KAVIARASAN KUPPUSAMY

Senior Engineer - PCB Layout design

PERSONAL SUMMARY:

A highly motivated and ambitious Senior Design Engineer with deep

knowledge on High- speed PCB layout design and
creepage/clearance for power supply designs. Managed PCB/Library
team and developed ECAD parts for Global centers (13 Years’
Experience).

Email: [email protected] Key Skills:

PCB Design Tools: Mentor Graphics, Xpedi tion, DX -
DOB: 12-01-1989 Desi gner, Li brar y Manager, Fabl inkDrawing Editor,
Cadence Allegro, Altium Designer, CAM350, GC-prevue.
Marital Status: Single

Nationality: Indian
Other Supporting Software: AutoCAD, MS-Office, Windchill,
Arena, Silicon Expert
Passport Number: J3615212
PCB Design Skills: Multilayer Design, Power supply Design,
Mobile No: +91 9916100626 Analog & Digital Designs, DDR (III, IV), USB (2.0,3.0), PCI Express,
SPI, I2C, CAN, ETHERNET Interfaces, Blind & Buried via’s
Notice Period: 2-Months
Constraint manager.

Work Experience:

Enphase Energy - Bangalore (India)

AREAS OF EXPERTISE
Senior Design Engineer - PCB Layout design July 2021-Present
PCB Layout Design

Project Name: System Controller

Library management

Equal Opportunities
Role: Schematic Draft + PCB Layout Design
Risk assessment
Overview of the Project:
PERSONAL SKILLS
This product has 4 boards.
High performance
1. Main Board
Delegating
2. Gateway board
3. Relay Board
Decision-making 4. Connector I/O and Startup Board

Organizing • Main Board consists of Processor, CAN, ZigBee with UFL

mount, SPI, RTC, RSD, Rs485 Transceiver & Power supply from
Multitask 240V to 6V.
o Maintain Creepage and Clearance in HV section to
Quick learning
achieve PD-3.
o SPI Signals are routed as short as possible and
provided ground guarding as required.
o Isolated CAN Communication is used to transfer
data and Rapid Shut down detector, temperature
sensor circuit are used to monitor the device.
PERSONAL
o Flash and crystal components are placed very close to processor and
DETAILS maintained 2x spacing with other signals and routed them with very short
distance.
Kaviarasan
Kuppusamy o Basic signal integrity analysis.
o Power integrity analysis has been done for all the power rails.
Flat No.602,
• Gateway Board consist of DDR4, Wi-FI,ETHERNET,USB, ASIC
S A Vasudeva
building,
o Communicate and control all the IO and power supply to ensure efficiency.
12th cross,
• Relay Board consists of Mains, Generator, PV, NFT relays with their drivers,
Maruthi Nagar, watchdog circuit, I2C circuit, LDO.
Madiwala,
o Controls all the relays and switches automatically based on availability of
Bangalore -560068. power.
o Mainly Placement is critical due to HV Relays and added more RTV and
Educational Details: coating to achieve creepage and clearance.

B.E-Electronics and
• Connector I/O and Startup Board consists of B-to-B connectors, Power supply
Communication with PLC transformer.
Engineering
o Maintain Creepage and Clearance in HV section to achieve PD-2.
(Year 2010)
o Using Mux based relays to select Power from either PV or Mains.
College: o Boost Convertor is used to convert 3V to 40V design.

Bannari Amman
Previous Work Experience:
Institute of
Technology,
Johnson controls (IEC) - Pune (India)
Sathyamangalam.

University: Senior Design Engineer - PCB Layout design August 2017- July 2021 (4Years 11months)

Anna University, Project Name: Refrigeration controller

Chennai
Role: Schematic draft + PCB Layout Design
Permanent Address:
Overview of the Project:
Kaviarasan
This product has 3 boards.
Kuppusamy

Flat No.2/32-7,
1. High Voltage Board

Sri Dhanam Nagar, 2. Low Voltage Board

Mylampatti, 3. UI Board

Neelambur, • Created the schematic as per given drawings, in layout we taken care the
mechanical, UL guidelines for high voltage section (creepage and clearance) and
Coimbatore -641062.
proper impedance matching for communication signals.

• High voltage Board has compressor current rating of 96 Amps, we take

care with proper placement to meet UL and routing to carry high
current.
Project Name: Global Library Development

Role: Part Creation and Maintenance

Team size: 3

Overview of the Project:

• Managing the task and reviewing the parts created by team members.
• We worked with global engineering centers and our counter parts to get the ECAD part
completed on time to get the requested parts to the corresponding design engineers.
• All the components are created as per IPC7351B Standards.
• Our team has created and successfully added 1150 parts to the Global Library.

Sienna Ecad Technologies Pvt.Ltd Bangalore, India

PCB Layout Engineer – PCB Board Design December 2011 to August 2017 (5Years 08months)

Project Name: BCM Series

Role: PCB Layout Design

Overview of the Project:

• This board was designed for set box application which contains DDR3, WIFI,
HDMI, Ethernet with dual ports, RF signals.
• WIFI section is completely isolated from all the high-speed signals.
• HDMI Signals are routed as 100 ohms differential with spacing b/w one pair to
other is maintained minimum 3x.
• RF Signals are routed as 50-ohm impedance with respect to ground signals.
o Understanding JEDEC specification for DDR3.
o Calculating the Package pin delay.
o Analyzing the Read/Write leveling of DDR chips and processor.
o Time delay consideration for DDR3 data, address and Clock signals.

Project Name: Flex Designs

Role: PCB Layout Design

Overview of the Project:

This product has 4 Flex designs. All the designs are interconnected with the help of
Mechanical support.

Placement: Here the board size and mechanical constraints are very critical. And, we need to
take care of the bending regions.

Routing: Ground shielding is required for all the signals and needs to avoid vias in bending
areas. These designs will have mostly edge fingers and stiffeners which need to be taken care of
properly.
Freelance Coimbatore, India

Junior PCB Layout Engineer – PCB Board Design July 2010 to December 2011 (1Year 06months)

Project Name: Heater Controller Board

Role: PCB Layout Design

Placement: In this design, Edge Connector, USB Connector, Controller with Crystal and
Linear regulars are major sections which need to be placed as per DFA requirements and
taking care mechanical restrictions.

Routing: DFM rules followed, and USB signals are routed carefully with good ground
return path and length matching done at tight tolerance. We also provided ground
shielding surrounding the board to achieve EMI and EMC considerations.

Type of PCB design’s handled:

1. Mother boards, server boards, Chip evaluation, universal power supply

board, Memory application and Backplane Evaluation boards.

2. Based on requirements, I have designed many boards with DDR signals with
T- Topology and Flyby topology.

3. Handled fine pitch BGA PCB layout designs like 0.4mm, 0.5mm 0.65mm and
0.8mm.

4. ATE Boards, S93K Template boards.