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EVM User's Guide: LAUNCHXL-F28P55X

C2000 F28P55x Series LaunchPad Development Kit

Description • Onboard XDS110 debug probe

• Two user-controlled LEDs
The LAUNCHXL-F28P55X is a low-cost development • One microcontroller reset switch
board for the Texas Instruments C2000™ Real- • Selectable power domains:
Time Microcontroller series of F28P55x devices. – USB (isolated)
The LAUNCHXL-F28P55X is designed around the – BoosterPack
TMS320F28P550SJ9 real-time MCU and highlights – External power supply
the control, analog, and communications peripherals, • CAN connector with on-board CAN transceiver
as well as the integrated nonvolatile memory. – Supports CAN-FD (MCAN)
The LaunchPad™ also features two independent • Two independent Enhanced Quadrature Encoder
BoosterPack™ XL expansion connectors (80-pins), Pulse (QEP)-based encoder connectors
on-board Controller Area Network (CAN) transceiver • Three Programmable Gain Amplifier (PGA)-based
supporting CAN-FD (MCAN), two 5V encoder connectors
interface (eQEP) connectors, FSI connector, three • FSI peripheral connector
PGA interface connectors, power-domain isolation, • Two independent BoosterPack XL standard
and an on-board XDS110 debug probe. connectors (80-pins) featuring stackable headers
to maximize expansion through the BoosterPack
Get Started ecosystem
1. Order LAUNCHXL-F28P55X from ti.com. Applications
2. Download the latest libraries.
3. Download the comprehensive reference design • Motor drives
files. • Appliances
4. See the latest device support files. • Hybrid, electric and powertrain systems
• Solar and EV charging
Features • Digital power
• C2000 Series F28P550SJ9PZ (100-pin) • Body electronics and lighting
microcontroller: • Test and measurement
– With Configurable Logic Block (CLB) capability

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1 Evaluation Module Overview

1.1 Introduction
The F28P55x LaunchPad (LAUNCHXL-28P55X) from Texas Instruments (TI) provides a great way to learn and
experiment with the F28P55x devices. The F28P55x device is a member of TI’s C2000 family of microcontrollers
(MCUs). This 100-pin LaunchPad is intended to provide a well-filtered, robust design capable of working in
most environments. This document provides the hardware details of the F28P55x LaunchPad and explains the
functions, locations of jumpers, and connectors present on the board.

Note
This kit is designed to explore the functionality of the F28P55x microcontroller. The LaunchPad can
be treated as a good reference design and is not intended to be a complete customer design. Full
compliance to safety, EMI/EMC, and other regulations are left to the designer of the customer’s
system.

1.2 Kit Contents

The F28P55x Series LaunchPad Development Kit contains these items:
• C2000 F28P55x Series LaunchPad development board (LAUNCHXL-F28P55X)
• USB Type-A male to USB Type-C® male cable
• Pinout map
1.3 Specifications
Table 1-1 summarizes the F28P55x LaunchPad specifications.
Table 1-1. LAUNCHXL-F28P55X Specifications
Parameter Value
5VDC from one of the following sources:
• USB Connector (USB101) - USB Type-C cable connected to PC or other compatible
power source.
Board supply voltage
• BoosterPack 1
• BoosterPack 2
• Auxiliary power connectors

Dimensions 5.5in x 2.3in x .425in (13.97cm x 5.84cm x 10.8mm) (L x W x H)

• 3.3VDC to BoosterPacks, limited by output of TPS7A3701 LDO. This 3.3V plane is
Break-out power output shared with on-board components. Total output power limit of TPS7A3701 is 1 Amp.

This kit is assumed to run at standard room conditions. The EVM runs at approximately
Assumed operating conditions
standard ambient temperature and pressure (SATP) with moderate-to-low humidity.

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Figure 1-1 highlights the key features of the F28P55x LaunchPad.

XDS110 Debug
Isolated USB Interface Probe
(USB101, U3) (U2)
XDS110 External
USB 5V Power Debug Port
Isola
on Header (J102)
(JP1)
Reset Buon
5V & 3.3V (S1)
Isolaon Headers
(JP2) JTAG/UART
Isola on Header
40-pin Boosterpack (J101)
Connector Site 1
(J1 - J4) UART Select
Switch
(S2)

PGA Select VDD (1.2V)

Switch Monitoring Pin
(S6) (JP4)
F28P55X
PGA Header Microcontoller
(J16) (U1)
Boost Enable FSI Connector
(J16) (J11)
VREFHI Header Boot Mode
(J15) Select Switch
(S3)
40-pin Boosterpack
Connector Site 2 QEP Select
(J5 - J8) Switch
(S5)

CAN Roung
Switch
(S4)

Encoder Interface CAN Interface

(J12, J13) (J14)

Figure 1-1. F28P55x LaunchPad Board Overview

1.4 Device Information

The TMS320F28P550SJ9PZ is a 32-bit floating-point microcontroller with 1088KB Flash memory, 133KB
RAM, a programmable Control Law Accelerator (CLA) for offloading tasks, and operates at 150MHz.
The TMS320F28P550SJ9PZ includes advanced control peripherals, differentiated analog, and various
communications peripherals. The device has been optimized for high-performance real-time control applications.
For more details, see the TMS320F28P55x Real-Time Microcontrollers data sheet.
Most of the signals of the microcontroller are routed to 0.1 inch (2.54mm) pitch headers laid out to comply
with the TI BoosterPack standards, with a few exceptions. The F28P55x internal multiplexer of the MCU allows
different peripheral functions to be assigned to each of the General-Purpose Input/Output (GPIO) pins. The
multiplexing options can be found in the device-specific data sheet. When adding external circuitry, consider the
additional load on the development board's power rails.
The F28P55x LaunchPad is factory-programmed with a quick start demo program. The quick start program
resides in the on-chip flash memory and executes each time power is applied, unless the application has been
replaced with a user program. For details on the demo program of the LaunchPad, see Section 3.1.2.

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2 Hardware
2.1 Hardware Description
The F28P55x LaunchPad includes a F28P550SJ9PZ MCU, which is an excellent choice for advanced real-
time control applications. A large number of these peripherals are made available to users via the on-board
accessories and the BoosterPack connectors. This section explains how those peripherals operate and interface
to the MCU.
Figure 2-1 shows a high-level block diagram of the F28P55x LaunchPad:
PWR & GND
Isola
on Boundary

3.3V & 5V Isola on

Boundary

Figure 2-1. F28P55x LaunchPad Development Kit Block Diagram

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2.1.1 Functional Description and Connections

2.1.1.1 Power Domains
The F28P55x LaunchPad has several power domains that can be connected or isolated from each other with
removable shunts. The different 3.3V and 5V power domains are further described in Figure 2-2 and Figure 2-3.

USB +3V3_XDS110
Isolator
Device

USB Type-C™ +5V0_USB +5V0 +5V0_XDS110 3.3-V Power

Conn Shunt 1 Management
+3.3-V power
JP1 only flows from
+5V0 and GND shunts to enable
GND or break isolation boundary XDS110 to MCU
+3V3_XDS110 side
Shunt

XDS110 Side
PWR & GND +5V0 +3V3 5-V & 3.3-V Isolation
+5V0 +3V3
Isolation Boundary Shunt 2 Shunt Boundary
MCU Side
JP2
+5-V power can flow
from either the
XDS110 or MCU +5V0_MCU +3V3_MCU
sides
Shunts to disconnect +5 V
and/or +3.3 V between
XDS110 and MCU sides

Figure 2-2. LaunchPad Power Distribution Diagram

Isola
on Boundary

3.3V & 5V Isola on

Boundary

Figure 2-3. LaunchPad Power Plane Diagram

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Table 2-1 describes the usage of the different removable shunts on the LaunchPad board.
Table 2-1. Power Domain Shunts
Shunt Identifier Usage Description
Connects the +5 V power from the USB-C connector (+5V0_USB) to the +5 V power on
JP1, +5V0 the XDS110 side of the board (+5V0_XDS110). Bridges the power and ground isolations
between the two board sides.
Connects the board Ground on the isolated USB-C connector side of the board (USB_GND)
JP1, GND to the rest of the board ground (GND). Bridges the power and ground isolations between the
two board sides.
Connects the +5 V power on the XDS110 side of the board (+5V0_XDS110) to the +5 V
JP2, +5V0
power on the F28P55X side of the board (+5V0_MCU).
Connects the +3.3 V power on the XDS110 side of the board (+3V3_XDS110) to the +3.3 V
JP2, +3V3
power on the F28P55X side of the board (+3V3_MCU).

2.1.1.2 LEDs
Power indicator LEDs (red) are included on the F28P55x LaunchPad board. Table 2-2 shows descriptions of
each LED.
Table 2-2. Power LED Indication Descriptions
LED NO. Indication Description:
LED7 +5 V power from the USB Type-C connector
LED0 +3.3 V power on the XDS110 side of the PCB
LED1 +3.3 V power on the F28P55x side of the PCB
LED6 +5 V power on the F28P55x side of the PCB

Two user LEDs are provided on the board: LED4 (red) and LED5 (green). These user LEDs are connected to
GPIO20 and GPIO21 of the F28P55X, respectively. The signals are connected to the SN74LVC2G07DBVR LED
driver IC and are connected in an active low configuration; that is, drive the GPIO low to turn on the LED and
high to turn off. These LEDs are dedicated for use by the software application.
Two blue LEDs, LED2 and LED3, are connected to the XDS110 debug probe. These indicate debugger activity
and are not controllable by any application software.
2.1.1.3 Encoder Connectors
The F28P55x LaunchPad includes two headers, J12 and J13, which are used for connecting linear or rotary
incremental encoders. These headers take 5V input signals that are stepped down to 3.3V and wired to the
F28P550SJ9 MCU. These signals are connected to the eQEP modules on the device when switch S5 is set
appropriately, see Table 2-5. Each header has the EQEPA, EQEPB, and EQEPI signals available for each eQEP
module (1 and 3) as well as pins for GND and 5V.

Note
If present, the EQEP2 on the LaunchPad silk screen corresponds to the EQEP module 3.

2.1.1.4 FSI
The F28P55x MCU features the Fast Serial Interface (FSI) communications peripheral. The FSI enables robust
high-speed communications and is intended to increase the amount of information transmitted while reducing the
cost to communicate over an isolation barrier. The FSI signals TXCLK, TXD0, TXD1, RXCLK, RXD0, and RXD1
are available on J11. This header is set up in such a way that adding jumpers on the pins connects the TX to RX
channels for external loopback and evaluation. Additionally, there are two GND signals on the connector that can
be used for a wrapped-pair connection to an external board with FSI. The GPIOs connected to this header are
only routed to the J11 FSI connector on this board, and not routed to the Boosterpack headers.
The LAUNCHXL-F28P55X does not include any on-board isolation devices for the FSI signals. If interested
in evaluating the FSI peripheral with isolation devices, or differential drivers and receivers, then see the
TMDSFSIADAPEVM plug on board.

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2.1.1.5 PGA
The Programmable Gain Amplifier (PGA) is used to amplify an input voltage for the purpose of increasing
the effective resolution of the downstream ADC and CMPSS modules. The integrated PGA helps to reduce
cost and design effort for many control applications that traditionally require external, stand-alone amplifiers.
On-chip integration verifies that the PGA is compatible with the downstream ADC and CMPSS modules.
Software-selectable gain and filter settings make the PGA adaptable to various performance needs.
Three PGA signals are available at the device pins: PGA_INP (positive input), PGA_INM (negative input), and
PGA_OUT (output). PGA_OUT supports op-amp output filtering with RC components. The filtered signal is
available for sampling and monitoring by on-chip ADC and CMPSS modules. The F28P55x LaunchPad includes
3x3 PGA header, J10. PGA signals are connected to the PGA modules on the device when switch S6 is set
appropriately, see Table 2-6. J10 header has the PGA_INP, PGA_INM, and GND signals available for each of
three PGA modules.
2.1.1.6 CAN
The F28P55x LaunchPad includes a connector (J14) for a CAN network. GPIO4 and GPIO5 are routed from
the F28P550SJ9 to J14 through the on-board CAN Transceiver. CAN-FD (MCAN) is used on these F28P55x
device pins. Switch S4 is used to route GPIO4 and GPIO5 to either the CAN transceiver and connector or the
Boosterpack headers. For more details, see Section 2.1.3.4.
2.1.1.7 CLB
The configurable logic block (CLB) is a collection of blocks that can be interconnected using software to
implement custom digital logic functions or enhance existing on-chip peripherals. The CLB is able to enhance
existing peripherals through a set of interconnections, which provide a high level of connectivity to existing
control peripherals such as enhanced pulse width modulators (ePWM), enhanced capture modules (eCAP), and
enhanced quadrature encoder pulse modules (eQEP). The crossbars also allow the CLB to be connected to
other internal peripheral signals of the device or external GPIO pins. In this way, the CLB can be configured to
perform small logical functions to augment device peripheral inputs and outputs. Through the CLB, functions that
are otherwise accomplished using external logic devices, such as FPGAs or CPLDs, can now be implemented
inside the C2000 MCU.
For more information on the CLB see the C2000 Configurable Logic Block (CLB) Training Series.
2.1.1.8 Boot Modes
The F28P550SJ9 boot ROM contains bootloading software that executes every time the device is powered
on or reset. Two pins, GPIO24 and GPIO32, are wired to the boot select switch (S3). By default, both pins
are set HIGH (1) so the device boots from Flash. For more information on the F28P55x boot modes, see the
TMS320F28P55x Real-Time Microcontrollers data sheet.
Table 2-3. Boot Select Switch Table - S3
Boot Mode GPIO24 (LEFT) GPIO32 (RIGHT)
Boot from parallel GPIO 0 0
Boot from SCI / wait boot 0 1
Boot from CAN 1 0
Boot from flash (default) 1 1

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2.1.1.9 BoosterPack Sites

The F28P55x LaunchPad features two fully independent BoosterPack XL connectors. Both BoosterPack sites
1 and 2 are compliant with the BoosterPack standard. To expand the functions available to the user on this
LaunchPad, some signals are also routed to alternate locations on the board. These alternate routes can be
selected by manipulating the onboard switches or by adding and removing 0Ω resistors. This is described in
Section 2.1.3.
The GPIO pin numbers as well as the BoosterPack compliant features can be viewed in the LAUNCHXL-
F28P55X Pinout Map (SPAZ056). Each GPIO has multiple functions available through the GPIO mux of the
F28P55x device. Some specific functions have been listed in the pinout map; the full GPIO mux table can be
found in the TMS320F28P55x Real-Time Microcontrollers data sheet.
All of the analog signals (denoted ADCIN) of the F28P55x MCU are routed to the J1/J3 and J5/J7 BoosterPack
headers on the left side of the board. Close to the respective BoosterPack header each ADC input signal has
component pads for a series resistor and parallel capacitor to create an RC filter. By default, a 0 ohm resistor is
populated and the capacitor is left un-populated. Users can populate these components with specific values to
filter out noise arriving at the ADC input of the device.
2.1.1.10 Analog Voltage Reference Header
The analog subsystem of the F28P55x allows for flexible voltage reference sources. The ADC modules are
referenced to the VREFHIx and VREFLOx pin voltages. VREFHIx can either be driven externally or can be
generated by an internal band-gap voltage reference. An external voltage can be supplied to header J15 as an
external voltage source for VREFHIx. Note that there is no signal conditioning circuitry in place for the voltage
reference. For best performance, some additional circuitry can be required.

Note
The two VREFHI pins on F28P550SJ9PZ MCU are shorted together, which is also the case for
VREFLO pins.

2.1.1.11 Other Headers and Jumpers

The LaunchPad has multiple jumpers to select different power sources for the board. This LaunchPad also
provides a way to isolate the connected USB from the device, allowing for safe operation and debugging in
higher voltage applications.
2.1.1.11.1 USB Isolation Block
JP1 is provided to enable isolation between the device and the connected USB in higher-voltage applications.
The area of isolation is defined by the white outline in the upper-left corner of the LaunchPad. JP1 has two
removable shunts to separate the GND and 5V power of the USB region and the XDS110 and F28P55x MCU
region of the LaunchPad. By default, both shunts are populated and the power is supplied by the connected
USB, meaning that the USB is NOT isolated from the XDS110 and F28P55x MCU regions. If power isolation is
desired, then remove the supplied shunts from JP1. In this configuration, one of the two external power options
below are required.
• An external 5V supply to power the 3.3V LDO (TPS7A3701), which provides 3.3V to the XDS110 and
F28P55x MCU regions of the board.
• An external 3.3V supply to power the XDS110 and F28P55x MCU regions of the board.
Some applications do not require 5V to be supplied to the MCU region. In an isolated power application with JP1
shunts removed, supplying 5V to the XDS110 and F28P55x MCU regions is optional.
2.1.1.11.2 BoosterPack Site 2 Power Isolation
JP8 is included to isolate 3.3V and 5V from the BoosterPack site 2 headers. This can be required if two
BoosterPacks are simultaneously connected to the LaunchPad and both provide power to the LaunchPad. If this
is the case, then power can be isolated by removing the shunts on JP8 and there is no contention between the
two BoosterPacks.

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2.1.1.11.3 Alternate Power

Additional jumpers are provided outside of the BoosterPack connector for additional external power connections
for 3.3V or 5V. These can be used to supply an external board or for powering the LaunchPad with an external
supply. When using these connection points, make sure that no other power supplies are connected.
• JP4 and JP6 are provided as extra connection points for a 3.3V supply to be connected to the LaunchPad.
• JP5 and JP7 are provided as extra connection points for a 5V supply to be connected to the LaunchPad.

CAUTION
The F28P55x LaunchPad features a VDD pin located on header JP4 that can only be used to
monitor the voltage of the 1.2V VDD rail of the TMS320F28P550SJ9PZ device. This pin can not be
used to supply power to an external device nor connected to an external supply.

2.1.2 Debug Interface

2.1.2.1 XDS110 Debug Probe
The F28P55x LaunchPad includes an on-board XDS110 Debug Probe. The XDS110 allows for the programming
and debugging of the F28P55X using Code Composer Studio™ (CCS), or any other supported tool chains. In the
default configuration, the XDS110 is only wired to support 2-pin cJTAG mode. This uses only the TMS and TCK
JTAG pins and allows the TDI and TDO pins of the F28P55x device to be reallocated for other application needs.
TDI and TDO are available on GPIO35 and GPIO37. These pins are not routed to the debug probe by default,
but can be connected by populating resistors R44 and R45.
2.1.2.2 XDS110 Output
The connector J102 is provided to debug an external target with the on-board XDS110 debug probe. This
connector allows the LaunchPad to be used as a stand-alone XDS110 debug probe. For mating connector and
cable, see Samtec FFSD or equivalent.
If the LaunchPad is being used in this manner, then make sure that all of the jumpers are removed from J101.
This isolates the JTAG signals from going to the F28P550SJ9 MCU. UART TX and RX signals from the XDS110
device are also included on this connector.
2.1.2.3 Virtual COM Port
When plugged into a USB host, the XDS110 enumerates as both a debugger and a virtual COM port. J101
allows the user to connect the SCI UART from the F28P550SJ9 to the debug probe to be passed on to the USB
host. By default the F28P55x SCIA maps to the virtual COM port of the XDS110 using GPIO28 and GPIO29.
Alternately, GPIO15 and GPIO56 can be used for SCIB. This is accomplished by manipulating the on-board
switch S2. For the appropriate switch settings, see Section 2.1.3.2.
2.1.3 Alternate Routing
2.1.3.1 Overview
The F28P550SJ9 MCU is a very versatile device in a mid-size package. To balance compatibility with
BoosterPack standards, as well as showcasing the versatility of the F28P550SJ9, some complexity was added
to the design. Most features aligning with the BoosterPack standard are available by default. The additional
functions are configured using switches or static resistors, which can be added or removed. This section covers
the alternate functions and how to enable switches or static resistors. Note that by enabling certain alternate
features, standard BoosterPack functionality can be lost. The switches and resistors are configured such that
connecting multiple functions to the same header is not possible.
2.1.3.2 UART Routing
This LaunchPad allows for one of two sets of pins to be used for the SCIA UART routed to the virtual COM port
of the XDS110. By default, GPIO28 (SCIA_RX) and GPIO29 (SCIA_TX) are routed to the virtual COM port and
not available on the BoosterPack connector. Alternately, GPIO15 (SCIB_RX) and GPIO56 (SCIB_TX) can be
routed to the virtual COM port. When UART functionality is not needed at the virtual COM port, the GPIOs can
be routed to the BoosterPack connectors for BoosterPack standard functions.

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The routing destination of these signal pairs are selected using the on-board switch S2, as described below in
Table 2-4.
Table 2-4. SCI UART Select - S2
SEL1 (Left) SEL2 (Right) GPIO28/29 GPIO15/56
0 0 XDS110 COM Port BP Headers
0 1 XDS110 COM Port No Connect
1 0 BP Headers BP Headers
1 1 BP Headers XDS110 COM Port

2.1.3.3 EQEP Routing

The LaunchPad has the ability to connect to two independent linear or rotary encoders through the F28P55x on-
chip eQEP interfaces; header J12 is connected to eQEP1 and header J13 is connected to eQEP3. By default,
this connection is not active and the GPIOs are routed to the BoosterPack connectors. The 5V eQEP input
signals from the J12 and J13 connectors are stepped down through a TI SN74LVC8T245 level translator (U13)
to 3.3V. The eQEP1 signals are connected to J12 header by default. The eQEP3 signals are routed through TI
SN74LV4053A triple 2-channel analog multiplexer/demultiplexer IC (U11). Switch S5 controls the select inputs of
the IC to configure the eQEP3 signal destinations to be either the J13 connectors or BoosterPack headers, as
described below in Table 2-5.
Table 2-5. QEP Select - S5
QEP1 Signals QEP3 Signals
QEP3 SEL
(GPIO40/41/59) (GPIO25/26/30)
0 (down) J12 J13
1 (up) J12 BP Headers

2.1.3.4 CAN Routing

The LaunchPad can be connected to a CAN bus through J14. GPIO4 and GPIO5 are routed to the on-board TI
TCAN332GDR 3.3V CAN Transceiver, U15. By setting S4 to DOWN (on), GPIO4 and GPIO5 are routed to the
transceiver. If S4 is set to UP (off), the GPIOs are routed to the BoosterPack connectors (default case).
2.1.3.5 PGA Routing
The PGAs on the LaunchPad are connected to J10 header. Some of the PGA signals (PGA1/2/3_INP and
PGA3_INM) can be accessed through the BoosterPack header as well when the switch is pulled to 1. All PGAs
are initially connected to J10 header by default when the switch is pulled to 0 as described below in Table 2-6.
Table 2-6. PGA Select - S6
PGA SEL 0 (right) 1 (left)
PGA1_INP J10 BP Headers
PGA1_INM J10 GND
PGA2_INP J10 BP Headers
PGA2_INM J10 GND
PGA3_INP J10 BP Headers
PGA3_INM J10 BP Headers

2.1.3.6 FSI Routing

One set of GPIOs with available FSI functionality are directly connected to the FSI header, J11. The traces
from the device to the FSI header are made short to verify higher signal integrity, as FSI signals can switch at
frequencies up to 150MHz on F28P55x devices.

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2.1.3.7 X1/X2 Routing

The F28P550SJ9 crystal oscillator output signal, X2, is multiplexed with GPIO18 and the crystal oscillator
input, X1, is multiplexed with GPIO19. By default, the Launchpad uses an on-board crystal oscillator, Y2,
as the clock source for the on-chip Phase-Locked Loop (PLL) that requires both X1 and X2 signals of the
MCU. To balance the requirement of having cleanly routed oscillator signals and bringing all possible GPIOs to
the BoosterPack connectors, both GPIO18/X2 and GPIO19/X1 can be routed to the BoosterPack connectors
through 0Ω resistors. If GPIO18 or GPIO19 are needed at the BoosterPack connectors, then the on-chip
zero-pin oscillators must be used as the clock source for the on-chip PLL. For more information on the X1/X2
configurations, see the TMS320F28P55x Real-Time Microcontrollers data sheet.
If GPIO18 functionality is needed at the BoosterPack connector, then
1. Remove R32 to separate GPIO18 from Y2.
2. Populate R36 to connect GPIO18 to the BoosterPack connector
If GPIO19 functionality is needed at the BoosterPack Connector, then
1. Remove R33 to separate GPIO19 from Y2.
2. Populate R37 to connect GPIO19 to the BoosterPack connector.
2.1.3.8 PWM DAC
The LaunchPad provides up to four PWM DAC signals at the BoosterPack headers using GPIO0 (BP pin 40)
and GPIO1 (BP pin 39) on site 1 and GPIO12 (BP pin 80) and GPIO13 (BP pin 79) on site 2. The intended
purpose of the PWM DAC signals are to utilize PWMs of the F28P55x device as digital-to-analog converters
(DAC). This method involves low-pass filtering the PWM signal to remove the high-frequency components and
preferably leaves only the DC component. For more information, see the Using PWM Output as a Digital-to-
Analog Converter on a TMS320F280x Digital Signal Control.
By default, the RC filter is not populated. A 0 ohm resistor is populated and the capacitor is left unpopulated.
2.2 Using the F28P55x LaunchPad
The recommended steps for using the F28P55x LaunchPad are:
1. Follow the instructions in Section 3.1.2 to begin running the LaunchPad demo program: Within just a few
minutes, users can control and monitor the F28P55x LaunchPad with the pre-programmed quick start
application. Additionally, Section 5.1 is helpful if there are any issues that can quickly be addressed.
2. Experiment with BoosterPacks: This development kit conforms to the latest revision of the BoosterPack
pinout standard. The kit has two independent BoosterPack sites to enable a variety of expansion
opportunities, such as two Boosterpacks being used simultaneously. For more information about the TI
LaunchPad and BoosterPack standard, see the TI LaunchPad web page at LaunchPad.
3. Take the first step towards developing your own control applications: The F28P55x LaunchPad
is supported by the C2000Ware development package. After C2000Ware is installed, look for
\F28P55x\examples\launchxl_F28P55X in the installation directory to find the pre-configured example
applications for this board. Any of the other examples found within the \F28P55x\examples directory can
be used with minor modifications to run on the LaunchPad as well. For more details about software
development, see Section 3.1.
a. Refer to a technical article featuring C2000 Real-Time Microcontrollers about how developers can take
advantage of the scalability and sustainability benefits these devices bring.
4. Customize and integrate the hardware to align to your end application: This development kit can be
used as a reference for building your own custom boards and circuits based on C2000 F28P55x series
microcontrollers. The LaunchPad also functions as a foundation for expansion with custom BoosterPacks
and other circuits. This document can serve as a starting point for such projects.

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5. Get trained: Review and download hours of written and video training materials on C2000 Real-time
Microcontrollers and related LaunchPads.
a. See Getting Started With C2000 Real-Time Control Microcontrollers (MCUs).
b. See the TI Training and Videos page.
c. See the C2000 Academy page.
2.3 BoosterPacks
The LAUNCHXL-F28P55X provides a simple and inexpensive way to develop applications with the F28P55x
series microcontroller. BoosterPacks are pluggable add-on boards for the LaunchPad ecosystem that follow
a pin-out standard created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly
expands the peripherals and potential applications that you can explore with the F28P55x LaunchPad.
Some examples of BoosterPacks that are compatible with the F28P55x LaunchPad are listed in Table 2-7.
Please note that this is not an exhaustive list of hardware supported BoosterPacks.
Table 2-7. Featured BoosterPacks for the F28P55x LaunchPad
BoosterPack/Board Application and Usage
Features a 48V/10A three-phase GaN inverter with precision in-line shunt-based phase current
BOOSTXL-3PHGANINV
sensing for accurate control of precision drives such as servo drives.
BOOSTXL-DRV8323RS DRV8323RS/H three-phase, 15A smart gate driver with buck, shunt amps (SPI or hardware
BOOSTXL-DRV8323RH interface) evaluation module.
FSI adapter board assists in understanding the functionality of the FSI communications peripheral
of the C2000. Enables evaluation of the peripheral for decentralized and point-to-point real-time
TMDSFSIADAPEVM
control system use cases, such as those in industrial drives, servo, sensing networks, and solar
system and industrial power.
15A, 3-phase brushless DC drive stage based on the DRV8353RS gate driver and CSD19532Q5B
DRV8353RS-EVM
NexFET™ MOSFETs.
DRV8316REVM provides three half-H-bridge integrated MOSFET drivers for driving a three-phase
DRV8316REVM brushless DC (BLDC) motor with 8A Peak current drive, for 12V/24V DC rails or battery powered
applications.
Digital Power Buck Converter BoosterPack for learning the basics of digital power control with
BOOSTXL-BUCKCONV C2000 microcontrollers. The buck converter power stage supports dynamic loads and converts an
external 9-VDC power supply to a configurable DC output voltage.
Position Manager BoosterPack is a flexible low voltage platform intended for evaluating interfaces
BOOSTXL-POSMGR
to absolute encoders and analog sensors like resolvers and SinCos transducers.
Sharp® 128x128 Memory LCD and microSD Card BoosterPack, controlled using SPI. Display
BOOSTXL-SHARP128
sensor readings, time, graphics, or other information using the LCD screen.

Note
Software support for the BoosterPacks and boards listed vary.

Users can also design BoosterPacks for the F28P55x LaunchPad. Make sure that compatibility requirements
are met by referencing the signal pin mapping in the LAUNCHXL-F28P55X Pinout Map or LAUNCHXL-F28P55X
Schematic.

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2.4 Hardware Revisions

This section contains an abbreviated revision history of the LAUNCHXL-F28P55X as well as known issues with
each revision.
2.4.1 Revision A
The first production revision of the LAUNCHXL-F28P55X was released in February 2023. This revision can be
identified by the MCU133A silkscreen labeling on the back side of the EVM between the BoosterPack Connector
site 1 towards the top of the board.
Issues and concerns that have been identified on the EVM are listed below:
Known issues:
• No issues to report at this time of initial release.
Special notes and considerations to be aware of:
• Some of the F28P55X LaunchPads come with indicated "EQEP2" label on the silkscreen instead of "EQEP3"
one. Beware that EQEP2 on the silkscreen corresponds to the EQEP3 module.

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3 Software
3.1 Software Development
This section provides general information about software development, as well as instructions for programming
the LaunchPad. Software tools and packages for C2000 real-time controllers, like the F28P55x, are listed in the
C2000 Evaluation & Development page.
3.1.1 Software Tools and Packages
Code Composer Studio (CCS) is a free integrated development environment (IDE) that supports TI's
Microcontroller and Embedded Processors portfolio. Code Composer Studio (CCS) provides a feature rich
environment for developing, programming, and debugging code on the C2000 family of MCUs.
C2000WARE is a repository of device-specific drivers, bit-field support files, libraries, peripheral examples,
utilities, hardware files, and documentation for C2000 MCUs. C2000WARE provides a solid foundation to
begin development and evaluation of the F28P55x device on the LAUNCHXL-F28P55X and minimize software
development time.
Software Development Kits (SDKs) are provided to make evaluating C2000 MCUs easier within specific system
use cases and reduce overall development time. The Motor Control SDK (C2000WARE-MOTORCONTROL-
SDK) is targeted for various motor control applications, such as industrial drives. The Digital Power SDK
(C2000WARE-DIGITALPOWER-SDK) is targeted for digital power system development for various AC-DC,
DC-DC and DC-AC power supply applications.
3.1.2 F28P55x LaunchPad Demo Program
The LAUNCHXL-F28P55X includes a TMSF28P550SJ9PZ device pre-programmed with a demo program. When
the LaunchPad is powered on the demo program begins with an LED blink sequence on LED4 and LED5. After
a few seconds the device switches into an ADC sampling mode.
Every 1 second the ADC samples pin ADCINA6 and the sampled value is represented as follows: If the sample
is above mid-scale (2048), then the red LED4 illuminates. If the sample is below mid-scale, then the green LED5
illuminates.
In addition to the LED indicators, ADC sample results are also displayed on your PC through the USB/UART
connection. To view the UART information on your PC, first determine the COM port associated with the
LaunchPad. To do this in Windows open the Device Manager. Look for an entry under Ports (COM and LPT)
titled XDS110 Class Application/User UART (COMX), where X is a number. Remember this number for opening
a serial terminal.

Figure 3-1. LaunchPad XDS110 COM Port

The demo application's UART data was tested using PuTTY, which is a free and open-source terminal emulator.
To view the UART data in a serial terminal program open the COM port found using the Windows Device
Manager with the following settings.

115200 Baud, 8 data bits, no parity, 1 stop bit.

After properly opening the serial port in your serial terminal, reset the LaunchPad by pressing the S1 reset button
and observe the serial terminal to see the TI logo in ASCII art.

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Figure 3-2. LaunchPad Demo Serial Terminal - TI Logo

After a few moments, the ADC value sampled on the ADCINA6 pin appears in the bottom right corner of the
terminal and be updated each second. Using a jumper wire connect the ADCINA6 header to a 3.3V, GND, or
other 0-3.3V signal to see the on-screen value change.

Figure 3-3. LaunchPad Demo Serial Terminal - ADC Sampling

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3.1.3 Programming and Running Other Software on the F28P55x LaunchPad

The software packages described in Section 3.1.1 include example projects that can be loaded
and run on the F28P55x LaunchPad. If you installed the C2000WARE software to the default
installation path of C:\ti\c2000\C2000Ware_<version>, you can find driverLib based example applications in
C:\ti\c2000\C2000Ware_<version>\examples\F28P55x. The on-board XDS110 is used with the On-Chip Flash
Programmer tool to program applications to the F28P55x LaunchPad.
Follow these steps to program example applications onto the F28P55x LaunchPad development kit using the
on-board XDS110 debug probe:
1. Install Code Composer Studio (CCS) on a PC running Microsoft Windows.
2. Connect the USB-A cable plug in to an available USB port on the PC and plug the USB Type-C plug to the
port (USB101) on the F28P55x LaunchPad.
3. Verify the following LEDs are illuminated:
a. LED7, at the top left of the board, indicating 5V USB power.
b. LED0 indicating 3.3V power to the XDS110 debug probe.
c. LED1 indicating 3.3V power to the F28P55X MCU.
4. Install Windows XDS110 and Virtual COM Port drivers if prompted. Installation instructions can be found at
XDS110 Product Page.
5. Run CCS on the PC.
6. Import a F28P55x project from C2000WARE, or another installed software package, into the CCS
workspace.
7. Add the _LAUNCHXL_F28P55X predefined symbol to the imported DriverLib example project for the
software to use relevant F28P55x LaunchPad signals.
a. Open the projects Properties → Expand the Build tab → Expand the C2000 Compiler tab → Select
Predefined Symbol → Add _LAUNCHXL_F28P55X predefined NAME.
8. Right click the project name and select Rebuild Project in CCS.
9. Launch the LAUNCHXL-F28P55X Target Configuration file and connect to the F28P55x device. Make sure
that the Target Configuration file is configured to use the 2-pin cJTAG advanced configuration. For additional
details, see Section 5.1.
10. Click Load Program and select the binary of the program to load. The binary is loaded onto the device and
can now be run and debugged.

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4 Hardware Design Files

The entire LAUNCHXL-F28P55X design files are available for download at this link: LAUNCHXL-F28P55X
design files.
4.1 Schematic
The schematic for the LaunchPad can be found at this link: LAUNCHXL-F28P55X Schematic.
4.2 PCB Layout
The layout source files for the LAUNCHXL-F28P55X are included in the LAUNCHXL-F28P55X design files
download.

Figure 4-1. Top Signal - Layer 1 Figure 4-2. GND - Layer 2

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Figure 4-3. PWR - Layer 3 Figure 4-4. Bottom Signal - Layer 4

4.2.1 LAUNCHXL-F28P55X Board Dimensions

Figure 4-5 is a dimensional drawing of the F28P55x LaunchPad that shows the location of selected features of
the board as well as the component locations.

Figure 4-5. F28P55x LaunchPad Dimensions and Component Locations

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4.3 Bill of Materials (BOM)

The bill of materials for the LAUNCHXL-F28P55X is included in the LAUNCHXL-F28P55X design files download.
5 Additional Information
5.1 Frequently Asked Questions
1. Can other programming and debug tools (such as an XDS200 debug probe) be used with the F28P55x
LaunchPad?
a. The F28P55x LaunchPad utilizes an on-board XDS110 debug probe in a 2-pin cJTAG configuration.
cJTAG only uses the TMS and TCK pins of the debug probe. TDI and TDO are present on J101 and can
be connected to a debug probe through jumper wires, if necessary.
2. What versions of Code Composer Studio can be used to develop software for the F28P55x LaunchPad?
a. The on-board XDS110 debug probe is compatible with Code Composer Studio development
environment version 6.1.0 and later.
3. Can users not connect to the LaunchPad in Code Composer Studio?
a. Are shunts present on J101 for TCK and TMS?
b. Is the XDS110 and the F28P55X MCU powered? Are LED0 and LED1 illuminated? For further details on
powering the LaunchPad, see Section 2.1.1.1.
i. If JP1 shunts are disconnected, then the power provided through the USB is isolated from the rest
of the board. Make sure that 3.3V is supplied to any of the available connectors on the target side of
the isolation.
c. Is the USB-C cable connected to the PCB and is the USB region receiving power? Is LED7 illuminated?
i. The USB region must be powered with the 5V from the USB cable. LED7 illuminates when 5V USB
power is connected. The USB isolation chip requires 5V on the USB side to operate and pass the
signals across the isolation barrier.
d. Make sure that the target configuration is set up to use cJTAG in 2-pin advanced mode. Open the
Target Configuration file (.ccxml) in Code Composer Studio. Click on the Advanced tab and select
cJTAG (1149.7) 2-pin advanced modes from the drop-down labeled JTAG/SWD/cJTAG Mode. Leave the
Target Scan Format as OSCAN2 format. Alternately, a working Target configuration file is included in the
launcxl_ex1_F28P55X_demo project TMS320F28P55X_LaunchPad.ccxml. Users can use this without
modifications.

Figure 5-1. Target Configuration Advanced Options

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Figure 5-2. Target Configuration Included in the Demo Project

4. Why is the serial connection not working?
a. Are shunts present on J101 for TXD and RXD?
b. Are you using the correct COM port?
i. Right-click on My Computer and select Properties. Navigate to the Hardware tab in the dialog box
and open the device manager. Scroll to Ports (COM & LPT) and expand this entry. Is XDS110 Class
Application/User UART listed? If so, then read the COM number to the right of the entry; this is the
COM number to be used.
c. Is the user using the correct baud rate? Most, if not all, of the examples are configured for a baud
rate of 115200 when the CPU is running at 150MHz. If the PLL settings have been changed or the
user developed a code, then users have to recalculate the baud rate for the specific application. For
information on how to do this, see the TMS320F28P55x C2000 Real-Time Microcontrollers technical
reference manual.
d. Does the UART channel wired to the debug probe match the UART channel configured in software?
i. The F28P55x LaunchPad provides an option for one of two possible UART channels to be routed to
the debug probe through J101. Make sure that S2 is configured to the appropriate UART channel for
the application software. For details, see Section 2.1.3.2.
5.2 Trademarks
C2000™, LaunchPad™, BoosterPack™, Code Composer Studio™, NexFET™, and SimpleLink™ are trademarks
of Texas Instruments.
USB Type-C® is a registered trademark of USB Implementers Forum.
Sharp® is a registered trademark of Sharp Microelectronics.
All trademarks are the property of their respective owners.
6 References
6.1 Reference Documents
In addition to this document, the following references are available for download at www.ti.com.
• TMS320F28P55x C2000 Real-Time Microcontrollers
• Texas Instruments: TMS320F28P55x C2000 Real-Time Microcontrollers data sheet
• Texas Instruments: TMS320F28P55x C2000 Real-Time Microcontrollers Technical Reference Manual
• Texas Instruments: Getting Started With C2000 Real-Time Control Microcontrollers (MCUs)
• Texas Instruments: The Essential Guide for Developing with C2000 Real-Time Microcontrollers
• Texas Instruments: TMS320F28P55x C2000 Real-Time Microcontrollers Silicon Errata
• Texas Instruments: LAUNCHXL-F28P55X LaunchPad Pinout Map
• C2000Ware for C2000 MCUs
• Application Specific Designs & Evaluation with C2000 Real-Time Microcontrollers
• C2000WARE Quick Start Guide
• Texas Instruments Code Composer Studio
• Texas Instruments LaunchPad Development Environment

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6.2 Other TI Components Used in This Design

This LaunchPad uses various other TI components for functions. A consolidated list of these components with
links to the TI product pages is shown below.
• MSP432E401Y SimpleLink™ 32-bit Arm Cortex-M4F MCU
• TCAN332 3.3V CAN Transceiver
• SN74LV4053A Triple 2-Channel Analog Multiplexer/Demultiplexer IC
• SN74LVC2G07 Dual Buffer/Driver With Open-Drain Output
• TPD4E004 4-Channel ESD Protection Array for High-Speed Data Interfaces
• TPD4E05U06 4-Channel ESD Protection Array for USB, HDMI & High Speed Interfaces
• TPS3702 High-Accuracy, Fixed-Threshold OV/UV Monitor
• TPS7A37 1A, High-Accuracy, Ultra-Low-Dropout Voltage Regulator with Reverse Current Protection and
Enable
• SN74LVC8T245 8-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and Three-State
Outputs

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