 593K Ω
5.5 –40 247K 292K 360K Ω
25 288K 341K 437K Ω
85 306K 371K 448K Ω
125 351K 407K 500K Ω

PIC12C5XX
11.3 Timing Parameter Symbology and Load Conditions - PIC12C508/C509
The timing parameter symbols have been created following one of the following formats:
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase subscripts (pp) and their meanings:
pp
2 to mc MCLR
ck CLKOUT osc oscillator
cy cycle time os OSC1
drt device reset timer t0 T0CKI
io I/O port wdt watchdog timer
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
FIGURE 11-1: LOAD CONDITIONS - PIC12C508/C509
Pin CL = 50 pF for all pins except OSC2

CL 15 pF for OSC2 in XT or LP
modes when external clock
is used to drive OSC1
VSS

PIC12C5XX
11.4 Timing Diagrams and Specifications
FIGURE 11-2: EXTERNAL CLOCK TIMING - PIC12C508/C509
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
TABLE 11-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC12C508/C509
AC Characteristics Standard Operating Conditions (unless otherwise specified)

Operating Temperature 0°C ≤ TA ≤ +70°C (commercial),
–40°C ≤ TA ≤ +85°C (industrial),
Operating Voltage VDD range is described in Section 11.1
Parameter
No.
Sym Characteristic Min Typ(1) Max Units Conditions
FOSC External CLKIN Frequency(2)

DC — 4 MHz XT osc mode
DC — 200 kHz LP osc mode
(2)
Oscillator Frequency
0.1 — 4 MHz XT osc mode
1 TOSC External CLKIN Period (2) 250 — — ns EXTRC osc mode
250 — — ns XT osc mode
5 — — ms LP osc mode
Oscillator Period(2) 250 — — ns EXTRC osc mode
250 — 10,000 ns XT osc mode
2 Tcy Instruction Cycle Time(3) — 4/FOSC — —
3 TosL, TosH Clock in (OSC1) Low or High Time 50* — — ns XT oscillator
2* — — ms LP oscillator
4 TosR, TosF Clock in (OSC1) Rise or Fall Time — — 25* ns XT oscillator
— — 50* ns LP oscillator
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
2: All specified values are based on characterization data for that particular oscillator type under standard oper-
ating conditions with the device executing code. Exceeding these specified limits may result in an unstable
oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
3: Instruction cycle period (TCY) equals four times the input oscillator time base period.

PIC12C5XX
TABLE 11-3: CALIBRATED INTERNAL RC FREQUENCIES - PIC12C508/C509

Parameter
No.
Sym Characteristic Min* Typ(1) Max* Units Conditions
Internal Calibrated RC Frequency 3.58 4.00 4.32 MHz VDD = 5.0V
Internal Calibrated RC Frequency 3.50 — 4.26 MHz VDD = 2.5V

FIGURE 11-3: I/O TIMING - PIC12C508/C509
Q4 Q1 Q2 Q3
OSC1
I/O Pin
(input)
17 19 18
I/O Pin Old Value New Value

(output)
20, 21
Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.

PIC12C5XX
TABLE 11-4: TIMING REQUIREMENTS - PIC12C508/C509

Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)
Parameter
No. Sym Characteristic Min Typ(1) Max Units
17 TosH2ioV (3) — — 100* ns

OSC1↑ (Q1 cycle) to Port out valid
18 TosH2ioI OSC1↑ (Q2 cycle) to Port input invalid TBD — — ns
(I/O in hold time)
19 TioV2osH Port input valid to OSC1↑ TBD — — ns
(I/O in setup time)
20 TioR Port output rise time(2, 3) — 10 25** ns
21 TioF Port output fall time(2, 3) — 10 25** ns

** These parameters are design targets and are not tested. No characterization data available at this time.
2: Measurements are taken in EXTRC mode.
3: See Figure 11-1 for loading conditions.
FIGURE 11-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC12C508/C509
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Timeout
(Note 2)
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
2: Runs in MCLR or WDT reset only in XT and LP modes.

PIC12C5XX
TABLE 11-5: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC12C508/C509

Parameter
No. Sym Characteristic Min Typ(1) Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2000* — — ns VDD = 5 V

31 Twdt Watchdog Timer Time-out Period 9* 18* 30* ms VDD = 5 V (Commercial)
(No Prescaler)
32 TDRT Device Reset Timer Period(2) 9* 18* 30* ms VDD = 5 V (Commercial)
34 TioZ I/O Hi-impedance from MCLR Low — — 2000* ns
Note 2: See Table 11-6.
TABLE 11-6: DRT (DEVICE RESET TIMER PERIOD - PIC12C508/C509)

Oscillator Configuration POR Reset Subsequent Resets
IntRC & ExtRC 18 ms (typical) 300 µs (typical)

XT & LP 18 ms (typical) 18 ms (typical)

PIC12C5XX
FIGURE 11-5: TIMER0 CLOCK TIMINGS - PIC12C508/C509
T0CKI
40 41
42
TABLE 11-7: TIMER0 CLOCK REQUIREMENTS - PIC12C508/C509

Operating Voltage VDD range is described in Section 11.1.
Parameter
No.
40 Tt0H T0CKI High Pulse Width - No Prescaler 0.5 TCY + 20* — — ns
- With Prescaler 10* — — ns
41 Tt0L T0CKI Low Pulse Width - No Prescaler 0.5 TCY + 20* — — ns
42 Tt0P T0CKI Period 20 or TCY + 40* — — ns Whichever is greater.
N N = Prescale Value
(1, 2, 4,..., 256)
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.

PIC12C5XX
12.0 DC AND AC CHARACTERISTICS - PIC12C508/PIC12C509
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables
the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information
only and devices will operate properly only within the specified range.
The data presented in this section is a statistical summary of data collected on units from different lots over a period of
time. “Typical” represents the mean of the distribution while “max” or “min” represents (mean + 3σ) and (mean – 3σ)
respectively, where σ is standard deviation.
FIGURE 12-1: CALIBRATED INTERNAL RC FIGURE 12-2: CALIBRATED INTERNAL RC

FREQUENCY RANGE VS. FREQUENCY RANGE VS.
TEMPERATURE (VDD = 2.5V) TEMPERATURE (VDD = 5.0V)
4.50
4.50
4.40
4.40
4.30
4.30
4.20
4.20
Frequency (MHz)
Frequency (MHz)
4.10
4.10
Max.
4.00 Max.
4.00
3.90
3.90
3.80
3.80
3.70 Min.
3.70
3.60
Min. 3.60
3.50
-40 25 85 125 3.50
-40 25 85 125
Temperature (Deg.C)
Temperature (Deg.C)

PIC12C5XX
TABLE 12-1: DYNAMIC IDD (TYPICAL) - WDT ENABLED, 25°C
Oscillator Frequency VDD = 2.5V VDD = 5.5V

External RC 4 MHz 250 µA* 780 µA*
Internal RC 4 MHz 420 µA 1.1 mA
XT 4 MHz 251 µA 780 µA
LP 32 KHz 15 µA 37 µA
*Does not include current through external R&C.
FIGURE 12-3: WDT TIMER TIME-OUT FIGURE 12-4: SHORT DRT PERIOD VS. VDD
PERIOD VS. VDD
1000
50
900
45
800
40
700
35 WDT period (µs)
WDT period (mS)
600
30
Max +125°C
500 Max +125°C
25
Max +85°C Max +85°C
400
20
Typ +25°C 300
Typ +25°C
15
200
10
MIn –40°C
MIn –40°C
100
5 2 3 4 5 6 7
2 3 4 5 6 7 VDD (Volts)
VDD (Volts)

PIC12C5XX
FIGURE 12-5: IOH vs. VOH, VDD = 2.5 V FIGURE 12-7: IOL vs. VOL, VDD = 2.5 V
25
0
-1
20
-2 Max –40°C
15
IOH (mA)
-3
IOL (mA)
Typ +25°C
-4
10
125 °C
Min +
Min +85°C
-5
85°C
Min +
Min +125°C
-6 5
Typ +25°C
C
Max –40°
-7
500m 1.0 1.5 2.0 2.5
0
VOH (Volts) 0 250.0m 500.0m 1.0
VOL (Volts)
FIGURE 12-6: IOH vs. VOH, VDD = 5.5 V
FIGURE 12-8: IOL vs. VOL, VDD = 5.5 V
0 50
-5
Max –40°C
40
-10
IOH (mA)
30 Typ +25°C
-15
IOL (mA)
°C
25
-20 +1 Min +85°C
in 20
C
M
5°
+8
in
C
M
5°
+2
Min +125°C
p
-25
Ty
0°
–4
10
ax
M
-30
3.5 4.0 4.5 5.0 5.5
VOH (Volts) 0
250.0m 500.0m 750.0m 1.0
VOL (Volts)

PIC12C5XX
NOTES:

PIC12C5XX
13.0 ELECTRICAL CHARACTERISTICS - PIC12C508A/PIC12C509A/
PIC12LC508A/PIC12LC509A/PIC12CR509A/PIC12CE518/PIC12CE519/
PIC12LCE518/PIC12LCE519/PIC12LCR509A
Absolute Maximum Ratings†
Ambient Temperature under bias ........................................................................................................... –40°C to +125°C
Storage Temperature ............................................................................................................................. –65°C to +150°C
Voltage on VDD with respect to VSS .................................................................................................................0 to +7.0 V
Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V
Voltage on all other pins with respect to VSS ............................................................................... –0.3 V to (VDD + 0.3 V)
Total Power Dissipation(1) ....................................................................................................................................700 mW
Max. Current out of VSS pin ..................................................................................................................................200 mA
Max. Current into VDD pin .....................................................................................................................................150 mA
Input Clamp Current, IIK (VI < 0 or VI > VDD).................................................................................................................... ±20 mA
Output Clamp Current, IOK (VO < 0 or VO > VDD)............................................................................................................. ±20 mA
Max. Output Current sunk by any I/O pin................................................................................................................25 mA
Max. Output Current sourced by any I/O pin...........................................................................................................25 mA
Max. Output Current sourced by I/O port (GPIO) .................................................................................................100 mA
Max. Output Current sunk by I/O port (GPIO )......................................................................................................100 mA
Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
†
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

PIC12C5XX
13.1 DC CHARACTERISTICS: PIC12C508A/509A (Commercial, Industrial, Extended)
PIC12CE518/519 (Commercial, Industrial, Extended)
PIC12CR509A (Commercial, Industrial, Extended)

DC Characteristics Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)
Power Supply Pins –40°C ≤ TA ≤ +85°C (industrial)
Parm
No.

Industrial, Extended)
Voltage(2)
D003 VDD Start Voltage to ensure VPOR VSS V See section on Power-on Reset for details
Power-on Reset
D004 VDD Rise Rate to ensure SVDD 0.05* V/ms See section on Power-on Reset for details
Power-on Reset
D010 Supply Current(3) IDD — 0.8 1.4 mA XT and EXTRC options (Note 4)
— 30 55 µA LP OPTION, Extended Temperature
D020 Power-Down Current (5) IPD — 0.25 4 µA VDD = 3.0V, Commercial WDT disabled
D021 — 0.25 5 µA VDD = 3.0V, Industrial WDT disabled
D021B — 2 12 µA VDD = 3.0V, Extended WDT disabled
D022 Power-Down Current ∆IWDT — 2.2 5 µA VDD = 3.0V, Commercial
— 2.2 6 µA VDD = 3.0V, Industrial
— 4 11 µA VDD = 3.0V, Extended
Supply Current (3) ∆IEE — 0.1 0.2 mA FOSC = 4 MHz, Vdd = 5.5V,
During read/write to SCL = 400kHz
EEPROM peripheral
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guid-
ance only and is not tested.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the
current consumption.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.

PIC12C5XX
13.2 DC CHARACTERISTICS: PIC12LC508A/509A (Commercial, Industrial)
PIC12LCE518/519 (Commercial, Industrial)
PIC12LCR509A (Commercial, Industrial)

DC Characteristics
Power Supply Pins
Parm
No.
Industrial)
Voltage(2)
D003 VDD Start Voltage to ensure VPOR VSS V See section on Power-on Reset for details
Power-on Reset
D004 VDD Rise Rate to ensure SVDD 0.05* V/ms See section on Power-on Reset for details
Power-on Reset
D010 Supply Current(3) IDD — 0.4 0.8 mA XT and EXTRC options (Note 4)
D020 Power-Down Current (5) IPD
D021 — 0.2 3 µA VDD = 2.5V, Commercial
D021B — 0.2 4 µA VDD = 2.5V, Industrial
∆IWDT — 2.0 4 mA VDD = 2.5V, Commercial
2.0 5 mA VDD = 2.5V, Industrial
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as
bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an
impact on the current consumption.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current
is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or
VSS.

PIC12C5XX
13.3 DC CHARACTERISTICS: PIC12C508A/509A (Commercial, Industrial, Extended)
PIC12C518/519 (Commercial, Industrial, Extended)
PIC12CR509A (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Section 13.2.
No.
Input Low Voltage
I/O ports VIL
D030 with TTL buffer VSS - 0.8V V For 4.5V ≤ VDD ≤ 5.5V
VSS - 0.15VDD V otherwise
D033 OSC1 (in EXTRC mode) VSS - 0.2VDD Note 1
D033 OSC1 (in XT and LP) VSS - 0.3VDD V Note 1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 0.25VDD + - VDD V 4.5V ≤ VDD ≤ 5.5V
0.8V
D040A 2.0V - VDD V otherwise
D042 MCLR, GP2/T0CKI 0.8VDD - VDD V
D042A OSC1 (XT and LP) 0.7VDD - VDD V Note 1
D070 GPIO weak pull-up current (Note 4) IPUR 30 250 400 µA VDD = 5V, VPIN = VSS
MCLR pull-up current - - - 30 µA VDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL - - +1 µA Vss ≤ VPIN ≤ VDD, Pin at hi-
impedance
D061 T0CKI - - +5 µA Vss ≤ VPIN ≤ VDD
D063 OSC1 - - +5 µA Vss ≤ VPIN ≤ VDD, XT and LP osc
configuration
Output Low Voltage
D080 I/O ports VOL - - 0.6 V IOL = 8.5 mA, VDD = 4.5V,
–40°C to +85°C
D080A - - 0.6 V IOL = 7.0 mA, VDD = 4.5V,
–40°C to +125°C
Output High Voltage
D090 I/O ports (Note 3) VOH VDD - 0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
–40°C to +85°C
D090A VDD - 0.7 - - V IOH = -2.5 mA, VDD = 4.5V,
–40°C to +125°C
Output Pins
D100 OSC2 pin COSC2 - - 15 pF In XT and LP modes when exter-
nal clock is used to drive OSC1.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC12C5XX be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: This spec. applies when GP3/MCLR is configured as MCLR. The leakage current of the MCLR circuit is higher than the
standard I/O logic.

PIC12C5XX
13.4 DC CHARACTERISTICS: PIC12LC508A/509A (Commercial, Industrial)
PIC12LC518/519 (Commercial, Industrial)
PIC12LCR509A (Commercial, Industrial)
DC CHARACTERISTICS –40°C ≤ TA ≤ +85°C (industrial)
Section 13.2.
No.
Input Low Voltage
I/O ports VIL
D030 with TTL buffer VSS - 0.8V V For 4.5V ≤ VDD ≤ 5.5V
VSS - 0.15VDD V otherwise
D033 OSC1 (in EXTRC mode) VSS - 0.2VDD V Note 1
D033 OSC1 (in XT and LP) VSS - 0.3VDD V Note 1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 0.25VDD + - VDD V 4.5V ≤ VDD ≤ 5.5V
0.8V
D040A 2.0V - VDD V otherwise
D042 MCLR, GP2/T0CKI 0.8VDD - VDD V
D042A OSC1 (XT and LP) 0.7VDD - VDD V Note 1
D070 GPIO weak pull-up current (Note 4) IPUR 30 250 400 µA VDD = 5V, VPIN = VSS
MCLR pull-up current - - - 30 µA VDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL - - +1 µA Vss ≤ VPIN ≤ VDD, Pin at hi-imped-
ance
D061 T0CKI - - +5 µA Vss ≤ VPIN ≤ VDD
D063 OSC1 - - +5 µA Vss ≤ VPIN ≤ VDD, XT and LP osc
configuration
Output Low Voltage
D080 I/O ports VOL - - 0.6 V IOL = 8.5 mA, VDD = 4.5V,
–40°C to +85°C
D080A - - 0.6 V IOL = 7.0 mA, VDD = 4.5V,
–40°C to +125°C
Output High Voltage
D090 I/O ports (Note 3) VOH VDD - 0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
–40°C to +85°C
D090A VDD - 0.7 - - V IOH = -2.5 mA, VDD = 4.5V,
–40°C to +125°C
Output Pins
D100 OSC2 pin COSC - - 15 pF In XT and LP modes when exter-
2 nal clock is used to drive OSC1.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC12C5XX be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: This spec. applies when GP3/MCLR is configured as MCLR. The leakage current of the MCLR circuit is higher than the
standard I/O logic.

PIC12C5XX
TABLE 13-1: PULL-UP RESISTOR RANGES* - PIC12C508A, PIC12C509A, PIC12CR509A,
PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A,
PIC12LCE518 and PIC12LCE519
VDD (Volts) Temperature (°C) Min Typ Max Units

GP0/GP1
2.5 –40 38K 42K 63K Ω
25 42K 48K 63K Ω
85 42K 49K 63K Ω
125 50K 55K 63K Ω
5.5 –40 15K 17K 20K Ω
25 18K 20K 23K Ω
85 19K 22K 25K Ω
125 22K 24K 28K Ω
GP3
2.5 –40 285K 346K 417K Ω
25 343K 414K 532K Ω
85 368K 457K 532K Ω
125 431K 504K 593K Ω
5.5 –40 247K 292K 360K Ω
25 288K 341K 437K Ω
85 306K 371K 448K Ω
125 351K 407K 500K Ω

PIC12C5XX
13.5 Timing Parameter Symbology and Load Conditions - PIC12C508A, PIC12C509A,
PIC12CR509A, PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A,
The timing parameter symbols have been created following one of the following formats:
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase subscripts (pp) and their meanings:
pp
2 to mc MCLR
ck CLKOUT osc oscillator
cy cycle time os OSC1
drt device reset timer t0 T0CKI
io I/O port wdt watchdog timer
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
FIGURE 13-1: LOAD CONDITIONS - PIC12C508A/C509A, PIC12CE518/519, PIC12LC508A/509A,

PIC12LCE518/519, PIC12LCR509A
Pin CL = 50 pF for all pins except OSC2

CL 15 pF for OSC2 in XT, HS or LP
modes when external clock
is used to drive OSC1
VSS

PIC12C5XX
13.6 Timing Diagrams and Specifications
FIGURE 13-2: EXTERNAL CLOCK TIMING - PIC12C508A, PIC12C509A, PIC12CR509A,

Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
TABLE 13-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC12C508A, PIC12C509A,


Parameter
No.
FOSC External CLKIN Frequency(2)

DC — 4 MHz XT osc mode
Oscillator Frequency(2) DC — 4 MHz EXTRC osc mode
0.1 — 4 MHz XT osc mode
1 TOSC External CLKIN Period(2)
250 — — ns XT osc mode
Oscillator Period(2) 250 — — ns EXTRC osc mode
250 — 10,000 ns XT osc mode
2 Tcy Instruction Cycle Time(3) — 4/FOSC — —
3 TosL, TosH Clock in (OSC1) Low or High Time 50* — — ns XT oscillator
2* — — ms LP oscillator
4 TosR, TosF Clock in (OSC1) Rise or Fall Time — — 25* ns XT oscillator
— — 50* ns LP oscillator
2: All specified values are based on characterization data for that particular oscillator type under standard oper-
ating conditions with the device executing code. Exceeding these specified limits may result in an unstable
oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
3: Instruction cycle period (TCY) equals four times the input oscillator time base period.

PIC12C5XX
TABLE 13-3: CALIBRATED INTERNAL RC FREQUENCIES - PIC12C508A, PIC12C509A,

Parameter
No.
Sym Characteristic Min* Typ(1) Max* Units Conditions
Internal Calibrated RC Frequency 3.65 4.00 4.28 MHz VDD = 5.0V
Internal Calibrated RC Frequency 3.55 — 4.31 MHz VDD = 2.5V


PIC12C5XX
FIGURE 13-3: I/O TIMING - PIC12C508A, PIC12C509A, PIC12CE518, PIC12CE519, PIC12LC508A,
PIC12LC509A, PIC12LCR509A, PIC12LCE518 and PIC12LCE519
Q4 Q1 Q2 Q3
OSC1
I/O Pin
(input)
17 19 18
I/O Pin Old Value New Value

(output)
20, 21
Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 13-4: TIMING REQUIREMENTS - PIC12C508A, PIC12C509A, PIC12CE518, PIC12CE519,

PIC12LC508A, PIC12LC509A, PIC12LCR509A, PIC12LCE518 and PIC12LCE519

Parameter
No. Sym Characteristic Min Typ(1) Max Units
17 TosH2ioV OSC1↑ (Q1 cycle) to Port out valid (3) — — 100* ns
18 TosH2ioI OSC1↑ (Q2 cycle) to Port input invalid TBD — — ns

(I/O in hold time)
19 TioV2osH Port input valid to OSC1↑ TBD — — ns
(I/O in setup time)
20 TioR Port output rise time(2, 3) — 10 25** ns
21 TioF (2, 3) — 10 25** ns

Port output fall time
** These parameters are design targets and are not tested. No characterization data available at this time.
2: Measurements are taken in EXTRC mode.
3: See Figure 13-1 for loading conditions.

PIC12C5XX
FIGURE 13-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING -
PIC12C508A, PIC12C509A, PIC12CE518, PIC12CE519, PIC12LC508A,
PIC12LC509A, PIC12LCR509A, PIC12LCE518 and PIC12LCE519
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Timeout
(Note 2)
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
2: Runs in MCLR or WDT reset only in XT and LP modes.
TABLE 13-5: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC12C508A,
PIC12C509A, PIC12CE518, PIC12CE519, PIC12LC508A, PIC12LC509A,
PIC12LCR509A, PIC12LCE518 and PIC12LCE519

Parameter
No. Sym Characteristic Min Typ(1) Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2000* — — ns VDD = 5 V

31 Twdt Watchdog Timer Time-out Period 9* 18* 30* ms VDD = 5 V (Commercial)
(No Prescaler)
32 TDRT Device Reset Timer Period(2) 9* 18* 30* ms VDD = 5 V (Commercial)
34 TioZ I/O Hi-impedance from MCLR Low — — 2000* ns
Note 2: See Table 13-6.

PIC12C5XX
TABLE 13-6: DRT (DEVICE RESET TIMER PERIOD) - PIC12C508A, PIC12C509A, PIC12CE518,
PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A, PIC12LCE518 and
PIC12LCE519
Oscillator Configuration POR Reset Subsequent Resets
(1)
IntRC & ExtRC 18 ms (typical) 300 µs (typical)(1)
(1)
XT & LP 18 ms (typical) 18 ms (typical)(1)
and are not tested.
FIGURE 13-5: TIMER0 CLOCK TIMINGS - PIC12C508A, PIC12C509A, PIC12CE518, PIC12CE519,

PIC12LC508A, PIC12LC509A, PIC12LCR509A, PIC12LCE518 and PIC12LCE519
T0CKI
40 41
42
TABLE 13-7: TIMER0 CLOCK REQUIREMENTS - PIC12C508A, PIC12C509A, PIC12CE518,

PIC12CE519, PIC12LC508A, PIC12LC509A, PIC12LCR509A, PIC12LCE518 and
PIC12LCE519
Operating Voltage VDD range is described in Section 13.1.
Parameter
No.
40 Tt0H T0CKI High Pulse Width - No Prescaler 0.5 TCY + 20* — — ns
41 Tt0L T0CKI Low Pulse Width - No Prescaler 0.5 TCY + 20* — — ns
42 Tt0P T0CKI Period 20 or TCY + 40* — — ns Whichever is greater.
N N = Prescale Value
(1, 2, 4,..., 256)
and are not tested.

PIC12C5XX
TABLE 13-8: EEPROM MEMORY BUS TIMING REQUIREMENTS - PIC12CE5XX ONLY.

Operating Temperature 0°C ≤ TA ≤ +70°C, Vcc = 3.0V to 5.5V (commercial)
–40°C ≤ TA ≤ +85°C, Vcc = 3.0V to 5.5V (industrial)
–40°C ≤ TA ≤ +125°C, Vcc = 4.5V to 5.5V (extended)
Parameter Symbol Min Max Units Conditions

Clock frequency FCLK — 100 kHz 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
— 100 3.0V ≤ Vcc ≤ 4.5V
— 400 4.5V ≤ Vcc ≤ 5.5V
Clock high time THIGH 4000 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4000 — 3.0V ≤ Vcc ≤ 4.5V
600 — 4.5V ≤ Vcc ≤ 5.5V
Clock low time TLOW 4700 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4700 — 3.0V ≤ Vcc ≤ 4.5V
1300 — 4.5V ≤ Vcc ≤ 5.5V
SDA and SCL rise time TR — 1000 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
(Note 1) — 1000 3.0V ≤ Vcc ≤ 4.5V
— 300 4.5V ≤ Vcc ≤ 5.5V
SDA and SCL fall time TF — 300 ns (Note 1)
START condition hold time THD:STA 4000 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4000 — 3.0V ≤ Vcc ≤ 4.5V
600 — 4.5V ≤ Vcc ≤ 5.5V
START condition setup time TSU:STA 4700 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4700 — 3.0V ≤ Vcc ≤ 4.5V
600 — 4.5V ≤ Vcc ≤ 5.5V
Data input hold time THD:DAT 0 — ns (Note 2)
Data input setup time TSU:DAT 250 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
250 — 3.0V ≤ Vcc ≤ 4.5V
100 — 4.5V ≤ Vcc ≤ 5.5V
STOP condition setup time TSU:STO 4000 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4000 — 3.0V ≤ Vcc ≤ 4.5V
600 — 4.5V ≤ Vcc ≤ 5.5V
Output valid from clock TAA — 3500 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
(Note 2) — 3500 3.0V ≤ Vcc ≤ 4.5V
— 900 4.5V ≤ Vcc ≤ 5.5V
Bus free time: Time the bus must TBUF 4700 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
be free before a new transmis- 4700 — 3.0V ≤ Vcc ≤ 4.5V
sion can start 1300 — 4.5V ≤ Vcc ≤ 5.5V
Output fall time from VIH TOF 20+0.1 250 ns (Note 1), CB ≤ 100 pF
minimum to VIL maximum CB
Input filter spike suppression TSP — 50 ns (Notes 1, 3)
(SDA and SCL pins)
Write cycle time TWC — 4 ms
Endurance 1M — cycles 25°C, VCC = 5.0V, Block Mode (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific appli-
cation, please consult the Total Endurance Model which can be obtained on Microchip’s website.

PIC12C5XX
NOTES:

PIC12C5XX
14.0 DC AND AC CHARACTERISTICS - PIC12C508A/PIC12C509A/
PIC12LC508A/PIC12LC509A, PIC12CE518/PIC12CE519/PIC12CR509A/
PIC12LCE518/PIC12LCE519/ PIC12LCR509A
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables
the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information
only and devices will operate properly only within the specified range.
The data presented in this section is a statistical summary of data collected on units from different lots over a period of
time. “Typical” represents the mean of the distribution while “max” or “min” represents (mean + 3σ) and (mean – 3σ)
respectively, where σ is standard deviation.
FIGURE 14-1: CALIBRATED INTERNAL RC FIGURE 14-2: CALIBRATED INTERNAL RC

FREQUENCY RANGE VS. FREQUENCY RANGE VS.
TEMPERATURE (VDD = 5.0V) TEMPERATURE (VDD = 2.5V)
(INTERNAL RC IS (INTERNAL RC IS
CALIBRATED TO 25°C, 5.0V) CALIBRATED TO 25°C, 5.0V)
4.50 4.50
4.40 4.40
4.30 4.30
Max.
4.20 4.20
Max.
Frequency (MHz)
4.10 4.10
Frequency (MHz)
4.00 4.00
3.90 3.90
3.80 3.80
3.70 Min. 3.70
3.60 3.60
Min.
3.50 3.50
-40 0 25 85 125 -40 0 25 85 125
Temperature (Deg.C) Temperature (Deg.C)

PIC12C5XX
TABLE 14-1: DYNAMIC IDD (TYPICAL) - WDT ENABLED, 25°C
Oscillator Frequency VDD =3.0V VDD = 5.5V

External RC 4 MHz 240 µA* 800 µA*
Internal RC 4 MHz 320 µA 800 µA
XT 4 MHz 300 µA 800 µA
LP 32 KHz 19 µA 50 µA
*Does not include current through external R&C.
FIGURE 14-3: TYPICAL IDD VS. VDD FIGURE 14-4: TYPICAL IDD VS. FREQUENCY
(WDT DIS, 25°C, FREQUENCY (WDT DIS, 25°C, VDD = 5.5V)
= 4MHZ)
600 600
550 550
500 500
450 450
400 400
350 350
IDD (µA)
IDD (µA)
300 300
250 250
200 200
150 150
100 100
0 0
2.5 3.0 4.5 5.0 5.5 0 .5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
VDD (Volts) Frequency (MHz)

PIC12C5XX
FIGURE 14-5: WDT TIMER TIME-OUT FIGURE 14-7: IOH vs. VOH, VDD = 2.5 V
PERIOD vs. VDD
55
-0
50 -1
-2
45
-3
40
-4
WDT period (µS)
IOH (mA)
Min +125°C
35 Min +85°C
-5
Max +125°C
30 -6
Max +85°C Typ +25°C
25 -7
-8
20
Typ +25°C
-9
Max -40°C
15
-10
MIn –40°C .5 .75 1.0 1.25 1.5 1.75 2.0 2.25 2.5
10 VOH (Volts)
0 2.5 3.5 4.5 5.5 6.5
VDD (Volts)
FIGURE 14-6: SHORT DRT PERIOD VS. VDD FIGURE 14-8: IOH vs. VOH, VDD = 3.5 V
950 0
850
-5
750
Min +125°C
IOH (mA)
-10
650
WDT period (µs)
Min +85°C
550 Typ +25°C

-15
Max +125°C
450 Max +85°C

Max -40°C
-20
350
Typ +25°C
250 -25
1.5 2.0 2.5 3.0 3.5
MIn –40°C
VOH (Volts)
150
0
0 2.5 3.5 4.5 5.5 6.5
VDD (Volts)

PIC12C5XX
FIGURE 14-9: IOL vs. VOL, VDD = 2.5 V FIGURE 14-11: IOH vs. VOH, VDD = 5.5 V
35 0
-5
30
Max -40°C -10
5°
25 C
12
-15 n+
Mi
°C
85
n+
20 Mi
IOH (mA)
IOL (mA)
Typ +25°C -20 °C

25
p+
Ty
15 -25
Min +85°C
C
0°
–4
10 -30
ax
M
Min +125°C
5 -35
0 -40
3.5 4.0 4.5 5.0 5.5
0 0.25 0.5 0.75 1.0
VOH (Volts)
VOL (Volts)

45
55
Max -40°C
Max -40°C
40 50
45
35
40
30
35
Typ +25°C Typ +25°C
25
IOL (mA)
IOL (mA)
30
25
20
Min +85°C
20
15
Min +85°C
15
Min +125°C Min +125°C
10
10
0 0
0 0.25 0.5 0.75 1.0 0 0.25 0.5 0.75 1.0
VOL (Volts) VOL (Volts)

PIC12C5XX
FIGURE 14-13: TYPICAL IPD VS. VDD, FIGURE 14-14: VTH (INPUT THRESHOLD
WATCHDOG DISABLED (25°C) VOLTAGE) OF GPIO PINS
VS. VDD
260 1.8
Max (-40 to 125)

250 1.6
VTH (Volts)
240 1.4
Ipd (nA)
Typ (25)
230 1.2
Min (-40 to 125)

220 1.0
210 0.8
200 0.6
2.5 3.0 3.5 4.5 5.0 5.5
VDD (Volts)
0
2.5 3.5 4.5 5.5
VDD (Volts)

PIC12C5XX
FIGURE 14-15: VIL, VIH OF NMCLR, AND T0CKI VS. VDD
3.5
Vih Max (-40 to 125)
VIH Typ (25)
3.0 VIH Min (-40 to 125)
VIL, VIH (Volts)
2.5
2.0
VIL Max (-40 to 125)
1.5 VIL Typ (25)

VIL Min (-40 to 125)
1.0
0.5
2.5 3.5 4.5 5.5
VDD (Volts)

PIC12C5XX
15.0 PACKAGING INFORMATION
15.1 Package Marking Information
8-Lead PDIP (300 mil) Example
XXXXXXXX 12C508A
XXXXXCDE 04I/PSAZ
AABB 9825
8-Lead SOIC (150 mil) Example
XXXXXXX C508A
AABB 9825
8-Lead SOIC (208 mil) Example
XXXXXXX 12C508A
XXXXXXX 04I/SM
AABBCDE 9824SAZ
8-Lead Windowed Ceramic Side Brazed (300 mil) Example
XXX JW
XXXXXX 12C508A
Legend: MM...M Microchip part number information

XX...X Customer specific information*
AA Year code (last 2 digits of calendar year)
BB Week code (week of January 1 is week ‘01’)
C Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D Mask revision number
E Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.

PIC12C5XX
Package Type: K04-018 8-Lead Plastic Dual In-line (P) – 300 mil
D
2
1
n
α
E1
A
A1
R L
c A2
β B1
p
eB B
Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
PCB Row Spacing 0.300 7.62
Number of Pins n 8 8
Pitch p 0.100 2.54
Lower Lead Width B 0.014 0.018 0.022 0.36 0.46 0.56
Upper Lead Width B1† 0.055 0.060 0.065 1.40 1.52 1.65
Shoulder Radius R 0.000 0.005 0.010 0.00 0.13 0.25
Lead Thickness c 0.006 0.012 0.015 0.20 0.29 0.38
Top to Seating Plane A 0.140 0.150 0.160 3.56 3.81 4.06
Top of Lead to Seating Plane A1 0.060 0.080 0.100 1.52 2.03 2.54
Base to Seating Plane A2 0.005 0.020 0.035 0.13 0.51 0.89
Tip to Seating Plane L 0.120 0.130 0.140 3.05 3.30 3.56
Package Length D‡ 0.355 0.370 0.385 9.02 9.40 9.78
Molded Package Width E‡ 0.245 0.250 0.260 6.22 6.35 6.60
Radius to Radius Width E1 0.267 0.280 0.292 6.78 7.10 7.42
Overall Row Spacing eB 0.310 0.342 0.380 7.87 8.67 9.65
Mold Draft Angle Top α 5 10 15 5 10 15
Mold Draft Angle Bottom β 5 10 15 5 10 15
* Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”

PIC12C5XX
Package Type: K04-057 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil
E1
D
2
B n 1
X α
45 °
L
c R2
A
A1
R1 φ
β L1 A2

Pitch p 0.050 1.27
Overall Pack. Height A 0.054 0.061 0.069 1.37 1.56 1.75
Shoulder Height A1 0.027 0.035 0.044 0.69 0.90 1.11
Standoff A2 0.004 0.007 0.010 0.10 0.18 0.25
Molded Package Length D‡ 0.189 0.193 0.196 4.80 4.89 4.98
Outside Dimension E1 0.229 0.237 0.244 5.82 6.01 6.20
Chamfer Distance X 0.010 0.015 0.020 0.25 0.38 0.51
Shoulder Radius R1 0.005 0.005 0.010 0.13 0.13 0.25
Gull Wing Radius R2 0.005 0.005 0.010 0.13 0.13 0.25
Foot Length L 0.011 0.016 0.021 0.28 0.41 0.53
Foot Angle φ 0 4 8 0 4 8
Radius Centerline L1 0.000 0.005 0.010 0.00 0.13 0.25
Lead Thickness c 0.008 0.009 0.010 0.19 0.22 0.25
Lower Lead Width B† 0.014 0.017 0.020 0.36 0.43 0.51
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡

PIC12C5XX
Package Type: K04-056 8-Lead Plastic Small Outline (SM) – Medium, 208 mil
E1
D
2
n 1
B
c R2
A
A1
R1 φ
L1 A2
β

Pitch p 0.050 1.27
Overall Pack. Height A 0.070 0.074 0.079 1.78 1.89 2.00
Shoulder Height A1 0.037 0.042 0.048 0.94 1.08 1.21
Standoff A2 0.002 0.005 0.009 0.05 0.14 0.22
Molded Package Length D‡ 0.200 0.205 0.210 5.08 5.21 5.33
Outside Dimension E1 0.300 0.313 0.325 7.62 7.94 8.26
Shoulder Radius R1 0.005 0.005 0.010 0.13 0.13 0.25
Gull Wing Radius R2 0.005 0.005 0.010 0.13 0.13 0.25
Foot Length L 0.011 0.016 0.021 0.28 0.41 0.53
Foot Angle φ 0 4 8 0 4 8
Radius Centerline L1 0.010 0.015 0.020 0.25 0.38 0.51
Lead Thickness c 0.008 0.009 0.010 0.19 0.22 0.25
Lower Lead Width B† 0.014 0.017 0.020 0.36 0.43 0.51
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡

PIC12C5XX
Package Type: K04-084 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
E W
T D
2
n 1
A
A1
L
A2
c B1
p
eB
B

PCB Row Spacing 0.300 7.62
Pitch p 0.098 0.100 0.102 2.49 2.54 2.59
Lower Lead Width B 0.016 0.018 0.020 0.41 0.46 0.51
Upper Lead Width B1 0.050 0.055 0.060 1.27 1.40 1.52
Lead Thickness c 0.008 0.010 0.012 0.20 0.25 0.30
Top to Seating Plane A 0.145 0.165 0.185 3.68 4.19 4.70
Top of Body to Seating Plane A1 0.103 0.123 0.143 2.62 3.12 3.63
Base to Seating Plane A2 0.025 0.035 0.045 0.64 0.89 1.14
Tip to Seating Plane L 0.130 0.140 0.150 3.30 3.56 3.81
Package Length D 0.510 0.520 0.530 12.95 13.21 13.46
Package Width E 0.280 0.290 0.300 7.11 7.37 7.62
Overall Row Spacing eB 0.310 0.338 0.365 7.87 8.57 9.27
Window Diameter W 0.161 0.166 0.171 4.09 4.22 4.34
Lid Length T 0.440 0.450 0.460 11.18 11.43 11.68
Lid Width U 0.260 0.270 0.280 6.60 6.86 7.11
* Controlling Parameter.

PIC12C5XX
NOTES:

PIC12C5XX
INDEX O
A OPTION Register................................................................ 17
OSC selection..................................................................... 35
ALU ....................................................................................... 9
Applications........................................................................... 4 OSCCAL Register............................................................... 18
Architectural Overview .......................................................... 9 Oscillator Configurations..................................................... 36
Oscillator Types
Assembler
MPASM Assembler..................................................... 61 HS............................................................................... 36
LP ............................................................................... 36
B RC .............................................................................. 36
Block Diagram XT ............................................................................... 36
On-Chip Reset Circuit ................................................. 41
P
Timer0......................................................................... 25
Package Marking Information............................................. 99
TMR0/WDT Prescaler................................................. 28
Packaging Information........................................................ 99
Watchdog Timer.......................................................... 43
PICDEM-1 Low-Cost PICmicro Demo Board ..................... 60
Brown-Out Protection Circuit .............................................. 44
PICDEM-2 Low-Cost PIC16CXX Demo Board................... 60
C PICDEM-3 Low-Cost PIC16CXXX Demo Board ................ 60
CAL0 bit .............................................................................. 18 PICSTART Plus Entry Level Development System ......... 59
CAL1 bit .............................................................................. 18 POR
CAL2 bit .............................................................................. 18 Device Reset Timer (DRT) ................................... 35, 42
CAL3 bit .............................................................................. 18 PD............................................................................... 44
CALFST bit ......................................................................... 18 Power-On Reset (POR).............................................. 35
CALSLW bit ........................................................................ 18 TO............................................................................... 44
Carry ..................................................................................... 9 PORTA ............................................................................... 21
Clocking Scheme ................................................................ 12 Power-Down Mode ............................................................. 45
Code Protection ............................................................ 35, 45 Prescaler ............................................................................ 28
Configuration Bits................................................................ 35 PRO MATE II Universal Programmer .............................. 59
Configuration Word ............................................................. 35 Program Counter ................................................................ 19
D Q
DC and AC Characteristics ........................................... 75, 93 Q cycles.............................................................................. 12
Development Support ......................................................... 59
R
Development Tools ............................................................. 59
RC Oscillator....................................................................... 37
Device Varieties .................................................................... 7
Read Modify Write .............................................................. 22
Digit Carry ............................................................................. 9
Register File Map................................................................ 14
E Registers
EEPROM Peripheral Operation .......................................... 29 Special Function ......................................................... 15
Errata .................................................................................... 3 Reset .................................................................................. 35
F Reset on Brown-Out ........................................................... 44
Family of Devices.................................................................. 5 S
Features ................................................................................ 1 SEEVAL Evaluation and Programming System .............. 61
FSR ..................................................................................... 20 SLEEP .......................................................................... 35, 45
Fuzzy Logic Dev. System (fuzzyTECH-MP) .................... 61 Software Simulator (MPLAB-SIM) ...................................... 61
I Special Features of the CPU .............................................. 35
I/O Interfacing ..................................................................... 21 Special Function Registers................................................. 15
I/O Ports .............................................................................. 21 Stack................................................................................... 19
STATUS ............................................................................... 9
I/O Programming Considerations........................................ 22
ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ............ 59 STATUS Register ............................................................... 16
ID Locations .................................................................. 35, 45 T
INDF.................................................................................... 20 Timer0
Indirect Data Addressing..................................................... 20 Switching Prescaler Assignment ................................ 28
Instruction Cycle ................................................................. 12 Timer0 ........................................................................ 25
Instruction Flow/Pipelining .................................................. 12 Timer0 (TMR0) Module .............................................. 25
Instruction Set Summary..................................................... 48 TMR0 with External Clock .......................................... 27
K Timing Diagrams and Specifications ............................ 70, 86
Timing Parameter Symbology and Load Conditions .... 69, 85
KeeLoq Evaluation and Programming Tools.................... 62
TRIS Registers ................................................................... 21
L
W
Loading of PC ..................................................................... 19
Wake-up from SLEEP......................................................... 45
M Watchdog Timer (WDT)................................................ 35, 42
Memory Organization.......................................................... 13 Period ......................................................................... 43
Data Memory .............................................................. 14 Programming Considerations ..................................... 43
Program Memory ........................................................ 13 WWW, On-Line Support ....................................................... 3
MPLAB Integrated Development Environment Software .... 61
Z
Zero bit ................................................................................. 9

PIC12C5XX

PIC12C5XX
ON-LINE SUPPORT Systems Information and Upgrade Hot Line
The Systems Information and Upgrade Line provides
Microchip provides on-line support on the Microchip
system users a listing of the latest versions of all of
World Wide Web (WWW) site.
Microchip’s development systems software products.
The web site is used by Microchip as a means to make Plus, this line provides information on how customers
files and information easily available to customers. To can receive any currently available upgrade kits.The
view the site, the user must have access to the Internet Hot Line Numbers are:
and a web browser, such as Netscape or Microsoft
1-800-755-2345 for U.S. and most of Canada, and
Explorer. Files are also available for FTP download
from our FTP site. 1-602-786-7302 for the rest of the world.
Connecting to the Microchip Internet Web Site 981103
The Microchip web site is available by using your

favorite Internet browser to attach to:
www.microchip.com
The file transfer site is available by using an FTP ser-
vice to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User’s Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
Trademarks: The Microchip name, logo, PIC, PICmicro,
• Latest Microchip Press Releases PICSTART, PICMASTER and PRO MATE are registered
• Technical Support Section with Frequently Asked trademarks of Microchip Technology Incorporated in the
Questions U.S.A. and other countries. FlexROM, MPLAB and fuzzy-
LAB are trademarks and SQTP is a service mark of Micro-
• Design Tips chip in the U.S.A.
• Device Errata All other trademarks mentioned herein are the property of
• Job Postings their respective companies.
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Sys-
tems, technical information and more
• Listing of seminars and events

PIC12C5XX
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
To: Technical Publications Manager Total Pages Sent

RE: Reader Response
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________ FAX: (______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: PIC12C5XX Literature Number: DS40139E
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
8. How would you improve our software, systems, and silicon products?

PIC12C5XX
PIC12C5XX Product Identification System
PART NO. -XX X /XX XXX Examples
Pattern: Special Requirements a) PIC12C508A-04/P
Commercial Temp.,
Package: SN = 150 mil SOIC PDIP Package, 4 MHz,
SM = 208 mil SOIC normal VDD limits
P = 300 mil PDIP
JW = 300 mil Windowed Ceramic Side Brazed b) PIC12C508A-04I/SM
Industrial Temp., SOIC
Temperature - = 0°C to +70°C package, 4 MHz, normal
Range: I = -40°C to +85°C
E = -40°C to +125°C VDD limits
Frequency 04 = 4 MHz c) PIC12C509-04I/P
Industrial Temp.,
Range:
PDIP package, 4 MHz,
normal VDD limits
Device PIC12C508
PIC12C509
PIC12C508T (Tape & reel for SOIC only)
PIC12C509T (Tape & reel for SOIC only)
PIC12C508A
PIC12C509A
PIC12C508AT (Tape & reel for SOIC only)
PIC12C509AT (Tape & reel for SOIC only)
PIC12LC508A
PIC12LC509A
PIC12LC508AT (Tape & reel for SOIC only)
PIC12LC509AT (Tape & reel for SOIC only)
PIC12CR509A
PIC12CR509AT (Tape & reel for SOIC only)
PIC12LCR509A
PIC12LCR509AT (Tape & reel for SOIC only)
PIC12CE518
PIC12CE518T (Tape & reel for SOIC only)
PIC12CE519
PIC12CE519T (Tape & reel for SOIC only)
PIC12LCE518
PIC12LCE518T (Tape & reel for SOIC only)
PIC12LCE519
PIC12LCE519T (Tape & reel for SOIC only)
Please contact your local sales office for exact ordering procedures.
Sales and Support:

Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

PIC12C5XX
NOTES:

PIC12C5XX
NOTES:

Note the following details of the code protection feature on PICmicro® MCUs.
• The PICmicro family meets the specifications contained in the Microchip Data Sheet.
• Microchip believes that its family of PICmicro microcontrollers is one of the most secure products of its kind on the market today,
when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowl-
edge, require using the PICmicro microcontroller in a manner outside the operating specifications contained in the data sheet.
The person doing so may be engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable”.
• Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of
our product.
If you have any further questions about this matter, please contact the local sales office nearest to you.
Information contained in this publication regarding device Trademarks

applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to The Microchip name and logo, the Microchip logo, FilterLab,
ensure that your application meets with your specifications. KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
No representation or warranty is given and no liability is PICSTART, PRO MATE, SEEVAL and The Embedded Control
assumed by Microchip Technology Incorporated with respect Solutions Company are registered trademarks of Microchip Tech-
to the accuracy or use of such information, or infringement of nology Incorporated in the U.S.A. and other countries.
patents or other intellectual property rights arising from such
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
use or otherwise. Use of Microchip’s products as critical com-
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
ponents in life support systems is not authorized except with
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
express written approval by Microchip. No licenses are con-
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
veyed, implicitly or otherwise, under any intellectual property
and Total Endurance are trademarks of Microchip Technology
rights.
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their

respective companies.
© 2002, Microchip Technology Incorporated, Printed in the

U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system

certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999. The
Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs and microperipheral
products. In addition, Microchip’s quality
system for the design and manufacture of
development systems is ISO 9001 certified.
 2002 Microchip Technology Inc.

M
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PIC12C5XX

8-Pin, 8-Bit CMOS Microcontrollers

 1999 Microchip Technology Inc. DS40139E-page 1

Pin Diagram - PIC12C508A/509A,

Pin Diagram - PIC12CR509A

PIC12C508A 3.0-5.5 See Note 1 6 0.7

DS40139E-page 2  1999 Microchip Technology Inc.

To Our Valued Customers

 1999 Microchip Technology Inc. DS40139E-page 3

DS40139E-page 4  1999 Microchip Technology Inc.

Features I/O Pins 5 5 5 5 5 5 5 5 5

 1999 Microchip Technology Inc. DS40139E-page 5

DS40139E-page 6  1999 Microchip Technology Inc.

The UV erasable version can be erased and 2.4 Serialized Quick-Turnaround

 1999 Microchip Technology Inc. DS40139E-page 7

DS40139E-page 8  1999 Microchip Technology Inc.

 1999 Microchip Technology Inc. DS40139E-page 9

DS40139E-page 10  1999 Microchip Technology Inc.

DIP SOIC I/O/P Buffer

 1999 Microchip Technology Inc. DS40139E-page 11

FIGURE 3-2: CLOCK/INSTRUCTION CYCLE

Fetch INST (PC)

EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW

1. MOVLW 03H Fetch 1 Execute 1

DS40139E-page 12  1999 Microchip Technology Inc.

4.1 Program Memory Organization

 1999 Microchip Technology Inc. DS40139E-page 13

The special function registers include the TMR0 01h TMR0

The general purpose register file is accessed either

Note 1: Not a physical register. See Section 4.8

DS40139E-page 14  1999 Microchip Technology Inc.

TABLE 4-1: SPECIAL FUNCTION REGISTER (SFR) SUMMARY

N/A TRIS — — --11 1111 --11 1111

02h(1) PCL Low order 8 bits of PC 1111 1111 1111 1111

 1999 Microchip Technology Inc. DS40139E-page 15

FIGURE 4-4: STATUS REGISTER (ADDRESS:03h)

R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x

DS40139E-page 16  1999 Microchip Technology Inc.

FIGURE 4-5: OPTION REGISTER

W-1 W-1 W-1 W-1 W-1 W-1 W-1 W-1

000 1:2 1:1

 1999 Microchip Technology Inc. DS40139E-page 17

R/W-0 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 U-0 U-0

FIGURE 4-7: OSCCAL REGISTER (ADDRESS 05h) FOR PIC12C508A/C509A/CR509A/12CE518/

R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0

DS40139E-page 18  1999 Microchip Technology Inc.

 1999 Microchip Technology Inc. DS40139E-page 19

FIGURE 4-9: DIRECT/INDIRECT ADDRESSING

bank select location select bank location select

Note 1: For register map detail see Section 4.2.

DS40139E-page 20  1999 Microchip Technology Inc.

Note: A read of the ports reads the pins, not the

 1999 Microchip Technology Inc. DS40139E-page 21

N/A TRIS — — --11 1111 --11 1111

03H STATUS GPWUF — PAO TO PD Z DC C 0001 1xxx q00q quuu(1)

5.4 I/O Programming Considerations EXAMPLE 5-1: READ-MODIFY-WRITE

DS40139E-page 22  1999 Microchip Technology Inc.

PC PC + 1 PC + 2 PC + 3 This example shows a write to GPIO followed

 1999 Microchip Technology Inc. DS40139E-page 23

DS40139E-page 24  1999 Microchip Technology Inc.